TWI524426B - 雷射處理裝置 - Google Patents

雷射處理裝置 Download PDF

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Publication number
TWI524426B
TWI524426B TW101148243A TW101148243A TWI524426B TW I524426 B TWI524426 B TW I524426B TW 101148243 A TW101148243 A TW 101148243A TW 101148243 A TW101148243 A TW 101148243A TW I524426 B TWI524426 B TW I524426B
Authority
TW
Taiwan
Prior art keywords
laser
unit
substrate
laser beam
laser processing
Prior art date
Application number
TW101148243A
Other languages
English (en)
Chinese (zh)
Other versions
TW201334076A (zh
Inventor
沈亨基
李基雄
羅玉鈞
崔東奎
Original Assignee
Ａｐ系統股份有限公司
三星顯示有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ａｐ系統股份有限公司, 三星顯示有限公司 filed Critical Ａｐ系統股份有限公司
Publication of TW201334076A publication Critical patent/TW201334076A/zh
Application granted granted Critical
Publication of TWI524426B publication Critical patent/TWI524426B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
TW101148243A 2011-12-20 2012-12-19 雷射處理裝置 TWI524426B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110138700A KR101361205B1 (ko) 2011-12-20 2011-12-20 레이저 가공장치

Publications (2)

Publication Number Publication Date
TW201334076A TW201334076A (zh) 2013-08-16
TWI524426B true TWI524426B (zh) 2016-03-01

Family

ID=48865842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101148243A TWI524426B (zh) 2011-12-20 2012-12-19 雷射處理裝置

Country Status (4)

Country Link
JP (1) JP5555307B2 (ja)
KR (1) KR101361205B1 (ja)
CN (1) CN103406664B (ja)
TW (1) TWI524426B (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465712B2 (ja) * 2015-03-25 2019-02-06 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
KR101944492B1 (ko) 2016-07-26 2019-02-01 에이피시스템 주식회사 레이저 장치, 이를 구비하는 레이저 처리설비, 및 이의 오염 방지방법
KR102489536B1 (ko) 2018-04-06 2023-01-17 에이피시스템 주식회사 기판 처리 장치 및 광 경로 조절 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133786A (ja) * 1984-07-27 1986-02-17 Hitachi Ltd レ−ザトリミング装置
JPS6259820A (ja) * 1985-09-11 1987-03-16 Mitsubishi Electric Corp ビ−ムモ−ドプロフアイラ
JP2852141B2 (ja) * 1991-06-06 1999-01-27 大成ラミック株式会社 積層フィルムへの引裂線形成装置
JP3882288B2 (ja) * 1997-09-16 2007-02-14 株式会社オーク製作所 レーザビーム遮断装置
JP2001028346A (ja) * 1999-07-14 2001-01-30 Sumitomo Heavy Ind Ltd 精密照射用シャッタ機構と制御方法
KR100449088B1 (ko) * 2002-07-12 2004-09-18 삼성전자주식회사 레이저 빔 차단장치 및 그것을 구비하는 화상형성 장치
JP2007190560A (ja) * 2006-01-17 2007-08-02 Miyachi Technos Corp レーザ加工装置
KR100769849B1 (ko) * 2006-11-06 2007-10-24 코닉시스템 주식회사 빔 프로파일 모듈
KR100937767B1 (ko) * 2007-07-30 2010-01-20 주식회사 코윈디에스티 레이저를 이용한 금속패턴 가공 장치 및 그 방법
JP4998946B2 (ja) * 2007-08-01 2012-08-15 株式会社日本製鋼所 レーザ照射方法及びその装置
KR101032794B1 (ko) * 2009-01-05 2011-05-06 나노전광 주식회사 헤이즈 가속 검출장치 및 그 검출방법
KR101092653B1 (ko) * 2009-07-02 2011-12-13 현대자동차주식회사 브레이징 접합용 레이저 헤드장치

Also Published As

Publication number Publication date
CN103406664B (zh) 2015-09-16
TW201334076A (zh) 2013-08-16
JP5555307B2 (ja) 2014-07-23
KR20130071289A (ko) 2013-06-28
CN103406664A (zh) 2013-11-27
JP2013131752A (ja) 2013-07-04
KR101361205B1 (ko) 2014-03-12

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