TWI551439B - Liquid crystal polymer film with metal foil, method for producing the same, and multilayer printed wiring board, and manufacturing method thereof - Google Patents

Liquid crystal polymer film with metal foil, method for producing the same, and multilayer printed wiring board, and manufacturing method thereof Download PDF

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Publication number
TWI551439B
TWI551439B TW104114276A TW104114276A TWI551439B TW I551439 B TWI551439 B TW I551439B TW 104114276 A TW104114276 A TW 104114276A TW 104114276 A TW104114276 A TW 104114276A TW I551439 B TWI551439 B TW I551439B
Authority
TW
Taiwan
Prior art keywords
metal foil
liquid crystal
crystal polymer
polymer film
rough surface
Prior art date
Application number
TW104114276A
Other languages
English (en)
Chinese (zh)
Other versions
TW201605612A (zh
Inventor
Tadashi Mori
Masaya Koyama
Minoru Uno
Original Assignee
Panasonic Ip Man Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Ip Man Co Ltd filed Critical Panasonic Ip Man Co Ltd
Publication of TW201605612A publication Critical patent/TW201605612A/zh
Application granted granted Critical
Publication of TWI551439B publication Critical patent/TWI551439B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW104114276A 2014-06-05 2015-05-05 Liquid crystal polymer film with metal foil, method for producing the same, and multilayer printed wiring board, and manufacturing method thereof TWI551439B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014117069 2014-06-05

Publications (2)

Publication Number Publication Date
TW201605612A TW201605612A (zh) 2016-02-16
TWI551439B true TWI551439B (zh) 2016-10-01

Family

ID=54714180

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104114276A TWI551439B (zh) 2014-06-05 2015-05-05 Liquid crystal polymer film with metal foil, method for producing the same, and multilayer printed wiring board, and manufacturing method thereof

Country Status (4)

Country Link
JP (1) JP6653466B2 (ja)
KR (1) KR20150140221A (ja)
CN (2) CN105128450A (ja)
TW (1) TWI551439B (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7178634B2 (ja) * 2016-05-20 2022-11-28 パナソニックＩｐマネジメント株式会社 金属張積層板の製造方法、電子回路基板の製造方法
CN105973091A (zh) * 2016-06-22 2016-09-28 韩德庆 一种玻璃定栅数显卡尺
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
TWI697409B (zh) * 2019-02-25 2020-07-01 臻鼎科技股份有限公司 覆卷材料層疊體及其製備方法
CN114007832B (zh) * 2019-06-17 2024-04-19 株式会社可乐丽 覆金属层叠体的制造方法
CN112433405B (zh) * 2020-11-24 2022-04-19 中国科学技术大学 一种液晶高分子基板及其加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100236820A1 (en) * 2007-11-13 2010-09-23 Samsung Fine Chemicals Co., Ltd Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719354A (en) * 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
JPH1027960A (ja) * 1996-07-09 1998-01-27 Mitsui Mining & Smelting Co Ltd 多層プリント配線板の製造方法
JP2000264987A (ja) * 1999-03-11 2000-09-26 Kuraray Co Ltd 熱可塑性液晶ポリマーフィルムの熱処理方法
JP4064897B2 (ja) * 2002-08-28 2008-03-19 株式会社クラレ 多層回路基板およびその製造方法
JP2005081649A (ja) * 2003-09-08 2005-03-31 Toray Eng Co Ltd 液晶ポリマーフィルム積層基材の製造方法
JP4615226B2 (ja) * 2004-02-06 2011-01-19 古河電気工業株式会社 基板用複合材及びそれを用いた回路基板
JP2007258697A (ja) * 2006-02-27 2007-10-04 Nippon Steel Chem Co Ltd 多層プリント配線板の製造方法
TWI443015B (zh) * 2007-01-16 2014-07-01 Sumitomo Bakelite Co 絕緣樹脂片積層體、由該絕緣樹脂片積層體所積層而成之多層印刷配線板
JP5382410B2 (ja) * 2008-09-25 2014-01-08 日立化成株式会社 三層配線基板及びその製造方法
JP5661051B2 (ja) * 2010-01-29 2015-01-28 新日鉄住金化学株式会社 片面金属張積層体の製造方法
KR101913368B1 (ko) * 2010-08-12 2018-10-30 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 금속장 적층판

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100236820A1 (en) * 2007-11-13 2010-09-23 Samsung Fine Chemicals Co., Ltd Prepreg having uniform permittivity, and metal clad laminates and print wiring board using the same

Also Published As

Publication number Publication date
JP2016010967A (ja) 2016-01-21
CN110328934A (zh) 2019-10-15
KR20150140221A (ko) 2015-12-15
TW201605612A (zh) 2016-02-16
JP6653466B2 (ja) 2020-02-26
CN105128450A (zh) 2015-12-09

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