TWI547684B - 電子零件封裝體側面攝影裝置 - Google Patents

電子零件封裝體側面攝影裝置 Download PDF

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Publication number
TWI547684B
TWI547684B TW104101926A TW104101926A TWI547684B TW I547684 B TWI547684 B TW I547684B TW 104101926 A TW104101926 A TW 104101926A TW 104101926 A TW104101926 A TW 104101926A TW I547684 B TWI547684 B TW I547684B
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TW
Taiwan
Prior art keywords
electronic component
component package
package
reflection
photographing
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TW104101926A
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English (en)
Chinese (zh)
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TW201544806A (zh
Inventor
新田一法
白井克昌
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東和股份有限公司
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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
TW104101926A 2014-05-21 2015-01-21 電子零件封裝體側面攝影裝置 TWI547684B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014105573A JP6491425B2 (ja) 2014-05-21 2014-05-21 電子部品パッケージ側面撮影装置

Publications (2)

Publication Number Publication Date
TW201544806A TW201544806A (zh) 2015-12-01
TWI547684B true TWI547684B (zh) 2016-09-01

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TW104101926A TWI547684B (zh) 2014-05-21 2015-01-21 電子零件封裝體側面攝影裝置

Country Status (4)

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JP (1) JP6491425B2 (ja)
KR (1) KR20150134267A (ja)
CN (1) CN105100560A (ja)
TW (1) TWI547684B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017170805A1 (ja) * 2016-03-31 2017-10-05 国立大学法人弘前大学 多面画像取得システム、観察装置、観察方法、スクリーニング方法、および被写体の立体再構成方法
US11340284B2 (en) * 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
JP7530763B2 (ja) * 2020-08-06 2024-08-08 Ｔｏｗａ株式会社 切断装置、及び、切断品の製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6088108A (en) * 1998-08-27 2000-07-11 Hewlett-Packard Company Leaded components inspection system
US6242756B1 (en) * 1998-05-21 2001-06-05 Agilent Technologies, Inc Cross optical axis inspection system for integrated circuits
US6243164B1 (en) * 1998-07-13 2001-06-05 Electro Scientific Industries Method and system for determining lead coplanarity
US6567161B1 (en) * 2000-11-28 2003-05-20 Asti Holdings Limited Three dimensional lead inspection system
TW201005285A (en) * 2008-06-23 2010-02-01 Semiconductor Technologies & Instr Pte Ltd System and method for inspection of semiconductor packages

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JP2530955B2 (ja) * 1990-12-27 1996-09-04 インターナショナル・ビジネス・マシーンズ・コーポレイション リ―ド付き部品の検査装置及び検査方法
DE59500333D1 (de) * 1994-02-02 1997-07-24 Kratzer Automatisierung Gmbh Vorrichtung zum abbilden eines dreidimensionalen objekts
JP3536166B2 (ja) * 1996-05-13 2004-06-07 株式会社椿本チエイン 表面検査方法及び表面検査装置
JP3014684B1 (ja) * 1998-12-01 2000-02-28 シーシーエス株式会社 側面検査装置
US6532063B1 (en) * 2000-11-10 2003-03-11 Semiconductor Technologies & Instruments 3-D lead inspection
EP1358473A2 (en) * 2001-01-02 2003-11-05 Robotic Vision Systems Inc. Lcc device inspection module
US20040156539A1 (en) * 2003-02-10 2004-08-12 Asm Assembly Automation Ltd Inspecting an array of electronic components
EP1602001B1 (fr) * 2003-03-07 2009-05-27 ISMECA Semiconductor Holding SA Dispositif optique et module d inspection
US7869021B2 (en) * 2007-04-05 2011-01-11 Asti Holdings Limited Multiple surface inspection system and method
CN101978248A (zh) * 2008-01-07 2011-02-16 动态通量生命科学仪器有限公司 具有整合微流化生物标记物光学检测阵列装置的发现工具和使用方法
JP5017628B2 (ja) * 2008-09-30 2012-09-05 株式会社ユタカ 側面検査装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6242756B1 (en) * 1998-05-21 2001-06-05 Agilent Technologies, Inc Cross optical axis inspection system for integrated circuits
US6243164B1 (en) * 1998-07-13 2001-06-05 Electro Scientific Industries Method and system for determining lead coplanarity
US6088108A (en) * 1998-08-27 2000-07-11 Hewlett-Packard Company Leaded components inspection system
US6567161B1 (en) * 2000-11-28 2003-05-20 Asti Holdings Limited Three dimensional lead inspection system
TW201005285A (en) * 2008-06-23 2010-02-01 Semiconductor Technologies & Instr Pte Ltd System and method for inspection of semiconductor packages

Also Published As

Publication number Publication date
TW201544806A (zh) 2015-12-01
KR20150134267A (ko) 2015-12-01
JP2015219224A (ja) 2015-12-07
CN105100560A (zh) 2015-11-25
JP6491425B2 (ja) 2019-03-27

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