TWI553767B - 真空處理設備 - Google Patents

真空處理設備 Download PDF

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TWI553767B
TWI553767B TW100148756A TW100148756A TWI553767B TW I553767 B TWI553767 B TW I553767B TW 100148756 A TW100148756 A TW 100148756A TW 100148756 A TW100148756 A TW 100148756A TW I553767 B TWI553767 B TW I553767B
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workpiece
compartment
vacuum processing
pumping
opening
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TW201234514A (en
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巴特 史考特凡麥斯特
渥夫甘 麗茲勒
羅傑 勞德
羅夫 巴茲蘭
丹尼爾 羅勒
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歐瑞康先進科技股份有限公司
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    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
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    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
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    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B45/00Pumps or pumping installations having flexible working members and specially adapted for elastic fluids
    • F04B45/02Pumps or pumping installations having flexible working members and specially adapted for elastic fluids having bellows
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    • H01J37/32715Workpiece holder
    • H01J37/32724Temperature
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    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
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    • H01J37/32834Exhausting
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Description

真空處理設備
本發明一般係關於一種真空處理設備,在此設有一個以上的真空處理室,此一或多個真空處理室透過在一真空運送室內的一運送裝置而服務欲處理的工件,真空運送室透過複數開口而與一或更多的處理室相通,工件係藉多個開口而饋入或移出處理室。因此,特別強調此一設備,其真空處理室必須在處理一個以上的工件期間與運送室密封隔開,而且在已經密封好之後,真空處理室要被抽吸降壓至個別真空處理所需的真空程度。這類設備係由US 6481955或WO 2010/105967已知。
