KR101361205B1 - 레이저 가공장치 - Google Patents

레이저 가공장치 Download PDF

Info

Publication number
KR101361205B1
KR101361205B1 KR1020110138700A KR20110138700A KR101361205B1 KR 101361205 B1 KR101361205 B1 KR 101361205B1 KR 1020110138700 A KR1020110138700 A KR 1020110138700A KR 20110138700 A KR20110138700 A KR 20110138700A KR 101361205 B1 KR101361205 B1 KR 101361205B1
Authority
KR
South Korea
Prior art keywords
laser
substrate
laser beam
unit
laser processing
Prior art date
Application number
KR1020110138700A
Other languages
English (en)
Korean (ko)
Other versions
KR20130071289A (ko
Inventor
심형기
이기웅
나옥균
최동규
Original Assignee
삼성디스플레이 주식회사
에이피시스템 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사, 에이피시스템 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020110138700A priority Critical patent/KR101361205B1/ko
Priority to TW101148243A priority patent/TWI524426B/zh
Priority to JP2012276994A priority patent/JP5555307B2/ja
Priority to CN201210557358.5A priority patent/CN103406664B/zh
Publication of KR20130071289A publication Critical patent/KR20130071289A/ko
Application granted granted Critical
Publication of KR101361205B1 publication Critical patent/KR101361205B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
KR1020110138700A 2011-12-20 2011-12-20 레이저 가공장치 KR101361205B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020110138700A KR101361205B1 (ko) 2011-12-20 2011-12-20 레이저 가공장치
TW101148243A TWI524426B (zh) 2011-12-20 2012-12-19 雷射處理裝置
JP2012276994A JP5555307B2 (ja) 2011-12-20 2012-12-19 レーザー処理装置
CN201210557358.5A CN103406664B (zh) 2011-12-20 2012-12-20 激光处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110138700A KR101361205B1 (ko) 2011-12-20 2011-12-20 레이저 가공장치

Publications (2)

Publication Number Publication Date
KR20130071289A KR20130071289A (ko) 2013-06-28
KR101361205B1 true KR101361205B1 (ko) 2014-03-12

Family

ID=48865842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110138700A KR101361205B1 (ko) 2011-12-20 2011-12-20 레이저 가공장치

Country Status (4)

Country Link
JP (1) JP5555307B2 (ja)
KR (1) KR101361205B1 (ja)
CN (1) CN103406664B (ja)
TW (1) TWI524426B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190117276A (ko) 2018-04-06 2019-10-16 에이피시스템 주식회사 기판 처리 장치 및 광 경로 조절 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6465712B2 (ja) * 2015-03-25 2019-02-06 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
KR101944492B1 (ko) 2016-07-26 2019-02-01 에이피시스템 주식회사 레이저 장치, 이를 구비하는 레이저 처리설비, 및 이의 오염 방지방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3882288B2 (ja) * 1997-09-16 2007-02-14 株式会社オーク製作所 レーザビーム遮断装置
KR100769849B1 (ko) * 2006-11-06 2007-10-24 코닉시스템 주식회사 빔 프로파일 모듈
KR20100081055A (ko) * 2009-01-05 2010-07-14 나노전광 주식회사 헤이즈 가속 검출장치 및 그 검출방법
KR20110002701A (ko) * 2009-07-02 2011-01-10 현대자동차주식회사 브레이징 접합용 레이저 헤드장치

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6133786A (ja) * 1984-07-27 1986-02-17 Hitachi Ltd レ−ザトリミング装置
JPS6259820A (ja) * 1985-09-11 1987-03-16 Mitsubishi Electric Corp ビ−ムモ−ドプロフアイラ
JP2852141B2 (ja) * 1991-06-06 1999-01-27 大成ラミック株式会社 積層フィルムへの引裂線形成装置
JP2001028346A (ja) * 1999-07-14 2001-01-30 Sumitomo Heavy Ind Ltd 精密照射用シャッタ機構と制御方法
KR100449088B1 (ko) * 2002-07-12 2004-09-18 삼성전자주식회사 레이저 빔 차단장치 및 그것을 구비하는 화상형성 장치
JP2007190560A (ja) * 2006-01-17 2007-08-02 Miyachi Technos Corp レーザ加工装置
KR100937767B1 (ko) * 2007-07-30 2010-01-20 주식회사 코윈디에스티 레이저를 이용한 금속패턴 가공 장치 및 그 방법
JP4998946B2 (ja) * 2007-08-01 2012-08-15 株式会社日本製鋼所 レーザ照射方法及びその装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3882288B2 (ja) * 1997-09-16 2007-02-14 株式会社オーク製作所 レーザビーム遮断装置
KR100769849B1 (ko) * 2006-11-06 2007-10-24 코닉시스템 주식회사 빔 프로파일 모듈
KR20100081055A (ko) * 2009-01-05 2010-07-14 나노전광 주식회사 헤이즈 가속 검출장치 및 그 검출방법
KR20110002701A (ko) * 2009-07-02 2011-01-10 현대자동차주식회사 브레이징 접합용 레이저 헤드장치

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190117276A (ko) 2018-04-06 2019-10-16 에이피시스템 주식회사 기판 처리 장치 및 광 경로 조절 장치
KR102489536B1 (ko) 2018-04-06 2023-01-17 에이피시스템 주식회사 기판 처리 장치 및 광 경로 조절 장치

Also Published As

Publication number Publication date
CN103406664B (zh) 2015-09-16
TW201334076A (zh) 2013-08-16
JP5555307B2 (ja) 2014-07-23
KR20130071289A (ko) 2013-06-28
TWI524426B (zh) 2016-03-01
CN103406664A (zh) 2013-11-27
JP2013131752A (ja) 2013-07-04

Similar Documents

Publication Publication Date Title
EP1840942B1 (en) Liquid processing apparatus and liquid processing method
KR101361205B1 (ko) 레이저 가공장치
KR20190005113A (ko) 기판 휨 감시 장치 및 이것을 사용한 기판 처리 장치, 그리고 기판 휨 감시 방법
JP4417205B2 (ja) 基板処理装置
KR102107292B1 (ko) 주연 처리 장치 및 주연 처리 방법
KR101326107B1 (ko) 레이저 가공장치 및 그 제어방법
KR101361206B1 (ko) 레이저 가공장치 및 그 제어방법
KR101389005B1 (ko) 레이저 가공장치 및 그 제어방법
JP4105613B2 (ja) 基板処理装置
TWI652479B (zh) 基板處理裝置及臭氧氣體濃度之異常偵測方法
CN108573900B (zh) 基板处理装置
JP7141204B2 (ja) 研磨装置、及び研磨方法
US11765879B2 (en) Substrate processing apparatus and monitoring method
KR102387540B1 (ko) 기판 세정 장치 및 기판 세정 방법
JP7223631B2 (ja) 検出装置及び真空処理装置
JP2018012132A (ja) 付着物除去方法及びベベルエッチング装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
N231 Notification of change of applicant
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170306

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180305

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20190305

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20200303

Year of fee payment: 7