TWI530465B - 用以形成熔合蓋片之方法及包含熔合蓋片之玻璃封裝 - Google Patents

用以形成熔合蓋片之方法及包含熔合蓋片之玻璃封裝 Download PDF

Info

Publication number
TWI530465B
TWI530465B TW099123528A TW99123528A TWI530465B TW I530465 B TWI530465 B TW I530465B TW 099123528 A TW099123528 A TW 099123528A TW 99123528 A TW99123528 A TW 99123528A TW I530465 B TWI530465 B TW I530465B
Authority
TW
Taiwan
Prior art keywords
frit
bead
substrate
seal
width
Prior art date
Application number
TW099123528A
Other languages
English (en)
Chinese (zh)
Other versions
TW201103872A (en
Inventor
伯吉斯黛博拉Ｌ
塞佛艾德華詹姆斯
斯特賴恩斯布萊恩保羅
Original Assignee
康寧公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 康寧公司 filed Critical 康寧公司
Publication of TW201103872A publication Critical patent/TW201103872A/zh
Application granted granted Critical
Publication of TWI530465B publication Critical patent/TWI530465B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/001—General methods for coating; Devices therefor
    • C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
    • C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/24421—Silicon containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Surface Treatment Of Glass (AREA)
  • Joining Of Glass To Other Materials (AREA)
TW099123528A 2009-07-17 2010-07-16 用以形成熔合蓋片之方法及包含熔合蓋片之玻璃封裝 TWI530465B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22634209P 2009-07-17 2009-07-17

Publications (2)

Publication Number Publication Date
TW201103872A TW201103872A (en) 2011-02-01
TWI530465B true TWI530465B (zh) 2016-04-21

Family

ID=42933089

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099123528A TWI530465B (zh) 2009-07-17 2010-07-16 用以形成熔合蓋片之方法及包含熔合蓋片之玻璃封裝

Country Status (7)

Country Link
US (1) US8505337B2 (enExample)
EP (1) EP2454213A1 (enExample)
JP (1) JP5730870B2 (enExample)
KR (1) KR101590058B1 (enExample)
CN (2) CN104591526B (enExample)
TW (1) TWI530465B (enExample)
WO (1) WO2011008909A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8860305B2 (en) * 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
US20120214017A1 (en) * 2011-02-22 2012-08-23 Pourin Welding Engineering Co., Ltd. Weld Overlay Structure and a Method of Providing a Weld Overlay Structure
JP5947098B2 (ja) * 2011-05-13 2016-07-06 株式会社半導体エネルギー研究所 ガラス封止体の作製方法および発光装置の作製方法
JP5628123B2 (ja) * 2011-09-21 2014-11-19 株式会社日立製作所 ペースト塗布装置およびペースト塗布方法
US9362522B2 (en) * 2012-10-26 2016-06-07 Semiconductor Energy Laboratory Co., Ltd. Method for bonding substrates, method for manufacturing sealing structure, and method for manufacturing light-emitting device
KR102160829B1 (ko) 2012-11-02 2020-09-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 밀봉체 및 밀봉체의 제작 방법
CN105047690B (zh) 2015-08-27 2020-12-04 京东方科技集团股份有限公司 一种玻璃胶、光电封装器件及其封装方法、显示装置
KR102426268B1 (ko) * 2017-09-15 2022-07-27 엘지디스플레이 주식회사 표시장치와 그의 제조방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001307633A (ja) * 2000-04-20 2001-11-02 Mitsubishi Electric Corp フラットディスプレイパネル、フラットディスプレイ装置およびフラットディスプレイパネルの製造方法
KR100429771B1 (ko) * 2000-06-13 2004-05-03 권상직 보조열선을 이용한 평판표시소자의 저온 진공 인-라인프릿 실장방법
TW517356B (en) * 2001-10-09 2003-01-11 Delta Optoelectronics Inc Package structure of display device and its packaging method
KR100865284B1 (ko) * 2001-10-31 2008-10-27 엘지디스플레이 주식회사 액정패널의 실링구조
TW515062B (en) * 2001-12-28 2002-12-21 Delta Optoelectronics Inc Package structure with multiple glue layers
KR100819864B1 (ko) * 2001-12-28 2008-04-07 엘지.필립스 엘시디 주식회사 유기전기발광소자
US6998776B2 (en) 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20050238803A1 (en) * 2003-11-12 2005-10-27 Tremel James D Method for adhering getter material to a surface for use in electronic devices
EP1683209A2 (en) 2003-11-12 2006-07-26 E.I. Dupont De Nemours And Company Encapsulation assembly for electronic devices
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices
KR100671647B1 (ko) 2006-01-26 2007-01-19 삼성에스디아이 주식회사 유기전계발광 표시 장치
KR20080033619A (ko) 2006-10-12 2008-04-17 삼성에스디아이 주식회사 플라즈마 디스플레이 패널
US7800303B2 (en) * 2006-11-07 2010-09-21 Corning Incorporated Seal for light emitting display device, method, and apparatus
TW200836580A (en) * 2007-02-28 2008-09-01 Corning Inc Seal for light emitting display device and method
US7815480B2 (en) * 2007-11-30 2010-10-19 Corning Incorporated Methods and apparatus for packaging electronic components

