JP2015120543A - Method for packaging substrate having adsorption layer, package, and apparatus for packaging substrate having adsorption layer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for packaging a substrate having an adsorption layer, capable of easily taking out the substrate one by one from a package container, even in a case of storing the plurality of substrates having the adsorption layer on a surface thereof in the package container without an intervening sheet, to provide a package, and to provide an apparatus for packaging the substrate having the adsorption layer.SOLUTION: A package apparatus includes a scratching device 10 and a robot 28. A reinforcing plate 3 is moved under a roll brush 12 by the scratching device 10 by placing a rear surface 3b of the reinforcing plate 3 on rollers 20 and rotating the rollers 20. At this time, a resin layer 4 of the reinforcing plate 3 is pressed to a brush 18 of the roll brush 12, and scratches caused by the brush 18 are applied on a surface of the resin layer 4 by the rotating roll brush 12. Then, the reinforcing plate 3 is stored on a pallet 36 by the robot 28.

Description

  The present invention relates to a method for packing a substrate with an adsorption layer, a packing body, and a packing device for a substrate with an adsorption layer.

  With the reduction in thickness and weight of electronic devices such as display panels, solar cells, and thin film secondary batteries, there is a demand for thinner substrates such as glass plates, resin plates, and metal plates used in these electronic devices.

  However, since the handling of the substrate deteriorates as the substrate becomes thinner, functional layers for electronic devices (thin film transistor (TFT), color filter (CF)) are formed on the surface of the substrate. It becomes difficult to do.

  Accordingly, a reinforcing plate (substrate) provided with an adsorption layer on the surface is used, and a laminated body in which the back surface of the substrate is adsorbed on the adsorption layer of the reinforcing plate to reinforce the substrate with the reinforcing plate is used. A method of forming a functional layer on the surface of a substrate in a state has been proposed (see Patent Document 1). In this method, since the handling property of the substrate is improved, the functional layer can be favorably formed on the surface of the substrate. The reinforcing plate is peeled off from the substrate after the functional layer is formed, and the peeled reinforcing plate is stacked and stored in units of a plurality of pallets (packaging containers).

International Publication No. 2010/090147

  However, conventionally, when the reinforcing plates stored in the pallet are taken out one by one from the pallet, the adjacent reinforcing plates are adsorbed by the adsorption layer, so that the reinforcing plates can be taken out from the pallet one by one. It was difficult. In order to solve such a problem, it can be solved by interposing a sheet such as a slip sheet between two adjacent reinforcing plates. However, this method requires a separate sheet and may cause the sheet to be adsorbed to the adsorption layer. This causes a problem that a separate work for removing the sheet is necessary.

  The present invention has been made in view of such a problem, and even when a plurality of substrates each having an adsorption layer on the surface are stored in a packaging container without interposing a sheet, It is an object of the present invention to provide a packing method for a substrate with an adsorption layer, a packing body, and a packaging device for the substrate with an adsorption layer, which can easily take out the substrates one by one.

  In one aspect of the method for packing a substrate with an adsorption layer according to the present invention, in order to achieve the above object, a plurality of substrates each having an adsorption layer formed thereon are prepared, and the surface of each adsorption layer of the plurality of substrates is provided. A plurality of substrates are stacked and stored in a packaging container after the scratching ridge is attached.

  The “scratch scissors” described in the present invention is a scissors attached by a scratching operation by a scissors applying means. More specifically, the substrate of the present invention is formed with a groove portion on the surface of the adsorption layer and a peak portion formed by being raised due to the formation of the groove portion on both sides of the groove portion by the scratching operation by the wrinkle applying means. It is a thing. The depth of the groove and the height of the peak are in units of microns based on the thickness of the adsorption layer (several microns to tens of microns). The present invention has a technical feature in that the adsorption area between the substrates is reduced by attaching “scratches” to the surface of the adsorption layer, thereby reducing the adsorption area of the adsorption layer.

  In order to further reduce the adsorption force between the substrates, it is preferable to attach a plurality of “scratch scissors” attached to the surface of the adsorption layer. Further, “scratch candy” may be regularly or randomly attached on the surface of the adsorption layer. Furthermore, in order to further reduce the adsorption force between the substrates, it is preferable to uniformly apply “scratches” on the surface of the adsorption layer.

  As described above, according to one aspect of the present invention, since the adsorption force between the substrates is reduced by scratching the surface of the adsorption layer, a plurality of substrates having adsorption layers on the surface are attached to the sheet. Even when it is stored in a packaging container without being interposed, the substrates can be easily taken out from the packaging container one by one.

  In one aspect of the present invention, it is preferable that the scratched ridge is a ridge formed by a roll brush.

  According to one embodiment of the present invention, a scratch can be easily attached with a roll brush.

  In one embodiment of the present invention, the substrate is preferably a glass plate having a thickness of 0.7 mm or less.

  According to one embodiment of the present invention, the substrate is suitable for a reinforcing plate that reinforces an electronic device substrate.

  In one embodiment of the present invention, the adsorption layer is preferably made of a silicone resin or a polyimide resin.

  According to one embodiment of the present invention, a plurality of substrates are housed in a packing container with a scratched surface attached to the surface of an adsorption layer made of a silicone resin or a polyimide resin.

  In order to achieve the above object, the packaging body of the present invention includes a plurality of substrates that are scratched by the packaging method for a substrate with an adsorption layer of the present invention, and a packaging container that stacks and stores the plurality of substrates. It is provided with.

  According to one embodiment of the present invention, even when a plurality of substrates having adsorption layers on the surface are stored in a packaging container without interposing sheets, the substrates are easily taken out one by one from the packaging container. be able to.

  In one embodiment of the present invention, it is preferable that the plurality of substrates housed in the packing container are stacked in the same direction on the front surface and the back surface of the substrate.

  According to one embodiment of the present invention, two adjacent substrates are in contact with the back surface of one substrate and the adsorption layer of the other substrate. Therefore, contact between the back surfaces of the substrates can be prevented, and damage to the substrates can be prevented. One embodiment of the present invention is suitable when the substrate is a glass plate.

  In order to achieve the above object, the packing device for a substrate with an adsorption layer according to the present invention is provided with a wrinkle applying means for scratching the adsorbing layer of the substrate having the adsorption layer formed on the surface, and the wrinkle applying means with the substrate. And a moving means for causing the wrinkle applying means and the substrate to move relative to each other along the adsorbing layer, and the substrate to which scratches have been attached by the wrinkle applying means. And storing means.

  According to one aspect of the present invention, wrinkles are attached to the surface of the adsorption layer of the substrate using wrinkle applying means and moving means. That is, the wrinkle applying means and the substrate are relatively moved along the adsorption layer of the substrate by the moving means, and the scratching flaw is applied to the adsorption layer of the substrate by the wrinkle application means. Next, the board | substrate with which the scratch flaw was attached is accommodated in a packing container by an accommodating means. Therefore, since the processing operation for attaching the wrinkles to the adsorption layer and the storage operation for the substrate with the wrinkles on the adsorption layer can be carried out continuously, it is possible to improve the efficiency of a series of operations (processing operations and storage operations). it can.

  In one aspect of the present invention, the wrinkle applying means is a rotatable roll-shaped brush member, and the moving means is a conveyor on which the back surface of the substrate is placed and moves the substrate along the adsorption layer. Preferably there is.

  According to one aspect of the present invention, the back surface of the substrate is placed on a conveyor that is a moving unit, and the substrate is moved by the conveyor. wear. Therefore, a scratch can be easily attached to the adsorption layer. In addition, by using the roll-shaped brush member and the conveyor, the processing operation for attaching the wrinkles to the adsorption layer can be continuously performed on a plurality of substrates, so that the efficiency of the processing operation can be improved.

  According to the packaging method and packaging body for a substrate with an adsorption layer and the packaging device for a substrate with an adsorption layer according to the present invention, when a plurality of substrates having adsorption layers on the surface are stored in a packaging container without interposing a sheet Even so, the substrates can be easily taken out one by one from the packaging container.

