TWI534232B - 液狀樹脂組成物及半導體裝置 - Google Patents
液狀樹脂組成物及半導體裝置 Download PDFInfo
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- TWI534232B TWI534232B TW100134956A TW100134956A TWI534232B TW I534232 B TWI534232 B TW I534232B TW 100134956 A TW100134956 A TW 100134956A TW 100134956 A TW100134956 A TW 100134956A TW I534232 B TWI534232 B TW I534232B
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- meth
- acrylate
- acrylic copolymer
- resin composition
- liquid resin
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- 239000007788 liquid Substances 0.000 title claims description 53
- 239000011342 resin composition Substances 0.000 title claims description 51
- 239000004065 semiconductor Substances 0.000 title claims description 37
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 103
- 229920006243 acrylic copolymer Polymers 0.000 claims description 70
- 239000000178 monomer Substances 0.000 claims description 69
- -1 n-octyl Chemical group 0.000 claims description 59
- 125000000524 functional group Chemical group 0.000 claims description 54
- 239000000470 constituent Substances 0.000 claims description 33
- 125000000217 alkyl group Chemical group 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 19
- 229910052799 carbon Inorganic materials 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 12
- 150000002148 esters Chemical class 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 3
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 150000008360 acrylonitriles Chemical group 0.000 claims 1
- 239000000843 powder Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 15
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 14
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 14
- 238000002156 mixing Methods 0.000 description 14
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 14
- 150000003254 radicals Chemical class 0.000 description 13
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 239000012986 chain transfer agent Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- QVKOLZOAOSNSHQ-UHFFFAOYSA-N prop-1-ene;prop-2-enoic acid Chemical compound CC=C.OC(=O)C=C QVKOLZOAOSNSHQ-UHFFFAOYSA-N 0.000 description 9
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical group C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 229920001515 polyalkylene glycol Polymers 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003999 initiator Substances 0.000 description 4
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- 239000007870 radical polymerization initiator Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- BEQKKZICTDFVMG-UHFFFAOYSA-N 1,2,3,4,6-pentaoxepane-5,7-dione Chemical compound O=C1OOOOC(=O)O1 BEQKKZICTDFVMG-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000012776 electronic material Substances 0.000 description 2
