TWI551591B - 苯并呋喃衍生物組成物、聚醯亞胺前驅物組成物、聚醯亞胺樹脂以及其製造方法 - Google Patents

苯并呋喃衍生物組成物、聚醯亞胺前驅物組成物、聚醯亞胺樹脂以及其製造方法 Download PDF

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TWI551591B
TWI551591B TW103135015A TW103135015A TWI551591B TW I551591 B TWI551591 B TW I551591B TW 103135015 A TW103135015 A TW 103135015A TW 103135015 A TW103135015 A TW 103135015A TW I551591 B TWI551591 B TW I551591B
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Taiwan
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group
composition
bis
benzofuran
polyimine
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TW103135015A
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Chinese (zh)
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TW201518285A (zh
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小林正典
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杰富意化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW103135015A 2013-10-10 2014-10-08 苯并呋喃衍生物組成物、聚醯亞胺前驅物組成物、聚醯亞胺樹脂以及其製造方法 TWI551591B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013212762 2013-10-10
JP2014137942A JP6175032B2 (ja) 2013-10-10 2014-07-03 ベンゾフラン誘導体組成物、ポリイミド前駆体組成物およびポリイミド樹脂の製造方法

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TW201518285A TW201518285A (zh) 2015-05-16
TWI551591B true TWI551591B (zh) 2016-10-01

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TW103135015A TWI551591B (zh) 2013-10-10 2014-10-08 苯并呋喃衍生物組成物、聚醯亞胺前驅物組成物、聚醯亞胺樹脂以及其製造方法

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JP (1) JP6175032B2 (ja)
CN (1) CN105612199B (ja)
TW (1) TWI551591B (ja)
WO (1) WO2015052907A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6481172B2 (ja) * 2015-03-06 2019-03-13 Jfeケミカル株式会社 ジヒドロフラン誘導体組成物、ポリイミド前駆体組成物およびポリイミド樹脂の製造方法
CN108811501B (zh) * 2017-02-28 2020-12-04 杰富意化学株式会社 聚酰亚胺前体组合物、聚酰亚胺树脂的制造方法及聚酰亚胺树脂
CN111263992B (zh) * 2018-10-03 2023-06-16 杰富意化学株式会社 糊料组合物、二次电池用电极材料、二次电池用电极及二次电池

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200606769A (en) * 2004-08-10 2006-02-16 Ind Tech Res Inst Full-color organic electroluminescence device
TW201335239A (zh) * 2012-02-23 2013-09-01 Hitachi Chem Dupont Microsys 樹脂組成物以及使用其的聚醯亞胺樹脂膜、顯示器基板與其製造方法

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JP3015998B2 (ja) * 1993-08-31 2000-03-06 キヤノン株式会社 液晶性化合物、それを含む液晶組成物、該液晶組成物を用いた液晶素子、液晶装置、並びに表示方法
JP4039011B2 (ja) * 2001-07-02 2008-01-30 宇部興産株式会社 耐熱性不織布及びバインダ−樹脂
KR100548625B1 (ko) * 2003-03-24 2006-01-31 주식회사 엘지화학 고내열성 투명 폴리이미드 전구체 및 이를 이용한 감광성수지 조성물
JP5428181B2 (ja) * 2008-03-31 2014-02-26 大日本印刷株式会社 ポリイミド前駆体の製造方法、及びそれを用いたポリイミドの製造方法
JP5428179B2 (ja) * 2008-03-31 2014-02-26 大日本印刷株式会社 ポリイミド前駆体樹脂組成物、及び電子部品
US8071273B2 (en) * 2008-03-31 2011-12-06 Dai Nippon Printing Co., Ltd. Polyimide precursor, resin composition comprising the polyimide precursor, pattern forming method using the resin composition, and articles produced by using the resin composition
TWI494373B (zh) * 2008-11-10 2015-08-01 Ajinomoto Kk Resin composition for printed circuit boards
CN102140169B (zh) * 2010-01-28 2013-08-21 长春人造树脂厂股份有限公司 水溶性聚酰亚胺树脂、其制法及其用途
CN102844291B (zh) * 2010-04-16 2015-06-17 聂克斯姆化学有限公司 新型交联剂

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200606769A (en) * 2004-08-10 2006-02-16 Ind Tech Res Inst Full-color organic electroluminescence device
TW201335239A (zh) * 2012-02-23 2013-09-01 Hitachi Chem Dupont Microsys 樹脂組成物以及使用其的聚醯亞胺樹脂膜、顯示器基板與其製造方法

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JP6175032B2 (ja) 2017-08-02
WO2015052907A1 (ja) 2015-04-16
JP2015096589A (ja) 2015-05-21
TW201518285A (zh) 2015-05-16
CN105612199A (zh) 2016-05-25
CN105612199B (zh) 2017-10-20

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