The principal part enlarged side view which shows an example of a laminated body The perspective view of the brazing apparatus of embodiment Explanatory drawing which showed the whole structure of the brazing apparatus of embodiment (A) is an image of a resin layer to which scratches are attached, and (B) is a graph showing the surface properties of the resin layer to which scratches are attached.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a packing method and a packing body for a substrate with an adsorption layer and a packaging apparatus for a substrate with an adsorption layer according to the present invention will be described with reference to the accompanying drawings.

  Below, the form which uses the packing method of a board | substrate with an adsorption layer and packing body which concern on this invention, and the packing apparatus of the board | substrate with an adsorption layer in the manufacturing factory of an electronic device is demonstrated.

  An electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. As a display panel, a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display) can be illustrated.

  An electronic device is manufactured by forming a functional layer for an electronic device (in the case of LCD, a thin film transistor (TFT) and a color filter (CF)) on the surface of a substrate made of glass, resin, metal, or the like.

  Before forming the functional layer, the back surface of the substrate is adsorbed by the adsorption layer of the reinforcing plate (substrate) to form a laminate. Thereafter, a functional layer is formed on the surface of the substrate in the state of the laminate. Then, after the functional layer is formed, the reinforcing plate is peeled from the substrate.

[Laminate 1]
FIG. 1 is an enlarged side view of an essential part showing an example of a laminated body 1.

  The laminate 1 includes a substrate 2 on which a functional layer is formed, and a reinforcing plate (substrate) 3 that reinforces the substrate 2. Further, the reinforcing plate 3 is provided with a resin layer (adsorption layer) 4 on the front surface 3 a, and the back surface 2 b of the substrate 2 is adsorbed on the resin layer 4. That is, the substrate 2 is adsorbed to the reinforcing plate 3 through the resin layer 4 by van der Waals force acting between the resin layer 4 or the adhesive force of the resin layer 4.

[Substrate 2]
The substrate 2 has a functional layer formed on the surface 2a. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, a glass substrate is suitable as the substrate 2 for an electronic device because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. Further, as the linear expansion coefficient becomes smaller, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to be displaced during cooling.

  Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, it is preferable to select and employ a glass suitable for the type of electronic device to be manufactured. For example, it is preferable to employ glass (non-alkali glass) that does not substantially contain an alkali metal component for the glass substrate for a liquid crystal panel.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed as the substrate 2, the thickness of the substrate 2 is preferably 0.7 mm or less, more preferably 0.3 mm or less, and even more preferably 0. It is set to 1 mm or less. When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roll, but from the viewpoint of manufacturing the glass substrate and handling the glass substrate, the thickness of the glass substrate is 0.03 mm. The above is preferable.

  In FIG. 1, the substrate 2 is composed of a single substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the board | substrate 2 can also be comprised with the laminated body which laminated | stacked the several board | substrate.

[Reinforcement plate 3]
Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, a semiconductor substrate, or a plate-like body obtained by stacking these plate-like bodies.

  The type of the reinforcing plate 3 is selected according to the type of electronic device to be manufactured, the type of the substrate 2 used for the electronic device, and the like. When the reinforcing plate 3 and the substrate 2 are made of the same material, warpage due to temperature change and peeling can be reduced.

The difference (absolute value) in the average linear expansion coefficient between the reinforcing plate 3 and the substrate 2 is appropriately set according to the dimensional shape of the substrate 2 and the like, but is preferably 35 × 10 ⁻⁷ / ° C. or less. Here, the “average linear expansion coefficient” refers to an average linear expansion coefficient (JIS R3102) in a temperature range of 50 to 300 ° C.

  The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type of the reinforcing plate 3, the type of the substrate 2 to be reinforced, the thickness, and the like. The reinforcing plate 3 may be thicker or thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2.

  In this example, the reinforcing plate 3 is constituted by a single substrate, but the reinforcing plate 3 can also be constituted by a laminated body in which a plurality of substrates are laminated.

[Resin layer 4]
In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, the reinforcing plate 3 is peeled from the substrate 2 between the resin layer 4 and the substrate 2.

