TWI556257B - Composite copper particles and methods for producing the same - Google Patents

Composite copper particles and methods for producing the same Download PDF

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Publication number
TWI556257B
TWI556257B TW103126967A TW103126967A TWI556257B TW I556257 B TWI556257 B TW I556257B TW 103126967 A TW103126967 A TW 103126967A TW 103126967 A TW103126967 A TW 103126967A TW I556257 B TWI556257 B TW I556257B
Authority
TW
Taiwan
Prior art keywords
particles
copper
copper particles
inorganic oxide
powder
Prior art date
Application number
TW103126967A
Other languages
English (en)
Chinese (zh)
Other versions
TW201511035A (zh
Inventor
Toshihiro Kohira
Nobuhiro Sasaki
Hikaru Minowa
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW201511035A publication Critical patent/TW201511035A/zh
Application granted granted Critical
Publication of TWI556257B publication Critical patent/TWI556257B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/068—Flake-like particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Nanotechnology (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Non-Insulated Conductors (AREA)
TW103126967A 2013-08-07 2014-08-06 Composite copper particles and methods for producing the same TWI556257B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013164445A JP2015034309A (ja) 2013-08-07 2013-08-07 複合銅粒子及びその製造方法

Publications (2)

Publication Number Publication Date
TW201511035A TW201511035A (zh) 2015-03-16
TWI556257B true TWI556257B (zh) 2016-11-01

Family

ID=52461295

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103126967A TWI556257B (zh) 2013-08-07 2014-08-06 Composite copper particles and methods for producing the same

Country Status (6)

Country Link
EP (1) EP3031551A4 (ja)
JP (1) JP2015034309A (ja)
KR (1) KR20160040538A (ja)
CN (1) CN105451914A (ja)
TW (1) TWI556257B (ja)
WO (1) WO2015019959A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI304003B (ja) * 2005-10-03 2008-12-11 Mitsui Mining & Smelting Co
TW201129995A (en) * 2009-12-14 2011-09-01 Samsung Electro Mech Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0463124A (ja) * 1990-06-29 1992-02-28 Kurimoto Ltd 固体粒子同志の固着方法
JP4001438B2 (ja) * 1999-05-31 2007-10-31 三井金属鉱業株式会社 複合銅微粉末の製造方法
JP4227373B2 (ja) 2001-08-07 2009-02-18 三井金属鉱業株式会社 フレーク銅粉及びそのフレーク銅粉を用いた銅ペースト
JP4168116B2 (ja) * 2002-03-06 2008-10-22 Ｄｏｗａエレクトロニクス株式会社 箔片状銅粉およびこれを用いた導電ペースト
JP4145127B2 (ja) * 2002-11-22 2008-09-03 三井金属鉱業株式会社 フレーク銅粉及びそのフレーク銅粉の製造方法並びにそのフレーク銅粉を用いた導電性ペースト
US7459007B2 (en) * 2005-03-15 2008-12-02 Clarkson University Method for producing ultra-fine metal flakes
JP5067545B2 (ja) * 2007-09-20 2012-11-07 国立大学法人宇都宮大学 コーティング方法及び装置
JP5439057B2 (ja) * 2009-06-29 2014-03-12 三井金属鉱業株式会社 複合銅粒子
JP5756694B2 (ja) * 2011-07-07 2015-07-29 三井金属鉱業株式会社 扁平金属粒子

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI304003B (ja) * 2005-10-03 2008-12-11 Mitsui Mining & Smelting Co
TW201129995A (en) * 2009-12-14 2011-09-01 Samsung Electro Mech Conductive paste compound for external electrode, multilayer ceramic capacitor including the same, and manufacturing method thereof

Also Published As

Publication number Publication date
EP3031551A4 (en) 2017-04-26
CN105451914A (zh) 2016-03-30
KR20160040538A (ko) 2016-04-14
JP2015034309A (ja) 2015-02-19
TW201511035A (zh) 2015-03-16
WO2015019959A1 (ja) 2015-02-12
EP3031551A1 (en) 2016-06-15

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