TWI510899B - A sheet-like heat pipe and an electronic device having a sheet-like heat pipe - Google Patents

A sheet-like heat pipe and an electronic device having a sheet-like heat pipe Download PDF

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Publication number
TWI510899B
TWI510899B TW102105829A TW102105829A TWI510899B TW I510899 B TWI510899 B TW I510899B TW 102105829 A TW102105829 A TW 102105829A TW 102105829 A TW102105829 A TW 102105829A TW I510899 B TWI510899 B TW I510899B
Authority
TW
Taiwan
Prior art keywords
sheet
heat
container
protruding piece
dissipating tube
Prior art date
Application number
TW102105829A
Other languages
English (en)
Chinese (zh)
Other versions
TW201339814A (zh
Inventor
青木博史
池田匡視
Original Assignee
古河電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電氣工業股份有限公司 filed Critical 古河電氣工業股份有限公司
Publication of TW201339814A publication Critical patent/TW201339814A/zh
Application granted granted Critical
Publication of TWI510899B publication Critical patent/TWI510899B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW102105829A 2012-02-24 2013-02-20 A sheet-like heat pipe and an electronic device having a sheet-like heat pipe TWI510899B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012038136A JP5379874B2 (ja) 2012-02-24 2012-02-24 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器

Publications (2)

Publication Number Publication Date
TW201339814A TW201339814A (zh) 2013-10-01
TWI510899B true TWI510899B (zh) 2015-12-01

Family

ID=49005614

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102105829A TWI510899B (zh) 2012-02-24 2013-02-20 A sheet-like heat pipe and an electronic device having a sheet-like heat pipe

Country Status (5)

Country Link
US (1) US9565786B2 (enExample)
JP (1) JP5379874B2 (enExample)
CN (1) CN204217285U (enExample)
TW (1) TWI510899B (enExample)
WO (1) WO2013125427A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6121854B2 (ja) * 2013-09-18 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプまたは携帯情報端末
CN103702549A (zh) * 2013-12-26 2014-04-02 苏州天脉导热科技有限公司 一种用于超薄电子产品的热管
CN104797120A (zh) * 2014-01-21 2015-07-22 宏达国际电子股份有限公司 电子装置
TW201530076A (zh) 2014-01-21 2015-08-01 Htc Corp 電子裝置
US9435590B2 (en) * 2014-04-07 2016-09-06 Microsoft Technology Licensing, Llc Thin heat transfer device for thermal management
JP6023120B2 (ja) * 2014-05-15 2016-11-09 レノボ・シンガポール・プライベート・リミテッド 携帯用情報機器
CN105636406A (zh) * 2014-11-07 2016-06-01 泰硕电子股份有限公司 行动装置的散热模块
JP6548032B2 (ja) * 2015-03-19 2019-07-24 株式会社オートネットワーク技術研究所 冷却部材、及び蓄電モジュール
US10670352B2 (en) * 2016-05-23 2020-06-02 Pimems, Inc. High performance two-phase cooling apparatus for portable applications
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
US20200100389A1 (en) * 2016-12-07 2020-03-26 Lg Electronics Inc. Mobile terminal
CN106714515B (zh) * 2016-12-20 2023-07-25 深圳市欢太科技有限公司 移动终端
JPWO2018147283A1 (ja) * 2017-02-07 2019-07-18 古河電気工業株式会社 ベーパーチャンバ
WO2019008954A1 (ja) * 2017-07-06 2019-01-10 株式会社村田製作所 電子機器
JP6866854B2 (ja) * 2018-01-22 2021-04-28 株式会社オートネットワーク技術研究所 熱輸送部材、熱輸送システム、及び蓄電モジュール
JP6400240B1 (ja) * 2018-02-05 2018-10-03 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
DE102018123707B4 (de) * 2018-09-26 2022-07-07 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Batterieeinrichtung
WO2020100533A1 (ja) * 2018-11-16 2020-05-22 株式会社村田製作所 ベーパーチャンバー
TWI819163B (zh) * 2018-12-26 2023-10-21 日商巴川製紙所股份有限公司 溫度控制單元、溫度控制裝置
TWI738179B (zh) * 2019-01-18 2021-09-01 李克勤 薄形散熱裝置及其製造方法
JP7132958B2 (ja) * 2020-01-31 2022-09-07 古河電気工業株式会社 ベーパーチャンバ
JP6998979B2 (ja) 2020-01-31 2022-01-18 古河電気工業株式会社 ベーパーチャンバ
EP4097760A1 (en) 2020-03-04 2022-12-07 Transport Phenomena Technologies, LLC Compliant thermal management devices, systems, and methods of fabrication thereof
JP7541570B2 (ja) * 2020-03-19 2024-08-28 Fcnt合同会社 携帯端末
JP7568430B2 (ja) 2020-06-30 2024-10-16 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
WO2022025260A1 (ja) * 2020-07-31 2022-02-03 日本電産株式会社 熱伝導ユニットおよび冷却装置
JP7240470B1 (ja) 2021-10-18 2023-03-15 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
JP7765355B2 (ja) * 2022-07-04 2025-11-06 Ａｓｔｅｍｏ株式会社 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
US20090071632A1 (en) * 2007-09-13 2009-03-19 3M Innovative Properties Company Flexible heat pipe

Family Cites Families (11)

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JPH09159381A (ja) 1995-12-13 1997-06-20 Fujikura Ltd ヒートパイプを用いた熱伝達構造
JPH11237193A (ja) * 1998-02-19 1999-08-31 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた実装構造
JP2000065490A (ja) * 1998-08-20 2000-03-03 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
JP2003322483A (ja) 2002-04-26 2003-11-14 Furukawa Electric Co Ltd:The 板型ヒートパイプおよびその製造方法
JP2004012011A (ja) 2002-06-06 2004-01-15 Furukawa Electric Co Ltd:The 薄型フレキシブルヒートパイプ
JP2004028442A (ja) * 2002-06-25 2004-01-29 Furukawa Electric Co Ltd:The 板型ヒートパイプおよびその実装構造
US7019976B1 (en) * 2003-06-04 2006-03-28 Cisco Technology, Inc. Methods and apparatus for thermally coupling a heat sink to a circuit board component
JP4305644B2 (ja) * 2003-10-30 2009-07-29 大成プラス株式会社 固着機能を有する電子部品の熱保護装置
US20080141872A1 (en) * 2006-12-17 2008-06-19 Jian-Dih Jeng Pressing Method for Sealing Heat Pipe
TW200849295A (en) * 2007-06-15 2008-12-16 Fu-Chia Chang Super-conducting uniform-temperature heat dissipating module
JP2009024996A (ja) * 2008-08-21 2009-02-05 Toshiba Home Technology Corp ヒートパイプの製造方

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
US20090071632A1 (en) * 2007-09-13 2009-03-19 3M Innovative Properties Company Flexible heat pipe

Also Published As

Publication number Publication date
TW201339814A (zh) 2013-10-01
US20140360701A1 (en) 2014-12-11
JP2013174376A (ja) 2013-09-05
WO2013125427A1 (ja) 2013-08-29
US9565786B2 (en) 2017-02-07
JP5379874B2 (ja) 2013-12-25
CN204217285U (zh) 2015-03-18

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