Also Published As

Publication number Publication date
US8505337B2 (en) 2013-08-13
JP5730870B2 (ja) 2015-06-10
JP2012533505A (ja) 2012-12-27
KR20120089242A (ko) 2012-08-09
WO2011008909A1 (en) 2011-01-20
EP2454213A1 (en) 2012-05-23
US20110014427A1 (en) 2011-01-20
CN102548925A (zh) 2012-07-04
CN104591526A (zh) 2015-05-06
CN102548925B (zh) 2014-12-31
TW201103872A (en) 2011-02-01
KR101590058B1 (ko) 2016-01-29
CN104591526B (zh) 2017-07-28

Similar Documents

Publication Publication Date Title
TWI530465B (zh) 用以形成熔合蓋片之方法及包含熔合蓋片之玻璃封裝
TWI395328B (zh) 封裝電子組件之方法
TWI394732B (zh) 密封玻璃包封之方法
JP4809368B2 (ja) ガラスパッケージをフリット封止するためのシステムおよび方法
JP4625085B2 (ja) 有機発光ダイオード（ｏｌｅｄ）ディスプレイを封止するためのパラメータの最適化
TWI327560B (en) Glass package that is hermetically sealed with a frit and method of fabrication
KR101829228B1 (ko) 밀봉재 및 그것을 사용한 밀봉방법
TWI461094B (zh) 有機發光顯示裝置及製造方法
US20210280817A1 (en) Display modules with laser weld seals and modular display
JP5140201B2 (ja) ガラス層定着方法
KR20110094091A (ko) 높은 열팽창계수 글래스의 레이저 이용 프릿 밀봉 및 이에 따른 밀봉 글래스 패키지
TW201103878A (en) Method and apparatus for manufacturing glass member provided with sealing material layer and method for manufacturing electronic device
KR101453585B1 (ko) 유리 패키지 밀봉용 마스크를 제조하는 방법
CN101536133A (zh) 制造玻璃包封的方法
CN102066277A (zh) 玻璃熔接方法
WO2009145044A1 (ja) ガラス溶着方法
KR20120052300A (ko) 마스크를 지닌 프릿 처리된 커버 시트를 제조하는 방법 및 이를 포함하는 유리 패키지
TW201734503A (zh) 包含uv吸收薄膜之密封元件
TW201904107A (zh) 形成密封之方法、製造密封單元之方法、密封單元及形成密封之設備
CN111048701B (zh) 一种显示面板的封装方法
CN107785499B (zh) 激光封装方法
CN107331796A (zh) 激光扫描密封玻璃封装体的封装方法
JP2021046337A (ja) 接合体及び接合体の製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees