TWI492282B - Manufacture of electronic parts - Google Patents
Manufacture of electronic parts Download PDFInfo
- Publication number
- TWI492282B TWI492282B TW100128058A TW100128058A TWI492282B TW I492282 B TWI492282 B TW I492282B TW 100128058 A TW100128058 A TW 100128058A TW 100128058 A TW100128058 A TW 100128058A TW I492282 B TWI492282 B TW I492282B
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- TW
- Taiwan
- Prior art keywords
- adhesive layer
- cation
- weight
- electronic component
- adhesive
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000012790 adhesive layer Substances 0.000 claims description 94
- 239000000853 adhesive Substances 0.000 claims description 73
- 230000001070 adhesive effect Effects 0.000 claims description 73
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 41
- 229920000058 polyacrylate Polymers 0.000 claims description 36
- 239000000178 monomer Substances 0.000 claims description 34
- 239000002608 ionic liquid Substances 0.000 claims description 32
- 239000002253 acid Substances 0.000 claims description 31
- 230000003068 static effect Effects 0.000 claims description 30
- 229920005601 base polymer Polymers 0.000 claims description 22
- 125000004432 carbon atom Chemical group C* 0.000 claims description 20
- 150000001768 cations Chemical class 0.000 claims description 15
- 125000005842 heteroatom Chemical group 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 230000005611 electricity Effects 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 7
- 239000000470 constituent Substances 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 238000000691 measurement method Methods 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 229920006267 polyester film Polymers 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 229910052717 sulfur Inorganic materials 0.000 claims description 5
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 229920000098 polyolefin Polymers 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 239000011593 sulfur Substances 0.000 claims description 3
- 125000004429 atom Chemical group 0.000 claims description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 2
- 125000004434 sulfur atom Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 7
- -1 nitrogen-containing cerium salt Chemical class 0.000 description 138
- 235000012431 wafers Nutrition 0.000 description 59
- 239000004065 semiconductor Substances 0.000 description 52
- 150000003949 imides Chemical class 0.000 description 33
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 31
- 238000006243 chemical reaction Methods 0.000 description 18
- 239000003795 chemical substances by application Substances 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 150000002148 esters Chemical class 0.000 description 11
- 230000005855 radiation Effects 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 150000002430 hydrocarbons Chemical group 0.000 description 8
- 239000000523 sample Substances 0.000 description 8
- 239000000460 chlorine Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 150000004820 halides Chemical class 0.000 description 6
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 6
- 239000005056 polyisocyanate Substances 0.000 description 6
- 229920001228 polyisocyanate Polymers 0.000 description 6
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 5
- 229910052794 bromium Inorganic materials 0.000 description 5
- 229910052801 chlorine Inorganic materials 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- YIOJGTBNHQAVBO-UHFFFAOYSA-N dimethyl-bis(prop-2-enyl)azanium Chemical compound C=CC[N+](C)(C)CC=C YIOJGTBNHQAVBO-UHFFFAOYSA-N 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 5
- 229910052740 iodine Inorganic materials 0.000 description 5
- 238000006386 neutralization reaction Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 150000000703 Cerium Chemical class 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 150000001450 anions Chemical class 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 4
- 150000002466 imines Chemical class 0.000 description 4
- 230000000977 initiatory effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052744 lithium Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 238000004448 titration Methods 0.000 description 4
- NJMWOUFKYKNWDW-UHFFFAOYSA-N 1-ethyl-3-methylimidazolium Chemical compound CCN1C=C[N+](C)=C1 NJMWOUFKYKNWDW-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003522 acrylic cement Substances 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 3
- 239000012965 benzophenone Substances 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 230000009918 complex formation Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000012948 isocyanate Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005510 radiation hardening Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000012488 sample solution Substances 0.000 description 3
- 238000005204 segregation Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical group NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- NRKYWOKHZRQRJR-UHFFFAOYSA-N 2,2,2-trifluoroacetamide Chemical compound NC(=O)C(F)(F)F NRKYWOKHZRQRJR-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 241001050985 Disco Species 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-O Imidazolium Chemical compound C1=C[NH+]=CN1 RAXXELZNTBOGNW-UHFFFAOYSA-O 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 229910017855 NH 4 F Inorganic materials 0.000 description 2
- 229910019800 NbF 5 Inorganic materials 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910018286 SbF 6 Inorganic materials 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 125000005210 alkyl ammonium group Chemical group 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- HQQASUCFGHRJOV-UHFFFAOYSA-N decyl-ethyl-dimethylazanium Chemical compound CCCCCCCCCC[N+](C)(C)CC HQQASUCFGHRJOV-UHFFFAOYSA-N 0.000 description 2
- HZHUAESPXGNNFV-UHFFFAOYSA-N diethyl(methyl)phosphane Chemical compound CCP(C)CC HZHUAESPXGNNFV-UHFFFAOYSA-N 0.000 description 2
