TWI485358B - Closure plate body inspection apparatus and method - Google Patents
Closure plate body inspection apparatus and method Download PDFInfo
- Publication number
- TWI485358B TWI485358B TW101121770A TW101121770A TWI485358B TW I485358 B TWI485358 B TW I485358B TW 101121770 A TW101121770 A TW 101121770A TW 101121770 A TW101121770 A TW 101121770A TW I485358 B TWI485358 B TW I485358B
- Authority
- TW
- Taiwan
- Prior art keywords
- inspection
- bubble
- line sensor
- bubble size
- plate
- Prior art date
Links
- 238000007689 inspection Methods 0.000 title claims description 141
- 238000000034 method Methods 0.000 title claims description 19
- 238000005286 illumination Methods 0.000 claims description 70
- 239000000853 adhesive Substances 0.000 claims description 38
- 230000001070 adhesive effect Effects 0.000 claims description 33
- 230000003287 optical effect Effects 0.000 claims description 15
- 239000006059 cover glass Substances 0.000 description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 1
- 101100189913 Caenorhabditis elegans pept-1 gene Proteins 0.000 description 1
- 241001074085 Scophthalmus aquosus Species 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
- G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8854—Grading and classifying of flaws
- G01N2021/8874—Taking dimensions of defect into account
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Textile Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011146833 | 2011-06-30 | ||
| JP2012129946A JP6032696B2 (ja) | 2011-06-30 | 2012-06-07 | 貼り合せ板状体検査装置及び方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201305527A TW201305527A (zh) | 2013-02-01 |
| TWI485358B true TWI485358B (zh) | 2015-05-21 |
Family
ID=47789012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101121770A TWI485358B (zh) | 2011-06-30 | 2012-06-18 | Closure plate body inspection apparatus and method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6032696B2 (enExample) |
| KR (1) | KR101374440B1 (enExample) |
| TW (1) | TWI485358B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017224670A (ja) * | 2016-06-14 | 2017-12-21 | 株式会社ディスコ | 保護部材形成装置 |
| JP7137439B2 (ja) * | 2018-11-02 | 2022-09-14 | 株式会社安永 | 検査装置、検査方法、及び検査プログラム |
| TWI779268B (zh) | 2019-02-28 | 2022-10-01 | 日商Ｉｈｉ股份有限公司 | 超音波探傷裝置 |
| JP7709877B2 (ja) * | 2021-09-15 | 2025-07-17 | 株式会社Ｓｃｒｅｅｎホールディングス | 端部状態確認装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06323956A (ja) * | 1993-03-19 | 1994-11-25 | Olympus Optical Co Ltd | プリズム異物検出方法 |
| TW583389B (en) * | 2002-01-10 | 2004-04-11 | Omron Tateisi Electronics Co | A surface conduction examination method and a substrate examination device |
| TWI277719B (en) * | 2005-08-03 | 2007-04-01 | Chi-Cheng Ye | Image inspection method and structure for attachment machine |
| TWI289658B (en) * | 2005-06-01 | 2007-11-11 | Tecnos Co Ltd | Substrate inspection device and inspection method |
| JP4581424B2 (ja) * | 2004-02-24 | 2010-11-17 | パナソニック電工株式会社 | 外観検査方法及び画像処理装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH055710A (ja) * | 1991-06-18 | 1993-01-14 | Fuji Electric Co Ltd | 瓶口天面の外観検査における２値化用しきい値の決定方法 |
| JP3332096B2 (ja) * | 1992-11-17 | 2002-10-07 | 株式会社東芝 | 欠陥検査方法および装置 |
| JPH08189903A (ja) * | 1995-01-10 | 1996-07-23 | Sekisui Chem Co Ltd | 気泡検査装置 |
| JPH08285789A (ja) * | 1995-04-18 | 1996-11-01 | Nippon Sheet Glass Co Ltd | 欠点検出方法における２値化レベルの決定方法 |
| JP3048342B2 (ja) * | 1997-08-19 | 2000-06-05 | 三菱化学株式会社 | 透明板中の気泡検出装置 |
| JP4044770B2 (ja) | 2002-02-22 | 2008-02-06 | 芝浦メカトロニクス株式会社 | 基板貼合装置および基板貼合方法 |
| JP2004170329A (ja) * | 2002-11-22 | 2004-06-17 | Nippon Steel Corp | バンプ電極およびバンプ電極用ボール検査方法 |
| JP2004257776A (ja) | 2003-02-25 | 2004-09-16 | Kiyousera Opt Kk | 光透過体検査装置 |
-
2012
- 2012-06-07 JP JP2012129946A patent/JP6032696B2/ja not_active Expired - Fee Related
- 2012-06-13 KR KR1020120063026A patent/KR101374440B1/ko not_active Expired - Fee Related
- 2012-06-18 TW TW101121770A patent/TWI485358B/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06323956A (ja) * | 1993-03-19 | 1994-11-25 | Olympus Optical Co Ltd | プリズム異物検出方法 |
| TW583389B (en) * | 2002-01-10 | 2004-04-11 | Omron Tateisi Electronics Co | A surface conduction examination method and a substrate examination device |
| JP4581424B2 (ja) * | 2004-02-24 | 2010-11-17 | パナソニック電工株式会社 | 外観検査方法及び画像処理装置 |
| TWI289658B (en) * | 2005-06-01 | 2007-11-11 | Tecnos Co Ltd | Substrate inspection device and inspection method |
| TWI277719B (en) * | 2005-08-03 | 2007-04-01 | Chi-Cheng Ye | Image inspection method and structure for attachment machine |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201305527A (zh) | 2013-02-01 |
| KR20130004079A (ko) | 2013-01-09 |
| JP2013033028A (ja) | 2013-02-14 |
| KR101374440B1 (ko) | 2014-03-17 |
| JP6032696B2 (ja) | 2016-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |