TWI536526B - 用於一積體電路封裝之電氣互連及其製造方法 - Google Patents

用於一積體電路封裝之電氣互連及其製造方法 Download PDF

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Publication number
TWI536526B
TWI536526B TW100122503A TW100122503A TWI536526B TW I536526 B TWI536526 B TW I536526B TW 100122503 A TW100122503 A TW 100122503A TW 100122503 A TW100122503 A TW 100122503A TW I536526 B TWI536526 B TW I536526B
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TW
Taiwan
Prior art keywords
layer
contact pads
feedthrough
interconnect
die
Prior art date
Application number
TW100122503A
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English (en)
Chinese (zh)
Other versions
TW201222755A (en
Inventor
保羅 艾倫 麥克考奈利
凱文 馬修 道奇
史考特 史密斯
唐納德 保羅 康寧漢
Original Assignee
奇異電器公司
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Publication date
Application filed by 奇異電器公司 filed Critical 奇異電器公司
Publication of TW201222755A publication Critical patent/TW201222755A/zh
Application granted granted Critical
Publication of TWI536526B publication Critical patent/TWI536526B/zh

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Classifications

    • H10W70/65—
    • H10W72/00—
    • H10W20/20—
    • H10W70/05—
    • H10W70/09—
    • H10W70/093—
    • H10W70/095—
    • H10W70/614—
    • H10W70/635—
    • H10W70/657—
    • H10W70/66—
    • H10W70/685—
    • H10W72/073—
    • H10W90/401—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW100122503A 2010-06-29 2011-06-27 用於一積體電路封裝之電氣互連及其製造方法 TWI536526B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/826,359 US8653670B2 (en) 2010-06-29 2010-06-29 Electrical interconnect for an integrated circuit package and method of making same

Publications (2)

Publication Number Publication Date
TW201222755A TW201222755A (en) 2012-06-01
TWI536526B true TWI536526B (zh) 2016-06-01

Family

ID=44532585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100122503A TWI536526B (zh) 2010-06-29 2011-06-27 用於一積體電路封裝之電氣互連及其製造方法

Country Status (6)

Country Link
US (4) US8653670B2 (cg-RX-API-DMAC10.html)
EP (1) EP2402992B1 (cg-RX-API-DMAC10.html)
JP (1) JP6014309B2 (cg-RX-API-DMAC10.html)
KR (1) KR101846545B1 (cg-RX-API-DMAC10.html)
CN (1) CN102315190B (cg-RX-API-DMAC10.html)
TW (1) TWI536526B (cg-RX-API-DMAC10.html)

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US8658473B2 (en) * 2012-03-27 2014-02-25 General Electric Company Ultrathin buried die module and method of manufacturing thereof
US9165885B2 (en) * 2013-12-30 2015-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Staggered via redistribution layer (RDL) for a package and a method for forming the same
US9653438B2 (en) 2014-08-21 2017-05-16 General Electric Company Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof
US9666516B2 (en) 2014-12-01 2017-05-30 General Electric Company Electronic packages and methods of making and using the same
US10141251B2 (en) 2014-12-23 2018-11-27 General Electric Company Electronic packages with pre-defined via patterns and methods of making and using the same
CN106972093B (zh) * 2016-01-13 2019-01-08 光宝光电(常州)有限公司 发光二极管封装结构
US9563732B1 (en) 2016-01-26 2017-02-07 International Business Machines Corporation In-plane copper imbalance for warpage prediction
KR102019352B1 (ko) 2016-06-20 2019-09-09 삼성전자주식회사 팬-아웃 반도체 패키지
EP3553816A4 (en) * 2016-12-08 2020-05-06 Hitachi Chemical Co., Ltd. METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
TWI648854B (zh) * 2017-06-14 2019-01-21 Win Semiconductors Corp. 用以減少化合物半導體晶圓變形之改良結構
TWI762894B (zh) * 2019-11-05 2022-05-01 友達光電股份有限公司 電路裝置

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US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
EP1030369B1 (en) * 1997-08-19 2007-12-12 Hitachi, Ltd. Multichip module structure and method for manufacturing the same
JP3618330B2 (ja) * 2002-11-08 2005-02-09 沖電気工業株式会社 半導体装置及びその製造方法
KR100613903B1 (ko) 2004-05-13 2006-08-17 한국전자통신연구원 유전자 알고리즘을 이용한 배열 안테나의 배열 간격 결정방법 및 이를 이용한 소파형 부등간격 배열 안테나
US7453157B2 (en) * 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
JP2006134912A (ja) * 2004-11-02 2006-05-25 Matsushita Electric Ind Co Ltd 半導体モジュールおよびその製造方法、ならびにフィルムインターポーザ
JP4520355B2 (ja) * 2005-04-19 2010-08-04 パナソニック株式会社 半導体モジュール
CN100392849C (zh) * 2005-12-09 2008-06-04 威盛电子股份有限公司 封装体及封装体模块
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TWI443789B (zh) 2008-07-04 2014-07-01 欣興電子股份有限公司 嵌埋有半導體晶片之電路板及其製法
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Also Published As

Publication number Publication date
US20160211208A1 (en) 2016-07-21
US20140159213A1 (en) 2014-06-12
CN102315190B (zh) 2016-03-16
JP2012015504A (ja) 2012-01-19
US8653670B2 (en) 2014-02-18
KR20120001651A (ko) 2012-01-04
EP2402992A3 (en) 2013-05-08
KR101846545B1 (ko) 2018-04-06
US9679837B2 (en) 2017-06-13
US10068840B2 (en) 2018-09-04
US9299647B2 (en) 2016-03-29
TW201222755A (en) 2012-06-01
CN102315190A (zh) 2012-01-11
US20170278782A1 (en) 2017-09-28
EP2402992A2 (en) 2012-01-04
JP6014309B2 (ja) 2016-10-25
EP2402992B1 (en) 2018-11-21
US20110316167A1 (en) 2011-12-29

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