- PIODCVYLDQEZFW-UHFFFAOYSA-N diethyl-heptyl-methylazanium Chemical compound CCCCCCC[N+](C)(CC)CC PIODCVYLDQEZFW-UHFFFAOYSA-N 0.000 description 2
- JCWIHQGUAVBVND-UHFFFAOYSA-N dihexyl(dipropyl)azanium Chemical compound CCCCCC[N+](CCC)(CCC)CCCCCC JCWIHQGUAVBVND-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- ZOZZQPFBMNNPPO-UHFFFAOYSA-N ethyl-dimethyl-propylazanium Chemical compound CCC[N+](C)(C)CC ZOZZQPFBMNNPPO-UHFFFAOYSA-N 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 230000026030 halogenation Effects 0.000 description 2
- 238000005658 halogenation reaction Methods 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- HRVTXKZFPPCSKD-UHFFFAOYSA-N heptyl-dimethyl-propylazanium Chemical compound CCCCCCC[N+](C)(C)CCC HRVTXKZFPPCSKD-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000011630 iodine Substances 0.000 description 2
- 239000003456 ion exchange resin Substances 0.000 description 2
- 229920003303 ion-exchange polymer Polymers 0.000 description 2
- 150000008040 ionic compounds Chemical class 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- ZUZLIXGTXQBUDC-UHFFFAOYSA-N methyltrioctylammonium Chemical compound CCCCCCCC[N+](C)(CCCCCCCC)CCCCCCCC ZUZLIXGTXQBUDC-UHFFFAOYSA-N 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- KPSSIOMAKSHJJG-UHFFFAOYSA-N neopentyl alcohol Chemical compound CC(C)(C)CO KPSSIOMAKSHJJG-UHFFFAOYSA-N 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 239000003209 petroleum derivative Substances 0.000 description 2
- 235000021317 phosphate Nutrition 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002098 polyfluorene Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 229920006132 styrene block copolymer Polymers 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- 150000003458 sulfonic acid derivatives Chemical class 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- WGYXSYLSCVXFDU-UHFFFAOYSA-N triethyl(propyl)azanium Chemical compound CCC[N+](CC)(CC)CC WGYXSYLSCVXFDU-UHFFFAOYSA-N 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- PUVAFTRIIUSGLK-UHFFFAOYSA-M trimethyl(oxiran-2-ylmethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1CO1 PUVAFTRIIUSGLK-UHFFFAOYSA-M 0.000 description 2
- NRZWQKGABZFFKE-UHFFFAOYSA-N trimethylsulfonium Chemical compound C[S+](C)C NRZWQKGABZFFKE-UHFFFAOYSA-N 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- CKGKXGQVRVAKEA-UHFFFAOYSA-N (2-methylphenyl)-phenylmethanone Chemical compound CC1=CC=CC=C1C(=O)C1=CC=CC=C1 CKGKXGQVRVAKEA-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- DOYSIZKQWJYULQ-UHFFFAOYSA-N 1,1,2,2,2-pentafluoro-n-(1,1,2,2,2-pentafluoroethylsulfonyl)ethanesulfonamide Chemical compound FC(F)(F)C(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)C(F)(F)F DOYSIZKQWJYULQ-UHFFFAOYSA-N 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-M 1,1,2,2,3,3,4,4,4-nonafluorobutane-1-sulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-M 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-Me3C6H3 Natural products CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- WJGNDSKDYFZIRF-UHFFFAOYSA-L 1-butyl-3-methylimidazol-3-ium trifluoromethanesulfonate Chemical compound S(=O)(=O)(C(F)(F)F)[O-].FC(S(=O)(=O)[O-])(F)F.C(CCC)[N+]1=CN(C=C1)C.C(CCC)[N+]1=CN(C=C1)C WJGNDSKDYFZIRF-UHFFFAOYSA-L 0.000 description 1
- QPDGLRRWSBZCHP-UHFFFAOYSA-M 1-butyl-3-methylimidazol-3-ium;2,2,2-trifluoroacetate Chemical compound [O-]C(=O)C(F)(F)F.CCCC[N+]=1C=CN(C)C=1 QPDGLRRWSBZCHP-UHFFFAOYSA-M 0.000 description 1
- MDJAMFZRTDMREK-UHFFFAOYSA-M 1-butyl-3-methylimidazol-3-ium;2,2,3,3,4,4,4-heptafluorobutanoate Chemical compound CCCC[N+]=1C=CN(C)C=1.[O-]C(=O)C(F)(F)C(F)(F)C(F)(F)F MDJAMFZRTDMREK-UHFFFAOYSA-M 0.000 description 1
- FRZPYEHDSAQGAS-UHFFFAOYSA-M 1-butyl-3-methylimidazol-3-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCC[N+]=1C=CN(C)C=1 FRZPYEHDSAQGAS-UHFFFAOYSA-M 0.000 description 1
- IQQRAVYLUAZUGX-UHFFFAOYSA-N 1-butyl-3-methylimidazolium Chemical compound CCCCN1C=C[N+](C)=C1 IQQRAVYLUAZUGX-UHFFFAOYSA-N 0.000 description 1
- DADKKHHMGSWSPH-UHFFFAOYSA-N 1-butyl-3-methylpyridin-1-ium Chemical compound CCCC[N+]1=CC=CC(C)=C1 DADKKHHMGSWSPH-UHFFFAOYSA-N 0.000 description 1
- VWRPMASNDUMPEH-UHFFFAOYSA-N 1-butyl-3-methylpyridin-1-ium;2,2,2-trifluoro-n-(trifluoromethylsulfonyl)acetamide Chemical compound CCCC[N+]1=CC=CC(C)=C1.FC(F)(F)C(=O)NS(=O)(=O)C(F)(F)F VWRPMASNDUMPEH-UHFFFAOYSA-N 0.000 description 1
- SZBRISJDXSIRRE-UHFFFAOYSA-M 1-butyl-3-methylpyridin-1-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCC[N+]1=CC=CC(C)=C1 SZBRISJDXSIRRE-UHFFFAOYSA-M 0.000 description 1
- REACWASHYHDPSQ-UHFFFAOYSA-N 1-butylpyridin-1-ium Chemical compound CCCC[N+]1=CC=CC=C1 REACWASHYHDPSQ-UHFFFAOYSA-N 0.000 description 1
- IRGDPGYNHSIIJJ-UHFFFAOYSA-N 1-ethyl-2,3-dimethylimidazol-3-ium Chemical compound CCN1C=C[N+](C)=C1C IRGDPGYNHSIIJJ-UHFFFAOYSA-N 0.000 description 1
- JOKVYNJKBRLDAT-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;2,2,2-trifluoroacetate Chemical compound [O-]C(=O)C(F)(F)F.CC[N+]=1C=CN(C)C=1 JOKVYNJKBRLDAT-UHFFFAOYSA-M 0.000 description 1
- XIYUIMLQTKODPS-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;acetate Chemical compound CC([O-])=O.CC[N+]=1C=CN(C)C=1 XIYUIMLQTKODPS-UHFFFAOYSA-M 0.000 description 1
- ZPTRYWVRCNOTAS-UHFFFAOYSA-M 1-ethyl-3-methylimidazol-3-ium;trifluoromethanesulfonate Chemical compound CC[N+]=1C=CN(C)C=1.[O-]S(=O)(=O)C(F)(F)F ZPTRYWVRCNOTAS-UHFFFAOYSA-M 0.000 description 1
- BGSUDDILQRFOKZ-UHFFFAOYSA-M 1-hexyl-3-methylimidazol-3-ium;bromide Chemical compound [Br-].CCCCCCN1C=C[N+](C)=C1 BGSUDDILQRFOKZ-UHFFFAOYSA-M 0.000 description 1
- RABFGPMWVQNDHI-UHFFFAOYSA-M 1-hexyl-3-methylimidazol-3-ium;trifluoromethanesulfonate Chemical compound [O-]S(=O)(=O)C(F)(F)F.CCCCCC[N+]=1C=CN(C)C=1 RABFGPMWVQNDHI-UHFFFAOYSA-M 0.000 description 1
- NKRASMXHSQKLHA-UHFFFAOYSA-M 1-hexyl-3-methylimidazolium chloride Chemical compound [Cl-].CCCCCCN1C=C[N+](C)=C1 NKRASMXHSQKLHA-UHFFFAOYSA-M 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- PTXVSDKCUJCCLC-UHFFFAOYSA-N 1-hydroxyindole Chemical class C1=CC=C2N(O)C=CC2=C1 PTXVSDKCUJCCLC-UHFFFAOYSA-N 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- CFYBHDCZEADVJH-UHFFFAOYSA-N 2,2,2-trifluoro-n-(trifluoromethylsulfonyl)acetamide Chemical compound FC(F)(F)C(=O)NS(=O)(=O)C(F)(F)F CFYBHDCZEADVJH-UHFFFAOYSA-N 0.000 description 1
