TWI526313B - The manufacturing method of the layered body - Google Patents

The manufacturing method of the layered body Download PDF

Info

Publication number
TWI526313B
TWI526313B TW100148985A TW100148985A TWI526313B TW I526313 B TWI526313 B TW I526313B TW 100148985 A TW100148985 A TW 100148985A TW 100148985 A TW100148985 A TW 100148985A TW I526313 B TWI526313 B TW I526313B
Authority
TW
Taiwan
Prior art keywords
substrate
laminated body
resin layer
support plate
body block
Prior art date
Application number
TW100148985A
Other languages
English (en)
Chinese (zh)
Other versions
TW201226198A (en
Inventor
Akira Wagatsuma
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW201226198A publication Critical patent/TW201226198A/zh
Application granted granted Critical
Publication of TWI526313B publication Critical patent/TWI526313B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Electroluminescent Light Sources (AREA)
TW100148985A 2010-12-28 2011-12-27 The manufacturing method of the layered body TWI526313B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010293248 2010-12-28

Publications (2)

Publication Number Publication Date
TW201226198A TW201226198A (en) 2012-07-01
TWI526313B true TWI526313B (zh) 2016-03-21

Family

ID=46382898

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100148985A TWI526313B (zh) 2010-12-28 2011-12-27 The manufacturing method of the layered body

Country Status (5)

Country Link
JP (1) JP5861647B2 (ja)
KR (1) KR101900971B1 (ja)
CN (1) CN103298615B (ja)
TW (1) TWI526313B (ja)
WO (1) WO2012090787A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014104712A (ja) * 2012-11-29 2014-06-09 Asahi Glass Co Ltd 電子デバイスの製造方法および多層ガラス積層体
WO2014092015A1 (ja) * 2012-12-13 2014-06-19 旭硝子株式会社 電子デバイスの製造方法およびガラス積層体の製造方法
JP6123899B2 (ja) * 2013-08-07 2017-05-10 旭硝子株式会社 板状体の加工方法、および電子デバイスの製造方法
JP6299405B2 (ja) * 2014-05-13 2018-03-28 旭硝子株式会社 複合体の製造方法および積層体の製造方法
CN104211294B (zh) * 2014-08-20 2018-03-27 深圳市华星光电技术有限公司 玻璃基板切割承载装置及切割系统
JP2019066750A (ja) * 2017-10-04 2019-04-25 株式会社ジャパンディスプレイ 表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3081122B2 (ja) * 1994-07-18 2000-08-28 シャープ株式会社 基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JP4326635B2 (ja) * 1999-09-29 2009-09-09 三菱樹脂株式会社 ガラスフィルムの取扱い方法及びガラス積層体
JP2007281067A (ja) * 2006-04-04 2007-10-25 Nitto Denko Corp 半導体装置の製造方法、及びそれに用いる半導体ウェハ加工用の粘着シート
JP4930161B2 (ja) * 2006-05-08 2012-05-16 旭硝子株式会社 薄板ガラス積層体、薄板ガラス積層体を用いた表示装置の製造方法および、支持ガラス基板
JP5716678B2 (ja) * 2010-01-25 2015-05-13 旭硝子株式会社 積層体の製造方法および積層体
JP5671265B2 (ja) * 2010-06-10 2015-02-18 東京応化工業株式会社 基板の加工方法

Also Published As

Publication number Publication date
KR20130133226A (ko) 2013-12-06
KR101900971B1 (ko) 2018-09-20
CN103298615B (zh) 2015-06-10
CN103298615A (zh) 2013-09-11
JPWO2012090787A1 (ja) 2014-06-05
TW201226198A (en) 2012-07-01
JP5861647B2 (ja) 2016-02-16
WO2012090787A1 (ja) 2012-07-05

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