TWI546364B - Adhesive composition, adhesive and adhesive sheet - Google Patents
Adhesive composition, adhesive and adhesive sheet Download PDFInfo
- Publication number
- TWI546364B TWI546364B TW101106892A TW101106892A TWI546364B TW I546364 B TWI546364 B TW I546364B TW 101106892 A TW101106892 A TW 101106892A TW 101106892 A TW101106892 A TW 101106892A TW I546364 B TWI546364 B TW I546364B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- meth
- monomer
- polymer
- acrylate polymer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/005—Diaphragms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011079022A JP5595321B2 (ja) | 2011-03-31 | 2011-03-31 | 粘着性組成物、粘着剤および粘着シート |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201241140A TW201241140A (en) | 2012-10-16 |
TWI546364B true TWI546364B (zh) | 2016-08-21 |
Family
ID=46988505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101106892A TWI546364B (zh) | 2011-03-31 | 2012-03-02 | Adhesive composition, adhesive and adhesive sheet |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5595321B2 (ko) |
KR (1) | KR101899382B1 (ko) |
CN (1) | CN102732188B (ko) |
TW (1) | TWI546364B (ko) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5602670B2 (ja) * | 2011-03-31 | 2014-10-08 | リンテック株式会社 | 粘着剤および粘着シート |
JP5611880B2 (ja) * | 2011-03-31 | 2014-10-22 | リンテック株式会社 | 粘着剤および粘着シート |
JP6508060B2 (ja) * | 2013-12-27 | 2019-05-08 | 日本ゼオン株式会社 | 光学積層体および面光源装置 |
CN106414644B (zh) * | 2015-03-20 | 2018-04-17 | 东洋油墨Sc控股株式会社 | 粘着剂及粘着带 |
KR102047288B1 (ko) * | 2015-12-10 | 2019-11-21 | 주식회사 엘지화학 | 점착제 조성물 |
KR102024256B1 (ko) | 2016-09-23 | 2019-11-04 | 주식회사 엘지화학 | 점착 조성물 |
JP6307189B2 (ja) * | 2017-03-02 | 2018-04-04 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
KR102705358B1 (ko) * | 2019-09-11 | 2024-09-09 | 주식회사 엘지화학 | 아크릴 계 에멀젼 점착제 조성물 |
JP2022179185A (ja) * | 2021-05-21 | 2022-12-02 | 日東電工株式会社 | 粘着シート、光学積層体及び画像表示装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4036272B2 (ja) * | 1996-07-18 | 2008-01-23 | 日東電工株式会社 | 粘着剤組成物および粘着シート類 |
JP3533589B2 (ja) * | 1997-04-09 | 2004-05-31 | 綜研化学株式会社 | 偏光板用粘着剤組成物および偏光板 |
JP2000109771A (ja) * | 1998-10-07 | 2000-04-18 | Lintec Corp | 粘着シート |
JP4072309B2 (ja) * | 2000-10-13 | 2008-04-09 | 日本カーバイド工業株式会社 | 偏光フィルム用粘着剤組成物及び偏光フィルム |
JP4534431B2 (ja) * | 2003-04-30 | 2010-09-01 | 東洋インキ製造株式会社 | 粘着剤およびそれを用いた光学部材 |
KR100668943B1 (ko) * | 2004-04-23 | 2007-01-12 | 주식회사 엘지화학 | 편광판용 아크릴계 점착제 조성물 |
JPWO2005111167A1 (ja) * | 2004-05-19 | 2008-03-27 | 綜研化学株式会社 | 粘着剤組成物 |
JP4839745B2 (ja) * | 2004-09-17 | 2011-12-21 | 住友化学株式会社 | 光学積層体 |
JP5023470B2 (ja) * | 2005-11-04 | 2012-09-12 | 住友化学株式会社 | アクリル樹脂組成物及び粘着剤 |
JP3997270B2 (ja) * | 2005-11-21 | 2007-10-24 | 綜研化学株式会社 | 光学フィルム用粘着剤組成物および粘着シート、ならびにこれを用いた光学部材 |
KR100948778B1 (ko) * | 2007-01-23 | 2010-03-24 | 주식회사 엘지화학 | 광학 보상된 아크릴계 점착제 조성물, 이를 포함하는편광판 및 액정표시소자 |
KR101019064B1 (ko) * | 2008-01-14 | 2011-03-07 | 주식회사 엘지화학 | 아크릴계 점착제 조성물 |
JP5379409B2 (ja) * | 2008-02-15 | 2013-12-25 | 日東電工株式会社 | 光学フィルム用粘着剤組成物、粘着型光学フィルムおよび画像表示装置 |
JP5243197B2 (ja) * | 2008-11-18 | 2013-07-24 | 日東電工株式会社 | 光学部材用粘着剤組成物、光学部材用粘着剤層、粘着型光学部材および画像表示装置 |
JP5595034B2 (ja) * | 2009-12-28 | 2014-09-24 | リンテック株式会社 | 粘着性組成物、粘着剤および粘着シート |
-
2011
- 2011-03-31 JP JP2011079022A patent/JP5595321B2/ja active Active
-
2012
- 2012-03-02 TW TW101106892A patent/TWI546364B/zh active
- 2012-03-27 KR KR1020120030998A patent/KR101899382B1/ko active IP Right Grant
- 2012-03-29 CN CN201210088874.8A patent/CN102732188B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
KR20120112100A (ko) | 2012-10-11 |
KR101899382B1 (ko) | 2018-09-17 |
CN102732188A (zh) | 2012-10-17 |
JP5595321B2 (ja) | 2014-09-24 |
CN102732188B (zh) | 2016-01-06 |
JP2012214547A (ja) | 2012-11-08 |
TW201241140A (en) | 2012-10-16 |
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