- 238000007720 emulsion polymerization reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 2
- 125000005007 perfluorooctyl group Chemical group FC(C(C(C(C(C(C(C(F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)F)(F)* 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- BGHCVCJVXZWKCC-UHFFFAOYSA-N tetradecane Chemical compound CCCCCCCCCCCCCC BGHCVCJVXZWKCC-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- FVQMJJQUGGVLEP-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)C FVQMJJQUGGVLEP-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- ZORJPNCZZRLEDF-UHFFFAOYSA-N (3-methoxy-3-methylbutoxy)carbonyloxy (3-methoxy-3-methylbutyl) carbonate Chemical compound COC(C)(C)CCOC(=O)OOC(=O)OCCC(C)(C)OC ZORJPNCZZRLEDF-UHFFFAOYSA-N 0.000 description 1
- NOBYOEQUFMGXBP-UHFFFAOYSA-N (4-tert-butylcyclohexyl) (4-tert-butylcyclohexyl)oxycarbonyloxy carbonate Chemical compound C1CC(C(C)(C)C)CCC1OC(=O)OOC(=O)OC1CCC(C(C)(C)C)CC1 NOBYOEQUFMGXBP-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- MJYFYGVCLHNRKB-UHFFFAOYSA-N 1,1,2-trifluoroethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(F)(F)CF MJYFYGVCLHNRKB-UHFFFAOYSA-N 0.000 description 1
- PYOLJOJPIPCRDP-UHFFFAOYSA-N 1,1,3-trimethylcyclohexane Chemical compound CC1CCCC(C)(C)C1 PYOLJOJPIPCRDP-UHFFFAOYSA-N 0.000 description 1
- VTEYUPDBOLSXCD-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-2-methylcyclohexane Chemical compound CC1CCCCC1(OOC(C)(C)C)OOC(C)(C)C VTEYUPDBOLSXCD-UHFFFAOYSA-N 0.000 description 1
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 1
- OTMBZPVYOQYPBE-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclododecane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCCCCCCCC1 OTMBZPVYOQYPBE-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- OKIRBHVFJGXOIS-UHFFFAOYSA-N 1,2-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC=C1C(C)C OKIRBHVFJGXOIS-UHFFFAOYSA-N 0.000 description 1
- BRBMYNGGGPTKKL-UHFFFAOYSA-N 1,9-decanediol Chemical compound CC(O)CCCCCCCCO BRBMYNGGGPTKKL-UHFFFAOYSA-N 0.000 description 1
- PKJOOHXMAGLQFZ-UHFFFAOYSA-N 1-(2-cyclohexylpropan-2-ylperoxy)ethyl hexanoate Chemical compound C(CCCCC)(=O)OC(C)OOC(C)(C)C1CCCCC1 PKJOOHXMAGLQFZ-UHFFFAOYSA-N 0.000 description 1
- AYMDJPGTQFHDSA-UHFFFAOYSA-N 1-(2-ethenoxyethoxy)-2-ethoxyethane Chemical compound CCOCCOCCOC=C AYMDJPGTQFHDSA-UHFFFAOYSA-N 0.000 description 1
- NANAFVMKEPYYRS-UHFFFAOYSA-N 1-(oxolan-2-yl)ethyl prop-2-enoate Chemical compound C(C=C)(=O)OC(C1CCCO1)C NANAFVMKEPYYRS-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- ZHKBLALOBMBJLL-UHFFFAOYSA-N 1-hexylperoxyhexane Chemical group CCCCCCOOCCCCCC ZHKBLALOBMBJLL-UHFFFAOYSA-N 0.000 description 1
- RZICEOJUAFHYFO-UHFFFAOYSA-N 1-hydroperoxyhexane Chemical compound CCCCCCOO RZICEOJUAFHYFO-UHFFFAOYSA-N 0.000 description 1
