TWI553368B - 包含具單晶矽之區域之基板的結構及用以製造基板及結構之方法 - Google Patents
包含具單晶矽之區域之基板的結構及用以製造基板及結構之方法 Download PDFInfo
- Publication number
- TWI553368B TWI553368B TW101150997A TW101150997A TWI553368B TW I553368 B TWI553368 B TW I553368B TW 101150997 A TW101150997 A TW 101150997A TW 101150997 A TW101150997 A TW 101150997A TW I553368 B TWI553368 B TW I553368B
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- Prior art keywords
- single crystal
- angle
- substrate
- layer
- crystal germanium
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 141
- 238000000034 method Methods 0.000 title claims description 85
- 238000004519 manufacturing process Methods 0.000 title claims description 50
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title 1
- 239000013078 crystal Substances 0.000 claims description 78
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 76
- 229910052732 germanium Inorganic materials 0.000 claims description 73
- 230000008569 process Effects 0.000 claims description 17
- 238000001039 wet etching Methods 0.000 claims description 9
- 230000008859 change Effects 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 5
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000002310 reflectometry Methods 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims 8
- 230000001419 dependent effect Effects 0.000 claims 4
- 239000010410 layer Substances 0.000 description 235
- 125000006850 spacer group Chemical group 0.000 description 89
- 235000012431 wafers Nutrition 0.000 description 81
- 230000003287 optical effect Effects 0.000 description 73
- 239000000835 fiber Substances 0.000 description 64
- 239000000463 material Substances 0.000 description 50
- 239000013307 optical fiber Substances 0.000 description 47
- 229910052751 metal Inorganic materials 0.000 description 37
- 239000002184 metal Substances 0.000 description 37
- 229920002120 photoresistant polymer Polymers 0.000 description 34
- 238000005530 etching Methods 0.000 description 28
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 229910052802 copper Inorganic materials 0.000 description 17
- 239000010949 copper Substances 0.000 description 17
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 16
- 239000012212 insulator Substances 0.000 description 15
- 238000002161 passivation Methods 0.000 description 14
- 238000000151 deposition Methods 0.000 description 12
- 238000012545 processing Methods 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 10
- 230000008021 deposition Effects 0.000 description 9
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 229920005591 polysilicon Polymers 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000000708 deep reactive-ion etching Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 210000000887 face Anatomy 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium dioxide Chemical compound O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 2
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 2
- 229940119177 germanium dioxide Drugs 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002736 nonionic surfactant Substances 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical group [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 2
- 238000009623 Bosch process Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000013504 Triton X-100 Substances 0.000 description 1
- 229920004890 Triton X-100 Polymers 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- -1 argon) Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000007521 mechanical polishing technique Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- MOWMLACGTDMJRV-UHFFFAOYSA-N nickel tungsten Chemical compound [Ni].[W] MOWMLACGTDMJRV-UHFFFAOYSA-N 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229910003468 tantalcarbide Inorganic materials 0.000 description 1
- 229910001936 tantalum oxide Inorganic materials 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Micromachines (AREA)
- Weting (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261585217P | 2012-01-10 | 2012-01-10 | |
| US13/362,898 US8757897B2 (en) | 2012-01-10 | 2012-01-31 | Optical interposer |
| US13/454,713 US9323010B2 (en) | 2012-01-10 | 2012-04-24 | Structures formed using monocrystalline silicon and/or other materials for optical and other applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201333567A TW201333567A (zh) | 2013-08-16 |
| TWI553368B true TWI553368B (zh) | 2016-10-11 |
Family
ID=48743988
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150997A TWI553368B (zh) | 2012-01-10 | 2012-12-28 | 包含具單晶矽之區域之基板的結構及用以製造基板及結構之方法 |
| TW101150996A TWI539191B (zh) | 2012-01-10 | 2012-12-28 | 光學插入物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101150996A TWI539191B (zh) | 2012-01-10 | 2012-12-28 | 光學插入物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9323010B2 (https=) |
| EP (2) | EP2802916B1 (https=) |
| JP (1) | JP5970081B2 (https=) |
| KR (2) | KR101955060B1 (https=) |
| CN (2) | CN104364688B (https=) |
| TW (2) | TWI553368B (https=) |
| WO (2) | WO2013106288A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI911930B (zh) * | 2023-10-13 | 2026-01-11 | 台灣積體電路製造股份有限公司 | 設計半導體結構的方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8508028B2 (en) * | 2010-07-16 | 2013-08-13 | Yu-Lung Huang | Chip package and method for forming the same |
| TW201417250A (zh) * | 2012-07-17 | 2014-05-01 | 海特根微光學公司 | 光學模組，特別是光電模組，及其製造方法 |
| US9529162B2 (en) * | 2012-10-09 | 2016-12-27 | Corning Optical Communications LLC | Optical fiber connectors and methods of forming optical fiber connectors |
| US9484211B2 (en) | 2013-01-24 | 2016-11-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Etchant and etching process |
| DE102013224607B4 (de) | 2013-11-29 | 2024-06-06 | Robert Bosch Gmbh | Mikro-elektromechanische Anordnung und Verfahren zum Aufbau einer mikro-elektromechanischen Anordnung |
| JP6382313B2 (ja) * | 2013-12-20 | 2018-08-29 | インテル コーポレイション | テーパー状導波路構造を有する光検出器 |
| CN104752192B (zh) * | 2013-12-31 | 2017-11-14 | 中芯国际集成电路制造(上海)有限公司 | 一种在半导体衬底表面制作斜面的方法 |
| US9395491B2 (en) * | 2014-02-05 | 2016-07-19 | Aurrion, Inc. | Shielding regions for photonic integrated circuits |
| CN103955129A (zh) * | 2014-04-10 | 2014-07-30 | 中国电子科技集团公司第三十八研究所 | 具有双反射镜的微型原子气体腔器件及其制造方法 |
| CN103941576A (zh) * | 2014-04-10 | 2014-07-23 | 中国电子科技集团公司第三十八研究所 | 基于mems技术的原子气体腔器件及其制造方法 |
| CN103941577A (zh) * | 2014-04-10 | 2014-07-23 | 中国电子科技集团公司第三十八研究所 | 具有双反射镜和凹槽形结构的原子气体腔器件及其制造方法 |
| TWI549259B (zh) * | 2014-05-15 | 2016-09-11 | 國立清華大學 | 全集成主被動積體光學於矽基積體電路及其製作方法 |
| US9274277B2 (en) | 2014-05-15 | 2016-03-01 | Globalfoundries Inc. | Waveguide devices with supporting anchors |
| CN104465855B (zh) * | 2014-11-24 | 2017-02-22 | 华天科技（昆山）电子有限公司 | 晶圆级光互连模块及制作方法 |
| US9498120B2 (en) | 2014-12-22 | 2016-11-22 | Carl Zeiss Meditec Ag | Method and system for optical coherence elastography of posterior parts of the eye |
| CN104966670A (zh) * | 2015-06-25 | 2015-10-07 | 中国工程物理研究院电子工程研究所 | 一种单晶硅刻蚀方法及刻蚀液 |
| JP6217706B2 (ja) | 2015-07-29 | 2017-10-25 | 日亜化学工業株式会社 | 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置 |
| JP6354704B2 (ja) * | 2015-08-25 | 2018-07-11 | 日亜化学工業株式会社 | 光学部材の製造方法、半導体レーザ装置の製造方法及び半導体レーザ装置 |
| CN105321929B (zh) * | 2015-08-26 | 2018-05-08 | 中国科学院微电子研究所 | 一种三维光电集成结构及其制作方法 |
| CN105336795B (zh) * | 2015-08-26 | 2017-03-22 | 中国科学院微电子研究所 | 一种基于光栅接口的光子芯片封装结构及其制作方法 |
| WO2017036827A1 (en) * | 2015-09-03 | 2017-03-09 | Koninklijke Philips N.V. | Ic die, probe and ultrasound system |
| US10408926B2 (en) | 2015-09-18 | 2019-09-10 | Qualcomm Incorporated | Implementation of the focal plane 2D APD array for hyperion lidar system |
| US9910232B2 (en) * | 2015-10-21 | 2018-03-06 | Luxtera, Inc. | Method and system for a chip-on-wafer-on-substrate assembly |
| US10705293B2 (en) * | 2015-12-14 | 2020-07-07 | Intel Corporation | Substrate integrated waveguide |
| US10209477B1 (en) * | 2017-05-25 | 2019-02-19 | Lockheed Martin Coherent Technologies, Inc. | Systems and methods for reconfigurable micro-optic assemblies |
| US10168495B1 (en) * | 2017-06-28 | 2019-01-01 | Kyocera Corporation | Optical waveguide and optical circuit board |
| JP6631609B2 (ja) * | 2017-09-26 | 2020-01-15 | 日亜化学工業株式会社 | 半導体レーザ装置の製造方法 |
| US20190237629A1 (en) | 2018-01-26 | 2019-08-01 | Lumileds Llc | Optically transparent adhesion layer to connect noble metals to oxides |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101955060B1 (ko) | 2019-03-06 |
| US20130177274A1 (en) | 2013-07-11 |
| TWI539191B (zh) | 2016-06-21 |
| US9323010B2 (en) | 2016-04-26 |
| WO2013106285A3 (en) | 2013-09-26 |
| JP5970081B2 (ja) | 2016-08-17 |
| EP2802916B1 (en) | 2020-03-11 |
| TW201333562A (zh) | 2013-08-16 |
| EP2802915B1 (en) | 2017-04-12 |
| EP2802916A2 (en) | 2014-11-19 |
| CN104169768B (zh) | 2016-03-02 |
| CN104364688A (zh) | 2015-02-18 |
| JP2015515113A (ja) | 2015-05-21 |
| WO2013106285A2 (en) | 2013-07-18 |
| KR101870490B1 (ko) | 2018-06-22 |
| CN104169768A (zh) | 2014-11-26 |
| EP2802915A1 (en) | 2014-11-19 |
| KR20140112069A (ko) | 2014-09-22 |
| KR20140112068A (ko) | 2014-09-22 |
| TW201333567A (zh) | 2013-08-16 |
| CN104364688B (zh) | 2016-08-24 |
| WO2013106288A1 (en) | 2013-07-18 |
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