JP2015047648A - Processing method for laminate, and method of manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing method for a laminate, which reduces uneven wear of a sharpening wheel.SOLUTION: A processing method for a laminate includes a grinding step of grinding at least a part of an outer periphery of the plate-like laminate by a sharpening wheel. The sharpening wheel has an abrasive grain surface for grinding the laminate. The whole abrasive grain surface of the sharpening wheel is brought into contact with the outer periphery of the laminate while the sharpening wheel makes one revolution around a revolving shaft.

Description

  The present invention relates to a laminate processing method and an electronic device manufacturing method.

  A rotating grindstone is used for processing the plate-shaped laminate (see, for example, Patent Document 1). The rotating grindstone is rotated about its central axis and is relatively moved along the outer periphery of the laminated body to grind at least a part of the outer periphery of the laminated body.

International Publication No. 2012/157610

  FIG. 23 is a diagram illustrating a conventional method for processing a laminated body. As shown in FIG. 23, the laminated body 310 and the rotating grindstone 330 are arranged horizontally. The rotating grindstone 330 has an abrasive grain surface 331 for scraping the laminated body 310 on the outer periphery, and the abrasive grain surface 331 forms a groove.

  The relative position in the vertical direction of the laminated body 310 and the rotating grindstone 330 is always the same, and only a part of the abrasive grain surface 331 of the rotating grindstone 330 is worn. Further, the layers 311 and 312 constituting the stacked body 310 are thin and easily chipped. The piece 313 promotes wear of the rotating grindstone 330. For these reasons, the rotating grindstone 330 was easily subject to uneven wear.

  This invention is made | formed in view of the said subject, Comprising: The main objective is to provide the processing method of the laminated body which reduced the uneven wear of a rotating grindstone.

In order to solve the above problems, according to one aspect of the present invention,
Having a grinding step of grinding at least a part of the outer periphery of the plate-like laminate with a rotating grindstone,
The rotating grindstone has an abrasive surface for grinding the laminate,
There is provided a processing method of a laminated body in which the entire abrasive grain surface of the rotating grindstone is in contact with the outer periphery of the laminated body while the rotating grindstone makes one rotation around a rotation axis.

  According to one aspect of the present invention, a method for processing a laminated body in which uneven wear of a rotating grindstone is reduced is provided.

It is a side view which shows the laminated body before a process by 1st Embodiment of this invention. It is a figure which shows the 1st grinding process which grinds the laminated body of FIG. 1, Comprising: It is the figure seen from the arrow II direction of FIG. It is the figure seen from the arrow III direction of FIG. It is a figure which shows the laminated body obtained by the 1st grinding process shown in FIG. 2 and FIG. It is a figure which shows the 2nd grinding process which grinds the laminated body of FIG. 4, Comprising: It is the figure seen from the arrow V direction of FIG. It is the figure seen from the arrow VI direction of FIG. It is a figure which shows the laminated body obtained by the 2nd grinding process shown in FIG. 5 and FIG. It is a figure which shows the TFT substrate preparation process using the laminated body of FIG. It is a figure which shows the CF board | substrate preparation process using the laminated body of FIG. It is a figure which shows the assembly process of the TFT substrate of FIG. 8, and CF substrate of FIG. It is a figure which shows the peeling process performed after the process of FIG. 8, or the process of FIG. It is a figure which shows the organic EL element formation process using the laminated body of FIG. It is a figure which shows the bonding process performed after the process of FIG. It is a figure which shows the peeling process performed after the process of FIG. It is a figure which shows the solar cell element formation process using the laminated body of FIG. It is a figure which shows the peeling process performed after the process of FIG. It is a figure which shows the 1st grinding process by 2nd Embodiment, Comprising: It is the figure seen from the arrow XVII direction of FIG. It is the figure seen from the arrow XVIII direction of FIG. It is a figure which shows the 2nd grinding process by 2nd Embodiment, Comprising: It is the figure seen from the arrow XIX direction of FIG. It is the figure seen from the arrow XX direction of FIG. It is a figure which shows the 2nd grinding process by 3rd Embodiment, Comprising: It is the figure seen from the arrow XXI direction of FIG. It is the figure seen from the arrow XXII direction of FIG. It is a figure which shows the processing method of the conventional laminated body.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted. In addition, although the plate-shaped laminated body of this embodiment is a thing which can peel between predetermined layers among the several layers which comprise a laminated body, it may be difficult to peel and may be a liquid crystal display, for example. . In this specification, the boundary where the layers constituting the laminate are in contact with each other is called a laminate interface.

[First Embodiment]
FIG. 1 is a side view showing a laminated body before processing according to the first embodiment of the present invention. For example, as shown in FIG. 1, the laminate 10 before processing includes a glass substrate 11 and a reinforcing plate 12 that is detachably coupled to the glass substrate 11. The laminated body 10 is used for manufacturing a product after being processed by a processing method described later. A plurality of laminates 10 may be used for manufacturing one product. Examples of the product include electronic devices such as an image display device, a solar battery, and a thin film secondary battery. Examples of the image display device include a liquid crystal display, a plasma display, and an organic EL display.

  The glass substrate 11 is a part of the product, and a functional film corresponding to the type of product is formed on the glass substrate 11 in the product manufacturing process. The functional film may be composed of one layer or a plurality of layers.

  Examples of the glass of the glass substrate 11 include non-alkali glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glass mainly composed of silicon oxide. The oxide-based glass is preferably a glass having a silicon oxide content of 40% by mass to 90% by mass in terms of oxide. The glass of the glass substrate 11 is selected according to the type of product. For example, in the case of a liquid crystal display, glass (alkali-free glass) substantially not containing an alkali metal component is used.

  The thickness of the glass substrate 11 is 0.3 mm or less, for example, More preferably, it is 0.1 mm or less, More preferably, it is 0.05 mm or less. The thickness of the glass substrate 11 is preferably 0.01 mm or more from the viewpoint of moldability.

  The reinforcing plate 12 is bonded to the glass substrate 11 and reinforces the glass substrate 11 until the peeling operation between the reinforcing plate 12 and the glass substrate 11 is performed. The reinforcing plate 12 may be thicker than the glass substrate 11. The reinforcing plate 12 is peeled off from the glass substrate 11 during the manufacturing process of the product and does not become a part of the product.

  The reinforcing plate 12 preferably has a small difference in thermal expansion from the glass substrate 11 in order to prevent warpage or peeling due to heat treatment. Therefore, the reinforcing plate 12 preferably includes a glass plate, and the glass of the glass substrate 11 and the glass of the reinforcing plate 12 are preferably the same kind of glass.

  The reinforcing plate 12 includes, for example, an organic film 13 as an intermediate film that is detachably coupled to the glass substrate 11 and a support plate 14 that supports the glass substrate 11 via the organic film 13. The organic film 13 and the glass substrate 11 are detachably coupled by van der Waals force acting between them.

  The organic film 13 prevents the displacement of the glass substrate 11 until the peeling operation between the organic film 13 and the glass substrate 11 is performed. The organic film 13 is easily peeled from the glass substrate 11 by a peeling operation. The glass substrate 11 can be prevented from being damaged by the peeling operation.

  The organic film 13 is formed so that the bonding force with the support plate 14 is relatively higher than the bonding force with the glass substrate 11. Unintentional peeling between the organic film 13 and the support plate 14 during the peeling operation can be prevented.

  The organic film 13 is formed of, for example, an acrylic resin, a polyolefin resin, a polyurethane resin, a polyimide resin, a silicone resin, or a polyimide silicone resin. From the viewpoints of heat resistance and releasability, silicone resins and polyimide silicone resins are preferred.

  As the silicone resin, those disclosed in JP2011-46174A are preferable. Specifically, the silicone resin is preferably a cured product of a curable silicone resin composition containing the following linear organopolysiloxane (a) and the following linear organopolysiloxane (b).

  The linear organopolysiloxane (a) has at least two alkenyl groups per molecule.

  The linear organopolysiloxane (b) has at least three hydrogen atoms bonded to silicon atoms per molecule and has at least one hydrogen atom bonded to silicon atoms at the molecular end. is there.

  The molar ratio of hydrogen atoms bonded to all silicon atoms to all alkenyl groups in the curable silicone resin composition (hydrogen atom / alkenyl group) is preferably 0.7 to 1.05.

  The curable silicone resin composition may contain an additive such as a catalyst for promoting the reaction between a hydrogen atom bonded to silicon element and an alkenyl group. Examples of the catalyst include platinum, palladium, and rhodium.

  The organic film 13 may be formed so that the bonding force with the support plate 14 is relatively higher than the bonding force with the glass substrate 11. As a method for forming the organic film 13, there are the following methods (1) to (3).

  (1) After the resin composition applied on the support plate 14 is cured to form the organic film 13, the glass substrate 11 and the support plate 14 are pressure bonded via the organic film 13. The bonding force between the support plate 14 and the organic film 13 tends to be higher than the bonding force between the glass substrate 11 and the organic film 13.

  (2) After the resin composition applied on a predetermined base material is cured to form the organic film 13, the organic film 13 is peeled off from the predetermined base material, and the glass substrate 11 and the support plate are interposed through the organic film 13. 14 is crimped. In order to make a difference in bonding strength, at least one surface of the glass substrate 11 and the support plate 14 may be surface-treated in advance.

  (3) The organic film 13 is formed by curing the resin composition sandwiched between the glass substrate 11 and the support plate 14. In order to make a difference in bonding strength, at least one surface of the glass substrate 11 and the support plate 14 may be surface-treated in advance.

  The pressure bonding in the methods (1) and (2) may be performed in an environment with a high degree of cleanliness. The atmospheric pressure at the time of pressure bonding may be atmospheric pressure, but is preferably a negative pressure lower than atmospheric pressure in order to suppress air entrainment. There are a roll type, a press type, and the like as a method of pressure bonding. The pressure bonding temperature may be higher than room temperature, but may be room temperature in order to prevent deterioration of the organic film.

  The resin composition may be cured by any mechanism of condensation reaction type, addition reaction type, ultraviolet ray curable type, and electron beam curable type. The addition reaction type resin composition is particularly preferable because it easily cures, has excellent peelability, and has high heat resistance.

  The resin composition may be used in any form of a solvent type, an emulsion type, and a solventless type, but a solventless type is preferable from the viewpoint of productivity and environmental characteristics. Further, since the solventless resin composition does not contain a solvent that can foam during curing, the organic film 13 with few defects can be obtained.

  Examples of the method for applying the resin composition include spray coating, die coating, spin coating, dip coating, roll coating, bar coating, screen printing, and gravure coating. These coating methods are appropriately selected according to the type of the resin composition.

  The thickness of the organic film 13 is preferably 100 μm or less. If the thickness of the organic film 13 exceeds 100 μm, the material cost of the organic film 13 is high, and cracks are likely to occur in the organic film 13. The causes of cracks include (1) drying shrinkage of the resin composition, (2) cure shrinkage of the resin composition, and (3) thermal expansion difference between the glass and the resin. (1) occurs when the resin composition contains a solvent. When the solvent evaporates and the resin composition shrinks, the shrinkage is hindered by the substrate that supports the resin composition, stress is generated, and cracks are generated. In the case of (2), cracks occur due to removal of products such as water by the curing reaction. In the case of (3), after drying, when the resin is cooled, the heat shrinkage of the resin is significantly larger than the heat shrinkage of the glass, so that cracks occur. The thickness of the organic film 13 is more preferably 50 μm or less, and further preferably 30 μm or less.

  The thickness of the organic film 13 is preferably 1 μm or more. Foreign matter can be buried in the organic film 13. Since the resin composition has fluidity before curing, foreign substances are buried in the resin composition. When foreign matter enters between the organic film 13 and the glass substrate 11 after curing and before lamination, the foreign matter is buried in the organic film 13 due to elastic deformation of the organic film 13.

  The outer shape of the organic film 13 is preferably the same as or larger than the outer shape of the glass substrate 11 as shown in FIG. 1 so that the organic film 13 can support the entire glass substrate 11. When the outer shape of the organic film 13 is larger than the outer shape of the glass substrate 11, the reinforcing plate 12 and the glass substrate 11 are gradually peeled by bending and deforming the portion of the organic film 13 that protrudes from the glass substrate 11. It is done smoothly.

  In addition, although the organic film 13 of this embodiment consists of one type of organic film, it may consist of a plurality of types of organic films. In this case, “the thickness of the intermediate film” means the total thickness of all the organic films.

  The support plate 14 supports the glass substrate 11 through the organic film 13. The support plate 14 is preferably a glass plate having a small difference in thermal expansion from the glass substrate 11.

  The thickness of the glass plate as the support plate 14 is preferably 0.7 mm or less. The thickness of the glass plate as the support plate 14 is preferably 0.4 mm or more for reinforcing the glass substrate 11.

  The outer shape of the support plate 14 is preferably the same as or larger than the outer shape of the organic film 13 as shown in FIG. 1 so that the support plate 14 can support the entire organic film 13. .

  The support plate 14 of the present embodiment is a single plate made of only a glass plate, but may be a composite plate made of a glass plate and a resin film.

  FIG. 2 is a diagram showing a first grinding process for grinding the laminated body of FIG. 1, and is a diagram seen from the direction of arrow II in FIG. FIG. 3 is a view seen from the direction of arrow III in FIG. FIG. 4 is a view showing a laminate obtained by the first grinding step shown in FIGS. 2 and 3. In FIG. 4, the laminated body 10 used for a 1st grinding process is shown with a broken line. FIG. 5 is a diagram showing a second grinding process for grinding the laminated body of FIG. 4, and is a view seen from the direction of arrow V in FIG. 6 is a view as seen from the direction of arrow VI in FIG. FIG. 7 is a view showing a laminate obtained by the second grinding step shown in FIGS. 5 and 6. In FIG. 7, the laminated body 10 </ b> A used for the second grinding process is indicated by a broken line.

  The processing method of the laminated body 10 includes a first grinding process and a second grinding process. The first grinding step is a step of adjusting the laminate to a desired size and making the side surface of the glass substrate, the side surface of the organic film, and the side surface of the support plate substantially flush. The second grinding step is a step for chamfering the laminate obtained by the first grinding step.

  In the first grinding step, as shown in FIGS. 2 and 3, at least a part of the outer periphery of the laminate 10 is ground by the rotating grindstone 21 to obtain a laminate 10A shown in FIG. A laminated body 10A shown in FIG. 4 is obtained by grinding the laminated body 10 shown in FIG.

  As shown in FIGS. 2 and 3, the rotating grindstone 21 has a cylindrical shape (including a disc shape), and has an abrasive grain surface 21a for grinding the laminated body 10 on the outer periphery, and has grinding grooves on the abrasive grain surface 21a. I don't have it. The abrasive grain surface 21a includes abrasive grains and bonds. The types of abrasive grains and bonds may be common. For example, examples of the rotating grindstone 21 include a metal bond grindstone, an electrodeposition grindstone, a vitrified bond grindstone, and an elastic grindstone.

  In addition, although the rotary grindstone 21 of this embodiment is a column shape, a truncated cone shape may be sufficient. The abrasive grain surface of the rotating grindstone 21 may have a taper.

  The rotating grindstone 21 is rotated about its central axis and relatively moved along the outer periphery of the laminate 10 to grind at least a part of the outer periphery of the laminate 10. When the rotating grindstone 21 and the laminated body 10 are relatively moved, either may be moved, or both may be moved.

  As shown in FIG. 2, the central axis of the rotating grindstone 21 is arranged on the same plane as the center surface in the plate thickness direction of the laminate 10 and is parallel to one side of the substantially rectangular laminate 10. The one side is ground by the rotating grindstone 21. A plurality of sides may be ground sequentially. On the central axis of the rotating grindstone 21, a rotation axis X21 is disposed.

  The abrasive surface 21a of the rotating grindstone 21 is an annular curved surface as shown in FIG. 2, and continuously contacts the outer periphery of the laminate 10 from one side end 21b to the other side end 21c shown in FIG. . In this state, the rotating grindstone 21 rotates around the rotation axis X21. Therefore, the entire abrasive grain surface 21a of the rotating grindstone 21 is in contact with the outer periphery of the laminate 10 while the rotating grindstone 21 makes one rotation around the rotation axis X21. Therefore, the partial wear of the rotating grindstone 21 can be reduced as compared with the conventional case where only a part of the abrasive grain surface of the rotating grindstone is in contact with the laminate.

  By the way, each layer constituting the laminate 10 is thin and easily chipped. The piece promotes the wear of the rotating grindstone 21. Fragments are likely to occur in the vicinity of the laminate interface of the laminate 10.

  At least one of the lamination interfaces of the laminate 10 (in this embodiment, the interface between the glass substrate 11 and the organic film 13 and the interface between the organic film 13 and the support plate 14) is from one end 21b to the other end 21c of the abrasive grain surface 21a. The first grinding process is performed in a state of continuous contact. Since the probability of hitting the pieces is the same everywhere on the abrasive grain surface 21a, uneven wear due to the pieces can be reduced.

  The laminated body 10A obtained by the first grinding step has a glass substrate 11A and a reinforcing plate 12A, similarly to the laminated body 10 before processing. This reinforcing plate 12A has an organic film 13A and a supporting plate 14A, like the reinforcing plate 12 before processing. The side surface of the glass substrate 11A, the side surface of the organic film 13A, and the side surface of the support plate 14A are substantially flush with the rotating grindstone 21, and the side surface of the laminated body 10A is substantially perpendicular to the main surface of the laminated body 10A.

  In the second grinding step, a portion of the laminated body 10A ground by the rotating grindstone 21 is chamfered by a plurality of multi-grinding stones 31 and 34 to obtain the laminated body 10B. A laminated body 10B shown in FIG. 7 is obtained by chamfering the laminated body 10A shown in FIG.

The plurality of multi-grinding stones 31 and 34 are used in combination, and the boundary portions 15A and 16A between the main surface and the side surface of the laminated body 10A shown in FIG. 4 are scraped to create the chamfered portions 15B and 16B shown in FIG. The chamfered portions 15B and 16B are flat surfaces that are oblique to the main surface of the stacked body 10B. The chamfered portions 15B and 16B are connected via a flat portion 17B perpendicular to the main surface of the stacked body 10B.
When an object such as a positioning pin perpendicular to the main surface of the stacked body 10B hits the side surface of the stacked body 10B, the parallel object and the flat portion 17B come into contact with each other. Therefore, the contact state between the object and the laminated body 10B is stabilized, and when the object is a positioning pin, the positioning accuracy is good.

  The upper multi-grinding stone 31 includes a plurality of rotating grindstones 32 and 33 as shown in FIG. The plurality of rotating grindstones 32 and 33 may be connected coaxially and simultaneously rotated at the same rotational speed. Each rotary grindstone 32, 33 has a cylindrical shape, and has abrasive grain surfaces 32a, 33a for grinding the laminated body 10A on the outer periphery, and does not have grinding grooves on the abrasive grain surfaces 32a, 33a.

  In addition, although the rotary grindstones 32 and 33 of this embodiment are cylindrical, they may be truncated cones. The abrasive grain surfaces of the rotating grindstones 32 and 33 may have a taper.

  Each rotary grindstone 32, 33 is rotated about its central axis and relatively moved along the outer periphery of the laminate 10A, and grinds the portion ground by the rotary grindstone 21 of the laminate 10A. When the multi-grinding stone 31 and the laminated body 10A are moved relatively, either may be moved, or both may be moved.

  As shown in FIG. 6, the central axes of the rotary grindstones 32 and 33 are arranged above the center surface in the thickness direction of the laminated body 10A, and are parallel to one side of the substantially rectangular laminated body 10A. . The one side is ground by the rotating grindstones 32 and 33. A plurality of sides may be ground sequentially. A rotation axis X31 is disposed on the central axis of each rotary grindstone 32, 33.

  The lower multi-grinding stone 34 is configured similarly to the upper multi-grinding stone 31 and includes a plurality of rotating grindstones 35 and 36. The central axes of the rotating grindstones 35 and 36 are disposed below the center plane in the thickness direction of the laminated body 10A, and are parallel to one side of the substantially rectangular laminated body 10A. On the central axis of each rotary grindstone 35, 36, a rotation axis X34 is disposed.

  The abrasive grain surfaces 32a, 33a, 35a, 36a of the respective rotating grindstones 32, 33, 35, 36 are annular curved surfaces, and from one side end 32b, 33b, 35b, 36b shown in FIG. 6 to the other side end. 32c, 33c, 35c, and 36c are continuously in contact with the outer periphery of the laminate 10A. In this state, the rotating grindstones 32, 33, 35, and 36 rotate about the respective rotation axes X31 and X34. Therefore, while each rotary grindstone 32, 33, 35, 36 makes one rotation around the respective rotation axis X31, X34, the entire abrasive surface of each rotary grindstone 32, 33, 35, 36 is the outer periphery of the laminate 10A. Contact with. Therefore, the partial wear of each rotary grindstone 32, 33, 35, 36 can be reduced as compared with the prior art.

  Any of the lamination interfaces of the laminate 10A (in this embodiment, the interface between the glass substrate 11A and the organic film 13A and the interface between the organic film 13A and the support plate 14A) is in contact with the respective abrasive grain surfaces 32a, 33a, 35a, and 36a. The second grinding step is performed in a state where no operation is performed (see FIG. 7). In the 2nd grinding process, since neither of the lamination | stacking interfaces of 10 A of laminated bodies is ground, generation | occurrence | production of a piece can be reduced and the partial wear by a piece can be suppressed.

  In the present embodiment, the rotating grindstone 21 is used in the first grinding step. However, instead of the rotating grindstone 21, one of the multiple grindstones 31 and 34 may be used, and the remaining multi grindstones are used. May not be used in the first grinding step.

  In the present embodiment, in the second grinding step, the plurality of chamfered portions 15B and 16B are simultaneously formed using the plurality of multi-grinding stones 31 and 34 in order to shorten the processing time. A plurality of chamfered portions 15B and 16B may be sequentially formed using

  In the present embodiment, the first grinding process is performed before the second grinding process, but the first grinding process may not be performed. For example, a cutting process may be performed instead of the first grinding process. In the cutting step, as in the first grinding step, the laminate can be adjusted to a desired size, and the side surface of the glass substrate, the side surface of the organic film, and the side surface of the support plate can be made substantially flush.

  In the present embodiment, in the second grinding step, the upper rotary grindstones 32 and 33 and the lower rotary grindstones 35 and 36 do not contact any of the laminated interfaces of the laminate, but at least one of the laminated interfaces You may touch. For example, when the thickness of the glass substrate 11A is thinner than the thickness of the support plate 14A and the thickness of the organic film 13A is negligibly small with respect to the thickness of the glass substrate 11A or the thickness of the support plate 14A, The lamination interface may come into contact with the upper rotating grindstone. In this case, a 2nd grinding process may be performed in the state which the lamination | stacking interface of the laminated body contacted continuously from the one end of the abrasive grain surface of the upper rotating grindstone to the other end.

  Next, the manufacturing method of the electronic device using the laminated body 10B obtained by the said processing method is demonstrated.

  The laminated body 10B obtained by the said processing method has the glass substrate 11B and the reinforcement board 12B similarly to the laminated body 10 before a process. This reinforcing plate 12B has an organic film 13B and a support plate 14B, as with the reinforcing plate 12 before processing.

  The method for manufacturing an electronic device includes a step of forming a functional film on the glass substrate 11B of the laminate 10B, and a step of peeling the glass substrate 11B and the reinforcing plate 12B on which the functional film is formed. Hereinafter, specific examples will be described.

  The liquid crystal display manufacturing method includes, for example, a TFT substrate manufacturing process (see FIG. 8), a CF substrate manufacturing process (see FIG. 9), an assembly process (see FIG. 10), and a peeling process (see FIG. 11).

  In the TFT substrate manufacturing process, as shown in FIG. 8, a thin film transistor (TFT) 41 or the like is formed on the glass substrate 11B of the laminated body 10B to manufacture the TFT substrate. The TFT substrate 42 includes a glass substrate 11B, a thin film transistor 41, and the like. Since the manufacturing method of the TFT substrate 42 is a general method, description thereof is omitted.

  In the CF substrate manufacturing process, as shown in FIG. 9, a color filter 43 and the like are formed on a glass substrate 11B of another laminated body 10B to manufacture a CF substrate 44. The CF substrate 44 includes a glass substrate 11B, a color filter 43, and the like. Since a method for manufacturing the CF substrate 44 is a general method, a description thereof will be omitted.

  As shown in FIG. 10, the assembly process includes a process of sealing a liquid crystal material 45 between the TFT substrate 42 and the CF substrate 44. The method of injecting the liquid crystal material 45 between the TFT substrate 42 and the CF substrate 44 may be either a reduced pressure injection method or a drop injection method.

  In the peeling step, as shown in FIG. 11, the glass substrate 11B and the reinforcing plate 12B are peeled off. The glass substrate 11B becomes a part of the liquid crystal display, and the reinforcing plate 12B does not become a part of the liquid crystal display. In this embodiment, the peeling process is performed after the assembly process, but may be performed after the TFT substrate manufacturing process and the CF substrate manufacturing process, or may be performed before the assembly process or in the middle of the assembly process.

  In the present embodiment, the thin film transistor 41 and the color filter 43 are formed on the glass substrate 11B of the separate laminate 10B, respectively, but either may be formed on a single glass substrate.

  The method for manufacturing an organic EL display (OLED) includes, for example, an organic EL element forming step (see FIG. 12), a bonding step (see FIG. 13), and a peeling step (see FIG. 14).

  In the organic EL element forming step, as shown in FIG. 12, the organic EL element 51 is formed on the glass substrate 11B of the laminate 10B. The organic EL element 51 includes, for example, a transparent electrode layer, a hole transport layer, a light emitting layer, an electron transport layer, and the like. Since the formation method of the organic EL element 51 is a general method, description is abbreviate | omitted.

