TWI549159B - A packing method with a substrate having an adsorbent layer and a packer and a packing device having a substrate having an adsorbent layer - Google Patents

Description

Bundling method for substrate with adsorption layer and packing device for packing body and substrate with adsorption layer

The present invention relates to a packing method of a substrate with an adsorption layer, a packing body, and a packing device for a substrate with an adsorption layer.

In order to reduce the thickness and weight of electronic components such as a display panel, a solar cell, and a thin film secondary battery, it is desirable to use a thin plate for a substrate such as a glass plate, a resin plate, or a metal plate.

However, when the thickness of the substrate is reduced, the handleability of the substrate is deteriorated, so that a functional layer for an electronic component (TFT: Thin Film Transistor, CF: Color Filter) is formed on the front surface of the substrate. It has become difficult.

Therefore, there has been proposed a method in which a reinforcing plate (substrate) having an adsorption layer on the front surface is used, and a back surface of the substrate is adsorbed on the adsorption layer on the reinforcing plate to form a laminate which reinforces the substrate by the reinforcing plate, and A functional layer is formed on the front surface of the substrate in a state of a laminate (see Patent Document 1). In this method, since the handleability of the substrate is improved, the functional layer can be favorably formed on the front surface of the substrate. Further, the reinforcing plate having the adsorption layer on the front surface is peeled off from the substrate after forming the functional layer, and the reinforced reinforcing plate which is peeled off is stacked in a plurality of sheets in a pallet (a packaging container).

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2010/090147

However, in the past, when the reinforcing plate accommodated in the pallet was taken out one by one from the pallet, the adjacent reinforcing plates were adsorbed by the adsorption layer, and it was difficult to take out the reinforcing plate piece by piece from the pallet. In order to eliminate such a problem, if a sheet such as a spacer paper is interposed between two adjacent reinforcing plates, it can be eliminated. However, this method has a case where a sheet is additionally required and the sheet is adsorbed to the adsorption layer, thus causing a problem that an operation for additionally removing the sheet is required.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a case where a plurality of substrates having an adsorption layer on the front surface are accommodated in a packaging container without interposing a sheet, and the package can be easily piece by piece from the package container. A packing method for removing a substrate with an adsorption layer of a substrate, a packing body, and a packing device for a substrate having an adsorption layer.

In order to achieve the above object, an aspect of the method for packaging a substrate with an adsorption layer of the present invention is characterized in that a plurality of substrates prepared with an adsorption layer on the front surface are prepared, and are formed on the front side of each of the plurality of substrates Traces are formed, and the plurality of substrate layers are stacked in a packaging container.

The "scratch" described in the present invention is a trace formed by the scratching action of the mark imparting mechanism. Specifically, in the substrate of the present invention, a groove portion is formed on the front surface of the adsorption layer by the scratching operation of the mark applying mechanism, and a groove portion is formed on both sides of the groove portion by the formation of the groove portion. Mountain department. The depth of the groove portion and the height of the mountain portion are based on the thickness of the adsorption layer (several micrometers to tens of micrometers) in micrometers. The technical feature of the present invention is that by forming a "scratch" on the front surface of the adsorption layer, the adsorption area of the adsorption layer is reduced, and the adsorption force between the substrates is lowered.

Further, in order to lower the adsorption force between the substrates, it is preferable to form a plurality of "scratches" on the front surface of the adsorption layer. Further, "scratches" can be formed regularly on the front surface of the adsorption layer, and "scratches" can be formed arbitrarily. Furthermore, in order to make the adsorption force of the substrates more advanced It is preferable to form a "scratch" uniformly on the front surface of the adsorption layer in one step.

As described above, according to one aspect of the present invention, by forming a scratch on the front surface of the adsorption layer, the adsorption force between the substrates is lowered, so that the plurality of substrates having the adsorption layer on the front side are not interposed between the sheets. In the case of being stored in a bale container, the substrate can be easily taken out one by one from the bale container.

In one aspect of the invention, it is preferred that the scratches are traces formed by a roller brush.

According to an aspect of the invention, the scratch can be easily formed by the roller brush.

