TWI535836B - 用於鎢拋光之組合物 - Google Patents
用於鎢拋光之組合物 Download PDFInfo
- Publication number
- TWI535836B TWI535836B TW104109036A TW104109036A TWI535836B TW I535836 B TWI535836 B TW I535836B TW 104109036 A TW104109036 A TW 104109036A TW 104109036 A TW104109036 A TW 104109036A TW I535836 B TWI535836 B TW I535836B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- acid
- polishing
- colloidal ceria
- abrasive particles
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
- B01J23/70—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of the iron group metals or copper
- B01J23/74—Iron group metals
- B01J23/745—Iron
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
-
- H10P52/00—
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/222,086 US9309442B2 (en) | 2014-03-21 | 2014-03-21 | Composition for tungsten buffing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201546252A TW201546252A (zh) | 2015-12-16 |
| TWI535836B true TWI535836B (zh) | 2016-06-01 |
Family
ID=54141489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104109036A TWI535836B (zh) | 2014-03-21 | 2015-03-20 | 用於鎢拋光之組合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9309442B2 (enExample) |
| EP (1) | EP3120380B1 (enExample) |
| JP (1) | JP6616394B2 (enExample) |
| KR (1) | KR102390227B1 (enExample) |
| CN (1) | CN106133881B (enExample) |
| TW (1) | TWI535836B (enExample) |
| WO (1) | WO2015143270A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3161858B1 (en) * | 2014-06-25 | 2021-01-27 | Cabot Microelectronics Corporation | Colloidal silica chemical-mechanical polishing concentrate |
| US10688623B2 (en) * | 2014-09-30 | 2020-06-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Slurry dispersion system with real time control |
| JP2017061612A (ja) * | 2015-09-25 | 2017-03-30 | Jsr株式会社 | 化学機械研磨用組成物および化学機械研磨方法 |
| US9631122B1 (en) * | 2015-10-28 | 2017-04-25 | Cabot Microelectronics Corporation | Tungsten-processing slurry with cationic surfactant |
| US9771496B2 (en) * | 2015-10-28 | 2017-09-26 | Cabot Microelectronics Corporation | Tungsten-processing slurry with cationic surfactant and cyclodextrin |
| US20190112196A1 (en) * | 2016-03-30 | 2019-04-18 | Fujimi Incorporated | Cation-modified silica raw material dispersion |
| US10316218B2 (en) * | 2017-08-30 | 2019-06-11 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them |
| US12473457B2 (en) | 2017-09-15 | 2025-11-18 | Cmc Materials Llc | Composition for tungsten CMP |
| US10647887B2 (en) | 2018-01-08 | 2020-05-12 | Cabot Microelectronics Corporation | Tungsten buff polishing compositions with improved topography |
| US11111435B2 (en) | 2018-07-31 | 2021-09-07 | Versum Materials Us, Llc | Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography |
| US10968366B2 (en) | 2018-12-04 | 2021-04-06 | Cmc Materials, Inc. | Composition and method for metal CMP |
| US10676647B1 (en) * | 2018-12-31 | 2020-06-09 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| JP7670722B2 (ja) | 2020-01-07 | 2025-04-30 | シーエムシー マテリアルズ リミティド ライアビリティ カンパニー | 誘導体化ポリアミノ酸 |
| KR20210095465A (ko) * | 2020-01-23 | 2021-08-02 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법 |
| CN111593350A (zh) * | 2020-06-18 | 2020-08-28 | 周家勤 | 一种铝合金镜面化学抛光液及其抛光方法 |
| KR102531445B1 (ko) * | 2020-10-28 | 2023-05-12 | 주식회사 케이씨텍 | 연마 슬러리 조성물 |
| KR102782549B1 (ko) * | 2021-08-23 | 2025-03-14 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법 |
| KR20250059910A (ko) * | 2023-10-25 | 2025-05-07 | 에스케이엔펄스 주식회사 | 반도체 공정용 연마 조성물 및 이를 이용한 기판의 제조방법 |
Family Cites Families (63)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US5230833A (en) | 1989-06-09 | 1993-07-27 | Nalco Chemical Company | Low sodium, low metals silica polishing slurries |
| US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
| US5958288A (en) | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
| US6083419A (en) | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
| JP3810588B2 (ja) | 1998-06-22 | 2006-08-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| IL147039A0 (en) | 1999-07-07 | 2002-08-14 | Cabot Microelectronics Corp | Cmp composition containing silane modified abrasive particles |
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| DE10065027A1 (de) | 2000-12-23 | 2002-07-04 | Degussa | Wäßrige Dispersion, Verfahren zu deren Herstellung und Verwendung |
| US6656241B1 (en) | 2001-06-14 | 2003-12-02 | Ppg Industries Ohio, Inc. | Silica-based slurry |
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| DE10164262A1 (de) | 2001-12-27 | 2003-07-17 | Bayer Ag | Zusammensetzung für das chemisch-mechanische Polieren von Metall- und Metall/Dielektrikastrukturen |
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| US20030162398A1 (en) | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
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| US20070075042A1 (en) | 2005-10-05 | 2007-04-05 | Siddiqui Junaid A | Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method |
| KR20070088245A (ko) | 2006-02-24 | 2007-08-29 | 후지필름 가부시키가이샤 | 금속용 연마액 |
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| JP5312887B2 (ja) * | 2008-09-24 | 2013-10-09 | 富士フイルム株式会社 | 研磨液 |
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| KR101626179B1 (ko) * | 2008-09-26 | 2016-05-31 | 후소카가쿠코교 가부시키가이샤 | 굴곡 구조 및/또는 분지 구조를 갖는 실리카 이차 입자를 함유하는 콜로이달 실리카 및 그의 제조 방법 |
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| CN102449747B (zh) | 2009-08-19 | 2015-09-16 | 日立化成株式会社 | Cmp研磨液和研磨方法 |
| JP2011216582A (ja) * | 2010-03-31 | 2011-10-27 | Fujifilm Corp | 研磨方法、および研磨液 |
| JP5141792B2 (ja) | 2010-06-29 | 2013-02-13 | 日立化成工業株式会社 | Cmp研磨液及び研磨方法 |
| KR101243331B1 (ko) | 2010-12-17 | 2013-03-13 | 솔브레인 주식회사 | 화학 기계적 연마 슬러리 조성물 및 이를 이용하는 반도체 소자의 제조 방법 |
| JP5844135B2 (ja) * | 2010-12-24 | 2016-01-13 | 花王株式会社 | 研磨液組成物の製造方法 |
| US8366059B2 (en) | 2011-01-06 | 2013-02-05 | GM Global Technology Operations LLC | Position controlled cable guide clip |
| JP6050839B2 (ja) * | 2013-02-01 | 2016-12-21 | 株式会社フジミインコーポレーテッド | 表面選択性研磨組成物 |
-
2014
- 2014-03-21 US US14/222,086 patent/US9309442B2/en active Active
-
2015
- 2015-03-20 EP EP15764567.2A patent/EP3120380B1/en active Active
- 2015-03-20 WO PCT/US2015/021666 patent/WO2015143270A1/en not_active Ceased
- 2015-03-20 TW TW104109036A patent/TWI535836B/zh active
- 2015-03-20 CN CN201580015491.XA patent/CN106133881B/zh active Active
- 2015-03-20 KR KR1020167028910A patent/KR102390227B1/ko active Active
- 2015-03-20 JP JP2017501124A patent/JP6616394B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106133881A (zh) | 2016-11-16 |
| TW201546252A (zh) | 2015-12-16 |
| KR20160135767A (ko) | 2016-11-28 |
| JP6616394B2 (ja) | 2019-12-04 |
| US9309442B2 (en) | 2016-04-12 |
| KR102390227B1 (ko) | 2022-04-25 |
| JP2017517900A (ja) | 2017-06-29 |
| EP3120380A4 (en) | 2017-12-13 |
| CN106133881B (zh) | 2019-01-08 |
| EP3120380A1 (en) | 2017-01-25 |
| EP3120380B1 (en) | 2019-03-06 |
| US20150267081A1 (en) | 2015-09-24 |
| WO2015143270A1 (en) | 2015-09-24 |
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