TWI525155B - A hardened resin composition, a dry film, a hardened product, and a display member - Google Patents

A hardened resin composition, a dry film, a hardened product, and a display member Download PDF

Info

Publication number
TWI525155B
TWI525155B TW103129704A TW103129704A TWI525155B TW I525155 B TWI525155 B TW I525155B TW 103129704 A TW103129704 A TW 103129704A TW 103129704 A TW103129704 A TW 103129704A TW I525155 B TWI525155 B TW I525155B
Authority
TW
Taiwan
Prior art keywords
group
resin
resin composition
compound
curable resin
Prior art date
Application number
TW103129704A
Other languages
English (en)
Chinese (zh)
Other versions
TW201529747A (zh
Inventor
Chiho Ueta
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW201529747A publication Critical patent/TW201529747A/zh
Application granted granted Critical
Publication of TWI525155B publication Critical patent/TWI525155B/zh

Links

Landscapes

  • Materials For Photolithography (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
TW103129704A 2013-09-27 2014-08-28 A hardened resin composition, a dry film, a hardened product, and a display member TWI525155B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013202397 2013-09-27
JP2014072819A JP5722483B2 (ja) 2013-09-27 2014-03-31 硬化性樹脂組成物、ドライフィルム、硬化物およびディスプレイ部材

Publications (2)

Publication Number Publication Date
TW201529747A TW201529747A (zh) 2015-08-01
TWI525155B true TWI525155B (zh) 2016-03-11

Family

ID=53049514

Family Applications (2)

Application Number Title Priority Date Filing Date
TW103129704A TWI525155B (zh) 2013-09-27 2014-08-28 A hardened resin composition, a dry film, a hardened product, and a display member
TW103129705A TWI533085B (zh) 2013-09-27 2014-08-28 A hardened resin composition, a dry film, a hardened product, and a display member

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW103129705A TWI533085B (zh) 2013-09-27 2014-08-28 A hardened resin composition, a dry film, a hardened product, and a display member

Country Status (2)

Country Link
JP (2) JP5722484B2 (ja)
TW (2) TWI525155B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127190B1 (ja) * 2016-09-30 2017-05-10 太陽インキ製造株式会社 感光性樹脂組成物、硬化物および硬化物を有するプリント配線板、並びにプリント配線板を備えた光学センサーモジュール
TWI635359B (zh) * 2017-06-02 2018-09-11 律勝科技股份有限公司 感光性聚醯亞胺樹脂組合物及應用其之覆蓋膜的製造方法
JP6853363B2 (ja) * 2017-07-26 2021-03-31 富士フイルム株式会社 硬化性組成物、硬化膜、硬化膜の製造方法、近赤外線カットフィルタ、固体撮像素子、画像表示装置および赤外線センサ
JP6374595B1 (ja) * 2017-09-26 2018-08-15 東京応化工業株式会社 感光性樹脂組成物、硬化膜、表示装置、及びパターン形成方法
JP7101513B2 (ja) * 2018-03-28 2022-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
EP3858923A1 (en) * 2018-09-28 2021-08-04 Nitto Denko Corporation Resin composition, optical semiconductor element, and optical semiconductor device
JP2020083947A (ja) * 2018-11-19 2020-06-04 東レ株式会社 ペースト、それを用いた硬化膜、焼成体、電子部品とその製造方法および配線つきセラミック積層体
JP7254559B2 (ja) * 2019-02-26 2023-04-10 太陽インキ製造株式会社 透明基材用硬化性組成物、ドライフィルム、硬化物、遮光用部材およびディスプレイ用部材
JP2020164814A (ja) * 2019-03-28 2020-10-08 住友化学株式会社 着色硬化性樹脂組成物
JP7061647B2 (ja) * 2020-08-07 2022-04-28 東京応化工業株式会社 固体撮像素子の製造方法、積層体、及びドライフィルム
CN116410656A (zh) * 2021-12-30 2023-07-11 上海飞凯材料科技股份有限公司 遮光组合物及其制备方法、显示装置

Also Published As

Publication number Publication date
TW201529747A (zh) 2015-08-01
JP5722484B2 (ja) 2015-05-20
TWI533085B (zh) 2016-05-11
TW201523131A (zh) 2015-06-16
JP5722483B2 (ja) 2015-05-20
JP2015086357A (ja) 2015-05-07
JP2015086356A (ja) 2015-05-07

Similar Documents

Publication Publication Date Title
TWI525155B (zh) A hardened resin composition, a dry film, a hardened product, and a display member
TWI485514B (zh) A photosensitive resin composition and a cured product thereof, and a printed circuit board
TWI398458B (zh) A photohardenable thermosetting resin composition, a dry film and a hardened product thereof, and a printed wiring board
TWI417662B (zh) A photosensitive resin composition and a hardened product thereof
TWI522735B (zh) A photosensitive resin composition and a cured product thereof, and a hardened product thereof, a printed circuit board having a solder resist layer
JP5865369B2 (ja) 難燃性硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
TWI475033B (zh) Hardened resin composition
JP6383621B2 (ja) 硬化性組成物、ドライフィルム、硬化物、プリント配線板およびプリント配線板の製造方法
JP4975579B2 (ja) 組成物、ドライフィルム、硬化物及びプリント配線板
JP5688116B2 (ja) 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
KR101612569B1 (ko) 경화성 수지 조성물과 그의 경화물, 및 인쇄 배선판
KR101587360B1 (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 디스플레이 부재
KR101619614B1 (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 디스플레이 부재
KR20200137946A (ko) 알칼리 현상형 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판