  Although resin which comprises the resin layer 4 is not specifically limited, Acrylic resin, polyolefin resin, polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin can be illustrated. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability. In the embodiment, a silicone resin layer is exemplified as the resin layer 4.

  The silicone resin used in the present invention is preferably the one disclosed in JP 2011-046174 A. For example, the silicone resin is a cured product of a curable silicone resin composition containing the following linear organopolysiloxane (a) and the following linear organopolysiloxane (b), and the curable silicone resin composition is It is preferable to use a cured silicone resin layer formed by curing on the surface of the reinforcing plate.

  Linear organopolysiloxane (a): A linear organopolysiloxane having at least two alkenyl groups per molecule.

  Linear organopolysiloxane (b): a linear organopolysiloxane having at least three hydrogen atoms bonded to silicon atoms per molecule, and at least one of the hydrogen atoms bonded to the silicon atoms is a molecular end. A linear organopolysiloxane present in the silicon atom.

  Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 4-20 micrometers. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matters can be absorbed by the deformation of the resin layer 4. On the other hand, when the thickness of the resin layer 4 is 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not used more than necessary, which is economical.

  The outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entire substrate 2.

  Moreover, although the resin layer 4 is comprised by 1 layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer. In this case, the type of resin constituting each layer may be different.

  Furthermore, in the embodiment, the resin layer 4 that is an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

  The metal silicide includes, for example, at least one selected from the group consisting of W, Fe, Mn, Mg, Mo, Cr, Ru, Re, Co, Ni, Ta, Ti, Zr, and Ba. Is tungsten silicide.

  The nitride is, for example, at least one selected from the group consisting of Si, Hf, Zr, Ta, Ti, Nb, Na, Co, Al, Zn, Pb, Mg, Sn, In, B, Cr, Mo, and Ba. It contains seeds, preferably aluminum nitride, titanium nitride, or silicon nitride.

  The carbide includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbide.

  The carbonitride includes, for example, at least one selected from the group consisting of Ti, W, Si, Zr, and Nb, and is preferably silicon carbonitride.

  Metal silicide, nitride, carbide, and carbonitride have a small difference in electronegativity between Si, N, or C contained in the material and other elements contained in the material, and have a small polarization. Therefore, the reactivity between the inorganic film and water is low, and hydroxyl groups are unlikely to be generated on the surface of the inorganic film. Therefore, the releasability between the inorganic film and the substrate 2 which is a glass substrate is kept good.

  A functional layer is formed on the surface 2 a of the substrate 2 of the laminate 1. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed in a predetermined pattern by photolithography or etching. After the functional layer is formed on the surface 2 a of the substrate 2, the reinforcing plate 3 is peeled from the substrate 2.

[Configuration of the brazing device 10]
Next, the brazing device 10 for scratching the resin layer 4 of the reinforcing plate 3 peeled from the substrate 2 will be described.

  FIG. 2 is a perspective view illustrating an example of the brazing device 10, and FIG. 3 is an explanatory diagram illustrating the overall configuration of the brazing device 10.

  The brazing device 10 is configured to include a rotatable roll brush (roll-like brush member) 12 that is a tacking means, a roller conveyor 14 that is a moving means, and the like.

  The roll brush 12 is configured by implanting a brush 18 around a disk or columnar core 16. Further, the length L of the roll brush 12 is configured to be longer than the width W of the reinforcing plate 3. Therefore, scratches by the roll brush 12 can be attached to the entire region of the resin layer 4 of the reinforcing plate 3.

  The roller conveyor 14 is constituted by a plurality of rollers 20 arranged in the horizontal direction, and is rotated by transmission of power from a drive source (not shown).

  As shown in FIG. 3, the back surface 3 b of the reinforcing plate 3 is placed on the roller 20, and the reinforcing plate 3 moves below the roll brush 12 in the direction of arrow A by the rotation of the roller 20. At this time, the resin layer 4 of the reinforcing plate 3 is pressed against the brush 18 of the roll brush 12, and the surface of the resin layer 4 is scratched by the brush 18 by the rotating roll brush 12, and the lower side of the roll brush 12. Pass through. Thereby, a scratch flaw (refer FIG. 4 (A)) can be easily attached to the whole surface of the resin layer 4. FIG.

  Further, by using the roll brush 12 and the roller conveyor 14, the processing operation for scratching the resin layer 4 can be continuously performed on the plurality of reinforcing plates 3, so that the processing operation efficiency can be improved. it can.

  In the brazing device 10 of the embodiment, the reinforcing plate 3 is moved along the surface of the resin layer 4 by the roller conveyor 14, but the reinforcing plate 3 is fixed and the roll brush 12 is moved along the surface of the resin layer 4. May be moved. Further, instead of the roll brush 12, a sharp tip member such as a razor or a comb-like member may be applied. That is, any wrinkle applying means that can apply a scratch wrinkle to the resin layer 4 can be applied as a wrinkle applying means.

  On the other hand, on the downstream side of the roller conveyor 14, a carry-out portion 26 including a plurality of driven rollers 22 and two positioning pins 24 is provided.

  The reinforcing plate 3 moved by the roller conveyor 14 is transferred to the driven roller 22 from the end of the roller conveyor 14. Thereafter, the reinforcing plate 3 moves on the driven roller 22 by inertial force, contacts the positioning pin 24 when the moving speed decreases, and is positioned by the carry-out portion 26.

  A robot (storage means) 28 is installed in the vicinity of the carry-out unit 26, and a pallet (packing container) mounting table 30 is provided in the vicinity of the robot 28.

  The packaging device according to the embodiment is configured by the robot 28 and the brazing device 10.

  A plurality of suction pads 34 are attached to the tip of the arm 32 of the robot 28 on the same plane. The operation of the arm 32 is controlled by a control unit (not shown), and the suction start / stop of the suction pad 34 is also controlled by the control unit. That is, the control unit has a position where the reinforcing plate 3 positioned by the carry-out unit 26 can be held by the suction pad 34 and a position where the reinforcing plate 3 is stored in a pallet (packing container) 36 mounted on the pallet mounting table 30. The arm 32 is moved between them. Further, the control unit starts the suction operation of the suction pad 34 when holding the reinforcing plate 3 positioned by the carry-out unit 26 by the suction pad 34, and when the reinforcing plate 3 is stored in the pallet 36, the suction pad 34 The suction pad 34 is controlled so as to stop the suction operation 34.

  Thereby, the reinforcing plate 3 in which the resin layer 4 is scratched by the roll brush 12 can be stored in the pallet 36 by the robot 28. Therefore, since the processing operation for attaching the wrinkles to the resin layer 4 and the storing operation of the reinforcing plate 3 with the scratched wrinkles on the resin layer 4 can be carried out continuously, it is possible to improve the efficiency of the processing operations and the storing operations. it can.

  A form in which a plurality of reinforcing plates 3 to which scratches are attached is stacked and stored on the pallet 36 is the packaging body of the embodiment.

  Further, the plurality of reinforcing plates 3 housed in the pallet 36 are stacked in the same direction on the front and back surfaces of the reinforcing plate 3 by the robot 28. Therefore, in the plurality of reinforcing plates 3 housed in the pallet 36, the two adjacent reinforcing plates 3 and 3 are in contact with the back surface of one reinforcing plate 3 and the resin layer 4 of the other reinforcing plate 3. Thereby, since the contact of the back surfaces of the reinforcement board 3 can be prevented, damage to the reinforcement board 3 can be prevented. In this case, it is suitable when the reinforcing plate 3 is a glass plate.

  As described above, according to the brazing device 10 of the embodiment, since the scratches can be attached to the resin layer 4, the adsorption force between the overlapping reinforcing plate 3 and the resin layer 4 can be reduced. In addition, the fact that the fine debris of the resin layer 4 generated when the scratching pad is attached is interposed between the reinforcing plate 3 and the resin layer 4 also reduces the adsorption force between the reinforcing plate 3 and the resin layer 4. It is effective. Therefore, even when the reinforcing plate 3 provided with the resin layer 4 on the surface is laminated on the pallet 36 without interposing a sheet, the reinforcing plates 3 can be easily taken out from the pallet 36 one by one.