- LWRXNMLZNDYFAW-UHFFFAOYSA-N 1-octylperoxyoctane Chemical compound CCCCCCCCOOCCCCCCCC LWRXNMLZNDYFAW-UHFFFAOYSA-N 0.000 description 1
- WVGXBYVKFQJQGN-UHFFFAOYSA-N 1-tert-butylperoxy-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1OOC(C)(C)C WVGXBYVKFQJQGN-UHFFFAOYSA-N 0.000 description 1
- HQOVXPHOJANJBR-UHFFFAOYSA-N 2,2-bis(tert-butylperoxy)butane Chemical compound CC(C)(C)OOC(C)(CC)OOC(C)(C)C HQOVXPHOJANJBR-UHFFFAOYSA-N 0.000 description 1
- DPGYCJUCJYUHTM-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-yloxy 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOOC(C)(C)CC(C)(C)C DPGYCJUCJYUHTM-UHFFFAOYSA-N 0.000 description 1
- QNLVSEVOEORLBH-UHFFFAOYSA-N 2,5-bis(2-ethylhexylperoxy)-2,5-dimethylhexane Chemical compound CCCCC(CC)COOC(C)(C)CCC(C)(C)OOCC(CC)CCCC QNLVSEVOEORLBH-UHFFFAOYSA-N 0.000 description 1
- ODBCKCWTWALFKM-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhex-3-yne Chemical compound CC(C)(C)OOC(C)(C)C#CC(C)(C)OOC(C)(C)C ODBCKCWTWALFKM-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- LBNDGEZENJUBCO-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethyl]butanedioic acid Chemical compound CC(=C)C(=O)OCCC(C(O)=O)CC(O)=O LBNDGEZENJUBCO-UHFFFAOYSA-N 0.000 description 1
- XKBHBVFIWWDGQX-UHFFFAOYSA-N 2-bromo-3,3,4,4,5,5,5-heptafluoropent-1-ene Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(Br)=C XKBHBVFIWWDGQX-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- BRQMAAFGEXNUOL-UHFFFAOYSA-N 2-ethylhexyl (2-methylpropan-2-yl)oxy carbonate Chemical compound CCCCC(CC)COC(=O)OOC(C)(C)C BRQMAAFGEXNUOL-UHFFFAOYSA-N 0.000 description 1
- NPSJHQMIVNJLNN-UHFFFAOYSA-N 2-ethylhexyl 4-nitrobenzoate Chemical compound CCCCC(CC)COC(=O)C1=CC=C([N+]([O-])=O)C=C1 NPSJHQMIVNJLNN-UHFFFAOYSA-N 0.000 description 1
- 239000004808 2-ethylhexylester Substances 0.000 description 1
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- QPIRYFWCAHUZTB-UHFFFAOYSA-N 3,5,5-trimethyl-1-(3,5,5-trimethylhexylperoxy)hexane Chemical compound CC(C)(C)CC(C)CCOOCCC(C)CC(C)(C)C QPIRYFWCAHUZTB-UHFFFAOYSA-N 0.000 description 1
- XYFRHHAYSXIKGH-UHFFFAOYSA-N 3-(5-methoxy-2-methoxycarbonyl-1h-indol-3-yl)prop-2-enoic acid Chemical compound C1=C(OC)C=C2C(C=CC(O)=O)=C(C(=O)OC)NC2=C1 XYFRHHAYSXIKGH-UHFFFAOYSA-N 0.000 description 1
- UVWVIEBLYRKAFQ-UHFFFAOYSA-N 4,4-bis(tert-butylperoxy)butyl pentanoate Chemical compound CCCCC(=O)OCCCC(OOC(C)(C)C)OOC(C)(C)C UVWVIEBLYRKAFQ-UHFFFAOYSA-N 0.000 description 1
- RBPBGWUCZJGOJF-UHFFFAOYSA-N 4,6-bis(tert-butylperoxy)benzene-1,3-dicarboxylic acid Chemical compound C(C)(C)(C)OOC1=CC(=C(C=C1C(=O)O)C(=O)O)OOC(C)(C)C RBPBGWUCZJGOJF-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- OQLZINXFSUDMHM-UHFFFAOYSA-N Acetamidine Chemical compound CC(N)=N OQLZINXFSUDMHM-UHFFFAOYSA-N 0.000 description 1