In one aspect of the invention, it is preferred that the substrate be a glass plate having a thickness of 0.7 mm or less.

According to an aspect of the present invention, a substrate is suitable as a reinforcing plate for reinforcing a substrate for an electronic component.

In one aspect of the invention, it is preferred that the adsorption layer comprises a polyoxyn resin or a polyimide resin.

According to an aspect of the present invention, a scratch is formed on a front surface of an adsorption layer containing a polyoxymethylene resin or a polyimide resin, and a plurality of substrates are housed in a packaging container.

In order to achieve the above object, a package according to the present invention includes a plurality of substrates which are formed on a front surface of a substrate on which an adsorption layer is formed, and which is formed on the front side of the adsorption layer by a processing operation for forming a mark on the adsorption layer. And forming a mark; and a packaging container, wherein the plurality of substrates are stacked and stored.

According to an aspect of the present invention, when a plurality of substrates having an adsorption layer on the front surface are accommodated in a packaging container without interposing a sheet, the substrate can be easily taken out one by one from the packaging container.

In one aspect of the invention, it is preferable that the front surface and the back surface of each of the plurality of substrate substrates accommodated in the packaging container are stacked in the same direction.

According to an aspect of the present invention, the two substrates adjacent to each other are in contact with the adsorption layer of the other substrate. Thereby, the back surfaces of the substrates can be prevented from contacting each other, thereby preventing Damage to the substrate. One aspect of the present invention is suitable for the case where the substrate is a glass plate.

In one aspect of the invention, the substrate is preferably a glass plate having a thickness of 0.7 mm or less.

In one aspect of the invention, the adsorption layer comprises an organic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, or an organic polyimide resin. a film; or an inorganic film containing at least one selected from the group consisting of metal tellurides, nitrides, carbides, and carbonitrides.

In order to achieve the above object, a packaging apparatus for a substrate with an adsorption layer according to the present invention includes: a mark applying mechanism that forms a scratch on the adsorption layer of a substrate on which an adsorption layer is formed on the front surface; and a moving mechanism that will The mark applying mechanism presses the adsorption layer formed on the substrate to move the mark providing mechanism and the substrate relatively along the adsorption layer, and the storage mechanism has a mark applying mechanism on the front surface The substrate on which the scratched adsorption layer is formed is housed in a packaging container.

According to an aspect of the present invention, the trace imparting mechanism and the moving mechanism are used to form a mark on the front surface of the adsorption layer on the substrate. That is, on the one hand, the trace imparting mechanism and the substrate are relatively moved along the adsorption layer on the substrate by the moving mechanism, and the scratch-receiving layer is formed on the adsorption layer on the substrate by the trace imparting mechanism. Then, the substrate having the adsorption layer in which the scratches are formed is housed in the packaging container by the storage mechanism. Thereby, the processing operation for forming the trace on the adsorption layer and the storage operation of the substrate having the adsorption layer on which the trace is formed can be continuously performed, so that the efficiency of the series of operations (processing work and storage operation) can be improved.

In one aspect of the invention, it is preferable that the mark applying mechanism is a roll-shaped brush member that is rotatable, and the moving mechanism is a back surface on which the substrate is placed (a surface opposite to a surface on which the adsorption layer is formed) A conveyor on which the substrate moves along the adsorption layer.

According to an aspect of the present invention, the substrate is moved by the conveyor on the back surface of the conveyor mounting substrate as the moving mechanism, and the scraping brush member is rotatably formed by the trace imparting mechanism, and the scraping layer is formed on the adsorption layer. mark. Thereby, the scraping can be easily formed on the adsorption layer mark. Further, by using the roller-shaped brush member and the conveyor, the plurality of substrates can be continuously subjected to the processing operation for forming the traces on the adsorption layer, so that the efficiency of the above-described processing can be improved.

According to the packing method of the substrate with an adsorption layer of the present invention, and the packing device of the package and the substrate with the adsorption layer, the plurality of substrates having the adsorption layer on the front side are accommodated in the bundle without interposing the sheet. In the case of a container, the substrate can be easily taken out one by one from the package container.

1‧‧ ‧ laminated body

2‧‧‧Substrate

2a‧‧‧front of the substrate

2b‧‧‧Back of the substrate

3‧‧‧ reinforcing plate

3a‧‧‧ Strengthening the front of the board

3b‧‧‧ Back of the reinforcing plate

4‧‧‧ resin layer

10‧‧‧ Trace forming device

12‧‧‧ Roller brush

14‧‧‧Roller conveyor

16‧‧‧ core material

18‧‧‧ bristles

20‧‧‧roll

22‧‧‧ driven roller

24‧‧‧Locating pin

26‧‧‧ Moving out

28‧‧‧ Robot

30‧‧‧Board loading platform

32‧‧‧ Arm

34‧‧‧Adsorption pad

36‧‧‧ pallet

A‧‧‧ arrow

L‧‧‧ length

W‧‧‧Width

Fig. 1 is an enlarged side elevational view showing an essential part of an example of a laminated body.

Fig. 2 is a perspective view of the mark forming apparatus of the embodiment.

Fig. 3 is an explanatory view showing an overall configuration of a mark forming apparatus of the embodiment.

4(A) is an image of a resin layer in which a scratch is formed, and FIG. 4(B) is a graph showing a front surface property of a resin layer on which a scratch is formed.

Hereinafter, an embodiment of a packaging method of a substrate with an adsorption layer, a package body, and a packaging device with a substrate having an adsorption layer according to the present invention will be described with reference to the accompanying drawings.

Hereinafter, a mode in which the packaging method of the substrate with an adsorption layer of the present invention, and the package of the package and the substrate with the adsorption layer are placed in a manufacturing plant of the electronic component will be described.

The electronic component is an electronic component such as a display panel, a solar cell, or a thin film secondary battery. As the display panel, a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display) can be exemplified.

The electronic component is formed of a functional layer for an electronic component on the front surface of a substrate made of glass, resin, or metal (in the case of an LCD, a thin film transistor (TFT), a color filter) (CF)) manufactured.

The substrate is attached to the adsorption layer formed on the reinforcing plate (substrate) to form a laminate before the functional layer is formed, and the back surface (the surface opposite to the surface on which the functional layer is formed) is adsorbed. Thereafter, a functional layer is formed on the front surface of the substrate in a state of a laminate. Then, after the functional layer is formed, the reinforcing plate and the adsorption layer are peeled off from the substrate.

[Layer 1]

Fig. 1 is an enlarged side elevational view showing an essential part of an example of the laminated body 1.

The laminated body 1 includes a substrate 2 on which a functional layer is formed, and a reinforcing plate (substrate) 3 that reinforces the substrate 2. Moreover, the reinforcing plate 3 is provided with a resin layer (adsorption layer) 4 on the front surface 3a, and the back surface 2b of the substrate 2 is adsorbed on the resin layer 4. That is, the substrate 2 is adsorbed to the reinforcing plate 3 via the resin layer 4 by the van der Waals force acting between the resin layer 4 and the resin layer 4 or the adhesion of the resin layer 4.

[Substrate 2]

The substrate 2 is formed with a functional layer on the front surface 2a. The substrate 2 can be exemplified by a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, the glass substrate is excellent in chemical resistance and moisture permeability resistance, and has a small coefficient of linear expansion. Therefore, it is suitable as the substrate 2 for electronic components. Further, it has the advantage that as the coefficient of linear expansion becomes smaller, the pattern of the functional layer formed at a high temperature becomes less likely to move upon cooling.

Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high cerium oxide glass, and other oxide-based glass containing cerium oxide as a main component. The oxide-based glass is preferably a glass having a content of cerium oxide in an amount of 40 to 90% by mass in terms of oxide.

The glass of the glass substrate is preferably selected from the group of electronic components suitable for manufacturing. For example, in the glass substrate for liquid crystal panels, it is preferable to use a glass (alkali-free glass) which does not substantially contain an alkali metal component.

The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when the substrate 2 is a glass substrate, the thickness of the substrate 2 is thinner for the weight reduction and thinning of the electronic component. It is preferably set to 0.7 mm or less, more preferably set to 0.3 mm or less, and further preferably set to 0.1 mm or less. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Further, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll shape. However, from the viewpoint of the production of the glass substrate and the treatment of the glass substrate, the thickness of the glass substrate is preferably 0.03 mm. the above.

Further, in FIG. 1, the substrate 2 is composed of one substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the substrate 2 may be composed of a laminate in which a plurality of substrates are laminated. In this case, the total thickness of all the substrates constituting the laminate is in the above thickness range. Further, in this case, the types of the substrates constituting the laminated body may be different.

[Reinforcing board 3]

The reinforcing plate 3 may, for example, be a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, or a plate-like body in which the plate-like bodies are laminated.

The type of the reinforcing plate 3 is selected depending on the type of electronic component to be manufactured, the type of the substrate 2 used for the electronic component, and the like. When the reinforcing plate 3 and the substrate 2 are made of the same material, warpage and peeling due to temperature change can be reduced.

The difference (absolute value) between the average linear expansion coefficients of the reinforcing plate 3 and the substrate 2 is appropriately set depending on the size and shape of the substrate 2, and is preferably 35 × 10 ^-7 / ° C or less. Here, the "average linear expansion coefficient" means an average linear expansion coefficient in a temperature range of 50 to 300 ° C (JIS R3102: 1995). Furthermore, the contents of JIS R3102:1995 are incorporated herein by reference.

The thickness of the reinforcing plate 3 is preferably set to 0.7 mm or less, and is set according to the type of the reinforcing plate 3, the type and thickness of the reinforcing substrate 2, and the like. Further, the reinforcing plate 3 may have a thickness thicker than the substrate 2 or may be thinner than the substrate 2. However, in order to reinforce the substrate 2, it is preferably 0.4 mm or more.

Further, in the present embodiment, the reinforcing plate 3 is composed of one substrate, but the reinforcing plate 3 may be composed of a laminated body in which a plurality of substrates are laminated. In this case, all the reinforcing plates constituting the laminated body The total thickness becomes the above thickness range. Further, in this case, the type of the reinforcing plate constituting the laminated body may be different.

[Resin layer 4]

In order to prevent peeling between the resin layer 4 and the reinforcing plate 3, the resin layer 4 is set to have a bonding force with the reinforcing plate 3 higher than the bonding force with the substrate 2. Thereby, between the resin layer 4 and the substrate 2, the reinforcing plate 3 is peeled off from the substrate 2.

The resin constituting the resin layer 4 is not particularly limited, and examples thereof include an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, and a polyimide resin. Several kinds of resins can also be used in combination. Among them, from the viewpoint of heat resistance or peelability, a polyoxyxylene resin, a polyimide resin, and a polyimide polyimide resin are preferable from the viewpoint of heat resistance and peelability after high-temperature treatment. Preferably, it is a polyoxymethylene resin or a polyimide resin. In the present embodiment, a polyoxynitride resin layer is exemplified as the resin layer 4.

The polyoxyxylene resin used in the present invention is preferably disclosed in Japanese Laid-Open Patent Publication No. 2011-046174. For example, the polyoxyxylene resin is a cured product of a curable polyanthracene resin composition comprising the linear organopolyoxane (a) and the linear organopolyoxane (b) described below, preferably A cured polyoxyalkylene resin layer formed by curing the curable polyoxyxene resin composition on the front surface of the reinforcing plate is used.

Linear organopolyoxane (a): a linear organopolyoxane having at least 2 alkenyl groups per molecule.

a linear organopolyoxane (b): a linear organopolyoxane having at least 3 hydrogen atoms bonded to a halogen atom in each molecule, and at least one of the above-mentioned hydrogen atoms bonded to a halogen atom One helium atom present at the end of the molecule.

The thickness of the resin layer 4 is not particularly limited, but is preferably set to 1 to 50 μm, and more preferably set to 4 to 20 μm. When the thickness of the resin layer 4 is 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matter can be absorbed by the deformation of the resin layer 4. On the other hand, by setting the thickness of the resin layer 4 to 50 μm In this case, the formation time of the resin layer 4 can be shortened, and it is not necessary to use the resin of the resin layer 4 as described above, which is economical.

Further, the outer shape of the resin layer 4 is preferably the same as or smaller than the outer shape of the reinforcing plate 3, so that the reinforcing plate 3 can support the entirety of the resin layer 4. Further, the outer shape of the resin layer 4 is preferably the same as the outer shape of the substrate 2 or larger than the outer shape of the substrate 2, so that the resin layer 4 can adhere the entirety of the substrate 2.

Further, in Fig. 1, the resin layer 4 is composed of one layer, but the resin layer 4 may be composed of two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 becomes the thickness of the resin layer. Moreover, in this case, the kind of the resin which comprises each layer may differ.

Further, in the present embodiment, the resin layer 4 as an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer contains, for example, at least one selected from the group consisting of metal halides, nitrides, carbides, and carbonitrides.

The metal halide is, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba, preferably Tungsten carbide.

The nitride is, for example, at least one selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba. One type is preferably aluminum nitride, titanium nitride, or tantalum nitride.

The carbide is, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and preferably ruthenium carbide.

The carbonitride is, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably lanthanum carbonitride.

The metal halides, nitrides, carbides, and carbonitrides are included in the Si, N, or C of the material, and the difference in the electrical and electrical properties between the other elements contained in the material is small, and the polarization is small. Therefore, the reactivity of the inorganic film with water is low, and it is difficult to generate a hydroxyl group on the front side of the inorganic film. Thereby, the release property of the inorganic film and the substrate 2 as a glass substrate is favorably maintained.

A functional layer is formed on the front surface 2a of the substrate 2 of the laminated body 1. As a method of forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method or a PVD (Physical Vapor Deposition) method or a sputtering method can be used. The functional layer is formed into a specific pattern by a photolithography method or an etching method. After the functional layer is formed on the front surface 2a of the substrate 2, the reinforcing plate 3 and the resin layer 4 are peeled off from the substrate 2.

[Configuration of Trace Forming Device 10]

Next, the trace forming device 10 for forming a scratch on the resin layer 4 on the reinforcing plate 3 peeled off from the substrate 2 will be described.

2 is a perspective view showing an example of the mark forming device 10, and FIG. 3 is an explanatory view showing an overall configuration of the mark forming device 10.

The mark forming apparatus 10 includes a roll brush (roller-shaped brush member) 12 that is rotatable as a mark applying mechanism, a roll conveyor 14 as a moving mechanism, and the like.

The roller brush 12 is constructed by arranging the bristles 18 around the disk or the cylindrical core material 16. Further, the length L of the roller brush 12 is configured to be longer than the width W of the reinforcing plate 3. Thereby, the scratch of the roller brush 12 can be formed in the entire area of the resin layer 4 on the reinforcing plate 3.

The roller conveyor 14 is composed of a plurality of rollers 20 arranged in the horizontal direction, and is rotated by transmitting power from a driving source (not shown).

As shown in Fig. 3, the reinforcing plate 3 is placed on the roller 20 with the back surface 3b of the reinforcing plate 3, and the roller brush 12 is moved in the direction of the arrow A in the downward direction by the rotation of the roller 20. At this time, the resin layer 4 on the reinforcing plate 3 is pressed against the bristles 18 of the roller brush 12, and the scratches of the bristles 18 are formed on the front surface of the resin layer 4 by the rotating roller brush 12 while passing under the roller brush 12. . Thereby, scratches can be easily formed on the entire surface of the resin layer 4 (refer to FIG. 4(A)).

Further, by using the roller brush 12 and the roller conveyor 14, the plurality of reinforcing plates 3 can be continuously subjected to the processing for forming the scratches on the resin layer 4, so that the efficiency of the above-described processing can be improved.

Further, the mark forming device 10 of the present embodiment is made by the roller conveyor 14. The reinforcing plate 3 is moved along the front surface of the resin layer 4, but the reinforcing plate 3 may be fixed to move the roller brush 12 along the front surface of the resin layer 4. Further, instead of the roller brush 12, a sharp member such as a razor front end or a comb-tooth member may be used. In other words, any trace applying mechanism can be used as long as it is a trace applying mechanism capable of forming a scratch on the resin layer 4.

On the other hand, on the downstream side of the roller conveyor 14, a carry-out portion 26 including a plurality of driven rollers 22 and two positioning pins 24 is provided.

The reinforcing plate 3, which is moved by the roller conveyor 14, is transferred from the end of the roller conveyor 14 to the driven roller 22. Thereafter, the reinforcing plate 3 moves on the driven roller 22 by the inertial force, and abuts against the positioning pin 24 at a position where the moving speed is lowered, and is positioned by the carrying-out portion 26.

Further, a robot (storage mechanism) 28 is provided in the vicinity of the carry-out unit 26, and a pallet (package container) mounting table 30 is provided in the vicinity of the robot 28.

The robot 28 and the mark forming device 10 constitute the packing device of the present embodiment.

At the front end of the arm 32 of the robot 28, a plurality of adsorption pads 34 are mounted on the same plane. The operation of the arm 32 is controlled by a control unit (not shown), and the control unit controls the start and stop of adsorption of the adsorption pad 34. In other words, the control unit causes the arm 32 to hold the reinforcing plate 3 in the tray (the packaging container) 36 mounted on the pallet mounting table 30 by the position of the reinforcing plate 3 that can be positioned by the loading unit 26 by the suction pad 34. The action between the positions. Further, the control unit controls the adsorption pad 34 such that when the reinforcing plate 3 positioned by the carrying-out portion 26 is held by the adsorption pad 34, the adsorption operation of the adsorption pad 34 is started, and the reinforcing plate 3 is housed in the reinforcing plate 3 When the pallet 36 is placed, the adsorption operation of the adsorption pad 34 is stopped.

Thereby, the reinforcing plate 3 having the resin layer 4 in which the scratches are formed by the roller brush 12 can be accommodated in the pallet 36 by the robot 28. Thereby, the processing operation for forming the marks on the resin layer 4 and the storage operation of the reinforcing sheets 3 having the resin layer 4 having the scratches can be continuously performed, so that the processing work and the storage work can be made more efficient.

The plurality of reinforcing plates 3 having the resin layer 4 having the scratches are stacked and stored in the pallet 36 in the form of the package of the embodiment.

Moreover, it is preferable that the plurality of reinforcing plates 3 accommodated in the pallet 36 are laminated by the robot 28 so that the front surface and the back surface of the reinforcing plate 3 are in the same direction. Thereby, in the plurality of reinforcing plates 3 accommodated in the pallet 36, the two rear reinforcing plates 3 and 3 are in contact with the resin layer 4 formed on the other reinforcing plate 3 on the back surface of the reinforcing plate 3. Thereby, the back surfaces of the reinforcing plates 3 can be prevented from coming into contact with each other, so that the damage of the reinforcing plates 3 can be prevented. In this case, it is suitable for the case where the reinforcing plate 3 is a glass plate.

As described above, according to the mark forming apparatus 10 of the present embodiment, since the scratches can be formed in the resin layer 4, the adsorption force of the reinforcing reinforcing sheets 3 and the resin layer 4 can be lowered. Further, when fine particles of the resin layer 4 which are formed when the scratches are formed are interposed between the reinforcing plate 3 and the resin layer 4, the adsorption force of the reinforcing plate 3 and the resin layer 4 is also effectively reduced. Therefore, when the reinforcing plate 3 having the resin layer 4 on the front surface is laminated on the pallet 36 without interposing the sheet, the reinforcing plate 3 can be easily taken out from the pallet 36 one by one.

In addition, in FIG. 3, the pallet 36 in which the longitudinal reinforcement of the reinforcing plate 3 is accommodated in the upright position is exemplified, but the horizontally stacked pallet of the horizontal reinforcement plate 3 may be used.

[Examples]

[Experimental example]

<roller brush 12>

Brush diameter: 120mm

Brush material: nylon 66

Wire diameter of bristles: 0.1mm

Line length of bristles: 12.5mm

Number of revolutions: 100 rotations / minute

<Roller conveyor 14>

Weekly rate: about 200mm / sec

Under the above conditions, the reinforcing plate 3 on which the resin layer 4 is formed on the front surface is conveyed by the roller conveyor 14, and the resin layer 4 is formed with a scratch by the rotating roller brush 12.

4(A) is an image of the resin layer 4 on which the scratches are formed, and FIG. 4(B) is a graph showing the front surface property of the resin layer 4 on which the scratches are formed. The vertical axis of Fig. 4(B) indicates the depth of the groove of the scratch and the height of the mountain portion, and the horizontal axis indicates the width dimension of the reinforcing plate 3. In addition, as the positive property measuring device, a non-contact frontal property measuring device (product name: PF-60) manufactured by Sanying Optical Co., Ltd. was used. Further, the measurement pitch was set to 0.1 μm, and the measurement range was set to 200 μm.

As shown in Fig. 4(B), a groove having a depth of several micrometers and a mountain portion having a height of several micrometers are continuously formed on the front surface of the resin layer 4.

The reinforcing plate 3 having the resin layer 4 having the scratches formed thereon is laminated on the pallet 36 without interposing the sheets. Thereafter, the operation of taking out the reinforcing plate 3 from the pallet 36 is carried out, and as a result, the reinforcing plate 3 can be taken out one by one.

The present application is based on Japanese Patent Application No. 2013-266491, filed on Dec.

3‧‧‧ reinforcing plate

4‧‧‧ resin layer

10‧‧‧ Trace forming device

12‧‧‧ Roller brush

14‧‧‧Roller conveyor

16‧‧‧ core material

18‧‧‧ bristles

20‧‧‧roll

22‧‧‧ driven roller

24‧‧‧Locating pin

26‧‧‧ Moving out

L‧‧‧ length

W‧‧‧Width

Claims (11)

A method for packaging a substrate with an adsorption layer, characterized in that a plurality of substrates having an adsorption layer formed on a front surface thereof are prepared, and after forming a mark on a front surface of each of the plurality of substrates, the plurality of substrates are laminated It is stored in a bale container. A method of packing a substrate with an adsorption layer according to claim 1, wherein the trace is a trace formed by a roller brush. A method of packing a substrate with an adsorption layer according to claim 1 or 2, wherein the substrate is a glass plate having a thickness of 0.7 mm or less. A method of packing a substrate with an adsorption layer according to claim 1 or 2, wherein the adsorption layer comprises a polyoxyn resin or a polyimide resin. The method of packing a substrate with an adsorption layer according to claim 3, wherein the adsorption layer comprises a polyoxymethylene resin or a polyimide resin. A package body comprising: a plurality of substrates, wherein the substrate is formed with an adsorption layer on a front surface thereof, and a trace is formed on a front surface of the adsorption layer by a processing operation for forming a mark on the adsorption layer; and A container in which a plurality of substrates are stacked and stored. The package body according to claim 6, wherein the front surface and the back surface of the plurality of substrate-based substrates housed in the packaging container are stacked in the same direction. The package body of claim 6 or 7, wherein the substrate is a glass plate having a thickness of 0.7 mm or less. The package body according to claim 8, wherein the adsorption layer comprises an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a polyoxymethylene resin, or a polythene oxide. An organic film of a resin; or comprising a metal halide selected from the group consisting of An inorganic film of at least one of the group consisting of nitrides, carbides, and carbonitrides. A packing device for a substrate having an adsorption layer, comprising: a mark applying mechanism that forms a scratch on the adsorption layer of a substrate on which an adsorption layer is formed on the front surface; and a moving mechanism that presses the mark imparting mechanism Abutting the adsorption layer of the substrate to move the mark providing mechanism and the substrate relative to the adsorption layer; and a housing mechanism for storing the substrate on which the scratch is formed by the mark applying mechanism in the packaging container . The packing device of the substrate with an adsorption layer according to claim 10, wherein the mark applying mechanism is a roll-shaped brush member that is rotatable, and the moving mechanism is configured to mount a back surface of the substrate and move the substrate along the adsorption layer. Conveyor.