- ALXMRMCFVATDJM-UHFFFAOYSA-N 2,2,3,3,4,4,4-heptafluorobutanoate 3-methyl-1H-imidazol-3-ium Chemical compound C[N+]1=CNC=C1.C(=O)(C(C(C(F)(F)F)(F)F)(F)F)[O-] ALXMRMCFVATDJM-UHFFFAOYSA-N 0.000 description 1
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- WULAHPYSGCVQHM-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethanol Chemical compound OCCOCCOC=C WULAHPYSGCVQHM-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- UMLWXYJZDNNBTD-UHFFFAOYSA-N 2-(dimethylamino)-1-phenylethanone Chemical compound CN(C)CC(=O)C1=CC=CC=C1 UMLWXYJZDNNBTD-UHFFFAOYSA-N 0.000 description 1
- KJSGODDTWRXQRH-UHFFFAOYSA-N 2-(dimethylamino)ethyl benzoate Chemical compound CN(C)CCOC(=O)C1=CC=CC=C1 KJSGODDTWRXQRH-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- KEUUWJRLGRUQAX-UHFFFAOYSA-N 2-chlorothiazine 1-oxide Chemical compound ClN1S(C=CC=C1)=O KEUUWJRLGRUQAX-UHFFFAOYSA-N 0.000 description 1
- UWQPDVZUOZVCBH-UHFFFAOYSA-N 2-diazonio-4-oxo-3h-naphthalen-1-olate Chemical class C1=CC=C2C(=O)C(=[N+]=[N-])CC(=O)C2=C1 UWQPDVZUOZVCBH-UHFFFAOYSA-N 0.000 description 1
- VUIWJRYTWUGOOF-UHFFFAOYSA-N 2-ethenoxyethanol Chemical compound OCCOC=C VUIWJRYTWUGOOF-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- QPXVRLXJHPTCPW-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-(4-propan-2-ylphenyl)propan-1-one Chemical compound CC(C)C1=CC=C(C(=O)C(C)(C)O)C=C1 QPXVRLXJHPTCPW-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- DMSRIHVZKOZKRV-UHFFFAOYSA-N 2-methyl-1-(2-methylprop-2-enoylamino)propane-1-sulfonic acid Chemical compound CC(C)C(S(O)(=O)=O)NC(=O)C(C)=C DMSRIHVZKOZKRV-UHFFFAOYSA-N 0.000 description 1
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 1
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 1
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- UVRCNEIYXSRHNT-UHFFFAOYSA-N 3-ethylpent-2-enamide Chemical compound CCC(CC)=CC(N)=O UVRCNEIYXSRHNT-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- YDIYEOMDOWUDTJ-UHFFFAOYSA-N 4-(dimethylamino)benzoic acid Chemical compound CN(C)C1=CC=C(C(O)=O)C=C1 YDIYEOMDOWUDTJ-UHFFFAOYSA-N 0.000 description 1
- UGVRJVHOJNYEHR-UHFFFAOYSA-N 4-chlorobenzophenone Chemical compound C1=CC(Cl)=CC=C1C(=O)C1=CC=CC=C1 UGVRJVHOJNYEHR-UHFFFAOYSA-N 0.000 description 1
- HMBNQNDUEFFFNZ-UHFFFAOYSA-N 4-ethenoxybutan-1-ol Chemical compound OCCCCOC=C HMBNQNDUEFFFNZ-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- ORJNLUXHBUSOKL-UHFFFAOYSA-N 6,7-dihydrodibenzo[2,1-b:1',2'-d][7]annulen-5-one Chemical compound O=C1CCC2=CC=CC=C2C2=CC=CC=C12 ORJNLUXHBUSOKL-UHFFFAOYSA-N 0.000 description 1
- AJCRMVXAICHYEM-UHFFFAOYSA-N 6-benzylidenecyclohexa-2,4-diene-1-carboxylic acid Chemical compound C(C1=CC=CC=C1)=C1C(C(=O)O)C=CC=C1 AJCRMVXAICHYEM-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910016467 AlCl 4 Inorganic materials 0.000 description 1
- 229910016569 AlF 3 Inorganic materials 0.000 description 1
- 229910017008 AsF 6 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- PDAJUHKAMPWXKO-UHFFFAOYSA-N C[S+](C)C.N Chemical compound C[S+](C)C.N PDAJUHKAMPWXKO-UHFFFAOYSA-N 0.000 description 1
- 229910020366 ClO 4 Inorganic materials 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- DFPAKSUCGFBDDF-UHFFFAOYSA-N Nicotinamide Chemical compound NC(=O)C1=CC=CN=C1 DFPAKSUCGFBDDF-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- HBSIZWRITXMTCS-UHFFFAOYSA-L P(=O)([O-])([O-])F.C(CCC)[N+]1=CC=CC=C1.C(CCC)[N+]1=CC=CC=C1 Chemical compound P(=O)([O-])([O-])F.C(CCC)[N+]1=CC=CC=C1.C(CCC)[N+]1=CC=CC=C1 HBSIZWRITXMTCS-UHFFFAOYSA-L 0.000 description 1
- NQRYJNQNLNOLGT-UHFFFAOYSA-O Piperidinium(1+) Chemical compound C1CC[NH2+]CC1 NQRYJNQNLNOLGT-UHFFFAOYSA-O 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910018287 SbF 5 Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 229910004527 TaF Inorganic materials 0.000 description 1
- 229910004529 TaF 5 Inorganic materials 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- RVWADWOERKNWRY-UHFFFAOYSA-N [2-(dimethylamino)phenyl]-phenylmethanone Chemical compound CN(C)C1=CC=CC=C1C(=O)C1=CC=CC=C1 RVWADWOERKNWRY-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000007754 air knife coating Methods 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000004202 aminomethyl group Chemical group [H]N([H])C([H])([H])* 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- OEPKLWHTHCQEOQ-UHFFFAOYSA-N bis(1,1,2,2,2-pentafluoroethylsulfonyl)azanide 1-butyl-3-methylpyridin-1-ium Chemical compound [N-](S(=O)(=O)C(F)(F)C(F)(F)F)S(=O)(=O)C(F)(F)C(F)(F)F.C(CCC)[N+]1=CC(=CC=C1)C OEPKLWHTHCQEOQ-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- IKWKJIWDLVYZIY-UHFFFAOYSA-M butyl(triphenyl)phosphanium;bromide Chemical compound [Br-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CCCC)C1=CC=CC=C1 IKWKJIWDLVYZIY-UHFFFAOYSA-M 0.000 description 1
- AILPSZWICOHGMA-UHFFFAOYSA-N butyl-dimethyl-propylazanium Chemical compound CCCC[N+](C)(C)CCC AILPSZWICOHGMA-UHFFFAOYSA-N 0.000 description 1
- VJBODIYZSOOKES-UHFFFAOYSA-N butyl-ethyl-dimethylazanium Chemical compound CCCC[N+](C)(C)CC VJBODIYZSOOKES-UHFFFAOYSA-N 0.000 description 1
- MKLCNZGZWCQCIY-UHFFFAOYSA-N butyl-heptyl-dimethylazanium Chemical compound CCCCCCC[N+](C)(C)CCCC MKLCNZGZWCQCIY-UHFFFAOYSA-N 0.000 description 1
- GUZLSXNNIAYDHJ-UHFFFAOYSA-N butyl-hexyl-dimethylazanium Chemical compound CCCCCC[N+](C)(C)CCCC GUZLSXNNIAYDHJ-UHFFFAOYSA-N 0.000 description 1
- HEZLPXHJHDDYOE-UHFFFAOYSA-N butyl-hexyl-dipropylazanium Chemical compound CCCCCC[N+](CCC)(CCC)CCCC HEZLPXHJHDDYOE-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- MKHFCTXNDRMIDR-UHFFFAOYSA-N cyanoiminomethylideneazanide;1-ethyl-3-methylimidazol-3-ium Chemical compound [N-]=C=NC#N.CCN1C=C[N+](C)=C1 MKHFCTXNDRMIDR-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- UIOXCPTYOYGESX-UHFFFAOYSA-N dibutyl(ethyl)phosphane Chemical compound CCCCP(CC)CCCC UIOXCPTYOYGESX-UHFFFAOYSA-N 0.000 description 1
- USXXKLJKCGLODH-UHFFFAOYSA-N dibutyl-hexyl-methylazanium Chemical compound CCCCCC[N+](C)(CCCC)CCCC USXXKLJKCGLODH-UHFFFAOYSA-N 0.000 description 1
- CJMALQPKCBISHD-UHFFFAOYSA-N dibutyl-methyl-pentylazanium Chemical compound CCCCC[N+](C)(CCCC)CCCC CJMALQPKCBISHD-UHFFFAOYSA-N 0.000 description 1
- BXHHZLMBMOBPEH-UHFFFAOYSA-N diethyl-(2-methoxyethyl)-methylazanium Chemical compound CC[N+](C)(CC)CCOC BXHHZLMBMOBPEH-UHFFFAOYSA-N 0.000 description 1
- KSRKBDUROZKZBR-UHFFFAOYSA-N diethyl-methyl-propylazanium Chemical compound CCC[N+](C)(CC)CC KSRKBDUROZKZBR-UHFFFAOYSA-N 0.000 description 1
- IAYWJKSKVFOMDT-UHFFFAOYSA-N diethyl-pentyl-propylazanium Chemical compound CCCCC[N+](CC)(CC)CCC IAYWJKSKVFOMDT-UHFFFAOYSA-N 0.000 description 1
- BVYKZCWFDFGEDY-UHFFFAOYSA-N dihexyl(dimethyl)azanium Chemical compound CCCCCC[N+](C)(C)CCCCCC BVYKZCWFDFGEDY-UHFFFAOYSA-N 0.000 description 1
- WQHRRUZRGXLCGL-UHFFFAOYSA-N dimethyl(dipropyl)azanium Chemical compound CCC[N+](C)(C)CCC WQHRRUZRGXLCGL-UHFFFAOYSA-N 0.000 description 1
- AEVGDMCWEJJJPC-UHFFFAOYSA-N dimethyl-pentyl-propylazanium Chemical compound CCCCC[N+](C)(C)CCC AEVGDMCWEJJJPC-UHFFFAOYSA-N 0.000 description 1
- DWNAQMUDCDVSLT-UHFFFAOYSA-N diphenyl phthalate Chemical compound C=1C=CC=C(C(=O)OC=2C=CC=CC=2)C=1C(=O)OC1=CC=CC=C1 DWNAQMUDCDVSLT-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- HBFNIDYFNYYMOB-UHFFFAOYSA-N ethoxy-hydroxy-phenyl-sulfanylidene-$l^{5}-phosphane Chemical compound CCOP(O)(=S)C1=CC=CC=C1 HBFNIDYFNYYMOB-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- DJCZADVNBUGGRS-UHFFFAOYSA-N ethyl-dimethyl-pentylazanium Chemical compound CCCCC[N+](C)(C)CC DJCZADVNBUGGRS-UHFFFAOYSA-N 0.000 description 1
- KUDSOEFZHRAMEU-UHFFFAOYSA-N ethyl-heptyl-dimethylazanium Chemical compound CCCCCCC[N+](C)(C)CC KUDSOEFZHRAMEU-UHFFFAOYSA-N 0.000 description 1
- BEURYHDWKDICEO-UHFFFAOYSA-N ethyl-hexyl-dimethylazanium Chemical compound CCCCCC[N+](C)(C)CC BEURYHDWKDICEO-UHFFFAOYSA-N 0.000 description 1
- YZCTWRWJKAZUIJ-UHFFFAOYSA-N ethyl-methyl-dipropylazanium Chemical compound CCC[N+](C)(CC)CCC YZCTWRWJKAZUIJ-UHFFFAOYSA-N 0.000 description 1
- HDGUMDFPVDXMFR-UHFFFAOYSA-N ethyl-methyl-pentyl-propylazanium Chemical compound CCCCC[N+](C)(CC)CCC HDGUMDFPVDXMFR-UHFFFAOYSA-N 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 150000002193 fatty amides Chemical class 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical class [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- PISCILXZPLTTFP-UHFFFAOYSA-N heptyl(trimethyl)azanium Chemical compound CCCCCCC[N+](C)(C)C PISCILXZPLTTFP-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KIVAZLJKZWJKRY-UHFFFAOYSA-N hexyl-dimethyl-pentylazanium Chemical compound CCCCCC[N+](C)(C)CCCCC KIVAZLJKZWJKRY-UHFFFAOYSA-N 0.000 description 1
- LZHJKZALMMLMRU-UHFFFAOYSA-N hexyl-dimethyl-propylazanium Chemical compound CCCCCC[N+](C)(C)CCC LZHJKZALMMLMRU-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000003014 ion exchange membrane Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- VMVNZNXAVJHNDJ-UHFFFAOYSA-N methyl 2,2,2-trifluoroacetate Chemical compound COC(=O)C(F)(F)F VMVNZNXAVJHNDJ-UHFFFAOYSA-N 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- OIRDBPQYVWXNSJ-UHFFFAOYSA-N methyl trifluoromethansulfonate Chemical compound COS(=O)(=O)C(F)(F)F OIRDBPQYVWXNSJ-UHFFFAOYSA-N 0.000 description 1
- HYYUVNFATOSGPP-UHFFFAOYSA-N methyl-pentyl-dipropylazanium Chemical compound CCCCC[N+](C)(CCC)CCC HYYUVNFATOSGPP-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 125000006502 nitrobenzyl group Chemical group 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000002892 organic cations Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- MUUZIDFBKZNXQS-UHFFFAOYSA-N oxido-phenyl-[(2,4,6-trimethylphenyl)methylidene]phosphanium Chemical compound CC1=C(C=P(C2=CC=CC=C2)=O)C(=CC(=C1)C)C MUUZIDFBKZNXQS-UHFFFAOYSA-N 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- FZUGPQWGEGAKET-UHFFFAOYSA-N parbenate Chemical compound CCOC(=O)C1=CC=C(N(C)C)C=C1 FZUGPQWGEGAKET-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- ADYYRXNLCZOUSU-UHFFFAOYSA-M potassium;propan-2-ol;hydroxide Chemical compound [OH-].[K+].CC(C)O ADYYRXNLCZOUSU-UHFFFAOYSA-M 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-O pyridinium Chemical compound C1=CC=[NH+]C=C1 JUJWROOIHBZHMG-UHFFFAOYSA-O 0.000 description 1
- 125000001422 pyrrolinyl group Chemical group 0.000 description 1
- 125000000168 pyrrolyl group Chemical group 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VFWRGKJLLYDFBY-UHFFFAOYSA-N silver;hydrate Chemical compound O.[Ag].[Ag] VFWRGKJLLYDFBY-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- DZLFLBLQUQXARW-UHFFFAOYSA-N tetrabutylammonium Chemical compound CCCC[N+](CCCC)(CCCC)CCCC DZLFLBLQUQXARW-UHFFFAOYSA-N 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- CBXCPBUEXACCNR-UHFFFAOYSA-N tetraethylammonium Chemical compound CC[N+](CC)(CC)CC CBXCPBUEXACCNR-UHFFFAOYSA-N 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- SZWHXXNVLACKBV-UHFFFAOYSA-N tetraethylphosphanium Chemical compound CC[P+](CC)(CC)CC SZWHXXNVLACKBV-UHFFFAOYSA-N 0.000 description 1
- DTIFFPXSSXFQCJ-UHFFFAOYSA-N tetrahexylazanium Chemical compound CCCCCC[N+](CCCCCC)(CCCCCC)CCCCCC DTIFFPXSSXFQCJ-UHFFFAOYSA-N 0.000 description 1
- AGWJLDNNUJKAHP-UHFFFAOYSA-N tetrahexylphosphanium Chemical compound CCCCCC[P+](CCCCCC)(CCCCCC)CCCCCC AGWJLDNNUJKAHP-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- BXYHVFRRNNWPMB-UHFFFAOYSA-N tetramethylphosphanium Chemical compound C[P+](C)(C)C BXYHVFRRNNWPMB-UHFFFAOYSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- HOMONHWYLOPSLL-UHFFFAOYSA-N tributyl(ethyl)phosphanium Chemical compound CCCC[P+](CC)(CCCC)CCCC HOMONHWYLOPSLL-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-O tributylphosphanium Chemical compound CCCC[PH+](CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-O 0.000 description 1
- MEJYOZOPFBOWNM-UHFFFAOYSA-N triethyl(heptyl)azanium Chemical compound CCCCCCC[N+](CC)(CC)CC MEJYOZOPFBOWNM-UHFFFAOYSA-N 0.000 description 1
- SEACXNRNJAXIBM-UHFFFAOYSA-N triethyl(methyl)azanium Chemical compound CC[N+](C)(CC)CC SEACXNRNJAXIBM-UHFFFAOYSA-N 0.000 description 1
- TZWFFXFQARPFJN-UHFFFAOYSA-N triethyl(methyl)phosphanium Chemical compound CC[P+](C)(CC)CC TZWFFXFQARPFJN-UHFFFAOYSA-N 0.000 description 1