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- 229910052582 BN Inorganic materials 0.000 description 1
- 229920001342 Bakelite® Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- NPYILHIUWRZRTG-UHFFFAOYSA-N C(CCCCCCCCC)OCCC.OC(=CC)CC Chemical compound C(CCCCCCCCC)OCCC.OC(=CC)CC NPYILHIUWRZRTG-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/14—Esterification
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/04—Polymers provided for in subclasses C08C or C08F
- C08F290/046—Polymers of unsaturated carboxylic acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
- C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
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Description
本發明係關於液狀樹脂組成物及半導體裝置。
本申請案係基於2010年9月30日於日本提出申請之日本專利特願2010-220164號主張優先權,其內容引用於本文中。
近年來,作為環境應對之一環,係發展自半導體製品中消除鉛,且傾向於基板安裝時使用無鉛銲錫,因此,與習知之錫-鉛銲錫之情形相比,回焊溫度亦變高。因此,作為將IC(integrated circuit,積體電路)等半導體元件接著於金屬框架或有機基板等支持體之晶粒黏著材料,期望尤其亦可充分耐受隨著回焊溫度之上升之半導體封裝內部的應力增加,且構件間(例如半導體元件/密封材料、半導體元件/晶粒黏著層、晶粒黏著層/阻焊層(基板表面)、基板內部(阻焊層/銅跡線)、導線架/晶粒黏著層、導線架/密封材料等)之剝離不易產生,亦即於高溫下具備低應力性、高密著性之晶粒黏著材料。
進而,於近來行動電話等電子機器之小型輕量化、薄型化、高功能化迅速發展之過程中,強烈要求半導體封裝本身之小型薄型化,伴隨於此,半導體封裝內之半導體元件之薄型化變得不可或缺。作為將半導體元件接著於支持體之晶粒黏著材料,雖就成本優點等理由而言,常常使用液狀之晶粒黏著材料,但於安裝薄型化之半導體元件於支持體之狀況下使用液狀之晶粒黏著材料的情形時,該液狀之晶粒黏著材料變得易於移動到半導體元件之上部,因此,作為液狀之晶粒黏著材料,除了期望高溫下之低應力性、高密著性外,亦期望於更低負荷下顯示出良好之潤濕擴散性。
為因應高溫下之低應力性、高密著性之要求,而對添加低玻璃轉移溫度(Tg)之高分子量成分之方法(例如,參照專利文獻1)進行研究。然而,為利用該方法獲得液狀之晶粒黏著材料,必需使用用以溶解高分子量成分之大量之稀釋劑或溶劑,甚至有所獲得之晶粒黏著材料易於拉絲,塗佈作業性差之問題。另一方面,若為膜狀之晶粒黏著材料,雖不影響作業性,然而膜狀之晶粒黏著材料有因接著半導體元件之有機基板等支持體表面上配線之有無等所造成的凹凸之埋入性非常差、且易於產生空隙之問題。
為解決此種問題,而對使用分子量為1000以上且20000以下的化合物之方法進行研究,而發明出塗佈作業性、耐焊裂性優異之液狀樹脂組成物(例如,參照專利文獻2)。然而,若添加分子量為1000以上且20000以下之化合物至顯示出良好之耐焊裂性之量,則液狀樹脂組成物之黏度變高,從而導致於近年來要求提高之半導體元件安裝時,引起低負荷下之潤濕擴散性變差。如上所述,並無可同時滿足耐焊裂性與半導體元件安裝時之低負荷下之潤濕擴散性的液狀之晶粒黏著材料。
[專利文獻1]日本專利特開2005-154687號公報
[專利文獻2]日本專利特開2008-235501號公報
本發明之課題在於提供顯示出低彈性模數且良好之高溫接著性,並且晶片安裝後之潤濕擴散性優異之液狀樹脂組成物,且提供於使用該液狀樹脂組成物作為半導體用晶粒黏著材料或散熱構件用接著劑之情形時,耐焊裂性等可靠性優異之半導體裝置。
本案之此種課題係藉由下述[1]~[6]所揭示之本發明而達成。
[1]一種液狀樹脂組成物,其係至少含有具自由基聚合性官能基之(甲基)丙烯酸系共聚物,用以將半導體元件或散熱構件接著於支持體者,其中,上述具自由基聚合性官能基之(甲基)丙烯酸系共聚物係於總構成單體中含有10重量%~40重量%之具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯,作為構成單體。
[2]如[1]之液狀樹脂組成物,其中,上述(甲基)丙烯酸系共聚物之自由基聚合性官能基係自(甲基)丙烯醯基、(甲基)烯丙基、乙烯基、馬來醯亞胺基所組成之群中選擇之至少1種。
[3]如[1]或[2]之液狀樹脂組成物,其中,上述(甲基)丙烯酸系共聚物之自由基聚合性官能基之官能基當量為1500~2500。
[4]如[1]至[3]中任一項之液狀樹脂組成物,其中,作為上述(甲基)丙烯酸系共聚物之構成單體的具有碳數6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯,係(甲基)丙烯酸正己酯、(甲基)丙烯酸正庚酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸2-甲基辛酯、(甲基)丙烯酸2-乙基庚酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯。
[5]如[1]至[4]中任一項之液狀樹脂組成物,其中,上述熱硬化性接著劑組成物進而含有至少1個以上之低應力劑。
[6]一種半導體裝置,其特徵為使用[1]至[5]中任一項之液狀樹脂組成物作為晶粒黏著材料或散熱構件接著用材料而製作。
本發明之液狀樹脂組成物由於塗佈作業性及半導體元件安裝時之低負荷下之潤濕擴散性優異,進而於高溫下顯示出低彈性模數且高密著性,故而可藉由使用本發明之液狀樹脂組成物作為晶粒黏著材料或散熱構件用接著劑,從而提供具有高可靠性之半導體裝置。
本發明係至少含有具自由基聚合性官能基之(甲基)丙烯酸系共聚物之液狀樹脂組成物,且上述具自由基聚合性官能基之(甲基)丙烯酸系共聚物係於總構成單體中含有10重量%~40重量%之具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯,作為構成單體。藉此,塗佈作業性及半導體元件安裝時之低負荷下之潤濕擴散性優異,進而於高溫下顯示出低彈性模數且高密著性,因此,可藉由使用本發明之液狀樹脂組成物作為晶粒黏著材料或散熱構件用接著劑,而提供具有高可靠性之半導體裝置。
以下,對本發明進行詳細說明。
本發明中使用之具自由基聚合性官能基之(甲基)丙烯酸系共聚物係於總構成單體中含有10重量%~40重量%之具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯,作為構成單體。使用(甲基)丙烯酸系共聚物之目的在於:由於可獲得彈性模數低之硬化物,故而可藉由此效果而賦予高溫下之優異低應力性。此外,較佳為(甲基)丙烯酸系共聚物含有自由基聚合性官能基。其原因在於:藉由具有反應性高之自由基聚合性官能基,可獲得硬化性優異之液狀樹脂組成物,從而可獲得於高溫下顯示出高密著性之硬化物。此處,所謂自由基聚合性官能基可舉出:(甲基)丙烯醯基、(甲基)烯丙基、乙烯基、馬來醯亞胺基等,較佳為使用該等中之至少1種。作為(甲基)丙烯酸系共聚物所具有之自由基聚合性官能基之數量,較佳為官能基當量成為1500~2500之範圍。其原因在於:於官能基當量小於上述範圍之情形時,由於交聯密度變高,故而缺乏低應力性,而於大於上述範圍之情形時,硬化性變差,從而成為於高溫下密著性下降之原因。又,分子量較佳為1000以上且20000以下之範圍。其原因在於:於分子量低於上述範圍之情形時,未充分發揮目標之低彈性模數化效果,而於高於上述範圍之情形時,液狀樹脂組成物之黏度變得過高,從而導致塗佈作業性惡化。
(甲基)丙烯酸系共聚物較佳為具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯在總構成單體中為10重量%~40重量%。藉此,(甲基)丙烯酸系共聚物變得於側鏈上具有碳數為6以上且9以下之直鏈或分支烷基,可藉由該等之立體障礙之影響而獲得低黏度化之(甲基)丙烯酸系共聚物。藉由此效果,即便使(甲基)丙烯酸系共聚物之添加量增多,仍可將液狀樹脂組成物之黏度抑制為較低,於半導體元件安裝時,即便低負荷下亦可實現良好之潤濕擴散性。此處,具有碳數6以上且9以下之直鏈或分支烷基的(甲基)丙烯酸烷基酯限定為總構成單體中含有10重量%~40重量%之理由為:於碳數小於上述範圍或構成單體量較少之情形時,所期待程度的低黏度化之效果消失,而於碳數大於上述範圍或構成單體量較多之情形時,會阻礙自由基聚合性官能基之反應,導致硬化性變差,故而不佳。
作為(甲基)丙烯酸系共聚物之構成單體的具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯,例如可舉出:(甲基)丙烯酸正己酯、(甲基)丙烯酸正庚酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸2-甲基辛酯、(甲基)丙烯酸2-乙基庚酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯等,該等可單獨使用或混合2種以上而使用。
本發明中使用之(甲基)丙烯酸系共聚物之製作方法並無特別限定,例如可藉由乳化聚合等使用通常之自由基聚合起始劑之公知的技術而製作。此時,作為於製作(甲基)丙烯酸系共聚物時使用之單體,較佳為至少3種以上,其3種之丙烯酸單體較佳為具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯單體;具有反應性官能基之(甲基)丙烯酸酯單體;具有碳數5以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯單體。使用具有反應性官能基之(甲基)丙烯酸酯單體之原因在於導入自由基聚合性官能基。例如,若使用(甲基)丙烯酸等具有羧基之單體,則可獲得具有羧基之(甲基)丙烯酸系共聚物。藉由使該共聚物與(甲基)丙烯酸羥乙酯、羥乙基乙烯醚、(甲基)烯丙醇等具有羥基及自由基聚合性官能基之化合物進行反應,可獲得具自由基聚合性官能基之(甲基)丙烯酸系共聚物。或者,若使用(甲基)丙烯酸環氧丙酯等具有環氧丙基之(甲基)丙烯酸酯,則可獲得具有環氧丙基之(甲基)丙烯酸系共聚物。藉由使該共聚物與(甲基)丙烯酸、馬來醯亞胺化胺基酸或其衍生物等具自由基聚合性官能基之化合物進行反應,可將自由基聚合性官能基導入(甲基)丙烯酸系共聚物中。
用作具有碳數5以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯單體者,例如可舉出:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯等,該等可單獨使用或混合2種以上而使用。
本發明之液狀樹脂組成物亦可含有填充材料。作為填充材料並無特別限制,例如可舉出:銀粉、金粉、銅粉、鋁粉、鎳粉、鈀粉等金屬粉;氧化鋁粉末、氧化鈦粉末、氮化鋁粉末、氮化硼粉末、二氧化矽粉末等陶瓷粉末;聚乙烯粉末、聚丙烯酸酯粉末、聚四氟乙烯粉末、聚醯胺粉末、聚胺基甲酸酯粉末、聚矽氧烷粉末等高分子粉末等,該等可單獨使用或混合2種以上而使用。其中,較佳為於表面具有疏水性官能基之粉末,或被覆疏水性分散劑等之粉末。其理由為:藉由使用粉末,與含有具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯作為構成單體而提高疏水性的(甲基)丙烯酸系共聚物之潤濕性變得良好,因此,可更有效地抑制液狀樹脂組成物之黏度增加,藉此可顯示出半導體元件安裝時之良好的潤濕擴散性。尤其於要求導電性、熱傳導性之情形時,較佳為使用銀粉。只要為市售作為一般電子材料用之銀粉即可,可取得還原粉、霧化粉(atomized powder)等。其中,電子材料用以外之銀粉中有離子性雜質之量較多之情形,因此需要注意。
上述填充材料之平均粒徑較佳為1μm以上且30μm以下。其原因在於:於平均粒徑小於上述範圍之情形時,液狀樹脂組成物之黏度變得過高,從而無法獲得良好之作業性,而於大於上述範圍之情形時,於使用噴嘴吐出液狀樹脂組成物之情形時,會導致噴嘴堵塞。