  In the bonding step, as shown in FIG. 13, the glass substrate 11B on which the organic EL element 51 is formed and the counter substrate 52 are bonded together.

  In the peeling step, as shown in FIG. 14, the glass substrate 11B and the reinforcing plate 12B are peeled off. The glass substrate 11B becomes a part of the organic EL display, and the reinforcing plate 12B does not become a part of the organic EL display. Although the peeling process is performed after the bonding process in the present embodiment, it may be performed after the organic EL element forming process, or may be performed before the bonding process or in the middle of the bonding process.

  The method for manufacturing a solar cell includes a solar cell element forming step (see FIG. 15) and a peeling step (see FIG. 16).

  In the solar cell element forming step, as shown in FIG. 15, the solar cell element 61 is formed on the glass substrate 11B of the laminate 10B. The solar cell element 61 is made of, for example, a transparent electrode layer or a semiconductor layer. Since the formation method of the solar cell element 61 is a general method, description is abbreviate | omitted.

  In the peeling process, as shown in FIG. 16, the glass substrate 11B and the reinforcing plate 12B are peeled off. The glass substrate 11B becomes a part of the solar cell, and the reinforcing plate 12B does not become a part of the solar cell. The peeling step may be performed after the solar cell element forming step.

[Second Embodiment]
The processing method of the second embodiment is different from the processing method of the first embodiment in the type of rotary grindstone used. Hereinafter, the difference will be mainly described.

  FIG. 17 is a diagram showing a first grinding process according to the second embodiment, and is a diagram seen from the direction of arrow XVII in FIG. 18. 18 is a view as seen from the direction of arrow XVIII in FIG. The laminate obtained by the first grinding step shown in FIGS. 17 and 18 is the same as the laminate shown in FIG. FIG. 19 is a diagram showing a second grinding process according to the second embodiment, and is a diagram seen from the direction of the arrow XIX in FIG. 20 is a view as seen from the direction of arrow XX in FIG. The laminate obtained by the second grinding step shown in FIGS. 19 and 20 is the same as the laminate shown in FIG.

  The processing method of the laminated body 10 includes a first grinding process and a second grinding process. The first grinding step is a step of adjusting the laminate to a desired size and making the side surface of the glass substrate, the side surface of the organic film, and the side surface of the support plate substantially flush. The second grinding step is a step for chamfering the laminate obtained by the first grinding step.

  In the first grinding step, as shown in FIGS. 17 and 18, at least a part of the outer periphery of the laminated body 10 is ground with a cup grindstone 121 as a rotating grindstone to obtain a laminated body 10A shown in FIG.

  The cup grindstone 121 has a disk part and a cylindrical part. The disk portion and the cylindrical portion are connected coaxially. The end surface of the cylindrical portion opposite to the disk portion is an abrasive surface 121a for grinding the laminate 10.

  The cup grindstone 121 is rotated about its central axis and is relatively moved along the outer periphery of the laminate 10 to grind at least a part of the outer periphery of the laminate 10. When the cup grindstone 121 and the laminated body 10 are moved relative to each other, either may be moved, or both may be moved.

  The center axis of the cup grindstone 121 is arranged on the same plane as the center plane in the thickness direction of the laminate 10 as shown in FIGS. 17 and 18 and is perpendicular to one side of the substantially rectangular laminate 10. The The one side is ground by the cup grindstone 121. A plurality of sides may be ground sequentially. On the central axis of the cup grindstone 121, the rotation axis X121 is disposed.

  The abrasive grain surface 121a of the cup grindstone 121 is an annular flat surface as shown in FIG. 18, and continuously contacts the outer periphery of the laminate 10 from the outer periphery 121b to the inner periphery 121c. In this state, the cup grindstone 121 rotates around the rotation axis X121. Therefore, the entire abrasive grain surface 121a of the cup grindstone 121 is in contact with the outer periphery of the laminate 10 while the cup grindstone 121 rotates once around the rotation axis X121. Therefore, the uneven wear of the cup grindstone 121 can be reduced as compared with the conventional case where only a part of the abrasive grain surface of the rotating grindstone is in contact with the laminate.

  At least one of the lamination interfaces of the laminate 10 (in this embodiment, the interface between the glass substrate 11 and the organic film 13 and the interface between the organic film 13 and the support plate 14) is from one end 121b to the other end 121c of the abrasive grain surface 121a. The first grinding process is performed in a state of continuous contact. Since the probability of hitting the pieces is the same everywhere on the abrasive grain surface 121a, uneven wear due to the pieces can be reduced.

  Note that, according to the present embodiment, when the cup grindstone 121 rotates halfway around the rotation axis X121, the entire abrasive grain surface 121a of the cup grindstone 121 comes into contact with the outer periphery of the laminate 10.

  In the second grinding step, the portion of the laminated body 10A ground by the cup grindstone 121 is chamfered by a plurality of cup grindstones 131 and 134 to obtain the laminated body 10B shown in FIG.

  The plurality of cup grindstones 131 and 134 are used in combination, and the boundary portions 15A and 16A between the main surface and the side surface of the laminate 10A shown in FIG. 4 are scraped to create the chamfered portions 15B and 16B shown in FIG. The chamfered portions 15B and 16B are flat surfaces that are oblique to the main surface of the stacked body 10B. The chamfered portions 15B and 16B are connected via a flat portion 17B perpendicular to the main surface of the stacked body 10B.

  In the present embodiment, a plurality of chamfered portions 15B and 16B are simultaneously formed using a plurality of cup grindstones 131 and 134 in order to shorten the processing time, but a plurality of chamfered portions are formed using any one cup grindstone. 15B and 16B may be formed sequentially. In the present embodiment, different cup grindstones are used in the second grinding step and the first grinding step, but the same cup grindstone may be used. Specifically, in the first grinding step, any of the cup grindstones 131 and 134 shown in FIG. 19 may be used instead of the cup grindstone 121 shown in FIG.

  Each cup grindstone 131, 134 is rotated about its central axis and is relatively moved along the outer periphery of the laminated body 10A, and grinds the portion ground by the cup grindstone 121 of the laminated body 10A. When the cup grindstones 131 and 134 and the laminated body 10A are relatively moved, either one may be moved, or both may be moved.

  As shown in FIG. 19, the central axis of one cup grindstone 131 is inclined with respect to the rectangular upper surface of the laminated body 10A, and when viewed from a direction perpendicular to the upper surface, the central axis is one side of the upper surface. In contrast, it is vertical. The one side is ground by the cup grindstone 131. A plurality of sides may be ground sequentially. On the central axis of the cup grindstone 131, a rotation axis X131 is disposed.

  The center axis of the other cup grindstone 134 is inclined with respect to the rectangular lower surface of the laminated body 10A, and is perpendicular to one side of the lower surface when viewed from a direction perpendicular to the lower surface. Is done. The one side is ground by the cup grindstone 134. A plurality of sides may be ground sequentially. On the central axis of the cup grindstone 134, the rotation axis X134 is disposed.

  The abrasive grain surfaces 131a and 134a of the cup grindstones 131 and 134 are annular flat surfaces, and continuously contact the outer periphery of the laminated body 10A from the outer periphery 131b and 134b to the inner periphery 131c and 134c shown in FIG. In this state, the cup grindstones 131 and 134 rotate about the respective rotation axes X131 and X134. Therefore, the entire abrasive grains 131a and 134a of the cup grindstones 131 and 134 are in contact with the outer periphery of the laminated body 10A while the cup grindstones 131 and 134 make one rotation around the rotation axes X131 and X134. Therefore, uneven wear of each cup grindstone 131, 134 can be reduced as compared with the conventional case.

  Any of the lamination interfaces of the laminate 10A (in this embodiment, the interface between the glass substrate 11A and the organic film 13A and the interface between the organic film 13A and the support plate 14A) is not in contact with the respective abrasive grain surfaces 131a and 134a. 2 is performed (see FIG. 7). In the 2nd grinding process, since neither of the lamination | stacking interfaces of 10 A of laminated bodies is ground, generation | occurrence | production of a piece can be reduced and the partial wear by a piece can be suppressed.

  In the present embodiment, in the second grinding step, the cup grindstones 131 and 134 do not contact any of the laminated interfaces of the laminated body, but may contact at least one of the laminated interfaces. For example, when the thickness of the glass substrate 11A is thinner than the thickness of the support plate 14A and the thickness of the organic film 13A is negligibly small with respect to the thickness of the glass substrate 11A or the thickness of the support plate 14A, The laminated interface may come into contact with one cup grindstone 131. In this case, the second grinding step may be performed in a state where the stack interface of the stacked body is continuously in contact from one end 131b to the other end 131c of the abrasive grain surface 131a of the cup grindstone 131.

[Third Embodiment]
The processing method of the third embodiment is different from the processing method of the first embodiment in the type of the rotating grindstone used in the second grinding step. The kind of rotary grindstone used in the first grinding process is the same. Hereinafter, the difference will be mainly described.

  FIG. 21 is a diagram showing a second grinding process according to the third embodiment, and is a diagram seen from the direction of the arrow XXI in FIG. 22 is a view as seen from the direction of arrow XXII in FIG. Since the laminated body obtained by the second grinding step shown in FIGS. 21 and 22 is the same as the laminated body 10B shown in FIG. 7, the illustration is omitted.

  In the second grinding step, at least a part of the outer periphery of the laminate 10A shown in FIG. 4 is ground by the rotating grindstone 231 as shown in FIGS.

  The rotating grindstone 231 is cylindrical as shown in FIGS. 21 and 22, and has an abrasive grain surface 231a for grinding the laminated body 10A on the outer periphery. The abrasive grain surface 231a forms a grinding groove having a V-shaped cross section. The grinding groove has a flat bottom at the bottom of the grinding groove. A flat portion 17B can be formed between the chamfered portions 15B and 16B shown in FIG.

  The rotating grindstone 231 is rotated around its central axis and is relatively moved along the outer periphery of the laminated body 10A to grind at least a part of the outer periphery of the laminated body 10A. When the rotary grindstone 231 and the laminated body 10A are relatively moved, either may be moved, or both may be moved.

  The central axis of the rotating grindstone 231 is disposed obliquely with respect to the main surface of the laminated body 10A as shown in FIG. 21, and when viewed from a direction perpendicular to the main surface of the laminated body 10A as shown in FIG. Are parallel to one side of the substantially rectangular laminate 10A. The one side is ground by the rotating grindstone 231. A plurality of sides may be ground sequentially. A rotation axis X231 is disposed on the central axis of the rotating grindstone 231.

  The abrasive grain surface 231a of the rotating grindstone 231 is an annular curved surface, and continuously contacts the outer periphery of the laminate 10A from one side end 231b to the other side end 231c shown in FIG. In this state, the rotating grindstone 231 rotates around the rotation axis X231. Therefore, the entire abrasive grain surface 231a of the rotating grindstone 231 is in contact with the outer periphery of the laminate 10A while the rotating grindstone 231 makes one rotation around the rotation axis X231. Therefore, the partial wear of the rotating grindstone 231 can be reduced as compared with the conventional case where only a part of the abrasive grain surface of the rotating grindstone is in contact with the laminate.

  At least one of the lamination interfaces of the laminated body 10A (in this embodiment, the interface between the glass substrate 11A and the organic film 13A and the interface between the organic film 13A and the support plate 14A) is from one end 231b to the other end 231c of the abrasive grain surface 231a. The second grinding process is performed in a state of continuous contact. Since the probability of hitting the pieces is the same everywhere on the abrasive grain surface 21a, uneven wear due to the pieces can be reduced.

  Further, since the central axis of the rotating grindstone 231 is disposed obliquely with respect to the main surface of the laminated body 10, fluctuations in the thickness of the laminated body 10 do not become a problem. In order to reduce uneven wear of the rotating grindstone when the central axis of the grindstone is arranged perpendicular to the main surface of the laminate, the groove width of the grinding groove and the thickness of the laminate must match. Therefore, a variation in the thickness of the laminated body becomes a problem.

  In the present embodiment, the laminated body 10A used for the second grinding step is obtained by the first grinding step shown in FIGS. 2 and 3, but the first grinding shown in FIGS. It may be obtained by a process. In addition, the first grinding process may not be performed before the second grinding process.

  Further, the grinding groove of the rotary grindstone 231 of the present embodiment has a V-shaped cross section and the bottom of the grinding groove is flat, but it may be round or pointed. In any case, the entire abrasive grain surface of the rotating grindstone may be in contact with the laminate while the rotating grindstone rotates once around the rotation axis.

  As mentioned above, although embodiment of the processing method of a laminated body, etc. was described, this invention is not limited to the said embodiment etc., In the range of the summary of this invention described in the claim, various deformation | transformation and improvement Is possible.

  For example, in the above embodiment, an organic film is used as the intermediate film of the reinforcing plate, but an inorganic film may be used. The inorganic film includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

  The metal silicide includes, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba. Is tungsten silicide.

  The nitride is, for example, at least one selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba. It contains seeds, preferably aluminum nitride, titanium nitride, or silicon nitride.

  The carbide includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbide.

  The carbonitride includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbonitride.

  Metal silicide, nitride, carbide, and carbonitride have a small difference in electronegativity between Si, N, or C contained in the material and other elements contained in the material, and have a small polarization. Therefore, the reactivity between the inorganic film and water is low, and hydroxyl groups are unlikely to be generated on the surface of the inorganic film. Therefore, the releasability between the inorganic film and the glass substrate is kept good.

  Moreover, although the reinforcing plate of the said embodiment has an intermediate film and a support plate, there may not be an intermediate film. For example, the reinforcing plate may be composed only of a glass plate, and the glass plate as the reinforcing plate and the glass substrate 11 may be in direct contact.

  Moreover, in the said embodiment, although a glass substrate is used as a board | substrate, a ceramic substrate, a resin substrate, a metal substrate, etc. may be used. Similarly, in the above embodiment, a glass plate is used as the support plate, but a ceramic plate, a resin plate, a metal plate, or the like may be used.

10, 10A, 10B Laminate 11, 11A, 11B Glass substrate 12, 12A, 12B Reinforcement plate 13, 13A, 13B Intermediate film 14, 14A, 14B Support plate 21 Rotating whetstone 31 Multi grindstone 32, 33 Rotating whetstone 34 Multi grindstone 35 , 36 Rotary grinding wheel 121, 131, 134 Cup grinding wheel

Claims (7)

Having a grinding step of grinding at least a part of the outer periphery of the plate-like laminate with a rotating grindstone,
The rotating grindstone has an abrasive surface for grinding the laminate,
The processing method of a laminated body, wherein the entire abrasive grain surface of the rotating grindstone is in contact with the outer periphery of the laminated body while the rotating grindstone makes one rotation around a rotation axis.   The processing method of a laminated body according to claim 1, wherein the grinding step is performed in a state in which at least one of the laminated interfaces of the laminated body is in continuous contact from one end to the other end of the abrasive grain surface.   The processing method of a laminated body according to claim 1, wherein the grinding step is performed in a state where none of the laminated interfaces of the laminated body is in contact with the abrasive grain surface.   The said laminated body is a processing method of the laminated body of any one of Claims 1-3 which has a reinforcing plate couple | bonded with a board | substrate and this board | substrate so that peeling is possible.   The laminate processing method according to claim 4, wherein the reinforcing plate includes an intermediate film that is detachably coupled to the substrate, and a support plate that supports the substrate via the intermediate film. Forming a functional film on a substrate of a laminate processed by the processing method according to claim 4 or 5,
The manufacturing method of an electronic device which has the process of peeling the said board | substrate with which the said functional film was formed, and the said reinforcement board.   The method of manufacturing an electronic device according to claim 6, wherein the electronic device is an image display device.

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