- NFRBUOMQJKUACC-UHFFFAOYSA-N triethyl(pentyl)azanium Chemical compound CCCCC[N+](CC)(CC)CC NFRBUOMQJKUACC-UHFFFAOYSA-N 0.000 description 1
- ZMANZCXQSJIPKH-UHFFFAOYSA-O triethylammonium ion Chemical compound CC[NH+](CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-O 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- FPZZZGJWXOHLDJ-UHFFFAOYSA-N trihexylphosphane Chemical compound CCCCCCP(CCCCCC)CCCCCC FPZZZGJWXOHLDJ-UHFFFAOYSA-N 0.000 description 1
- YWWDBCBWQNCYNR-UHFFFAOYSA-O trimethylphosphanium Chemical compound C[PH+](C)C YWWDBCBWQNCYNR-UHFFFAOYSA-O 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
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Description
本發明係關於一種使用在基材上至少依序積層有黏著劑層及隔離層且具有除靜電效果之黏著片的電子零件之製造方法。
近年來,伴隨以半導體裝置為代表之電子零件之高精密化或高集成化,製造步驟中之電子零件之帶電對其後之特性造成影響令人擔憂。例如於半導體裝置之製造步驟中之半導體晶圓之切割時,係於該半導體晶圓之背面貼合切割用黏著片而進行。該黏著片例如為在基材上依序積層有黏著劑層及隔離層之結構。隔離層係於使用黏著片時剝離,但於剝離時,有時在一分為二之隔離層與黏著劑層之表面會產生電荷而帶電。於將半導體晶圓貼合至此種帶電狀態之黏著劑層上之情形時,有時會對上述半導體晶圓引起放電。其結果為,根據情況,存在形成於半導體晶圓表面之電路被破壞而變得無法正常運作之問題。
針對該問題,下述專利文獻1中揭示有藉由向黏著劑層中添加界面活性劑等抗靜電劑而降低黏著劑層表面之帶電電荷量之發明。但是近年來,作為電子零件之半導體裝置向小型化方向進展迅猛,為了實現抗靜電並且可進行精密之加工,加工時之半導體晶圓之保持性開始變得重要。於採用先前之添加有抗靜電劑之黏著劑層時,有時會因抗靜電劑偏析於黏著劑層表面而使黏著力下降,無法進行精密之加工。又,於僅添加抗靜電劑時,亦存在黏著劑層表面之帶電電位之降低不充分之情形,依然有導致半導體晶圓表面之電路被破壞而變得無法正常運作之事態之虞。
專利文獻1:日本專利文獻2002-285134號公報
本發明係鑒於上述問題而成者,其目的在於提供一種於使用黏著片製造電子零件時,藉由以短時間效率良好地除去該黏著片上所帶之電荷,可防止對形成於電子零件上之電路等之靜電破壞的電子零件之製造方法。
本申請案發明者等人為了解決上述先前之問題而對電子零件之製造方法進行了研究。結果發現:藉由採用下述構成,可解決上述課題,從而完成本發明。
即,為了解決上述課題,本發明之電子零件之製造方法係使用在基材上至少依序積層有黏著劑層及隔離層之黏著片者,其特徵在於:使用藉由依據JIS L1094之電荷衰減測定法求出之上述黏著劑層之表面之帶電電荷之半衰期為900秒以下者作為上述黏著片,並且至少具有如下步驟:自上述黏著劑層剝離上述隔離層之步驟;除去上述黏著劑層之表面之帶電電荷的步驟;及於除靜電後之上述黏著劑層上貼合電子零件之步驟。
於利用隔離層保護表面之黏著劑層中,有時於剝離隔離層時黏著劑層表面會帶電荷。針對該帶電電荷,藉由將電子零件貼合於黏著劑層上之前進行除靜電,可除去或降低帶電電荷。此處,於本發明中,使用具備藉由依據JIS L1094之電荷衰減測定法求出之表面之帶電電荷之半衰期為900秒以下之黏著劑層者作為黏著片。若採用此種黏著片,則可以短時間有效率地進行黏著劑層表面之除靜電,因此將電子零件貼附於黏著劑層上時,亦可充分地抑制對電子零件之放電。其結果為,可實現電子零件之製造良率之提高。
於上述構成中,較佳為使用向上述黏著劑層中相對於其基礎聚合物100重量份而添加有0.01重量份~30重量份之範圍內之離子性液體者作為上述黏著片。若採用向黏著劑層中添加有離子性液體者,則可對該黏著劑層賦予導電性。其結果為,即使因隔離層之剝離而使黏著劑層表面帶電荷,亦會促進放電,因此除靜電變得容易。又,由於離子性液體可均勻地存在於黏著劑層中,故而可遍及黏著劑層之整個表面而有效地除去帶電電荷。此處,藉由使離子性液體之添加量相對於黏著劑層之基礎聚合物100重量份為0.01重量份以上,可遍及黏著劑層之整個表面而有效地除去帶電電荷。另一方面,藉由使上述添加量相對於黏著劑層之基礎聚合物100重量份為30重量份以下,可防止自電子零件剝離黏著片時之污染。
於上述構成中,較佳為上述黏著片之上述黏著劑層中之基礎聚合物至少由丙烯酸系聚合物及極性較高之單體所形成,上述丙烯酸系聚合物係由具有碳數1~14之烷基之丙烯酸酯、或具有碳數1~14之烷基的甲基丙烯酸酯中之至少任一者所形成,上述極性較高之單體相對於上述丙烯酸系聚合物100重量份而調配0.1重量份以上。藉由使用相對於上述丙烯酸系聚合物100重量份而調配0.1重量份以上之極性較高之聚合物的黏著片,可提高基礎聚合物與離子性液體之相溶性。藉此,可防止離子性液體向黏著劑層表面之偏析,抑制黏著劑層之黏著力之下降。其結果為,作為電子零件之加工,例如進行半導體晶圓之切割之情形時,防止經單片化之半導體晶片飛散,進一步實現良率之提高。
於上述構成中,較佳為使用作為上述黏著劑層之構成成分之基礎聚合物之酸值為1~200者作為上述黏著片。藉由使上述基礎聚合物之酸值為1以上,可抑制黏著劑層之黏著力之下降。其結果為,例如進行半導體晶圓之切割之情形時,防止經單片化之半導體晶片飛散,進一步實現良率之提高。另一方面,藉由使上述酸值為200以下,可維持較高之黏著性。再者,上述酸值係指中和試樣1 g中所含之COOH基所需之氫氧化鉀之mg數。
又,於上述構成中,較佳為使用作為上述黏著劑層之構成成分之基礎聚合物具有羧基者作為上述黏著片。若使用含有羧基之聚合物作為基礎聚合物,則可實現黏著劑層之黏著力之提高。其結果為,例如進行半導體晶圓之切割之情形時,防止經單片化之半導體晶片飛散,進一步實現良率之提高。
於上述構成中,較佳為使用上述黏著劑層之構成成分為放射線聚合性之寡聚物者作為上述黏著片。
進而,於上述構成中,較佳為使用上述隔離層為聚烯烴膜或聚酯膜者作為上述黏著片。
又,本發明之黏著片之特徵在於:為了解決上述課題而用於上述所記載之電子零件之製造方法。
本發明係使用具備藉由依據JIS L1094之電荷衰減測定法求出之表面之帶電電荷之半衰期為900秒以下之黏著劑層的黏著片進行電子零件之製造者。若上述帶電電荷半衰期為900秒以下,則於除去隔離層剝離後之黏著劑層表面之帶電電荷時,可遍及黏著劑層之整個表面而以短時間有效率地進行除靜電。藉此,即使於黏著劑層上貼附例如半導體晶圓等電子零件,亦抑制對電子零件之放電,實現電子零件之製造良率之提高。
以下,說明本發明之一實施形態之電子零件之製造方法。圖1係概略性地表示本實施形態之電子零件之製造方法之說明圖。
如圖1(a)所示,本實施形態之電子零件之製造方法係使用在基材11上至少依序積層有黏著劑層12及隔離層13之黏著片10。更具體而言,其至少具有如下步驟:自上述黏著片10中之黏著劑層12剝離隔離層13之步驟、除去上述黏著劑層12之表面之帶電電荷之步驟、及於除靜電後之上述黏著劑層12上貼合電子零件14之步驟。
作為該製造方法中之電子零件,並無特別限定,可使用公知者。作為電子零件之具體例,例如可列舉:以矽或鎵-砷、鍺、氮化鎵等作為構成材料之半導體或半導體晶圓,對其進行集成、密封而成之半導體封裝,進而以紅寶石、玻璃、陶瓷等作為構成材料之基板等。以下,以半導體晶圓作為電子零件之例,說明本實施形態,但並非意在將電子零件限定為半導體晶圓。
首先,自黏著片10之黏著劑層12上剝離隔離層13。此時,黏著劑層12之表面與隔離層13上帶有電荷。作為剝離方法,並無特別限定,由於加大剝離速度而剝離隔離層13之情形時,黏著劑層12及隔離層13各自所帶之電荷量增大,故而較佳為降低剝離速度而剝離隔離層13。具體而言,剝離條件例如較佳為於溫度25℃、相對濕度55%、剝離速度100 mm/min~5000 mm/min、剝離角度180°下進行剝離。
其次,除去黏著劑層12表面之帶電電荷。作為除靜電方法並無特別限定,例如可使用自放電式除靜電器,交流式除靜電器、直流式除靜電器、鼓風機式除靜電器、利用壓縮空氣之除靜電裝置、利用電暈放電之除靜電裝置等電氣式除靜電器,紫外線或軟X射線式除靜電裝置等。除靜電後之黏著劑層12之表面之帶電壓較佳為200 V以下,更佳為100 V以下,尤佳為50 V以下。
此處,於本實施形態中,作為上述黏著片10,係使用上述黏著劑層12之表面之帶電電荷之半衰期為900秒以下、較佳為0.01秒~600秒、更佳為0.01秒~300秒者。若帶電電荷之半衰期大於900秒,則有時黏著劑層12表面之除靜電變得不充分。其結果為,於將半導體晶圓14貼合於黏著劑層12上之情形時,有時對上述半導體晶圓14產生放電,形成於半導體晶圓14表面上之電路被破壞,變得無法正常地運作。再者,上述帶電電荷之半衰期係藉由依據JIS L1094之電荷衰減測定法所求出之值。例如可使用Static Honestmeter(Shishido靜電氣股份有限公司製造,型號:H-0110),於施加電壓10 V、測定時間900秒、溫度20℃、相對濕度40% Rh之環境下測定。
繼而,於除靜電後之黏著劑層12上貼合半導體晶圓14(參照圖1(d))。貼合例如係將半導體晶圓14壓接於黏著劑層12上,將其接著保持而固定。本步驟係一面利用壓接輥等按壓手段進行按壓,一面進行貼合。貼合時之貼附溫度並無特別限定,例如較佳為20℃~80℃之範圍內。
其次,於實施形態中,可對貼附於黏著劑層12上之半導體晶圓14進行切割。藉由該切割,將半導體晶圓14切割成特定之尺寸而進行單片化,從而製造半導體晶片15。切割例如係自半導體晶圓14之電路面側起而進行。作為切割步驟中使用之切割裝置並無特別限定,可使用先前公知之切割裝置。又,向黏著劑層12中添加下述離子性液體之情形時,由於該離子性液體與界面活性劑等相比,向黏著劑層12之表面滲出受到抑制,故而可防止黏著力之下降。其結果為,由於半導體晶圓14係利用黏著劑層12而牢固地接著固定,故而可抑制晶片缺失或晶片飛散,並且亦可抑制半導體晶圓14之破損。再者,切割條件可視需要適當地設定。
為了剝離接著固定於黏著劑層12上之半導體晶片15,而進行半導體晶片15之拾取。拾取之方法並無特別限定,例如可列舉:利用針,將各半導體晶片15自黏著片10之基材11側頂起,並利用拾取裝置拾取被頂起之半導體晶片15之方法等。
此處,於黏著劑層12為放射線硬化型之情形時,較佳為於對該黏著劑層12照射放射線後進行拾取。藉此,由於黏著劑層12對半導體晶片15之黏著力下降,故而可容易地進行半導體晶片15之剝離。其結果為,可無損半導體晶片15而進行拾取。照射放射線時之照射強度、照射時間等條件並無特別限定,視需要適當設定即可。
其次,下文詳細說明本實施形態所使用之黏著片10。
本實施形態之黏著劑層12如上所述,只要為藉由依據JIS L1094之電荷衰減測定法求出之表面之帶電電荷之半衰期為900秒以下者,則無特別限定。
作為黏著劑層12之構成成分即黏著劑組合物,例如較佳為調配有除靜電劑者。本發明中所謂除靜電劑,係指藉由調配至黏著劑層12中而對黏著劑層12賦予導電性,藉此促進放電者。又,於本發明中,作為上述除靜電劑,較佳為離子性液體。其原因在於:離子性液體係液狀之有機化合物,其與黏著劑組合物之基礎聚合物(詳情如下)之相溶性良好。藉此,可抑制離子性液體偏析至黏著劑層12之表面,亦防止黏著力之下降。再者,所謂離子性液體,係指於室溫(25℃)下呈液狀之熔鹽(離子性化合物)。又,所謂相溶性,係指於藉由適當之混合方法(熔融混合、溶液混合)而混合離子性液體與基礎聚合物之情形時均勻地混合且難以分相之性質。
其中,較佳為使用含氮之鎓鹽、含硫之鎓鹽或含磷之鎓鹽,尤其是基於可獲得優異之抗靜電能力之原因,較佳為使用包含下述通式(A)~(D)所示之有機陽離子成分與陰離子成分者。
[式(A)中之R1
表示碳數為4至20之烴基,亦可含有雜原子;R2
及R3
相同或不同,表示氫或碳數為1至16之烴基,亦可含有雜原子;其中,於氮原子含有雙鍵之情形時,無R3
]。
[式(B)中之R4
表示碳數為2至20之烴基,亦可含有雜原子,R5
、R6
、及R7
相同或不同,表示氫或碳數為1至16之烴基,亦可含有雜原子]。
[式(C)中之R8
表示碳數為2至20之烴基,亦可含有雜原子,R9
、R10
、及R11
相同或不同,表示氫或碳數為1至16之烴基,亦可含有雜原子]。
[式(D)中之X表示氮、硫或磷原子,R12
、R13
、R14
、及R15
相同或不同,表示碳數為1至20之烴基,亦可含有雜原子;其中,於X為硫原子之情形時,無R12
]。
作為式(A)所示之陽離子,可列舉:吡啶鎓陽離子、哌啶鎓陽離子、吡咯啶鎓陽離子、具有吡咯啉骨架之陽離子、具有吡咯骨架之陽離子等。作為具體例,可列舉:1-乙基吡啶鎓陽離子、1-丁基吡啶鎓陽離子、1-己基吡啶鎓陽離子、1-丁基-3-甲基吡啶鎓陽離子、1-丁基-4-甲基吡啶鎓陽離子、1-己基-3-甲基吡啶鎓陽離子、1-丁基-3,4-二甲基吡啶鎓陽離子、1,1-二甲基吡咯啶鎓陽離子、1-乙基-1-甲基吡咯啶鎓陽離子、1-甲基-1-丙基吡咯啶鎓陽離子、2-甲基-1-吡咯啉陽離子、1-乙基-2-苯基吲哚鎓陽離子、1,2-二甲基吲哚鎓陽離子、1-乙基咔唑鎓陽離子。
