TWI539547B - 液體流量控制裝置、液體流量控制方法、及記憶媒體 - Google Patents
液體流量控制裝置、液體流量控制方法、及記憶媒體 Download PDFInfo
- Publication number
- TWI539547B TWI539547B TW100130304A TW100130304A TWI539547B TW I539547 B TWI539547 B TW I539547B TW 100130304 A TW100130304 A TW 100130304A TW 100130304 A TW100130304 A TW 100130304A TW I539547 B TWI539547 B TW I539547B
- Authority
- TW
- Taiwan
- Prior art keywords
- flow rate
- flow
- control
- range
- liquid
- Prior art date
Links
- 239000007788 liquid Substances 0.000 title claims description 231
- 238000000034 method Methods 0.000 title claims description 37
- 230000008569 process Effects 0.000 claims description 23
- 230000008859 change Effects 0.000 claims description 15
- 230000003247 decreasing effect Effects 0.000 claims description 5
- 230000007704 transition Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 description 79
- 239000000126 substance Substances 0.000 description 79
- 238000003860 storage Methods 0.000 description 21
- 239000003085 diluting agent Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/2496—Self-proportioning or correlating systems
- Y10T137/2559—Self-controlled branched flow systems
- Y10T137/2564—Plural inflows
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
- Y10T137/7758—Pilot or servo controlled
- Y10T137/7759—Responsive to change in rate of fluid flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87265—Dividing into parallel flow paths with recombining
- Y10T137/87298—Having digital flow controller
- Y10T137/87306—Having plural branches under common control for separate valve actuators
- Y10T137/87314—Electromagnetic or electric control [e.g., digital control, bistable electro control, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Flow Control (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Feedback Control In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010247705A JP5646956B2 (ja) | 2010-11-04 | 2010-11-04 | 液体流量制御装置、液体流量制御方法および記憶媒体 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201230228A TW201230228A (en) | 2012-07-16 |
| TWI539547B true TWI539547B (zh) | 2016-06-21 |
Family
ID=46018475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100130304A TWI539547B (zh) | 2010-11-04 | 2011-08-24 | 液體流量控制裝置、液體流量控制方法、及記憶媒體 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8622073B2 (enExample) |
| JP (1) | JP5646956B2 (enExample) |
| KR (1) | KR101669689B1 (enExample) |
| TW (1) | TWI539547B (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3159016B2 (ja) | 1995-11-13 | 2001-04-23 | 株式会社ムロコーポレーション | 連続ビス締付機 |
| US20140271243A1 (en) * | 2013-03-14 | 2014-09-18 | Usc, L.L.C. | Pump stand with improved pump control |
| US9038861B2 (en) | 2013-03-14 | 2015-05-26 | Usc, L.L.C. | Seed metering wheel assembly |
| JP6290762B2 (ja) * | 2013-10-30 | 2018-03-07 | 東京エレクトロン株式会社 | 流量調整機構、希釈薬液供給機構、液処理装置及びその運用方法 |
| JP6378555B2 (ja) * | 2014-06-26 | 2018-08-22 | 株式会社荏原製作所 | 洗浄ユニット |
| US10340159B2 (en) | 2014-06-09 | 2019-07-02 | Ebara Corporation | Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit |
| JP6486986B2 (ja) | 2017-04-03 | 2019-03-20 | 株式会社荏原製作所 | 液体供給装置及び液体供給方法 |
| JP6917864B2 (ja) * | 2017-11-02 | 2021-08-11 | 東京エレクトロン株式会社 | 液供給装置およびリーク検知方法 |
| US12050478B2 (en) * | 2019-07-25 | 2024-07-30 | Siemens Aktiengesellschaft | Conveyor assembly with two conveyor elements connected in parallel |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1757059A (en) * | 1928-04-28 | 1930-05-06 | Frederick B Rickenberg | Valve |
| US3875964A (en) * | 1973-05-21 | 1975-04-08 | Process Systems | Multiple element control valve |
| US4207919A (en) * | 1975-09-19 | 1980-06-17 | Powell Industries, Inc. | Digital fluid flow control system |
| DE2725410C2 (de) * | 1977-06-04 | 1983-09-01 | Bodenseewerk Perkin-Elmer & Co GmbH, 7770 Überlingen | Vorrichtung zur Steuerung einer Druckmittelströmung |
| JPS575507A (en) * | 1980-06-12 | 1982-01-12 | Toshiba Corp | Level control device of auxiliary machinery to steam turbine |
| JPS5870319A (ja) * | 1981-10-21 | 1983-04-26 | Hitachi Ltd | 流量制御装置 |
| FR2548329B1 (fr) * | 1983-06-30 | 1986-06-20 | Bosteels Michel | Dispositif de commande de debits calibres de fluide |
| DE3432466C2 (de) * | 1984-09-04 | 1986-10-30 | Boge Gmbh, 5208 Eitorf | Drosselventil |
| JPS6351638A (ja) | 1986-08-20 | 1988-03-04 | Clean Saafueisu Gijutsu Kk | フオト・エツチングのレジスト塗布回収装置 |
| JPH0746347Y2 (ja) * | 1987-07-23 | 1995-10-25 | 富士通株式会社 | 薬品処理装置 |
| JPH01214911A (ja) * | 1988-02-23 | 1989-08-29 | Toshiba Corp | 流量制御装置 |
| US5038821A (en) * | 1990-08-06 | 1991-08-13 | Maget Henri J R | Electrochemical control valve |
| US5329965A (en) * | 1993-07-30 | 1994-07-19 | The Perkin-Elmer Corporation | Hybrid valving system for varying fluid flow rate |
| NL9402237A (nl) * | 1994-12-29 | 1996-08-01 | Adrianus Martinus M Wildenberg | Debietregelklep. |
| CA2183478C (en) * | 1995-08-17 | 2004-02-24 | Stephen A. Carter | Digital gas metering system using tri-stable and bi-stable solenoids |
| US6240944B1 (en) * | 1999-09-23 | 2001-06-05 | Honeywell International Inc. | Addressable valve arrays for proportional pressure or flow control |
| JP3365753B2 (ja) * | 1999-12-20 | 2003-01-14 | 川崎重工業株式会社 | 底吹き転炉のガス供給装置 |
| JP2002116824A (ja) * | 2000-10-05 | 2002-04-19 | Ishikawajima Harima Heavy Ind Co Ltd | 液体流量の制御方法 |
| JP2003158122A (ja) | 2001-09-04 | 2003-05-30 | Japan Pionics Co Ltd | 気化供給方法 |
-
2010
- 2010-11-04 JP JP2010247705A patent/JP5646956B2/ja active Active
-
2011
- 2011-08-22 KR KR1020110083469A patent/KR101669689B1/ko active Active
- 2011-08-24 TW TW100130304A patent/TWI539547B/zh active
- 2011-10-26 US US13/281,617 patent/US8622073B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP5646956B2 (ja) | 2014-12-24 |
| US8622073B2 (en) | 2014-01-07 |
| KR20120049119A (ko) | 2012-05-16 |
| JP2012099730A (ja) | 2012-05-24 |
| TW201230228A (en) | 2012-07-16 |
| KR101669689B1 (ko) | 2016-10-27 |
| US20120111412A1 (en) | 2012-05-10 |
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