TWI493288B - 用於厚層之光敏性聚合物樹脂及包含該樹脂之樹脂組合物 - Google Patents

用於厚層之光敏性聚合物樹脂及包含該樹脂之樹脂組合物 Download PDF

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Publication number
TWI493288B
TWI493288B TW102113032A TW102113032A TWI493288B TW I493288 B TWI493288 B TW I493288B TW 102113032 A TW102113032 A TW 102113032A TW 102113032 A TW102113032 A TW 102113032A TW I493288 B TWI493288 B TW I493288B
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TW
Taiwan
Prior art keywords
resin composition
polymer resin
group
photosensitive resin
photosensitive
Prior art date
Application number
TW102113032A
Other languages
English (en)
Chinese (zh)
Other versions
TW201346445A (zh
Inventor
Hyuk Jin Cha
Misun Ryu
Jin Kyu Park
Sung Jae Jung
Original Assignee
Ism Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ism Co Ltd filed Critical Ism Co Ltd
Publication of TW201346445A publication Critical patent/TW201346445A/zh
Application granted granted Critical
Publication of TWI493288B publication Critical patent/TWI493288B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
TW102113032A 2012-04-13 2013-04-12 用於厚層之光敏性聚合物樹脂及包含該樹脂之樹脂組合物 TWI493288B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120038346A KR101354539B1 (ko) 2012-04-13 2012-04-13 후막용 감광성 폴리머 수지 및 이를 포함하는 수지 조성물

Publications (2)

Publication Number Publication Date
TW201346445A TW201346445A (zh) 2013-11-16
TWI493288B true TWI493288B (zh) 2015-07-21

Family

ID=49635141

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102113032A TWI493288B (zh) 2012-04-13 2013-04-12 用於厚層之光敏性聚合物樹脂及包含該樹脂之樹脂組合物

Country Status (2)

Country Link
KR (1) KR101354539B1 (ko)
TW (1) TWI493288B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104193738B (zh) * 2014-08-21 2016-05-18 上海道亦化工科技有限公司 一种基于苯并咪唑的电子传输化合物
KR101949611B1 (ko) * 2017-09-29 2019-05-08 (주)휴넷플러스 화학 증폭형 바인더 수지 및 이를 포함하는 유기 절연막 조성물

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214044A (en) * 2010-09-29 2012-04-01 Cheil Ind Inc Black photosensitive resin composition and black matrix using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2102378A1 (en) 1992-11-16 1994-05-17 Huan K. Toh Cross-linkable polymeric composition
KR20080067816A (ko) * 2007-01-17 2008-07-22 제일모직주식회사 블랙매트릭스용 감광성 수지 조성물 및 그로부터 제조되는블랙매트릭스
KR20090062898A (ko) * 2007-12-13 2009-06-17 제일모직주식회사 컬러필터용 감광성 수지 조성물
KR101182247B1 (ko) * 2008-12-01 2012-09-13 제일모직주식회사 컬러필터 및 그 제조방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201214044A (en) * 2010-09-29 2012-04-01 Cheil Ind Inc Black photosensitive resin composition and black matrix using the same

Also Published As

Publication number Publication date
TW201346445A (zh) 2013-11-16
KR20130115747A (ko) 2013-10-22
KR101354539B1 (ko) 2014-01-23

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