TWI487724B - 塗料組成物 - Google Patents

塗料組成物 Download PDF

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Publication number
TWI487724B
TWI487724B TW099141669A TW99141669A TWI487724B TW I487724 B TWI487724 B TW I487724B TW 099141669 A TW099141669 A TW 099141669A TW 99141669 A TW99141669 A TW 99141669A TW I487724 B TWI487724 B TW I487724B
Authority
TW
Taiwan
Prior art keywords
composition
resin
substituted
unsubstituted
weight
Prior art date
Application number
TW099141669A
Other languages
English (en)
Chinese (zh)
Other versions
TW201130875A (en
Inventor
Guillaume Metral
Bernd Hoevel
Joseph Gan
Michael J Mullins
Hefner, Jr
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of TW201130875A publication Critical patent/TW201130875A/zh
Application granted granted Critical
Publication of TWI487724B publication Critical patent/TWI487724B/zh

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/03Powdery paints
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
TW099141669A 2009-12-02 2010-12-01 塗料組成物 TWI487724B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26580609P 2009-12-02 2009-12-02

Publications (2)

Publication Number Publication Date
TW201130875A TW201130875A (en) 2011-09-16
TWI487724B true TWI487724B (zh) 2015-06-11

Family

ID=43513864

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099141669A TWI487724B (zh) 2009-12-02 2010-12-01 塗料組成物

Country Status (8)

Country Link
US (2) US8937114B2 (enExample)
EP (1) EP2507325B1 (enExample)
JP (1) JP5871326B2 (enExample)
KR (1) KR20120101090A (enExample)
CN (1) CN102648247B (enExample)
SG (1) SG181486A1 (enExample)
TW (1) TWI487724B (enExample)
WO (1) WO2011068645A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2507283B1 (en) * 2009-12-02 2013-10-23 Dow Global Technologies LLC Epoxy resin compositions
JP5922582B2 (ja) * 2009-12-02 2016-05-24 ブルー キューブ アイピー エルエルシー コンポジット組成物
EP2507325B1 (en) 2009-12-02 2014-05-21 Dow Global Technologies LLC Coating compositions
JP5629370B2 (ja) 2010-04-29 2014-11-19 ダウ グローバル テクノロジーズ エルエルシー ポリシクロペンタジエンポリフェノールのビニルベンジルエーテル
JP5854359B2 (ja) 2010-04-29 2016-02-09 ブルー キューブ アイピー エルエルシー ポリシクロペンタジエンポリフェノールのポリ(アリルエーテル)
US8609788B2 (en) 2010-04-29 2013-12-17 Dow Global Technologies Llc Polycyclopentadiene compounds
WO2013126643A1 (en) 2012-02-24 2013-08-29 Dow Global Technologies Llc Polycyanates of cyclododecane polyphenols and thermosets thereof
BR112014018939B1 (pt) 2012-02-24 2021-02-23 Dow Global Technologies Llc Poliglicidil éteres, métodos para preparar os compostos, composiçõescuradas e adutos
JP2014034629A (ja) * 2012-08-08 2014-02-24 Mitsubishi Chemicals Corp エポキシ樹脂組成物、硬化物及び半導体封止材
US11535750B2 (en) 2013-09-30 2022-12-27 Lg Chem, Ltd. Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the same
CN106488941B (zh) * 2014-07-04 2019-12-10 三菱化学株式会社 树脂、感光性树脂组合物、固化物、滤色片及图像显示装置
EP3263628A1 (en) 2016-06-27 2018-01-03 Hexcel Composites Limited Particulate curing components
KR20230102201A (ko) * 2021-12-30 2023-07-07 솔루스첨단소재 주식회사 고온안정성 에폭시 수지 조성물 및 이를 포함하는 봉지재

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6063876A (en) * 1997-05-29 2000-05-16 Shell Oil Company Epoxy resin composition and epoxy resin composition for encapsulating semiconductors
TW200942093A (en) * 2007-12-12 2009-10-01 Atotech Deutschland Gmbh Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards

Family Cites Families (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018262A (en) 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
DE1495841A1 (de) * 1964-10-27 1969-04-10 Bayer Ag Verfahren zur Herstellung hochmolekularer Polycarbonate
CH571511A5 (enExample) 1972-04-21 1976-01-15 Ciba Geigy Ag
US4129488A (en) * 1976-11-08 1978-12-12 Scm Corporation Ultraviolet curable epoxy-polyester powder paints
US4638027A (en) 1982-12-27 1987-01-20 General Electric Company Polycarbonate exhibiting improved heat resistance from cycloalkylidene diphenol
US4438241A (en) 1982-12-27 1984-03-20 General Electric Company Heat resistant polyarylates
US4707534A (en) * 1986-12-09 1987-11-17 Minnesota Mining And Manufacturing Company Glycidylethers of fluorene-containing bisphenols
US4925901A (en) 1988-02-12 1990-05-15 The Dow Chemical Company Latent, curable, catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds
NO170326C (no) 1988-08-12 1992-10-07 Bayer Ag Dihydroksydifenylcykloalkaner
US5463091A (en) 1989-01-17 1995-10-31 The Dow Chemical Company Diglycidyl ether of 4,4'-dihydroxy-α-methylstilbene
EP0384940B1 (de) 1989-03-03 1994-06-22 Siemens Aktiengesellschaft Epoxidharzmischungen
ZA913801B (en) * 1990-05-21 1993-01-27 Dow Chemical Co Latent catalysts,cure-inhibited epoxy resin compositions and laminates prepared therefrom
US5135993A (en) 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
US5369192A (en) * 1993-06-28 1994-11-29 Minnesota Mining And Manufacturing Company Binder resin for resin transfer molding preforms
US5401814A (en) 1993-10-13 1995-03-28 The Dow Chemical Company Process for the preparation of thermoplastic poly(hydroxy ethers)
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
DE19539444A1 (de) 1995-10-24 1997-04-30 Bayer Ag Verfahren zur Herstellung von Bisphenolen unter Verwendung neuer Cokatalysatoren
CN1171219A (zh) 1996-07-24 1998-01-28 藤泽光男 具有装饰花纹的片料
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
GB9713526D0 (en) 1997-06-26 1997-09-03 Dow Deutschland Inc Flame retardant laminating formulations
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
US6576718B1 (en) * 1999-10-05 2003-06-10 General Electric Company Powder coating of thermosetting resin(s) and poly(phenylene ethers(s))
US6403220B1 (en) 1999-12-13 2002-06-11 The Dow Chemical Company Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
ATE308585T1 (de) 1999-12-13 2005-11-15 Dow Global Technologies Inc Feuerhemmende phosporenthaltende epoxidharzzusammensetzung
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
EP1440348A1 (en) * 2001-10-31 2004-07-28 DSM IP Assets B.V. Uv curable powder suitable for use as photoresist
DE10208743A1 (de) 2002-02-28 2003-12-11 Siemens Ag Korrosionsarme Epoxidharze und Herstellungsverfahren dazu
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
JP4698586B2 (ja) 2004-03-25 2011-06-08 株式会社Adeka 新規フェノール化合物及び該フェノール化合物から誘導し得る新規エポキシ樹脂
US20050261398A1 (en) * 2004-05-21 2005-11-24 General Electric Company Catalyst for curing epoxy resins, epoxy resin composition, and powder coating composition
CN103554184A (zh) 2004-05-28 2014-02-05 陶氏环球技术有限责任公司 可用于制造无卤素抗引燃聚合物的含磷化合物
ES2337598T3 (es) 2004-11-10 2010-04-27 Dow Global Technologies Inc. Resinas espoxi endurecidas con copolimeros de bloques anfifilicos y estratificados electricos fabricados a partir de ellas.
JP4539845B2 (ja) * 2005-03-17 2010-09-08 信越化学工業株式会社 フォトレジスト下層膜形成材料及びパターン形成方法
US8048819B2 (en) 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
WO2007075769A1 (en) * 2005-12-22 2007-07-05 Dow Global Technologies Inc. A curable epoxy resin composition and laminates made therefrom
JP2010540754A (ja) * 2007-10-05 2010-12-24 ダウ グローバル テクノロジーズ インコーポレイティド イソシアネート変性エポキシ樹脂及びそのエポキシ粉体コーティング組成物
CN101842401B (zh) 2007-10-31 2015-06-24 陶氏环球技术公司 用于熔融粘结环氧树脂应用的非烧结异氰酸酯改性环氧树脂
DE102008008841A1 (de) 2008-02-13 2009-08-20 Bayer Materialscience Ag Verfahren zur Herstellung von Polycarbonaten
JP5722636B2 (ja) * 2008-03-12 2015-05-27 ダウ グローバル テクノロジーズ エルエルシー 脂肪族炭素含有量が大きい芳香族ジシアナート化合物
EP2507325B1 (en) 2009-12-02 2014-05-21 Dow Global Technologies LLC Coating compositions
EP2507283B1 (en) 2009-12-02 2013-10-23 Dow Global Technologies LLC Epoxy resin compositions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6063876A (en) * 1997-05-29 2000-05-16 Shell Oil Company Epoxy resin composition and epoxy resin composition for encapsulating semiconductors
TW200942093A (en) * 2007-12-12 2009-10-01 Atotech Deutschland Gmbh Solid powder formulations for the preparation of resin-coated foils and their use in the manufacture of printed circuit boards

Also Published As

Publication number Publication date
US20150099831A1 (en) 2015-04-09
JP5871326B2 (ja) 2016-03-01
US20120238668A1 (en) 2012-09-20
US9340702B2 (en) 2016-05-17
US8937114B2 (en) 2015-01-20
CN102648247A (zh) 2012-08-22
CN102648247B (zh) 2015-10-14
WO2011068645A1 (en) 2011-06-09
KR20120101090A (ko) 2012-09-12
JP2013512989A (ja) 2013-04-18
TW201130875A (en) 2011-09-16
EP2507325B1 (en) 2014-05-21
EP2507325A1 (en) 2012-10-10
SG181486A1 (en) 2012-07-30

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