KR101846545B1 - 인터커넥트 조립체 - Google Patents

인터커넥트 조립체 Download PDF

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Publication number
KR101846545B1
KR101846545B1 KR1020110062762A KR20110062762A KR101846545B1 KR 101846545 B1 KR101846545 B1 KR 101846545B1 KR 1020110062762 A KR1020110062762 A KR 1020110062762A KR 20110062762 A KR20110062762 A KR 20110062762A KR 101846545 B1 KR101846545 B1 KR 101846545B1
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South Korea
Prior art keywords
contact pads
interconnect assembly
die
interconnect
dielectric layer
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KR1020110062762A
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English (en)
Korean (ko)
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KR20120001651A (ko
Inventor
폴 알란 맥코넬리
케빈 매튜 듀로셔
스콧 스미스
도날드 폴 커닝햄
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제너럴 일렉트릭 캄파니
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    • H10W70/65—
    • H10W72/00—
    • H10W20/20—
    • H10W70/05—
    • H10W70/09—
    • H10W70/093—
    • H10W70/095—
    • H10W70/614—
    • H10W70/635—
    • H10W70/657—
    • H10W70/66—
    • H10W70/685—
    • H10W72/073—
    • H10W90/401—

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020110062762A 2010-06-29 2011-06-28 인터커넥트 조립체 Active KR101846545B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/826,359 US8653670B2 (en) 2010-06-29 2010-06-29 Electrical interconnect for an integrated circuit package and method of making same
US12/826,359 2010-06-29

Publications (2)

Publication Number Publication Date
KR20120001651A KR20120001651A (ko) 2012-01-04
KR101846545B1 true KR101846545B1 (ko) 2018-04-06

Family

ID=44532585

Family Applications (1)

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KR1020110062762A Active KR101846545B1 (ko) 2010-06-29 2011-06-28 인터커넥트 조립체

Country Status (6)

Country Link
US (4) US8653670B2 (cg-RX-API-DMAC10.html)
EP (1) EP2402992B1 (cg-RX-API-DMAC10.html)
JP (1) JP6014309B2 (cg-RX-API-DMAC10.html)
KR (1) KR101846545B1 (cg-RX-API-DMAC10.html)
CN (1) CN102315190B (cg-RX-API-DMAC10.html)
TW (1) TWI536526B (cg-RX-API-DMAC10.html)

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* Cited by examiner, † Cited by third party
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US8658473B2 (en) * 2012-03-27 2014-02-25 General Electric Company Ultrathin buried die module and method of manufacturing thereof
US9165885B2 (en) * 2013-12-30 2015-10-20 Taiwan Semiconductor Manufacturing Company, Ltd. Staggered via redistribution layer (RDL) for a package and a method for forming the same
US9653438B2 (en) 2014-08-21 2017-05-16 General Electric Company Electrical interconnect structure for an embedded semiconductor device package and method of manufacturing thereof
US9666516B2 (en) 2014-12-01 2017-05-30 General Electric Company Electronic packages and methods of making and using the same
US10141251B2 (en) 2014-12-23 2018-11-27 General Electric Company Electronic packages with pre-defined via patterns and methods of making and using the same
CN106972093B (zh) * 2016-01-13 2019-01-08 光宝光电(常州)有限公司 发光二极管封装结构
US9563732B1 (en) 2016-01-26 2017-02-07 International Business Machines Corporation In-plane copper imbalance for warpage prediction
KR102019352B1 (ko) 2016-06-20 2019-09-09 삼성전자주식회사 팬-아웃 반도체 패키지
EP3553816A4 (en) * 2016-12-08 2020-05-06 Hitachi Chemical Co., Ltd. METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT
TWI648854B (zh) * 2017-06-14 2019-01-21 Win Semiconductors Corp. 用以減少化合物半導體晶圓變形之改良結構
TWI762894B (zh) * 2019-11-05 2022-05-01 友達光電股份有限公司 電路裝置

Citations (2)