上述填充材料之形狀為片(flake)狀、球狀等,並無特別限定,但就例如於銀粉之情形時使保存性或作業性提高之方面而言,較佳為使用片狀者。填充材料之調配量可根據目的而進行適當調整,例如於使用銀粉之情形時,通常較佳為於液狀樹脂組成物中為65重量%以上且95重量%以下。其理由為:於銀粉之調配量少於上述範圍之情形時,導電性變差,而於多於上述範圍之情形時,液狀樹脂組成物之黏度變得過高,從而導致作業性惡化。
又,本發明之液狀樹脂組成物亦可含有低應力劑。藉由使用低應力劑,可對液狀樹脂組成物之硬化物賦予韌性或低應力性,藉此,半導體元件與支持體之密著性大幅提高,且成為更不易剝離者。作為所使用之低應力劑,並無特別限定,例如可舉出:聚異戊二烯、聚丁二烯、1,2-聚丁二烯、苯乙烯-丁二烯橡膠、丙烯腈-丁二烯橡膠、聚氯丁二烯、聚(氧化丙烯)、聚(氧化四亞甲基)二醇、聚烯烴二醇、聚-ε-己內酯、聚矽氧橡膠、聚硫橡膠、氟橡膠等,該等可單獨使用或混合2種以上而使用。
上述低應力劑之調配量較佳為於液狀樹脂組成物中為1重量%以上且15重量%以下。其理由為:於調配量小於上述範圍之情形時,無法充分賦予目標之韌性或低應力性,而於大於上述範圍之情形時,液狀樹脂組成物之黏度變得過高,從而導致作業性惡化。
又,上述低應力劑為提高與其他樹脂之相溶性,更佳為使用具有官能基之低應力劑。作為低應力劑所具有之具體官能基,可舉出:乙烯基、環氧基、羧基、羥基或順丁烯二酸酐基等。該等官能基之中,就獲得相溶性提高且塗佈作業性優異之液狀樹脂組成物之方面而言,更佳為使用具有順丁烯二酸酐基之低應力劑。
就硬化性、作業性、接著性、可靠性等觀點而言,本發明之液狀樹脂組成物亦可視需要含有以下所示之化合物。例如有:2-(甲基)丙烯醯氧基乙基琥珀酸、2-(甲基)丙烯醯氧基丙基琥珀酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基甲基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基甲基六氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基四氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基四氫鄰苯二甲酸、2-(甲基)丙烯醯氧基乙基甲基四氫鄰苯二甲酸、2-(甲基)丙烯醯氧基丙基甲基四氫鄰苯二甲酸、2-羥基1,3二(甲基)丙烯醯氧基丙烷、四羥甲基甲烷三(甲基)丙烯酸酯、(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸2-羥丁酯、甘油二(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-(甲基)丙烯醯氧基丙酯、1,4-環己烷二甲醇單(甲基)丙烯酸酯、(甲基)丙烯酸乙基-α-(羥甲基)酯、(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸異戊酯、(甲基)丙烯酸異十八烷基酯、(甲基)丙烯酸二十二烷基酯、(甲基)丙烯酸-2-乙基己酯、其他之(甲基)丙烯酸烷基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸第三丁基環己酯、(甲基)丙烯酸四氫糠酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸苯氧基乙酯、(甲基)丙烯酸異酯、(甲基)丙烯酸環氧丙酯、三羥甲基丙烷三(甲基)丙烯酸酯、單(甲基)丙烯酸鋅、二(甲基)丙烯酸鋅、(甲基)丙烯酸二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯、新戊二醇(甲基)丙烯酸酯、(甲基)丙烯酸三氟乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、(甲基)丙烯酸2,2,3,3,4,4-六氟丁酯、(甲基)丙烯酸全氟辛酯、(甲基)丙烯酸全氟辛基乙酯、乙二醇二(甲基)丙烯酸酯、丙二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,3-丁二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、四亞甲基二醇二(甲基)丙烯酸酯、(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸丁氧基乙酯、乙氧基二乙二醇(甲基)丙烯酸酯、甲氧基聚伸烷二醇單(甲基)丙烯酸酯、辛氧基聚伸烷二醇單(甲基)丙烯酸酯、十二烷氧基聚伸烷二醇單(甲基)丙烯酸酯、十八烷氧基聚伸烷二醇單(甲基)丙烯酸酯、烯丙氧基聚伸烷二醇單(甲基)丙烯酸酯、壬基苯氧基聚伸烷二醇單(甲基)丙烯酸酯、N,N'-亞甲基雙(甲基)丙烯醯胺、N,N'-伸乙基雙(甲基)丙烯醯胺、1,2-二(甲基)丙烯醯胺乙二醇、二(甲基)丙烯醯氧基甲基三環癸烷、2-(甲基)丙烯醯氧基乙基、N-(甲基)丙烯醯氧基乙基馬來醯亞胺、N-(甲基)丙烯醯氧基乙基六氫鄰苯二甲醯亞胺、N-(甲基)丙烯醯氧基乙基鄰苯二甲醯亞胺、N-乙烯基-2-吡咯啶酮、乙氧化雙酚A(甲基)丙烯酸酯、丙氧化雙酚A(甲基)丙烯酸酯、苯乙烯衍生物、α-甲基苯乙烯衍生物等,但並無特別限定。
進而,本發明之液狀樹脂組成物亦可含有聚合起始劑,作為聚合起始劑,尤佳係使用熱自由基聚合起始劑。只要為一般用作熱自由基聚合起始劑者,則無特別限定,但作為所期望者,較佳為於急速加熱試驗(將1 g試樣置於電熱板之上,以4℃/min進行升溫時之分解開始溫度)中分解溫度為40℃以上且140℃以下者。若分解溫度低於40℃,則液狀樹脂組成物常溫下之保存性變差,若高於140℃,則硬化時間變得極長,故而不佳。