TWI521815B - 用於積體電路裝置之插座 - Google Patents

用於積體電路裝置之插座 Download PDF

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Publication number
TWI521815B
TWI521815B TW101103120A TW101103120A TWI521815B TW I521815 B TWI521815 B TW I521815B TW 101103120 A TW101103120 A TW 101103120A TW 101103120 A TW101103120 A TW 101103120A TW I521815 B TWI521815 B TW I521815B
Authority
TW
Taiwan
Prior art keywords
layer
conductive
substrate
contact pins
power
Prior art date
Application number
TW101103120A
Other languages
English (en)
Chinese (zh)
Other versions
TW201246727A (en
Inventor
川手良尚
椿裕一
Original Assignee
３Ｍ新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201246727A publication Critical patent/TW201246727A/zh
Application granted granted Critical
Publication of TWI521815B publication Critical patent/TWI521815B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW101103120A 2011-02-01 2012-01-31 用於積體電路裝置之插座 TWI521815B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011019937A JP6157047B2 (ja) 2011-02-01 2011-02-01 Ｉｃデバイス用ソケット

Publications (2)

Publication Number Publication Date
TW201246727A TW201246727A (en) 2012-11-16
TWI521815B true TWI521815B (zh) 2016-02-11

Family

ID=45563617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101103120A TWI521815B (zh) 2011-02-01 2012-01-31 用於積體電路裝置之插座

Country Status (3)

Country Link
JP (1) JP6157047B2 (https=)
TW (1) TWI521815B (https=)
WO (1) WO2012106220A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708063B (zh) * 2017-02-24 2020-10-21 義大利商探針科技公司 具有增進頻率性質的垂直探針測試頭
US11624759B1 (en) 2021-11-23 2023-04-11 Global Unichip Corporation Inspecting device and its testing socket

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI494576B (zh) * 2013-12-03 2015-08-01 Tohoku Seiki Ind Co Ltd IC processor
EP3158345B1 (en) * 2014-06-20 2023-11-15 Xcerra Corporation Test socket assembly and related methods
KR101735774B1 (ko) 2015-11-30 2017-05-16 주식회사 아이에스시 테스트용 러버 소켓
US9958918B2 (en) * 2016-05-23 2018-05-01 Qualcomm Incorporated Systems and methods to separate power domains in a processing device
TWI713807B (zh) 2016-12-16 2020-12-21 義大利商探針科技公司 具有增進的頻率性質的測試頭
IT201600127581A1 (it) 2016-12-16 2018-06-16 Technoprobe Spa Testa di misura per un’apparecchiatura di test di dispositivi elettronici con migliorate proprietà di filtraggio
IT201700021389A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura con migliorate proprietà in frequenza
IT201700021397A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura con migliorate proprietà in frequenza
KR101920822B1 (ko) * 2017-04-21 2019-02-13 리노공업주식회사 프로브 소켓
US11460485B2 (en) 2017-10-20 2022-10-04 Formfactor, Inc. Direct metalized guide plate
JP7346026B2 (ja) 2018-12-26 2023-09-19 株式会社日本マイクロニクス 電気的接続装置
KR102295761B1 (ko) * 2020-06-01 2021-09-01 리노공업주식회사 검사소켓
TW202202859A (zh) * 2020-06-22 2022-01-16 日商友華股份有限公司 檢查裝置
CN119335233A (zh) * 2024-09-20 2025-01-21 强一半导体(苏州)股份有限公司 用于探针卡的金属化导引板及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001249163A (ja) * 2000-03-06 2001-09-14 Takai Kogyo Kk Ｉｃデバイスの試験用ソケット
JP4259928B2 (ja) 2003-06-11 2009-04-30 株式会社リコー 移送物体検出装置，原稿読取装置および画像形成装置
JP4607004B2 (ja) * 2005-12-27 2011-01-05 株式会社ヨコオ 検査ユニット
JP5259945B2 (ja) * 2006-10-30 2013-08-07 スリーエム イノベイティブ プロパティズ カンパニー 熱放散機能を備えたｉｃソケット
US7663387B2 (en) * 2007-09-27 2010-02-16 Yokowo Co., Ltd. Test socket
TWI349397B (en) * 2007-10-24 2011-09-21 Fujitsu Ltd Printed circuit board unit and socket
JP4659087B2 (ja) * 2008-12-17 2011-03-30 パナソニック株式会社 差動平衡信号伝送基板
KR101126690B1 (ko) * 2009-07-02 2012-04-02 남재우 Ｍｅｍｓ 기술을 이용한 테스트 소켓 및 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI708063B (zh) * 2017-02-24 2020-10-21 義大利商探針科技公司 具有增進頻率性質的垂直探針測試頭
US11624759B1 (en) 2021-11-23 2023-04-11 Global Unichip Corporation Inspecting device and its testing socket

Also Published As

Publication number Publication date
WO2012106220A1 (en) 2012-08-09
TW201246727A (en) 2012-11-16
JP6157047B2 (ja) 2017-07-05
JP2012159422A (ja) 2012-08-23

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MM4A Annulment or lapse of patent due to non-payment of fees