本發明之目的是提供一種真空處理設備,其具有一或多個真空處理室之改進的泵吸降壓時間。
發明人理解一「真空處理」係,工件的任何真空製程,例如PVD或CVD真空製程或其他真空製程,工件的表面在低於大氣壓力(亦即:在真空條件下)被處理。
為了達成上述目的,本發明提供一種真空處理設備,其包含一真空處理室及一真空運送室。真空運送室包含具有至少一工件支架的一運送裝置且能夠沿著一條移動路徑驅動式移動。運送室透過一開口而與處理室相通,且被構思成供運送裝置、工件支架、及支架中的一工件的至少一部分能夠沿著該移動路徑通過。真空處理 室包含位於移動路徑一側上的工件處理隔間及相對於移動路徑而與工件處理隔間相對的一泵吸隔間。泵吸隔間包含一泵吸口。另外設有一可控制式密封裝置,其可控制地密封運送室與整個真空處理室之間的開口。因此,整個真空處理室係被分割成一工件處理隔間及一泵吸隔間,此二隔間係位於運送裝置的移動路徑之二側彼此相對且完全流通。藉此,可達成實際上在構思泵吸口的寬度時沒有任何限制,因為不需要設置在工件處理室隔間內。如此能允許安裝高效能的泵吸設備,這一點是由泵吸設備的低壓側上之泵吸線路的流動截面所顯著決定的。
由於在整個真空處理室中分隔有一工件處理隔間及一泵吸隔間,如此能允許安裝高泵吸容量。也可能藉由連接至泵吸隔間的泵吸口之一真空泵吸設備而至少實質上排空運送室。
藉由可控制式密封設備,一旦工件被載入處理室內且因此準備由處理隔間的加工動作進行處理時,處理室係被密封而與真空處理室隔開。連接至在泵吸隔間內的泵吸口之泵吸設備可以快速排空包含處理隔間的整個處理室至意欲的真空處理所需要的真空程度。
尤其對利用本發明且被構思成具有由一共同運送裝置所服務的多個真空處理室之設備來說,將選定的幾個真空處理室打開至周圍壓力(例如基於保養目的)是相當有利地。將整個設備的一部分充滿周圍壓力不應該影響設備的其餘真空區域。例如,這一點是用以在周圍壓力下交換工件,以減少整個設備的停工時間,或者甚至允許設備處理其他工件,而不管其中一處理室充滿了周圍壓力。
在本發明之一個實施例的此形態下,可控制式密封設備係被構思成當處理隔間以及與泵吸口流體相通的泵吸隔間內的一區域中的壓力增加時能夠增加密封力。換句話說,根據本發明,每當處理室被密封而與處理隔間隔開,且泵吸隔間或至少與泵吸口流體相通的泵吸隔間及工件處理隔間中之區域內的壓力上升至例如周圍壓力時,則密封設備的密封效果會增加。對於熟練的技師來說實為已知,這樣的概念可藉由個別修改在密封關閉方向負載個別壓力的表面區域之範圍而實現。之前描述的此實施例可以與任何後續提及的實施例組合在一起。
僅管在一般形態中,本發明的設備可以被構思成一旦運送裝置已經從真空處理室移除之後,密封設備僅在運送室與處理隔間/泵吸隔間之間建立起密封隔離,藉此將工件留在真空處理室內,在本發明的一個實施例中,它可以與已提及或稍後提及的實施例之任一組合(除非互有矛盾),可控制式密封設備係被構思成當運送裝置係處於運送裝置上工件支架擱置於真空處理室內的一位置時,可控制式密封設備能夠密封住所提及的開口。在此實施例中,在工件的處理期間,運送裝置仍維持在真空處理室內。
在本發明的一實施例中,它可與任何已提及或稍後提及的實施例組合(除非互有矛盾),可控制式密封設備包含一可驅動伸縮的管狀風箱。管狀風箱的一端係密封地安裝在泵吸隔間內,管狀風箱的另一端係可控制地在開口周圍移動以密封住該開口。泵吸口係位於泵吸隔間與風箱內側流通的一區域內。藉由設置這樣的管狀風箱,可以如窗簾般移動該管狀風箱的可動端而密封地跨過所述開口。然後,處理隔間係透過風箱的內側而與泵吸隔間中的泵吸口自由地流通。
在本發明運用所述之管狀風箱的一實施例中,運送室延伸跨過真空處理室,因此它也與一第二開口相通,此第二開口被構思成供運送裝置、運送裝置上的工件支架及設置於工件支架內的工件通過。第二開口係位於相對在真空處理室的壁體中之一個開口。風箱的另一端(亦即:自由端)亦在第二開口周圍可密封地移動,因此,藉由分別控制管狀風箱的自由端之移動,可以同時密封關閉運送室至真空處理室的二連通開口。
在所述的一實施例中,運送裝置可以沿著移動路徑且沿著真空處理室移動而通過所述之第一開口與第二開口,且包含多數隔開的工件支架。在此實施例中,在所述的一真空處理室中,執行多數工件的線上處理。
在本發明的一實施例中,它可以與任何已提及或稍後提及的實施例相互組合(除非互有矛盾),運送裝置上的工件支架包含一貫通開口,一工件支撐構件係被保持在該貫通開口且可以在朝向處理隔間的方向抬升,藉此將其座部留在運送裝置上。管狀風箱的另一端(亦即:自由端)係可驅動地移動,並與所述之工件支撐構件形成密封接觸,以便抬起此構件成為沿著處理隔間的一壁體之環狀區域的密封接觸。因此,藉由管狀風箱的自由端之驅動移動,工件支撐構件係從運送裝置的貫通開口被抬起,且沿著處理隔間的內壁朝向所述之環狀區域密封地擠壓。藉此,管狀風箱的自由端也會密封地偏壓在工件支撐構件上。
在不同於上述本發明實施例之一實施例中,此設備包含一抬升裝置,其能夠從泵吸隔間朝向及進入處理隔間而可控制地抬起。此抬升裝置係位於管狀風箱的內側。它包含一致動器,用以可抬升地與管狀風箱的開放端合作,以便將本身抬起來而成為與工件支撐構件有所述之密封接觸,且抬升工件支撐構件而進一步成與沿著處理隔間的壁之環狀區域密封接觸。因此,藉由抬起抬升裝置朝向處理隔間,在抬升裝置的致動器抬起管狀風箱的一開放端向上以接觸工件支撐構件,抬起工件支撐構件後使其朝向及在沿著處理隔間的壁之環狀區域上,一方面在環狀區域與工件支撐構件之間建立密封,另一方面則在工件支撐構件與管狀風箱的上端之間建立密封。
在本發明的一實施例中,所述之工件支撐構件包含具有沿著其周緣之貫通開口的一支撐板。在此實施例中,欲處理的工件係位於支撐構件上,而且當沿著處理隔間的壁之環狀區域建立密封時,欲處理的工件將被定位在根據支撐構件所斷定的位置。工件的處理位置及工件支撐板的密封位置並非獨立。支撐板具有沿著其周緣的貫通開口,而工件係擱置於支撐板的中心,以便在處理隔間與在泵吸隔間中的泵吸口之間確立自由流通。
在本發明的另一實施例中,工件支撐構件包含一框架,此框架可以是圓形或矩形,且一般外框周圍係適以在運送裝置中貫通開口之形狀,而內框周圍係適以一或多數個欲處理的工件之形狀。框架包含多個保持構件,其用以將至少一個工件保持在其內部開放區域中。這些保持構件係被構思成能允許一或多個工件以朝向處理隔間的方向從框架被抬起。在抬升裝置上的致動器透過一彈簧裝置而與管狀風箱的另一端(自由端)合作。抬升裝置包含一工件支撐板,該工件支撐板係位於抬升裝置朝向處理隔間的一端。藉此實施例,工件支撐構件的全部所述之密封,亦即框架朝向沿著處理隔間之壁的環狀區域之密封,以及管狀風箱的開放端與所述之框架之間的密封係被確立但額外地,由於致動器與管狀風箱的自由端之間彈簧裝置的作用,抬升裝置可以將支撐板上的工件從框架抬起,並將工件定位於處理隔間內,此位置係獨立於確立所述之密封的位置。
在本發明的一實施例中,它可以與已提及或稍後提及的實施例之任一組合(除非互有矛盾),其包含有一額外手段,用以將工件從工件支撐板抬起,致使工件的位置變得獨立於工件支撐板的位置。假如,作為一範例,工件支撐板有用於促進工件加熱或冷卻的配備,然後,可以利用所述之額外的手段調整甚至在工件處理期間從工件進出的熱轉變。藉此,實現用以控制工件溫度的一調整構件,例如以負回授控制迴路。
因此,本實施例包含用於在工件處理室內工件之一工件處理保持器、及用於該工件處理保持器上的工件之一可控制驅動抬升裝置。
在本發明的一變形例中,設有一溫度感應手段,其適以感測在工件處理保持器上工件之溫度,藉此,溫度感應手段及可控制驅動抬升裝置係以負回授迴路操作性地連接並用於工件的溫度。
在本發明的設備之一實施例中,它可以與已提及或稍後提及的實施例之任一組合(除非互有矛盾),運送裝置可以沿著其移動路徑移動通過真空處理室,運送裝置可以沿一直線或沿一圓形的移動路徑移動。本發明的整個設備可以是一設備,其中藉由一線性運送裝置以索引方式將多數工件從一個真空處理設備移動至下一個真空處理設備,其中至少之一者係根據本發明而構思,或者整個設備可以被構思成一運送裝置,其以繞圓方式圍繞一中心被驅動,藉此,多個工件係以索引方式從一真空處理設備再次運送至下一個真空處理設備。
在一實施例中,它可以與已提及或稍後提及的實施例之任一組合(除非互有矛盾),運送裝置可以沿著一圓形移動路徑移動,處理隔間與泵吸隔間在圓形移動路徑的軸線方向配置成彼此相對。