  3 illustrates the vertically stacked pallet 36 that stores the reinforcing plates 3 while leaning diagonally, but a flat pallet that stores the reinforcing plates 3 horizontally may be used.

[Experimental example]
<Roll brush 12>
Brush diameter: 120mm
Brush material: Nylon 66
Brush wire diameter: 0.1mm
Brush wire length: 12.5mm
Number of revolutions: 100 revolutions / minute <Roller conveyor 14>
Peripheral speed: about 200 mm / sec While transporting the reinforcing plate 3 by the roller conveyor 14 under the above conditions, the resin layer 4 of the reinforcing plate 3 was scratched with a rotating roll brush 12.

  FIG. 4 (A) is an image of the resin layer 4 with scratches, and FIG. 4 (B) is a graph showing the surface properties of the resin layer 4 with scratches. The vertical axis of FIG. 4 (B) indicates the depth of the groove and the height of the peak portion due to the scratches, and the horizontal axis indicates the width dimension of the reinforcing plate 3. As the surface texture measuring device, a non-contact surface texture measuring device (product name: PF-60) manufactured by Mitaka Kogyo Co., Ltd. was used. The measurement pitch was set to 0.1 μm and the measurement range was set to 200 μm.

  As shown in FIG. 4B, grooves having a depth of several microns and peaks having a height of several microns are continuously formed on the surface of the resin layer 4.

  A plurality of reinforcing plates 3 with such scratches were stacked on the pallet 36 without interposing sheets. Thereafter, when the reinforcing plate 3 was taken out from the pallet 36, the reinforcing plates 3 could be taken out one by one.

  DESCRIPTION OF SYMBOLS 1 ... Laminated body, 2 ... Board | substrate, 2a ... The surface of a board | substrate, 2b ... The back surface of a board | substrate, 3 ... Reinforcement board, 3a ... The surface of a reinforcement board, 3b ... The back surface of a reinforcement board, 4 ... Resin layer, 10 ... Brazing apparatus , 12 ... Roll brush, 14 ... Roller conveyor, 16 ... Core material, 18 ... Brush, 20 ... Roller, 22 ... Driven roller, 24 ... Positioning pin, 26 ... Unloading part, 28 ... Robot, 30 ... Pallet mounting base, 32 ... Arm, 34 ... Suction pad, 36 ... Pallet

Claims (8)

Prepare multiple substrates with an adsorption layer on the surface,
A method of packing a substrate with an adsorption layer, comprising: scratching the surface of each adsorption layer of the plurality of substrates and then stacking and storing the plurality of substrates in a packaging container.   The method for packing a substrate with an adsorption layer according to claim 1, wherein the scratched ridge is a ridge formed by a roll brush.   The method for packing a substrate with an adsorption layer according to claim 1, wherein the substrate is a glass plate having a thickness of 0.7 mm or less.   The said adsorption layer consists of a silicone resin or a polyimide resin, The packaging method of the board | substrate with an adsorption layer of Claim 1, 2, or 3.   A plurality of substrates that are scratched by the method for packing a substrate with an adsorption layer according to any one of claims 1 to 4, and a packaging container that stores the plurality of substrates in a stacked manner. Characteristic packaging.   The package according to claim 5, wherein the plurality of substrates housed in the packaging container are laminated in the same direction on the front surface and the back surface of the substrate. Wrinkle imparting means for scratching the adsorption layer of the substrate having the adsorption layer formed on the surface;
Moving means for causing the wrinkle application means to press-contact with the adsorption layer of the substrate and to move the wrinkle application means and the substrate relative to each other along the adsorption layer;
Storage means for storing the substrate, which has been scratched by the wrinkle applying means, in a packaging container;
An apparatus for packing a substrate with an adsorption layer, comprising:   The said wrinkle provision means is a rotatable roll-shaped brush member, The said movement means is a conveyor by which the back surface of the said board | substrate is mounted and moves the said board | substrate along the said adsorption layer. Packing device for substrates with adsorption layer.