作為滿足此條件之熱自由基聚合起始劑之具體例,可舉出:甲基乙基酮過氧化物、甲基環己酮過氧化物、甲基乙醯乙酸鹽過氧化物、乙醯丙酮過氧化物、1,1-雙(第三丁基過氧化)3,3,5-三甲基環己烷、1,1-雙(第三己基過氧化)環己烷、1,1-雙(第三己基過氧化)3,3,5-三甲基環己烷、1,1-雙(第三丁基過氧化)環己烷、2,2-雙(4,4-二-第三丁基過氧化環己基)丙烷、1,1-雙(第三丁基過氧化)環十二烷、4,4-雙(第三丁基過氧化)戊酸正丁酯、2,2-雙(第三丁基過氧化)丁烷、1,1-雙(第三丁基過氧化)-2-甲基環己烷、第三丁基過氧化氫、過氧化氫對薄荷烷、1,1,3,3-四甲基丁基過氧化氫、第三己基過氧化氫、過氧化二異丙苯、2,5-二甲基-2,5-雙(第三丁基過氧化)己烷、α,α'-雙(第三丁基過氧化)二異丙基苯、第三丁基過氧化異丙苯、二-過氧化第三丁基、2,5-二甲基-2,5-雙(第三丁基過氧化)己炔、3-異丁醯過氧化物、3,5,5-三甲基己醯過氧化物、辛醯過氧化物、月桂醯過氧化物、桂皮酸過氧化物、間甲苯醯過氧化物、苯甲醯過氧化物、過氧化二碳酸二異丙酯、過氧化二碳酸雙(4-第三丁基環己基)酯、過氧化二碳酸二-3-甲氧基丁酯、過氧化二碳酸二-2-乙基己酯、過氧化二碳酸二-第二丁酯、過氧化二碳酸二(3-甲基-3-甲氧基丁基)酯、過氧化二碳酸二(4-第三丁基環己基)酯、α,α'-雙(新癸醯基過氧化)二異丙基苯、異丙苯基過氧化新癸酸酯、過氧化新癸酸1,1,3,3,-四甲基丁酯、過氧化新癸酸1-環己基-1-甲基乙酯、過氧化新癸酸第三己酯、過氧化新癸酸第三丁酯、過氧化異丁酸第三己酯、過氧化異丁酸第三丁酯、2,5-二甲基-2,5-雙(2-乙基己醯基過氧化)己烷、1,1,3,3-四甲基丁基過氧化-2-乙基己酸酯、己酸1-環己基-1-甲基乙基過氧化-2-乙酯、己酸第三己基過氧化-2-乙酯、己酸第三丁基過氧化-2-乙酯、第三丁基過氧化異丁酸酯、第三丁基過氧化順丁烯二酸酯、第三丁基過氧化月桂酸酯、己酸第三丁基過氧化-3,5,5-三甲酯、單碳酸第三丁基過氧化異丙酯、單碳酸第三丁基過氧化-2-乙基己酯、2,5-二甲基-2,5-雙(苯甲醯過氧化)己烷、第三丁基過氧化乙酸酯、第三己基過氧化苯甲酸酯、第三丁基過氧化-間甲苯醯基苯甲酸酯、第三丁基過氧化苯甲酸酯、雙(第三丁基過氧化)間苯二甲酸酯、單碳酸第三丁基過氧化烯丙酯、3,3',4,4'-四(第三丁基過氧化羰基)二苯甲酮等。該等可單獨使用或為了控制硬化性而混合2種以上使用。聚合起始劑之較佳調配量係於液狀樹脂組成物中為0.02重量%以上且5重量%以下,更佳為0.05重量%以上且2重量%。
此處,本發明之液狀樹脂組成物由於通常於螢光燈等照明下使用,故而若含有光聚合起始劑,則於使用中會觀察到因反應而黏度上升之現象。因此,實質上含有光聚合起始劑並不佳。實質上,光聚合起始劑亦可以未觀察到黏度上升之程度而微量存在,較佳為不含有光聚合起始劑。
進而,本發明之液狀樹脂組成物亦可使用偶合劑、消泡劑、界面活性劑等添加劑。本發明之液狀樹脂組成物例如可藉由將各成分預先混合,使用三輥混合機進行混練後,進行真空下脫泡,從而製造。
使用本發明之液狀樹脂組成物而製作半導體裝置之方法,係可使用公知之方法。例如,可使用市售之黏晶機,於導線架或基板之既定之部位點膠(dispense)塗佈液狀樹脂組成物後,安裝半導體元件,進行加熱硬化。其後,進行焊線接合,使用環氧樹脂進行轉印成形,藉此製作半導體裝置。或者於倒裝晶片接合後,於利用底部填充材料密封之倒裝晶片BGA(Ball Grid Array,球狀柵格陣列)等晶片背面,點膠液狀樹脂組成物,搭載散熱片、蓋等散熱零件,並進行加熱硬化等。
以下基於實施例及比較例對本發明進行詳細之說明,但本發明並非限定於此。
使用丙烯酸環氧丙酯作為具有反應性官能基之(甲基)丙烯酸酯單體,使用丙烯酸乙酯作為具有碳數5以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯單體,使用丙烯酸-2-乙基己酯作為具有碳數6~9之直鏈或分支烷基之(甲基)丙烯酸烷基酯單體,利用一般之乳化聚合獲得具有環氧丙基之丙烯酸系共聚物後,使該共聚物之環氧丙基與丙烯酸進行反應,獲得含有丙烯醯基之丙烯酸系共聚物1(分子量20000,官能基當量2000,丙烯酸-2-乙基己酯(碳數8)之調配量為總構成單體中之25重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸-2-乙基己酯作為構成單體,藉由與製作丙烯酸系共聚物1之方法相同之操作,獲得分子量不同之含有丙烯醯基之丙烯酸系共聚物2(分子量13000,官能基當量2000,丙烯酸-2-乙基己酯(碳數8)之調配量為總構成單體中之25重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸-2-乙基己酯作為構成單體,藉由與製作丙烯酸系共聚物1之方法相同之操作,獲得分子量不同之含有丙烯醯基之丙烯酸系共聚物3(分子量7000,官能基當量2000,丙烯酸-2-乙基己酯(碳數8)之調配量為總構成單體中之25重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸正己酯作為構成單體,藉由與製作丙烯酸系共聚物2之方法相同之操作,獲得構成單體不同之含有丙烯醯基之丙烯酸系共聚物4(分子量13000,官能基當量2000,丙烯酸正己酯(碳數6)之調配量為總構成單體中之25重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸-2-乙基己酯作為構成單體,藉由與製作丙烯酸系共聚物2之方法相同之操作,獲得官能基當量不同之含有丙烯醯基之丙烯酸系共聚物5(分子量13000,官能基當量1500,丙烯酸-2-乙基己酯(碳數8)之調配量為總構成單體中之25重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸-2-乙基己酯作為構成單體,藉由與製作丙烯酸系共聚物2之方法相同之操作,獲得官能基當量不同之含有丙烯醯基之丙烯酸系共聚物6(分子量13000,官能基當量2500,丙烯酸-2-乙基己酯(碳數8)之調配量為總構成單體中之25重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯作為構成單體,藉由與製作丙烯酸系共聚物1之方法相同之操作,獲得構成單體不同之含有丙烯醯基之丙烯酸系共聚物7(分子量20000,官能基當量2000,構成單體之(甲基)丙烯酸烷基酯為丙烯酸乙酯(碳數2),且不含有具有碳數6~9之直鏈或分支烷基之(甲基)丙烯酸烷基酯)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯作為構成單體,藉由與製作丙烯酸系共聚物7之方法相同之操作,獲得分子量不同之含有丙烯醯基之丙烯酸系共聚物8(分子量7000,官能基當量2000,構成單體之(甲基)丙烯酸烷基酯為丙烯酸乙酯(碳數2),且不含有具有碳數6~9之直鏈或分支烷基之(甲基)丙烯酸烷基酯)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸月桂酯作為構成單體,藉由與製作丙烯酸系共聚物2之方法相同之操作,獲得構成單體不同之含有丙烯醯基之丙烯酸系共聚物9(分子量13000,官能基當量2000,丙烯酸月桂酯(碳數12)之調配量為總構成單體中之25重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸-2-乙基己酯作為構成單體,藉由與製作丙烯酸系共聚物2之方法相同之操作,獲得構成單體之調配不同之含有丙烯醯基之丙烯酸系共聚物10(分子量13000,官能基當量2000,丙烯酸-2-乙基己酯(碳數8)之調配量為總構成單體中之5重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
使用丙烯酸環氧丙酯、丙烯酸乙酯、丙烯酸-2-乙基己酯作為構成單體,藉由與製作丙烯酸系共聚物2之方法相同之操作,獲得構成單體之調配不同之含有丙烯醯基之丙烯酸系共聚物11(分子量13000,官能基當量2000,丙烯酸-2-乙基己酯(碳數8)之調配量為總構成單體中之50重量%)。分子量係藉由鏈轉移劑,官能基當量係藉由單體之調配比而進行調整。
如表1所示,調配上述丙烯酸系共聚物1;藉由1,4乙烯鍵結之比例為72%之聚丁二烯與順丁烯二酸酐之反應而獲得的順丁烯二酸酐改質聚丁二烯(數量平均分子量3100,酸值74 meqKOH/g,Satomer公司製造,Ricobond1731,以下稱為低應力劑);丙氧化雙酚A二丙烯酸酯(新中村化學(股)製造,NK ester A-BPP-3,以下稱為單體1);1,6-己二醇二甲基丙烯酸酯(共榮社化學(股)製造,Light ester1、6HX,以下稱為單體2);甲基丙烯酸異 酯(共榮社化學(股)製造,Light ester IBX,以下稱為單體3);具有甲基丙烯醯基之矽烷偶合劑(信越化學工業(股)製造,KBM-503P,以下稱為偶合劑1);具有環氧丙基之矽烷偶合劑(信越化學工業(股)製造,KBM-403E,以下稱為偶合劑2);1,1-二(第三丁基過氧化)環己烷(日本油脂(股)製造,Perhexa CS,以下稱為聚合起始劑);平均粒徑8 μm,最大粒徑30 μm之片狀銀粉(以下稱為銀粉),使用三輥混合機進行混練並脫泡,藉此獲得液狀樹脂組成物後,將利用以下之評價方法進行評價之結果示於表1。再者,調配比例為重量份。
以表1所示之比例進行調配,以與實施例1相同之方式獲得液狀樹脂組成物後,進行評價。
於實施例2中使用上述丙烯酸系共聚物2,於實施例3中使用上述丙烯酸系共聚物3,於實施例4中使用上述丙烯酸系共聚物4,於實施例5中使用上述丙烯酸系共聚物5,於實施例6中使用上述丙烯酸系共聚物6。
以表1所示之比例進行調配,以與實施例1相同之方式獲得液狀樹脂組成物後,進行評價。
於比較例1中使用丙烯酸系共聚物7,於比較例2中使用丙烯酸系共聚物8,於比較例3中使用丙烯酸系共聚物9,於比較例4中使用丙烯酸系共聚物10,於比較例5中使用丙烯酸系共聚物11。
黏度:使用E型黏度計(3°圓錐),於剛製作好液狀樹脂組成物後測定25℃、2.5 rpm下之值。將黏度之值為20±10 Pa‧S者設為合格。黏度之單位為Pa‧S。
潤濕擴散性:使用表1所示之液狀樹脂組成物,於厚度0.3 mm之BT基板(使用由氰酸酯單體及其寡聚物與雙馬來醯亞胺所構成之BT樹脂的基板)上將矽晶片(7×7 mm,厚度0.2 mm)以成為7成左右之晶片潤濕之方式於低負荷下進行安裝,其後於常溫下放置10分鐘後,藉由X射線可視化裝置測定晶片潤濕殘留之程度。將液狀樹脂組成物之晶片潤濕殘留面積未滿5%之情形設為合格。潤濕殘留面積之單位為%。
抗回焊性:使用表1所示之液狀樹脂組成物,於厚度0.3 mm之BT基板(使用由氰酸酯單體及其寡聚物與雙馬來醯亞胺所構成之BT樹脂的基板)上將矽晶片(7×7 mm,厚度0.2 mm)以成為7成左右之晶片潤濕之方式於低負荷下進行安裝,其後於常溫下放置10分鐘後,進行175℃ 15分鐘(增強(ramp up)30分鐘)硬化而接著。藉由半導體密封用環氧樹脂組成物(SUMITOMO BAKELITE(股)製造,EME-G760),將經固晶之基板密封成5.5×6.6×1.0 mm之面板狀後,進行175℃4小時之後壓模固化,於不吸濕之狀態下通過1次IR回焊。其後,使用切割機單片化成本體大小:10×12 mm,藉此獲得半導體裝置(MAPBGA)。對獲得之半導體裝置進行85℃、相對濕度85%、72小時之吸濕處理後,進行IR回焊處理(260℃,10秒,3次回焊),藉由超音波探傷裝置(穿透型),對處理後之半導體裝置之剝離程度進行測定。將晶粒黏著部位之剝離面積未滿10%之情形設為合格。剝離面積之單位為%。
本發明之液狀樹脂組成物由於潤濕擴散性良好,故而可應用於薄化晶片,藉此,可獲得IR回焊處理等之於高溫環境下耐焊裂性仍優異之半導體裝置。
Claims (5)
- 一種液狀樹脂組成物,其係至少含有具自由基聚合性官能基之(甲基)丙烯酸系共聚物,用以將半導體元件或散熱構件接著於支持體者,其中,上述具自由基聚合性官能基之(甲基)丙烯酸系共聚物係於總構成單體中含有10重量%~40重量%的具有碳數為6以上且9以下之直鏈或分支烷基之(甲基)丙烯酸烷基酯,作為構成單體;上述(甲基)丙烯酸系共聚物之自由基聚合性官能基之官能基當量為1500~2500;上述(甲基)丙烯酸系共聚物之分子量為1000以上且20000以下之範圍。
- 如申請專利範圍第1項之液狀樹脂組成物,其中,上述(甲基)丙烯酸系共聚物之自由基聚合性官能基係自(甲基)丙烯醯基、(甲基)烯丙基、乙烯基、馬來醯亞胺基所組成之群中選擇之至少1種。
- 如申請專利範圍第1或2項之液狀樹脂組成物,其中,作為上述(甲基)丙烯酸系共聚物之構成單體之(甲基)丙烯酸烷基酯係(甲基)丙烯酸正己酯、(甲基)丙烯酸正庚酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸2-甲基辛酯、(甲基)丙烯酸2-乙基庚酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯。
- 如申請專利範圍第1或2項之液狀樹脂組成物,其中, 上述熱硬化性接著劑組成物進一步含有至少1個以上之低應力劑。
- 一種半導體裝置,其特徵為使用申請專利範圍第1至4項中任一項之液狀樹脂組成物作為晶粒黏著材料或散熱構件接著用材料而製作。
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