作為式(B)所示之陽離子,可列舉:咪唑鎓陽離子、四氫嘧啶鎓陽離子、二氫嘧啶鎓陽離子等。作為具體例,可列舉:1,3-二甲基咪唑鎓陽離子、1,3-二乙基咪唑鎓陽離子、1-乙基-3-甲基咪唑鎓陽離子、1-丁基-3-甲基咪唑鎓陽離子、1-己基-3-甲基咪唑鎓陽離子、1-辛基-3-甲基咪唑鎓陽離子、1-癸基-3-甲基咪唑鎓陽離子、1-十二烷基-3-甲基咪唑鎓陽離子、1-十四烷基-3-甲基咪唑鎓陽離子、1,2-二甲基-3-丙基咪唑鎓陽離子、1-乙基-2,3-二甲基咪唑鎓陽離子、1-丁基-2,3-二甲基咪唑鎓陽離子、1-己基-2,3-二甲基咪唑鎓陽離子、1,3-二甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3-三甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,2,3,5-四甲基-1,4,5,6-四氫嘧啶鎓陽離子、1,3-二甲基-1,4-二氫嘧啶鎓陽離子、1,3-二甲基-1,6-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,4-二氫嘧啶鎓陽離子、1,2,3-三甲基-1,6-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,4-二氫嘧啶鎓陽離子、1,2,3,4-四甲基-1,6-二氫嘧啶鎓陽離子等。
作為式(C)所示之陽離子,可列舉吡唑鎓陽離子、吡唑啉鎓陽離子等。作為具體例,可列舉:1-甲基吡唑鎓陽離子、3-甲基吡唑鎓陽離子、1-乙基-2-甲基吡唑啉鎓陽離子等。
作為式(D)所示之陽離子,可列舉四烷基銨陽離子、三烷基鋶陽離子、四烷基鏻陽離子或將上述烷基之一部分取代為烯基者等。
作為具體例,可列舉:四甲基銨陽離子、四乙基銨陽離子、四丁基銨陽離子、四己基銨陽離子、三乙基甲基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、縮水甘油基三甲基銨陽離子、N,N-二甲基-N,N-二丙基銨陽離子、N,N-二甲基-N,N-二己基銨陽離子、N,N-二丙基-N,N-二己基銨陽離子、三甲基鋶陽離子、三乙基鋶陽離子、三丁基鋶陽離子、三己基鋶陽離子、二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子、四甲基鏻陽離子、四乙基鏻陽離子、四丁基鏻陽離子、四己基鏻陽離子、三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子、二烯丙基二甲基銨陽離子等。
其中,較佳為使用:三乙基甲基銨陽離子、三丁基乙基銨陽離子、三甲基癸基銨陽離子、N,N-二乙基-N-甲基-N-(2-甲氧基乙基)銨陽離子、縮水甘油基三甲基銨陽離子、N,N-二甲基-N-乙基-N-丙基銨陽離子、N,N-二甲基-N-乙基-N-丁基銨陽離子、N,N-二甲基-N-乙基-N-戊基銨陽離子、N,N-二甲基-N-乙基-N-己基銨陽離子、N,N-二甲基-N-乙基-N-庚基銨陽離子、N,N-二甲基-N-乙基-N-壬基銨陽離子、N,N-二甲基-N-丙基-N-丁基銨陽離子、N,N-二甲基-N-丙基-N-戊基銨陽離子、N,N-二甲基-N-丙基-N-己基銨陽離子、N,N-二甲基-N-丙基-N-庚基銨陽離子、N,N-二甲基-N-丁基-N-己基銨陽離子、N,N-二甲基-N-丁基-N-庚基銨陽離子、N,N-二甲基-N-戊基-N-己基銨陽離子、三甲基庚基銨陽離子、N,N-二乙基-N-甲基-N-丙基銨陽離子、N,N-二乙基-N-甲基-N-戊基銨陽離子、N,N-二乙基-N-甲基-N-庚基銨陽離子、N,N-二乙基-N-丙基-N-戊基銨陽離子、三乙基甲基銨陽離子、三乙基丙基銨陽離子、三乙基戊基銨陽離子、三乙基庚基銨陽離子、N,N-二丙基-N-甲基-N-乙基銨陽離子、N,N-二丙基-N-甲基-N-戊基銨陽離子、N,N-二丙基-N-丁基-N-己基銨陽離子、N,N-二丁基-N-甲基-N-戊基銨陽離子、N,N-二丁基-N-甲基-N-己基銨陽離子、三辛基甲基銨陽離子、N-甲基-N-乙基-N-丙基-N-戊基銨陽離子等非對稱四烷基銨陽離子,二乙基甲基鋶陽離子、二丁基乙基鋶陽離子、二甲基癸基鋶陽離子等三烷基鋶陽離子,三乙基甲基鏻陽離子、三丁基乙基鏻陽離子、三甲基癸基鏻陽離子等非對稱四烷基鏻陽離子。
另一方面,作為陰離子成分,只要為滿足形成離子性液體者,則無特別限定,例如可使用:Cl-
、Br-
、I-
、AlCl4 -
、Al2
Cl7 -
、BF4 -
、PF6 -
、ClO4 -
、NO3 -
、CH3
COO-
、CF3
COO-
、CH3
SO3 -
、CF3
SO3 -
、(CF3
SO2
)2
N-
、(CF3
SO2
)3
C-
、AsF6 -
、SbF6 -
、NbF6 -
、TaF6 -
、F(HF)n -
、(CF)2
N-
、C4
F9
SO3 -
、(C2
F5
SO2
)2
N-
、C3
F7
COO-
、(CF3
SO2
)(CF3
CO)N-
等。其中,尤其就獲得低熔點之離子性化合物之方面而言,較佳為使用含有氟原子之陰離子成分。
作為本發明中所使用之離子性液體之具體例,係自上述陽離子成分與陰離子成分之組合中適當選擇使用,可列舉:1-丁基吡啶鎓四氟硼酸鹽、1-丁基吡啶鎓六氟磷酸鹽、1-丁基-3-甲基吡啶鎓四氟硼酸鹽、1-丁基-3-甲基吡啶鎓三氟甲磺酸鹽、1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯)亞胺、1-丁基-3-甲基吡啶鎓雙(五氟乙基磺醯)亞胺、1-己基吡啶鎓四氟硼酸鹽、2-甲基-1-吡咯啉四氟硼酸鹽、1-乙基-2-苯基吲哚鎓四氟硼酸鹽、1,2-二甲基吲哚鎓四氟硼酸鹽、1-乙基咔唑鎓四氟硼酸鹽、1-乙基-3-甲基咪唑鎓四氟硼酸鹽、1-乙基-3-甲基咪唑鎓乙酸鹽、1-乙基-3-甲基咪唑鎓三氟乙酸鹽、1-乙基-3-甲基咪唑鎓七氟丁酸鹽、1-乙基-3-甲基咪唑鎓三氟甲磺酸鹽、1-乙基-3-甲基咪唑鎓全氟丁磺酸鹽、1-乙基-3-甲基咪唑鎓二氰胺、1-乙基-3-甲基咪唑鎓雙(三氟甲磺醯)亞胺、1-乙基-3-甲基咪唑鎓雙(五氟乙基磺醯)亞胺、1-乙基-3-甲基咪唑鎓三(三氟甲磺醯)亞胺、1-丁基-3-甲基咪唑鎓四氟硼酸酯、1-丁基-3-甲基咪唑鎓六氟磷酸鹽、1-丁基-3-甲基咪唑鎓三氟乙酸鹽、1-丁基-3-甲基咪唑鎓七氟丁酸鹽、1-丁基-3-甲基咪唑鎓三氟甲磺酸鹽、1-丁基-3-甲基咪唑鎓全氟丁磺酸鹽、1-丁基-3-甲基咪唑鎓雙(三氟甲磺醯)亞胺、溴化1-己基-3-甲基咪唑、氯化1-己基-3-甲基咪唑、1-己基-3-甲基咪唑鎓四氟硼酸鹽、1-己基-3-甲基咪唑鎓六氟磷酸鹽、1-己基-3-甲基咪唑鎓三氟甲磺酸鹽、1-辛基-3-甲基咪唑鎓四氟硼酸鹽、1-辛基-3-甲基咪唑鎓六氟磷酸鹽、1-己基-2,3-二甲基咪唑鎓四氟硼酸鹽、1,2-二甲基-3-丙基咪唑鎓雙(三氟甲磺醯)亞胺、1-甲基吡唑鎓四氟硼酸鹽、3-甲基吡唑鎓四氟硼酸鹽、四己基銨雙(三氟甲磺醯)亞胺、二烯丙基二甲基銨四氟硼酸鹽、二烯丙基二甲基銨三氟甲磺酸鹽、二烯丙基二甲基銨雙(三氟甲磺醯)亞胺、二烯丙基二甲基銨雙(五氟乙基磺醯)亞胺、1-丁基吡啶鎓(三氟甲磺醯基)三氟乙醯胺、1-丁基-3-甲基吡啶鎓(三氟甲磺醯基)三氟乙醯胺、1-乙基-3-甲基咪唑鎓(三氟甲磺醯基)三氟乙醯胺、二烯丙基二甲基銨(三氟甲磺醯基)三氟乙醯胺、N,N-二甲基-N-乙基-N-丙基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-乙基-N-丁基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-乙基-N-戊基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-乙基-N-己基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-乙基-N-庚基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-乙基-N-壬基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N,N-二丙基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-丙基-N-丁基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-丙基-N-戊基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-丙基-N-己基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-丙基-N-庚基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-丁基-N-己基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-丁基-N-庚基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N-戊基-N-己基銨雙(三氟甲磺醯)亞胺、N,N-二甲基-N,N-二己基銨雙(三氟甲磺醯)亞胺、三甲基庚基銨雙(三氟甲磺醯)亞胺、N,N-二乙基-N-甲基-N-丙基銨雙(三氟甲磺醯)亞胺、N,N-二乙基-N-甲基-N-戊基銨雙(三氟甲磺醯)亞胺、N,N-二乙基-N-甲基-N-庚基銨雙(三氟甲磺醯)亞胺、N,N-二乙基-N-丙基-N-戊基銨雙(三氟甲磺醯)亞胺、三乙基丙基銨雙(三氟甲磺醯)亞胺、三乙基戊基銨雙(三氟甲磺醯)亞胺、三乙基庚基銨雙(三氟甲磺醯)亞胺、N,N-二丙基-N-甲基-N-乙基銨雙(三氟甲磺醯)亞胺、N,N-二丙基-N-甲基-N-戊基銨雙(三氟甲磺醯)亞胺、N,N-二丙基-N-丁基-N-己基銨雙(三氟甲磺醯)亞胺、N,N-二丙基-N,N-二己基銨雙(三氟甲磺醯)亞胺、N,N-二丁基-N-甲基-N-戊基銨雙(三氟甲磺醯)亞胺、N,N-二丁基-N-甲基-N-己基銨雙(三氟甲磺醯)亞胺、三辛基甲基銨雙(三氟甲磺醯)亞胺、N-甲基-N-乙基-N-丙基-N-戊基銨雙(三氟甲磺醯)亞胺等。
如上所述之離子性液體可使用市售之離子性液體,亦可藉由下述方式合成。作為離子性液體之合成方法,只要可獲得目標之離子性液體,則無特別限定,通常可使用如文獻「離子性液體-開發之最前線與未來-」[(股)CMC出版發行]中所記載之鹵化物法、氫氧化物法、酸酯法、錯合物形成法及中和法等。
關於鹵化物法、氫氧化物法、酸酯法、錯合物形成法及中和法,下文以含氮鎓鹽為例揭示其合成方法,其他含硫鎓鹽、含磷鎓鹽等其他離子性液體亦可藉由相同之方法獲得。
鹵化物法係藉由如下述式(1)~(3)所示之反應而進行之方法。首先,使三級胺與鹵化烷反應而獲得鹵化物(反應式(1),作為鹵素可使用氯、溴、碘)。使所得之鹵化物與具有目標之離子性液體之陰離子結構(A-
)的酸(HA)或鹽(MA、M係銨、鋰、鈉、鉀等與目標之陰離子形成鹽之陽離子)反應,而獲得目標之離子性液體(R4
NA)。
(1) R3
N+RX→R4
NX(X: Cl,Br,I)
(2) R4
NX+HA→R4
NA+HX
(3) R4
NX+MA→R4
NA+MX(M: NH4
,Li,Na,K,Ag等)
氫氧化物法係藉由如(4)~(8)所示之反應而進行之方法。首先,藉由離子交換膜法電解(反應式(4))、OH型離子交換樹脂法(反應式(5))或與氧化銀(Ag2
O)之反應(反應式(6)),由鹵化物(R4
NX)獲得氫氧化物(R4
NOH)(作為鹵素,可使用氯、溴、碘)。與上述鹵素化法同樣地使用反應式(7)~(8)之反應,由所獲得之氫氧化物獲得目標之離子性液體(R4
NA)。
(4) R4
NX+H2
O→R4
NOH+1/2H2
+1/2X2
(X: Cl,Br,I)
(5) R4
NX+P-OH→R4
NOH+P-X(P-OH: OH型離子交換樹脂)
(6) R4
NX+1/2Ag2
O+1/2H2
O→R4
NOH+AgX
(7) R4
NOH+HA→R4
NA+HX
(8) R4
NOH+MA→R4
NA+MX(M: NH4
,Li,Na,K,Ag等)
酸酯法係藉由(9)~(11)所示之反應而進行之方法。首先,使三級胺(R3
N)與酸酯反應而獲得酸酯物(反應式(9),作為酸酯,可使用硫酸、亞硫酸、磷酸、亞磷酸、碳酸等無機酸之酯或甲基磺酸、甲基膦酸、甲酸等有機酸之酯等)。與上述鹵素化法同樣地使用反應式(10)~(11)之反應,由所得之酸酯物獲得目標之離子性液體(R4
NA)。又,藉由使用三氟甲磺酸甲酯、三氟乙酸甲酯等作為酸酯,亦可直接獲得離子性液體。
(11) R4
NOY+MA→R4
NA+MOY(M:NH4
,Li,Na,K,Ag等)
錯合法係藉由(12)~(15)所示之反應而進行之方法。首先,使四級銨之鹵化物(R4
NX)、四級銨之氫氧化物(R4
NOH)、四級銨之碳酸酯化物(R4
NOCO2
CH3
)等與氟化氫(HF)或氟化銨(NH4
F)反應,而獲得氟化四級銨鹽(反應式(12)~(14))。藉由使所得之氟化四級銨鹽與BF3
、AlF3
、PF5
、ASF5
、SbF5
、NbF5
、TaF5
等氟化物進行錯合物形成反應,可獲得離子性液體(反應式(15))。
(12) R4
NX+HF→R4
NF+HX(X: Cl,Br,I)
(13) R4
NY+HF→R4
NF+HY(Y: OH,OCO2
CH3
)
(14) R4
NY+NH4
F→R4
NF+NH3
+HY(Y: OH,OCO2
CH3
)
(15) R4
NF+MFn-1
→R4
NMFn
(MFn-1
: BF3
,AlF8
,PF6
,ASF6
,SbF6
,NbF5
,TaF6
)
中和法係藉由如(16)所示之反應而進行之方法。可藉由使三級胺與HBF4
、HPF6
、CH3
COOH、CF3
COOH、CF3
SO3
H、(CF3
SO2
)2
NH、(CF3
SO2
)3
CH、(C2
F5
SO2
)2
NH等有機酸進行反應而獲得。
(16) R3
N+HZ→R3
H+
Z-
[HZ: HBF4
,HPF6
,CH3
COOH,CF3
COOH,CF3
SO3
H,CF3
SO2
)2
NH,(CF3
SO2
)3
CH,(C2
F5
SO2
)2
NH等有機酸]
上述R表示氫或碳數為1至20之烴基,亦可含有雜原子。