在本發明的一實施例中,它可以與提及的實施例之任一組合,此設備更包含一第一泵吸裝置,其操作性地連接至運送室且被構思成排空該運送室。若此設備更包含一第二泵吸裝置,其操作性地連接至處理室且被構思成排空該處理室。藉此,一泵吸裝置係連接至泵吸隔間的泵吸口,且此泵吸裝置是泵吸裝置被構思成排空運送室之泵吸隔間的至少一主要部位,且獨立於構思成排空處理室的該泵吸裝置。
現在,將藉助於圖式進一步說明本發明。
藉由圖1與2,將說明本發明的一般概念。在一運送室1內,其可以例如藉由一運送室泵裝置3而排空,一運送裝置5係沿著如虛線所示的一移動路徑S受控制地驅動。運送裝置5具有欲處理之工件9用的至少一工件支架7。運送室1係透過一開口11而與一真空處理室13相通。真空處理室13在一側包含在運送裝置5的移動路徑S之一側的一工件處理隔間13T,及一泵吸隔間13P相對於移動路徑S與處理隔間13T相對。根據圖1,沿著運送裝置5的移動路徑S,在真空處理室13內設有一工件容納構件15,其上有藉由虛線所示的運送裝置5放置的工件9。在工件9放置在真空處理室13中之後,根據圖1的實施例,運送裝置5例如在圖1所示的位置縮回而離開真空處理室13。
在工件9放置在支架15上之後,如圖1所示的一密封裝置17係藉一驅動器20受控制地驅動,以移動通過開口11並密封開口11。在密封位置中的密封裝置17係以虛線表示。
藉此,包含相互自由流通的隔間13T與13P之真空處理室13與運送室1密封地隔開。支架15上的工件9曝露在處理隔間13T中以進行一真空處理。於是(未顯示於圖1),處理隔間13T裝備有多個單元以執行想要的工件處理,例如濺射源、電弧蒸發器、氣體供應源、用於PECVD的電漿放電單元、加熱器、冷卻器等。
在泵吸隔間13P中設有一大型泵吸口18,以應用於一泵吸裝置19。泵吸隔間13P提供一大表面積而允許對泵吸裝置19以非常大的截面來應用於如此大型泵吸口18,使得含有處理隔間13T的整個真空處理室13可以被快速地泵吸至想要的真空壓力。藉此,泵吸裝置19的泵吸效果可以被調整成夠大,致使開口11無須密封裝置17,此泵吸裝置19亦可被用以在運送室1上提供至少主要的泵吸效果。在此情形中,若真需要,運送室泵吸裝置3僅成為一輔助裝置。假如運送裝置服務超過一個真空處理室13,則個別的泵吸裝置19通常也作用為運送室泵吸裝置。
元件符號22概略地顯示運送裝置5用的可控制驅動器。
在圖1中概略地顯示一實施例,其中在執行處理前運送裝置5係從真空處理室13縮回,且因此在密封裝置17密封地關閉開口11前,圖2以類似圖形顯示一實施例,其中運送裝置5在工件處理期間能夠使其上擱置的工件9保持在真空處理室13內。
根據圖2的實施例,密封裝置17a係構思成介於運送裝置5與開口11的邊緣之間,致使每當運送裝置5被完全引進到真空處理室13內並保持在那裡以處理工件9時,開口11就能關閉。
不同於本發明依據圖1的一般方法,圖3以類似於圖1與圖2的方式顯示一實施例,以實現圖1的設備。在泵吸隔間13P中密封地安裝有一管狀風箱21。管狀風箱21係驅動且受控制地朝處理隔間13T伸長並因此縮回泵吸隔間13P內。泵吸裝置19用的泵吸口18係設置於管狀風箱21內側泵吸隔間13P之壁。因此,事實上,在泵吸隔間13P內,在風箱21內側確立一泵吸區域13p'。朝向處理隔間13T之風箱21的開放端係藉概略性圖示的驅動器20可控制地驅動,而能夠在相對於泵吸區域13P'與處理隔間13T在密封地關閉開口11的位置移動,此二隔間在開口11被密封地關閉時係保持開放相通。根據圖3,此係藉由在風箱21指向處理隔間13T的該端設置一密封環或框架25實現,此密封環或框架密封地唧合真空處理室13的一肩部表面27。相對於開口11及移動路徑S,環狀或框架狀的肩部表面27係朝向處理隔間13T
經常需要(例如基於工件交換或保養目的)交換一處理設備來打開處理隔間13T並藉此暴露整個真空處理室13在周圍壓力。藉此,一方面應該要防止具有運送室1之運送裝置的其餘部分及或運送裝置5所服務的額外處理設備受到汙染,或將必須要再次排空。通常,也可以藉由此設備繼續所欲的工件處理,即使多數個處理設備的之一者正在保養(更一般地說是開啟至周圍壓力)。因此,在如圖4所示的一實施例中,作為圖3的實施例之一範例,密封裝置係被構思成在高壓的真空處理室13以及相對於處理室中的壓力為低壓的運送室1之間所存在的一壓力差,能在密封開口11時提供增加的密封力。
此一般係藉由在可移動的密封裝置設置多個表面實現,這些表面被暴露至來自在處理隔間13T與泵吸隔間13P的壓力以及在運送室1內的壓力之間的壓力差,致使所產生的合力係指向密封唧合。不同於圖3的實施例,圖4顯示此一實施例。在具有相對於環或框架狀肩部表面27建立的密封後,風箱21內密封環25之表面係沿著圖4中的平行陰影線所顯示的表面區域F而暴露在處理隔間13T與泵吸區域13p'中之壓力Pa,同時密封環25的對相表面係暴露於運送室1的較低壓力Pv。沿著表面區域F以及在整個密封環25上產生如此的壓力差,而能在密封環25上產生如圖4所示的一合成力Q,此合成力Q係指向密封關閉方向。這一點的實施方式係藉由相對於管狀風箱21的軸線A,在密封環25至圖4中肩部27的密封7'係沿著具有半徑R7'的一環狀區域被建立起來,此半徑R7'係小於密封環25密封地連接到管狀風箱21的端部之環狀區域的半徑R21
在圖5所示的實施例中,組合了圖2與圖3的方案,亦即,圖5顯示一實施例,其中當工件9受到來自處理隔間13T的動作而被處理且利用管狀風箱21而開口11至運送室1被密封地關閉時,運送裝置5保持在真空處理室13內。
運送裝置5'具有一貫通開口31,此貫通開口31例如可為圓形。
貫通開口31的邊緣界定成用於一支撐肩部33或更一般的保持裝置。一工件承載板35係擱置於支撐肩部33上的貫通開口31內。
因此,工件承載板35可以自由地從運送裝置5'抬起朝向處理隔間13T。如擱置於運送裝置5'的貫通開口31中工件承載板35的位置係以虛線顯示。
管狀風箱21的上端係密封地連結到密封環25。如圖3所示用以抬升並縮回風箱21的驅動器20在圖5的實施例中係藉由一可控制驅動的抬升裝置20'來實現(未顯示於圖5中)。與管狀風箱21的軸線A同軸配置的一抬升桿37係被引導至一真空密閉的導孔39中而通過泵吸隔間13P的壁,且在其指向處理隔間13T的端部承載有一抬升板41。
此抬升板41係被修改成能唧合在風箱21的端部的密封環或框架25,藉此以與工件承載板35密封唧合的方式抬起密封環25,並藉此以與肩部環狀表面27密封唧合的方式抬起工件承載板35。抬升板41沿著其邊緣具有大量或少量的大型貫通開口43,工件承載板35沿著其邊緣也具有大量或少量大型貫通開口45。工件9用的工件支架7主要係藉由在工件乘載板35的中央區域中朝向處理隔間13T之表面而設置。
圖6係類似於圖5的一示意圖,且顯示本發明目前已實現的另一實施例。相對於圖5的實施例,圖6的實施例之差異在於它包含一運送裝置及個別建構的一運送室,此運送室通過真空處理室且因此完全適合在真空處理設備的框架內實現,在真空處理室中,基底係以單向索引的方式從一個真空處理設備移運送至另一真空處理設備。此外,圖6的實施例允許將工件定位在處理隔間內,且獨立於一側上的處理隔間/泵吸隔間及另一側上的運送室之間建立起密封。
圖6顯示在工件處理位置的設備。
根據圖6的實施例,一運送室61藉由二對向開口71而與真空處理室73相通。被塑形成一圓盤板、一環板或一直線延伸的帶狀板之運送裝置65,係擱置於運送室61中且行經真空處理室73。運送裝置65係藉由個別驅動器(未顯示於圖6)受控制地驅動在一個方向或來回方向上以索引方式移動,且然後在每一索引週期內運送集中於真空處理室73內的工件支撐區域66。真空處理室73在運送裝置65的移動路徑S之一側上包含一處理隔間75T,且一泵吸隔間75P相對於所述之移動路徑S與處理隔間75T對向。類似於圖5的實施例,運送裝置65在工件支撐區域66內包含一貫通開口77,其中擱置有一密封環79,這一點類似於圖5的運送裝置5'中個別貫通開口內的工件乘載板35。密封環79包含多個徑向突出至密封環79內的支撐構件81。再且,類似於圖5的實施例,設有一管狀風箱83。管狀風箱83的一個端係密封地連結到泵吸隔間75P的一環狀肩部表面85。管狀風箱83的對向端係密封地連結到一第二密封環87。與管狀風箱83的軸線A同軸配置的一抬升裝置包含一抬升桿89,其藉由一真空氣密的導孔91而通過泵吸隔間75P的壁且可藉由驅動器93控制地上下移動。
抬升桿89設有一凸緣95以作為致動器。凸緣95係牢固地安裝至抬升桿89。凸緣95朝處理隔間75T支撐一彈簧裝置97,此彈簧裝置97支撐一抬升板99,此抬升板99能夠沿著抬升桿89移動且相對於凸緣95而擱置於彈簧裝置97上且被彈簧裝置97所支撐。
更設有一大型泵吸口101,其與管狀風箱83的內部相通,因此類似於圖5的實施例而形成一泵吸區75P'。
抬升板99包含多個寬的貫通開口105,朝向處理隔間75T的抬升桿89之端部裝設有一工件抬升板103,其可以設有例如一被動夾頭或一主動夾頭,如同保持工件107用的一靜電夾頭,例如工件107可為一圓盤狀工件(例如:晶圓)。替代或額外地,誠如本技術所熟知的,工件107可以藉由擱置在工件107周緣上的一重物環(未顯示)而被保持在抬升板103上。
圖6的實施例之操作如下:當抬升板103完全朝向泵吸隔間75P縮回時,運送裝置65能夠自由地移動通過真空處理室73,連接到大型泵吸口101的泵吸裝置(未顯示於圖6中)泵吸真空處理室73以及運送室61。然後,運送裝置65如箭頭I所示以索引方式移動,以便定位集中在真空處理室73內的工件支撐區域66。工件107(例如:晶圓)擱置於密封環79中並藉支撐構件81保持,且密封環79擱置於貫通開口77內並沿著貫通開口77的邊緣而支撐在運送裝置65上。抬升板103完全縮回到運送裝置65的移動路徑S下且因此也在運送裝置65下。具有第二密封環87的管狀風箱83、具有彈簧裝置97的凸緣95、以及被支撐的抬升板99均縮回到運送裝置65下。高容量真空泵連接(例如:連續延伸)到泵吸口101,抬升桿89被驅動器93抬升。藉由凸緣95及實質上未受偏壓的彈簧裝置97之抬升移動,抬升板99被抬起且唧合密封地連結至管狀風箱83的上端之第二密封環87。抬升板103將工件107抬起而脫離在密封環79上藉支撐構件81的支撐。第二密封環87係被抬升板99抬起朝向密封環79',藉此,密封環79被朝上抬起至密封地擱置在處理隔間75T的環狀肩部表面109。藉此,第二密封環87密封地唧合密封環79,而且,藉由抬升板99緊對彈簧裝置97的力量之偏壓力量,而在環狀肩部表面109、密封環79與第二密封環87之間密封。僅管具有工件107用的支撐構件81之密封環79已經密封地擱置緊對環狀肩部109,抬升桿89被進一步朝上驅動以緊對彈簧裝置97的偏壓力量,並抬升在處理隔間75T內處於該位置的工件107,該工件在此欲施以真空處理。此位置係顯示於圖6。總而言之,每當具有抬升板103的工件107已經移動至處理位置時,就會在第二密封環87與密封環79之間、密封環79與環狀肩部表面109之間建立密封。管狀風箱83將泵吸隔間75'p與真空處理室73的區域隔開,其中,運送室61透過開口71相通。透過密封環79的寬開放的貫通開口、寬開放的第二密封環87、抬升板99中的大型貫通開口105、及藉環狀肩部表面85左方開放的大型內部區域,可以在處理隔間75T與泵吸口101之間建立自由流通。
一旦已如期望處理工件107後,抬升桿89縮回,藉此打開所述之密封,且工件107連同密封環79被置回運送裝置65上,然後可以進一步編號索引,因為操作性耦合到抬升桿89的所有構件會縮回到泵吸隔間75T內,因此不會妨礙運送裝置65的移動。
根據本發明,由於在處理隔間的一側設有一單獨隔間,其中工件被真空處理且進一步與處理隔間流通,而且,從處理隔間到具有運送至少一個工件進出的運送裝置之運送室有一切換流通,如一旦至少一個工件被處理,有足夠的空間能設置一具非常大截面且亦用於處理隔間的泵吸口。藉此,將處理隔間非常快速地泵吸至想要的低真空狀態成為可能。
參考圖4,已經注意到在圖5或圖6的實施例中,有利於實現,每當處理隔間被打開至周圍壓力(例如:基於保養目的)時,周圍壓力增加了隔開處理隔間與運送室的密封上之密封力。繼續參考圖4,在圖4中已經說明的表面考量對於圖5或圖6中的實施例也同樣是有效的,例如,關於第二密封環87及風箱83,這一點類似於圖4的密封環25與風箱21。
如上所述,如圖6所示,本發明的設備較佳係適合沿多個真空處理站以索引方式運送大量工件,在這些真空處理站中連續地處理工件。
如以圖6在上下文所示的實施例,可以設置數個抬升銷109(以虛線顯示),其可以藉由個別的驅動器111而相對於其上擱置有工件107的抬升板103之表面同步升高與縮回。藉此,在工件的處理期間,工件也可以受到控制並正確地從所述之表面抬起。例如,若抬升板103裝備有一加熱及/或冷卻設備115,藉由控制工件底表面與抬升板頂表面之間距離的調整而可調整抬升板與工件之間的熱交換。
藉由設置工件溫度用的一溫度感測裝置117,將此溫度感測裝置的輸出值與一比較器單元119的一額定想要的溫度值相比較,根據比較結果,比較器單元119的輸出值作用在驅動器111',而建立用於工件溫度的負回授控制,並運用抬升銷裝置作為一調整構件。顯然地,如此銷裝置及可能的控制迴路可以設置在本發明的任何實施例中,其中工件在處理期間係擱置於一支架上。
圖7概略地顯示本發明的此一設備,其中多數個真空處理室的至少之一者係根據本發明而實現,且所有的真空處理室係由一共同的運送裝置以箭頭W所示的線性索引方式服務。假如藉這些真空處理站110a至110c待執行的所有真空處理需要分別泵吸成個別的處理真空,則所有的真空處理站係以所描述過(特別是圖6)的實施例而實現。另一方面,假如一或另一處理過程並不需要個別的泵吸作用,則可以利用習知方式實現個別的真空處理室,而不需要泵吸口。反之,根據圖7,以虛線所示的運送裝置112係被索引成一直線移動,圖8係以類似圖形顯示一整體設備,其中藉由圓形板狀的運送裝置112'而實現索引運送。在一類似圖形中,圖9顯示仍是本發明的整體設備之另一實施例,其中藉由一環狀運送裝置112"而實現出索引的工件運送。
1...運送室
3...運送室泵裝置
5...運送裝置
7...工件支架
9...工件
11...開口
13...真空處理室
13T...工件處理隔間
13P...泵吸隔間
15...支架
17...密封裝置
18...泵吸口
19...泵吸裝置
20...驅動器裝置
20'...用於密封用的驅動器
21...管狀風摺箱
22...用於運送裝置用的驅動器
25...用於框架的密封環或框架
27...肩部表面
31...貫通開口
33...肩部
35...工件承載板
37...抬升桿
39...導通孔
41...抬升板
61...運送室
65...運送裝置
66...工件支撐區域
71...對相向泵
73...真空處理室
75T...處理隔間
75P...泵吸隔間
77...貫通開口
79...密封環
81...支撐構件
83...管狀風摺箱
85...環肩部表面
87...第二密封環
89...抬升桿
91...真空密閉導通孔
93...驅動器
95...凸緣
97...彈簧裝置
99...抬升板
101...泵吸口
75P'...泵吸區域
103...抬升板
107...工件
109...銷
111...驅動器
115...加熱及/或冷卻設備
117...溫度感測裝置
119...比較器單元
圖1概略地顯示本發明的設備之一第一實施例,其中一運送裝置在工件的處理期間係從真空處理室移除。
圖2係類似於圖1的圖形,其顯示本發明的一第二實施例,其中運送裝置在工件的真空處理期間係仍舊位於真空處理室內。
圖3係類似於圖1的一示意圖,其顯示本發明的另一實施例。
圖4係根據本發明設備的一實施例及圖3之一部分,其中本發明的設備所提供的一處理隔間之高壓能夠強化密封效果。
圖5係顯示本發明的設備之另一實施例的詳細示意圖,其組合有圖2與圖3的設備。
圖6係類似於圖5的示意圖,其顯示本發明的其它現有實施例。
圖7係顯示本發明的設備之一部分,其具有一線性運送裝置。
圖8係根據圖7且根據本發明的設備之示意圖,其具有一圓形中心驅動的運送裝置。
圖9係類似於圖7與圖8且顯示本發明的一設備,其具有一環狀圓形運送裝置。
1...運送室
3...運送室泵裝置
5...運送裝置
7...工件支架
9...工件
11...開口
13...真空處理室
13T...工件處理隔間
13P...泵吸隔間
15...支架
17...密封裝置
18...泵吸口
19...泵吸裝置
20...驅動器裝置
22...用於運送裝置用的驅動器

Claims (16)

  1. 一種真空處理設備,包含:一真空處理室(13、73);一真空運送室(1、61),包含一運送裝置(5、65),其具有可沿著一移動路徑(S)驅動式移動的至少一個工件支架(7、81);該運送室(1、61)經由一開口(11、71)而相通,該開口(11、71)被構思成供該運送裝置(5、65)、該工件支架(7、81)及其內部的一工件(7、107)的至少一部分通過;該真空處理室(13、73)包含在該移動路徑(S)一側上的一工件處理隔間(13T、75T)、及相對於該移動路徑(S)而與該工件處理隔間(13T、75T)相對的一泵吸隔間(13P、75P),該泵吸隔間(13P、75P)包含一泵吸口(18、101),在該真空處理室內的一可控制式密封裝置(17、79、87、83、85),可控制地密封介於該開口(11、71)與該泵吸口(18、101)之間的第一氣流連通,且該可控制式密封裝置係構造成當該第一氣流連通被密封時,減少在該真空處理室中與該泵吸口形成第二氣流連通的體積。
  2. 如申請專利範圍第1項所述之真空處理設備,其中該可控制式密封裝置被構思成當該處理隔間內及該泵吸隔間中與該泵吸口流體相通的一區域內之壓力增加時能夠增加密封力量。
  3. 如申請專利範圍第1項所述之真空處理設備,其中該可控制式密封裝置被構思成當該運送裝置處在使其上的該工件支架位於該真空處理室內之一位置時能夠密封住該開口。
  4. 如申請專利範圍第1項所述之真空處理設備,其中該可控制式密封裝置包含一可驅動式伸縮的管狀風箱,其一端係密封地安裝在該泵吸隔間內,其另一端係可控制地在該開口周圍移動以密封住該開口,該泵吸口係位於該泵吸隔間中與該風箱內側流體相通的一區域內。
  5. 如申請專利範圍第4項所述之真空處理設備,其中該運送室通過該真空處理室且與一第二開口相通,該第二開口被構思成供該運送裝置、該工件支架、及設置於其內的該工件通過且設置成與該一個開口相對,該風箱的另一端也密封地在該第二開口周圍移動。
  6. 如申請專利範圍第5項所述之真空處理設備,其中該運送裝置能夠沿著該移動路徑移動而通過該真空處理室及該第一與第二開口,該運送裝置並包含許多隔開的該等工件支架。
  7. 如申請專利範圍第4項所述之真空處理設備,其中該工件支架包含一貫通開口及一工件支撐構件,該工作支撐構件係保持於該貫通開口內且能夠在朝著該處理隔間的方向升起,該管狀風箱的該另一端係可驅動地移動而與該工件支撐構件密封接觸,以便抬起該工件支撐構件而與沿著該處理隔間的一壁體之一環狀區域 密封接觸。
  8. 如申請專利範圍第7項所述之真空處理設備,其中包含一抬升裝置,其可控制地從該泵吸隔間朝向該處理隔間升起且位於該管狀風箱的內側,且包含一致動器,其可升起地與該管狀風箱的該另一端合作以將其本身抬起而與該工件支撐構件密封接觸。
  9. 如申請專利範圍第7項所述之真空處理設備,其中該工件支撐構件包含具有多個貫通開口的一支撐板。
  10. 如申請專利範圍第8項所述之真空處理設備,其中該工件支架構件包含一框架,該框架包含多個保持構件以將一工件保持在該框架的開放區域內,該等保持構件被構思成能夠使一工件從該框架以朝向該處理隔間的方向升起,該致動器透過一彈簧裝置而與該管狀風箱的該另一端合作,該抬升裝置包含位於其一端並朝向該處理隔間的一工件支撐板。
  11. 如申請專利範圍第7項所述之真空處理設備,其中該運送裝置可沿該運送路徑移動而通過該真空處理室且通過該第一與該第二開口,該運送裝置包含多數個相互隔開的該等工件支撐構件。
  12. 如申請專利範圍第11項所述之真空處理設備,其中該運送裝置能夠沿著一直線或圓形的移動路徑移動。
  13. 如申請專利範圍第12項所述之真空處理設備,其中該運送裝置可沿一圓形移動路徑移動,該處理隔間與該泵吸隔間在該圓形移動路徑的一軸線方向彼此相向配置。
  14. 如申請專利範圍第1項所述之真空處理設備,更包含操作性地連接至該運送室且構思成排空該運送室的一第一泵吸裝置、操作性地連接至該處理隔間且構思成排空該處理隔間的一第二泵吸裝置,一泵吸裝置係連接至該泵吸隔間的該泵吸口且是該第一泵吸裝置的至少一主要部分且是該第二泵吸裝置。
  15. 如申請專利範圍第1項所述之真空處理設備,包含用於該真空處理室內的該工件之一工件處理保持器、及用於該工件處理保持器上的一工件之一可控制驅動的抬升裝置。
  16. 如申請專利範圍第15項所述之真空處理設備,包含一溫度感測手段,其用以感測該工件處理支架上的一工件之溫度,該溫度感測手段及該可控制驅動的抬升裝置係操作性連接而形成用以感測該工件溫度之一負回授迴路。
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