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Publication number Priority date Publication date Assignee Title
US20090051038A1 (en) 2007-08-24 2009-02-26 Casio Computer Co., Ltd. Semiconductor device including semiconductor constituent and manufacturing method thereof
US20100108371A1 (en) 2008-11-06 2010-05-06 Ibiden Co., Ltd. Wiring board with built-in electronic component and method for manufacturing the same

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US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
EP1030369B1 (en) * 1997-08-19 2007-12-12 Hitachi, Ltd. Multichip module structure and method for manufacturing the same
JP3618330B2 (ja) * 2002-11-08 2005-02-09 沖電気工業株式会社 半導体装置及びその製造方法
KR100613903B1 (ko) 2004-05-13 2006-08-17 한국전자통신연구원 유전자 알고리즘을 이용한 배열 안테나의 배열 간격 결정방법 및 이를 이용한 소파형 부등간격 배열 안테나
US7453157B2 (en) * 2004-06-25 2008-11-18 Tessera, Inc. Microelectronic packages and methods therefor
JP2006134912A (ja) * 2004-11-02 2006-05-25 Matsushita Electric Ind Co Ltd 半導体モジュールおよびその製造方法、ならびにフィルムインターポーザ
JP4520355B2 (ja) * 2005-04-19 2010-08-04 パナソニック株式会社 半導体モジュール
CN100392849C (zh) * 2005-12-09 2008-06-04 威盛电子股份有限公司 封装体及封装体模块
US20080197478A1 (en) 2007-02-21 2008-08-21 Wen-Kun Yang Semiconductor device package with die receiving through-hole and connecting through-hole and method of the same
US20090127686A1 (en) * 2007-11-21 2009-05-21 Advanced Chip Engineering Technology Inc. Stacking die package structure for semiconductor devices and method of the same
US7863721B2 (en) * 2008-06-11 2011-01-04 Stats Chippac, Ltd. Method and apparatus for wafer level integration using tapered vias
TWI443789B (zh) 2008-07-04 2014-07-01 欣興電子股份有限公司 嵌埋有半導體晶片之電路板及其製法
US8237257B2 (en) * 2008-09-25 2012-08-07 King Dragon International Inc. Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
US8114708B2 (en) 2008-09-30 2012-02-14 General Electric Company System and method for pre-patterned embedded chip build-up
US7964974B2 (en) 2008-12-02 2011-06-21 General Electric Company Electronic chip package with reduced contact pad pitch
US8008781B2 (en) 2008-12-02 2011-08-30 General Electric Company Apparatus and method for reducing pitch in an integrated circuit
US8163596B2 (en) * 2009-03-24 2012-04-24 General Electric Company Stackable electronic package and method of making same
US20110058348A1 (en) 2009-09-10 2011-03-10 Ibiden Co., Ltd. Semiconductor device
JP5633493B2 (ja) 2011-09-16 2014-12-03 オムロン株式会社 半導体装置及びマイクロフォン

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090051038A1 (en) 2007-08-24 2009-02-26 Casio Computer Co., Ltd. Semiconductor device including semiconductor constituent and manufacturing method thereof
US20100108371A1 (en) 2008-11-06 2010-05-06 Ibiden Co., Ltd. Wiring board with built-in electronic component and method for manufacturing the same
WO2010052942A1 (ja) 2008-11-06 2010-05-14 イビデン株式会社 電子部品内蔵配線板及びその製造方法

Also Published As

Publication number Publication date
US20160211208A1 (en) 2016-07-21
US20140159213A1 (en) 2014-06-12
CN102315190B (zh) 2016-03-16
JP2012015504A (ja) 2012-01-19
US8653670B2 (en) 2014-02-18
KR20120001651A (ko) 2012-01-04
EP2402992A3 (en) 2013-05-08
US9679837B2 (en) 2017-06-13
US10068840B2 (en) 2018-09-04
US9299647B2 (en) 2016-03-29
TW201222755A (en) 2012-06-01
CN102315190A (zh) 2012-01-11
US20170278782A1 (en) 2017-09-28
EP2402992A2 (en) 2012-01-04
JP6014309B2 (ja) 2016-10-25
EP2402992B1 (en) 2018-11-21
US20110316167A1 (en) 2011-12-29
TWI536526B (zh) 2016-06-01

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