離子性液體之調配量由於根據所使用之聚合物與離子性液體之相溶性而改變,故而無法統一定義,通常相對於基礎聚合物100重量份,較佳為0.01重量份~40重量份,更佳為0.03重量份~20重量份,最佳為0.05重量份~10重量%。若未達0.01重量份,則無法獲得充分之抗靜電特性,若超過40重量份,則有對半導體晶圓等被接著體之污染增加之傾向。
作為上述基礎聚合物,較佳為使用酸值為1~200、較佳為2~150、更佳為5~100之聚合物。藉由使上述基礎聚合物之酸值為1以上,可抑制黏著劑層12之黏著力之下降。另一方面,藉由使上述酸值為200以下,可維持較高之黏著力。再者,上述酸值係中和試樣1 g中所含之COOH基所需之氫氧化鉀之mg數。
又,作為基礎聚合物,亦可使用玻璃轉移溫度Tg為0℃以下、較佳為-100℃~-5℃、更佳為-80℃~-10℃之聚合物。若玻璃轉移溫度Tg超過0℃,則即使於含有離子性液體之情形時,有時亦難以獲得充分之黏著力。
作為上述基礎聚合物,可列舉:具有碳數1~14之烷基之丙烯酸酯及/或甲基丙烯酸酯之1種或2種以上作為主成分的丙烯酸系聚合物、天然橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS嵌段共聚物)、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS嵌段共聚物)、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS嵌段共聚物)、苯乙烯-丁二烯橡膠、聚丁二烯、聚異戊二烯、聚異丁烯、丁基橡膠、氯丁二烯橡膠、聚矽氧橡膠等通常用作黏著劑之聚合物的聚合物。
該等中,就獲得與離子性液體之相溶性之平衡性及優異之黏著特性之方面而言,較佳為使用以具有碳數1~14之烷基之丙烯酸酯及/或甲基丙烯酸酯之1種或2種以上作為主成分的丙烯酸系聚合物。
作為以具有碳數1~14之烷基之丙烯酸酯及/或甲基丙烯酸酯之1種或2種以上作為主成分的丙烯酸系聚合物,可使用以下述單體作為主成分之重量平均分子量為10萬以上之丙烯酸系聚合物,該單體含有50重量%~100重量%之具有碳數為1~14之烷基之丙烯酸酯及/或甲基丙烯酸酯{以下稱為(甲基)丙烯酸酯}之1種或2種以上。
作為具有碳數1~14之烷基之(甲基)丙烯酸酯之具體例,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸正壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸正癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸正十二烷基酯、(甲基)丙烯酸正十三烷基酯、(甲基)丙烯酸正十四烷基酯等。再者,所謂(甲基)丙烯酸酯,係指丙烯酸酯及/或甲基丙烯酸酯,本發明之(甲基)為完全相同之含義。
進而,作為基礎聚合物,較佳為極性(親水性)較高之聚合物。藉由使用極性較高之聚合物,與除靜電劑之相溶性變得良好,且可防止除靜電劑向黏著劑層12表面之偏析,抑制黏著力之下降。作為極性較高之基礎聚合物,較佳為相對於主單體(例如以具有碳數1~14之烷基之丙烯酸酯及/或甲基丙烯酸酯之1種或2種以上作為主成分的丙烯酸系聚合物等)100重量份,含有極性較高之單體0.1重量份以上、較佳為0.1重量份~30重量份、更佳為0.1重量份~20重量份之聚合物。作為上述極性較高之單體,例如可列舉丙烯酸等。再者,於本發明中,所謂極性較高,例如係指介電常數為2.0以上之情形。
作為其他成分,基於易獲取黏著性能之平衡性之原因,可以Tg成為0℃以下(通常-100℃以上)之方式可適當地使用含有磺酸基之單體、含有磷酸基之單體、含有氰基之單體、乙烯酯類、芳香族乙烯基化合物等凝聚力、耐熱性提高成分,或含有羧基之單體、含有酸酐基之單體、含有羥基之單體、含有醯胺基之單體、含有胺基之單體、含有環氧基之單體、N-丙烯醯基嗎啉、乙烯基醚類等具有發揮接著力之提高或交聯化基點之作用之官能基的成分。其他成分可使用1種,或併用2種以上。
其中,於使用具有羧基、磺酸基、磷酸基等酸官能基之丙烯酸酯及/或甲基丙烯酸酯之情形時,較佳為以丙烯酸系聚合物之酸值成為29以下之方式進行調整。若丙烯酸系聚合物之酸值超過29,則有抗靜電特性變差之傾向。酸值之調整可藉由具有酸官能基之丙烯酸酯及/或甲基丙烯酸酯之調配量而調整,例如作為具有羧基之丙烯酸系聚合物,可列舉將丙烯酸2-乙基己酯與丙烯酸共聚合而成之丙烯酸系聚合物,於此情形時,藉由相對於丙烯酸2-乙基己酯與丙烯酸之合計量100重量份,將丙烯酸調整至3.7重量份以下,可滿足上述酸值之值。
作為含有磺酸基之單體,可列舉:苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺基丙酯、(甲基)丙烯醯氧基萘磺酸等。作為含有磷酸基之單體,可列舉丙烯醯基磷酸2-羥乙酯。
作為含有氰基之單體,可列舉丙烯腈。作為乙烯酯類,可列舉乙酸乙烯酯。
作為芳香族乙烯基化合物,可列舉苯乙烯。作為含有羧基之單體,可列舉(甲基)丙烯酸、(甲基)丙烯酸羧基乙酯、(甲基)丙烯酸羧基戊酯、衣康酸、順丁烯二酸、反丁烯二酸、丁烯酸等。作為含有酸酐基之單體,可列舉順丁烯二酸酐、衣康酸酐等。
作為含有羥基之單體,可列舉:(甲基)丙烯酸2-羥乙酯、(甲基)丙烯酸2-羥丙酯、(甲基)丙烯酸4-羥丁酯、(甲基)丙烯酸6-羥己酯、(甲基)丙烯酸8-羥辛酯、(甲基)丙烯酸10-羥癸酯、(甲基)丙烯酸12-羥基十二烷基酯、甲基丙烯酸4-羥甲基環己酯、N-羥甲基(甲基)丙烯醯胺、乙烯醇、烯丙醇、2-羥乙基乙烯基醚、4-羥丁基乙烯基醚、二乙二醇單乙烯基醚等。
作為含有醯胺基之單體,可列舉丙烯醯胺、二乙基丙烯醯胺。作為含有胺基之單體,可列舉(甲基)丙烯酸N,N-二甲基胺基乙酯、(甲基)丙烯酸N,N-二甲基胺基丙酯。作為含有環氧基之單體,可列舉(甲基)丙烯酸縮水甘油酯、烯丙基縮水甘油醚等。
作為乙烯基醚類,可列舉乙烯基乙基醚。上述丙烯酸系聚合物係藉由溶液聚合、乳化聚合、塊狀聚合、懸浮聚合等通常用作丙烯酸系聚合物之合成方法之聚合方法而獲得。
本實施形態之黏著劑係藉由適當使基礎聚合物、尤其是丙烯酸系聚合物交聯,而獲得耐熱性更優異之黏著片類。作為交聯方法之具體手段,有如下之所謂使用交聯劑之方法:添加聚異氰酸酯化合物、環氧化合物、氮丙啶化合物等可與丙烯酸系聚合物中適宜作為交聯化基點而含有之羧基、羥基、胺基、醯胺基等反應之基的化合物。其中,尤佳為使用聚異氰酸酯化合物或環氧化合物。
作為上述聚異氰酸酯化合物,例如可列舉:二異氰酸丁二酯、六亞甲基二異氰酸酯等低級脂肪族聚異氰酸酯類,二異氰酸環戊二酯、二異氰酸環己二酯、異佛酮二異氰酸酯等脂環族異氰酸酯類,2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、二異氰酸苯二甲酯等芳香族二異氰酸酯類,三羥甲基丙烷/甲苯二異氰酸酯三聚物加成物(商品名Coronate L),三羥甲基丙烷/六亞甲基二異氰酸酯三聚物加成物(商品名Coronate HL)、六亞甲基二異氰酸酯之異氰尿酸酯體(商品名Coronate HX)[均為日本聚氨酯工業(股)製造]等異氰酸酯加成物等。作為環氧化合物,可列舉N,N,N',N'-四縮水甘油基-間-二甲苯二胺(商品名TETRAD-X)或1,3-雙(N,N-二縮水甘油基胺基甲基)環己烷(商品名TETRAD-C)[均為三菱瓦斯化學(股)製造]等。該等交聯劑可單獨使用或以2種以上之混合系而使用。交聯劑之使用量係根據與應交聯之丙烯酸系聚合物之平衡性,進而根據黏著片之使用用途而適當選擇。
作為上述聚異氰酸酯化合物之調配量,為了藉由丙烯酸黏著劑之凝聚力而獲得充分之耐熱性,通常較佳為相對於上述丙烯酸系聚合物100重量份,而調配0.5重量份以上。又,就柔軟性、接著性之方面而言,較佳為相對於上述丙烯酸系聚合物100重量份,而調配10重量份以下。
又,作為實質之交聯劑,亦可添加具有2個以上之放射線反應性不飽和鍵的多官能單體或放射線聚合性之寡聚物,利用放射線等使之交聯。
作為具有2個以上之放射線反應性不飽和鍵的多官能單體,可使用可利用如具有2個以上之乙烯基、丙烯醯基、甲基丙烯醯基、乙烯基苄基之類的可藉由照射放射線進行交聯處理(硬化)之1種或2種以上之放射線反應性基的多官能單體成分。再者,通常可較佳地使用放射線反應性不飽和鍵為10個以下者。多官能單體亦可併用2種以上。
作為多官能單體之具體例,可列舉:乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、二乙烯基苯、N,N'-亞甲基雙丙烯醯胺等。
又,作為上述放射線聚合性寡聚物成分,可列舉胺基甲酸酯系、聚醚系、聚酯系、聚碳酸酯系、聚丁二烯系等之各種寡聚物。進而,較佳為寡聚物成分之重量平均分子量為100~30000左右之範圍者。
上述多官能單體或放射線聚合性寡聚物之使用量係根據與欲交聯之丙烯酸系聚合物之平衡性,進而根據黏著片之使用用途而適當選擇。為了藉由丙烯酸黏著劑之凝聚力而獲得充分之耐熱性,通常較佳為相對於丙烯酸系聚合物100重量份而調配0.1重量份~30重量份。又,就柔軟性、接著性之方面而言,更佳為相對於丙烯酸系聚合物100重量份而調配10重量份以下。
作為放射線,例如可列舉紫外線、雷射線、α射線、β射線、γ射線、X射線、電子束等,就控制性及操作性之良好程度、成本之方面而言,較佳為使用紫外線。更佳為使用波長200 nm~400 nm之紫外線。紫外線可使用高壓水銀燈、微波激發型燈、化學燈等適宜光源進行照射。再者,於使用紫外線作為放射線之情形時,向丙烯酸黏著劑中添加光聚合起始劑。
作為光聚合起始劑,只要為根據放射線反應性成分之種類,照射可成為其聚合反應之誘因之適當波長之紫外線,而生成自由基或陽離子之物質即可。
作為光自由基聚合起始劑,例如可列舉:安息香、安息香甲基醚、安息香乙基醚、鄰苯甲醯基苯甲酸甲酯基-對安息香乙基醚、安息香異丙基醚、α-甲基安息香等安息香類,苯偶醯二甲基縮酮、三氯苯乙酮、2,2-二乙氧基苯乙酮、1-羥基環己基苯基酮等苯乙酮類,2-羥基-2-甲基苯丙酮、2-羥基-4'-異丙基-2-甲基苯丙酮等苯丙酮類,二苯甲酮、甲基二苯甲酮、對氯二苯甲酮、對二甲胺基二苯甲酮等二苯甲酮類,2-氯硫雜蒽酮、2-乙基硫雜蒽酮、2-異丙基硫雜蒽酮等硫雜蒽酮類,雙(2,4,6-三甲基苯甲醯基)苯基氧化膦、2,4,6-三甲基苯甲醯基二苯基氧化膦、(2,4,6-三甲基苯甲醯基)(乙氧基)苯基氧化膦等醯基氧化膦類,苯偶醯、二苯并環庚酮、α-醯基肟酯等。
作為光陽離子聚合起始劑,例如可列舉:芳香族重氮鎓鹽、芳香族錪鹽、芳香族鋶鹽等鎓鹽,或鐵-芳烴錯合物、二茂鈦錯合物、芳基矽烷醇-鋁錯合物等有機金屬錯合物類,硝基苄基酯、磺酸衍生物、磷酸酯、磺酸衍生物、磷酸酯、苯酚磺酸酯、重氮萘醌、N-羥基醯亞胺磺酸鹽等。上述光聚合起始劑亦可併用2種以上。
較佳為光聚合起始劑相對於丙烯酸系聚合物100重量份,通常調配0.1重量份~10重量份,較佳為調配0.2重量份~7重量份。
進而亦可併用胺類等光聚合起始助劑。作為上述光聚合起始助劑,可列舉:苯甲酸2-二甲基胺基乙酯、二甲基胺基苯乙酮、對二甲胺基苯甲酸乙酯、對二甲胺基苯甲酸異戊酯等。上述光聚合起始助劑亦可併用2種以上。聚合起始助劑相對於丙烯酸系聚合物100重量份,較佳為調配0.05重量份~10重量份,更佳為調配0.1重量份~7重量份。
進而,可根據使用之用途,向本實施形態中所使用之黏著劑中適當添加先前公知之各種增黏劑或表面潤滑劑、均化劑、抗氧化劑、抗腐蝕劑、光穩定劑、紫外線吸收劑、聚合抑制劑、矽烷偶合劑、無機或有機之填充劑、金屬粉、顏料等之粉體、粒子狀、箔狀物等先前公知之各種添加劑。
本實施形態之黏著片10係以通常厚度成為3 μm~100 μm、較佳為成為5 μm~50 μm左右之方式,於包含聚酯膜等塑膠膜、或紙、不織布等多孔質材料等的各種基材之單面或兩面上塗佈形成上述黏著劑層12,而製成片狀或帶狀等形態者。尤其於表面保護膜之情形時,較佳為使用塑膠基材作為基材。
又,黏著劑層12之表面之剝離黏著力對於半導體晶圓,較佳為2 N/20 mm~50 N/20 mm,更佳為3 N/20 mm~30 N/20 mm,尤佳為4 N/20 mm~20 N/20 mm。藉由使剝離黏著力為2 N/20 mm以上,例如於切割半導體晶圓時可防止晶片飛散。另一方面,藉由使剝離黏著力為50 N/20 mm以下,可防止半導體晶片之拾取變困難。進而,於黏著劑層12為放射線硬化型之情形時,放射線硬化後之剝離黏著力對於半導體晶圓,較佳為0.01 N/20 mm~1 N/20 mm,更佳為0.01 N/20 mm~0.8 N/20 mm,尤佳為0.01 N/20 mm~0.5 N/20 mm。藉由使剝離黏著力為0.01 N/20 mm以上,可保持放射線硬化後之半導體晶片。另一方面,藉由使剝離黏著力為1 N/20 mm以下,可防止半導體晶片之拾取變困難。再者,上述各黏著力係於溫度23℃、拉伸速度50 mm/min、剝離角度180°下進行剝離並進行測定時之值。
作為塑膠基材,只要為可形成片狀或膜狀者,則無特別限定,可列舉:聚乙烯、聚丙烯、聚-1-丁烯、聚-4-甲基-1-戊烯、乙烯-丙烯共聚物、乙烯-1-丁烯共聚物、乙烯-乙酸乙烯酯共聚物、乙烯-丙烯酸乙酯共聚物、乙烯-乙烯醇共聚物等聚烯烴之膜,聚對苯二甲酸乙二酯、聚萘二甲酸二乙酯、聚對苯二甲酸丁二酯等聚酯之膜,聚丙烯酸酯膜、聚苯乙烯膜、尼龍6、尼龍6,6、部分芳香族聚醯胺等聚醯胺之膜,聚氯乙烯膜、聚偏二氯乙烯膜、聚碳酸酯膜等。上述膜之厚度通常為5 μm~200 μm,較佳為10 μm~100 μm左右。
對於塑膠基材,視需要可進行利用聚矽氧系、氟系、長鏈烷基系或脂肪醯胺系之脫模劑,二氧化矽粉等之脫模及防污處理或酸處理、鹼處理、底塗處理、電暈處理、電漿處理、紫外線處理等易接著處理,塗佈型、捏合型、蒸鍍型等之抗靜電處理。作為黏著劑之塗佈形成方法,可使用黏著帶之製造中所使用之公知方法,具體可列舉:輥塗法、凹版印刷塗佈法、反向塗佈法、輥式刷塗法、噴塗法、氣刀塗佈法等。
上述隔離層13係為了保護黏著劑層12之表面而貼合者。作為構成隔離層13之基材,有紙或塑膠膜,就表面平滑性優異之方面而言,較佳為使用塑膠膜。更具體而言,可列舉:聚乙烯膜、聚丙烯膜、聚丁二烯膜、聚甲基戊烯膜等聚烯烴膜,聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚胺酯膜等聚酯膜等。
上述隔離層13之厚度通常為5 μm~200 μm,較佳為10 μm~100 μm左右。對於上述隔離層13之與黏著劑層12之貼合面,亦可利用聚矽氧系、氟系、長鏈烷基系或脂肪酸醯胺系之脫模劑,二氧化矽粉等適當地實施脫模劑處理。
以下,藉由實施例詳細地說明本發明,但本發明只要不超出其主旨之範圍,則並不限定於以下之實施例。
(丙烯酸系聚合物A)
使丙烯酸2-乙基己酯80重量份、丙烯酸甲酯20重量份、丙烯酸10重量份、過氧化苯甲醯0.2重量份之混合物於氮氣流中且於65℃下反應6小時,而獲得Tg=-49℃、重量平均分子量為100萬、酸值為70之丙烯酸系聚合物之溶液(25重量%)。
(丙烯酸系聚合物B)
使丙烯酸2-乙基己酯100重量份、丙烯酸4重量份、AIBN(偶氮雙異丁腈)0.2重量份之混合物於氮氣流中且於65℃下反應6小時,而獲得Tg=-66℃、重量平均分子量為55萬、酸值為30之丙烯酸系聚合物之溶液(33重量%)。
(丙烯酸系聚合物C)
使丙烯酸2-乙基己酯100重量份、丙烯酸2-羥乙酯4重量份、AIBN(偶氮雙異丁腈)0.2重量份之混合物於氮氣流中且於65℃下反應6小時,而獲得Tg=-68℃、重量平均分子量為55萬、酸值為0之丙烯酸系聚合物之溶液(35重量%)。
(實施例1)
相對於100重量份之上述丙烯酸系聚合物A,添加作為除靜電劑之1-丁基-3-甲基吡啶鎓雙(三氟甲磺醯)亞胺(日本Carlit(股)製造,商品名:CIL-312)0.1重量份、作為交聯劑之聚異氰酸酯化合物(商品名「Coronate L」,日本聚氨酯(股)製造)5重量份、紫外線聚合性之寡聚物(日本合成化學(股)製造,商品名:UV1700TL)50重量份、光聚合起始劑(Ciba Specialty Chemicals(股)製造,商品名:Irgacure 2959)3重量份,而製作黏著劑溶液。
將上述所製備之黏著劑溶液塗佈於聚對苯二甲酸乙二酯膜(厚度100 μm)上,於140℃下加熱交聯2分鐘,而形成厚度為10 μm之黏著劑層。其次,於該黏著劑層面上貼合作為隔離層之三菱化學聚酯膜(股)製造之-MRF38(厚度38 μm)。藉此,製作本實施例之黏著片。
(實施例2)
於本實施例中,將除靜電劑之調配量變更為1重量份,除此以外以與上述實施例1相同之方式製作本實施例之黏著片。
(實施例3)
於本實施例中,將除靜電劑之調配量變更為10重量份,除此以外以與上述實施例1相同之方式製作本實施例之黏著片。
(實施例4)
於本實施例中,使用丙烯酸系聚合物B且不調配UV寡聚物及光聚合起始劑,除此以外以與上述實施例1相同之方式製作本實施例之黏著片。
(實施例5)
於本實施例中,將除靜電劑之調配量變更為1重量份,除此以外以與上述實施例4相同之方式製作本實施例之黏著片。
(實施例6)
於本實施例中,將除靜電劑之調配量變更為10重量份,除此以外以與上述實施例4相同之方式製作本實施例之黏著片。
(實施例7)
於本實施例中,使用丙烯酸系聚合物C且不調配UV寡聚物及光聚合起始劑,除此以外以與上述實施例1相同之方式製作本實施例之黏著片。
(實施例8)
於本實施例中,將除靜電劑之調配量變更為1重量份,除此以外以與上述實施例7相同之方式製作本實施例之黏著片。
(實施例9)
於本實施例中,將除靜電劑之調配量變更為10重量份,除此以外以與上述實施例7相同之方式製作本實施例之黏著片。
(比較例1)
於本比較例中,不調配除靜電劑,除此以外以與上述實施例1相同之方式製作本比較例之黏著片。
(重量平均分子量)
重量平均分子量係使用Tosoh股份有限公司製造之GPC裝置、HLC-8220GPC進行測定,並由聚苯乙烯換算值求出。測定條件如下所述。樣品濃度:0.2重量%(THF(Tetrahydrofuran,四氫呋喃)溶液),樣品注入量:10 μl,洗滌液:THF,流速:0.6 ml/min,測定溫度:40℃,管柱:樣品管柱、TSKguardcolumn
SuperHZ-H一根+TSKgelSuperHZM-H兩根,參比管柱:TSKgel SuperH-RC一根,檢測器:示差折射計。
(酸值)
酸值係使用平沼產業股份有限公司製造之自動滴定裝置(COM-550)進行測定,並根據下式求出。
A={(Y-X)×f×5.611}/M
(A:酸值,Y:樣品溶液之滴定量(ml),X:僅為混合溶劑50 g之溶液之滴定量(ml),f:滴定溶液之係數,M:聚合物樣品之重量(g))
測定條件如下所述。樣品溶液:將聚合物樣品約0.5 g溶解於混合溶劑(甲苯/2-丙醇/蒸餾水=50/49.5/0.5,重量比)50 g中而製成樣品溶液。滴定溶液:0.1 N,2-丙醇性氫氧化鉀溶液(和光純藥工業(股)製造,石油製品中和值試驗用),電極:玻璃電極、GE-101,比較電極:RE-201,測定模式:石油製品中和值試驗用1。
(帶電電荷之半衰期)
各實施例及比較例所製作之黏著片之黏著劑層表面之帶電電荷之半衰期係藉由依據JIS L1094之電荷衰減測定法而求出。首先,使用Static Honest Meter(Shishido靜電氣股份有限公司製造,型號:H-0110)於其平台上固定各黏著片。其次,一面沿水平方向旋轉平台一面藉由電暈放電對黏著片表面施加電壓。其電位之檢測值達到飽和值後,切斷高壓之施加,觀察其後之電位之衰減狀態。測定其值達到飽和值之二分之一的時間,設為半衰值。再者,測定條件設為施加電壓10 V、測定時間900秒、溫度20℃、相對濕度40% Rh。
(剝離黏著力)
自各黏著片相對於縱向以寬度20 mm×長度12 cm切取樣品片,將其貼附於矽鏡晶圓上,放置約30分鐘,並測定剝離黏著力。對設置有紫外線硬化型黏著劑層之黏著片測定紫外線照射前之剝離黏著力(N/20 mm)。測定條件設為:測定機器Tensilon(Orientec公司製造)、溫度23℃、拉伸速度:50 mm/min、剝離角度:180°。
(除靜電性)
確認剝離隔離層後之表面之除靜電性。具體而言,於尺寸為70 mm×70 mm之丙烯酸系樹脂板上貼合尺寸為30 mm×70 mm之雙面膠帶。於雙面膠帶上貼合尺寸為30 mm×70 mm之實施例及比較例之黏著片之基材側。接著,用手迅速剝離隔離層,使用電位測定器[春日電機(股)公司製造之KSD-0202]測定黏著劑層表面之帶電量。其次,使地線接觸黏著劑層表面,再次測定黏著劑層表面之帶電量,而確認黏著劑層之帶電量之變化。對於其結果,將設置地線後1分鐘以內帶電量衰減至一半之情形設為「○」,將1分鐘以內未衰減至一半之情形設為「×」。將結果示於下述表2。
(黏著性)
各黏著片對電子零件之黏著性之評價係藉由將矽晶圓作為電子零件,確認於切割矽晶圓時引起之晶片飛散現象而評價。具體而言,於下述條件下切割厚度為200 μm之矽晶圓,此時,確認有無黏著力較低,無法保持而飛散之晶片。將未見晶片之飛散之情形設為「○」,將可見晶片之飛散之情形設為「×」。將結果示於下述表2。
<切割條件>
矽晶圓:6吋200 μm
切割裝置:DISCO公司製造之DFD-651
切割刀片:DISCO公司製造之27HECC
刀片轉速:40000 rpm
切割速度:50 mm/sec
切割深度:25 μm
切割模式:下切
切割尺寸:5 mm×5 mm
(結果)
由上述表1及2之結果明確,本發明之實施例1~9之黏著片於隔離層剝離後,黏著劑層之表面之帶電電位之半衰期為900秒以下,若進行除靜電,則可以極短時間除去電位。又,確認實施例1~6之黏著片藉由添加作為極性較高之單體之丙烯酸,亦可防止黏著劑層之剝離黏著力之下降。另一方面,比較例1之黏著片由於未調配作為除靜電劑之離子性液體,故而帶電電位之半衰期超過900秒,且即使除靜電,電位仍為較高之狀態。
10...黏著片
11...基材
12...黏著劑層
13...隔離層
14...半導體晶圓
15...半導體晶片
圖1(a)~(f)係用以說明本發明之一實施形態之電子零件之製造方法的概略圖。
圖2係表示於本發明之實施例等中測定剝離帶電壓時所使用之電位測定部的概略構成圖。
10...黏著片
11...基材
12...黏著劑層
13...隔離層
14...半導體晶圓
15...半導體晶片
Claims (7)
- 一種電子零件之製造方法,其係使用在基材上至少依序積層有黏著劑層及隔離層之切割用黏著片者,其使用藉由依據JIS L1094之電荷衰減測定法求出之上述黏著劑層之表面之帶電電荷之半衰期為900秒以下者作為上述黏著片,上述黏著片之上述黏著劑層中之基礎聚合物為由具有碳數1~14之烷基之丙烯酸酯、或具有碳數1~14之烷基之甲基丙烯酸酯中之至少任一者、以及至少具有羧基之極性高之單體所形成的丙烯酸系聚合物,相對於100重量份之上述基礎聚合物之主單體,係含有10~30重量份之上述極性高之單體,且使用作為上述黏著劑層之構成成分的基礎聚合物之酸值為70~200者作為上述黏著片;並且該製造方法至少具有如下步驟:自上述黏著劑層剝離上述隔離層之步驟;除去上述黏著劑層之表面之帶電電荷之步驟;於除靜電後之上述黏著劑層上貼合電子零件;及切割上述電子零件之步驟。
- 如請求項1之電子零件之製造方法,其使用向上述黏著劑層中相對於其基礎聚合物100重量份而添加有0.01重量份~30重量份之範圍內之離子性液體者作為上述黏著片。
- 如請求項2之電子零件之製造方法,其中上述離子性液 體包含下述通式(A)~(D)所示之1種以上的陽離子:
- 如請求項1之電子零件之製造方法,其使用作為上述黏著劑層之構成成分的基礎聚合物具有羧基者作為上述黏著片。
- 如請求項1之電子零件之製造方法,其使用上述黏著劑層之構成成分為放射線聚合性的寡聚物者作為上述黏著 片。
- 如請求項1之電子零件之製造方法,其使用上述隔離層為聚烯烴膜或聚酯膜者作為上述黏著片。
- 一種黏著片,其係用於如請求項1之電子零件之製造方法而成者。
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JP2015003988A (ja) * | 2013-06-20 | 2015-01-08 | 古河電気工業株式会社 | 半導体加工用粘着テープ |
TWI600526B (zh) * | 2013-11-27 | 2017-10-01 | 住友化學股份有限公司 | 光學部件貼合體之製造裝置 |
JP6624825B2 (ja) * | 2014-09-25 | 2019-12-25 | 日東電工株式会社 | 熱剥離型粘着シート |
CN111808541A (zh) * | 2014-09-25 | 2020-10-23 | 日东电工株式会社 | 热剥离型粘合片 |
CN105845618B (zh) * | 2015-01-13 | 2019-07-19 | 中芯国际集成电路制造(上海)有限公司 | 一种防止铜氧化扩散的方法 |
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JP6630956B2 (ja) * | 2015-06-05 | 2020-01-15 | リンテック株式会社 | 保護膜形成用複合シート及び保護膜付き半導体チップの製造方法 |
JP2020164778A (ja) * | 2018-09-03 | 2020-10-08 | 日東電工株式会社 | 粘着剤組成物、粘着シート、及び接合体 |
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2011
- 2011-08-04 EP EP11814708.1A patent/EP2602814A1/en not_active Withdrawn
- 2011-08-04 US US13/576,079 patent/US20120291944A1/en not_active Abandoned
- 2011-08-04 CN CN201180004835.9A patent/CN102741983B/zh active Active
- 2011-08-04 WO PCT/JP2011/067873 patent/WO2012018083A1/ja active Application Filing
- 2011-08-04 JP JP2012507495A patent/JP5605957B2/ja active Active
- 2011-08-04 KR KR1020127005772A patent/KR20120055601A/ko not_active Application Discontinuation
- 2011-08-05 TW TW100128058A patent/TWI492282B/zh active
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JP2003105292A (ja) * | 2001-07-04 | 2003-04-09 | Furukawa Electric Co Ltd:The | 帯電防止ダイシングテープ |
CN101175830A (zh) * | 2005-05-20 | 2008-05-07 | 日东电工株式会社 | 粘合剂组合物、粘合片及表面保护薄膜 |
JP2007031534A (ja) * | 2005-07-26 | 2007-02-08 | Denki Kagaku Kogyo Kk | 粘着シートおよび電子部品製造方法 |
Also Published As
Publication number | Publication date |
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CN102741983B (zh) | 2015-06-17 |
TW201220377A (en) | 2012-05-16 |
CN102741983A (zh) | 2012-10-17 |
JPWO2012018083A1 (ja) | 2013-10-03 |
WO2012018083A1 (ja) | 2012-02-09 |
JP5605957B2 (ja) | 2014-10-15 |
US20120291944A1 (en) | 2012-11-22 |
KR20120055601A (ko) | 2012-05-31 |
EP2602814A1 (en) | 2013-06-12 |
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