TWI485358B - Closure plate body inspection apparatus and method - Google Patents

Closure plate body inspection apparatus and method Download PDF

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TWI485358B
TWI485358B TW101121770A TW101121770A TWI485358B TW I485358 B TWI485358 B TW I485358B TW 101121770 A TW101121770 A TW 101121770A TW 101121770 A TW101121770 A TW 101121770A TW I485358 B TWI485358 B TW I485358B
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inspection
bubble
line sensor
bubble size
plate
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TW201305527A (en
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Yoshinori Hayashi
Hiroshi Wakaba
Osamu Izutsu
Katsutoshi Seki
Yoko Ono
Takanori Gondo
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Shibaura Mechatronics Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958Inspecting transparent materials or objects, e.g. windscreens
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/89Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8874Taking dimensions of defect into account

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  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
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  • Analytical Chemistry (AREA)
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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Description

貼合板狀體檢查裝置及方法Laminated plate inspection device and method 技術領域Technical field

本發明係有關於貼合板狀體檢查裝置及方法,其係根據拍攝貼合板狀體而獲得之檢查圖像資訊,進行關於接著劑中的氣泡之檢查,且前述貼合板狀體係構成為藉由前述接著劑,貼合2片具有透光性之板狀體。The present invention relates to a laminated plate-shaped object inspection apparatus and method for performing inspection of air bubbles in an adhesive agent based on inspection image information obtained by photographing a laminated plate-like body, and the laminated plate-like system is configured by The above-mentioned adhesive agent bonded two sheets of a light-transmitting plate-like body.

背景技術Background technique

以往,已知的是專利文獻1所揭示之氣泡檢查裝置。該氣泡檢查裝置係進行關於以下結構之被檢查體(貼合板狀體)中的糊中的氣泡之檢查,即:將業已於其中一面塗佈前述糊(接著劑)之透明偏光膜(板狀體),藉由該糊黏貼於玻璃基板(板狀體)者。具體而言,照明裝置及CCD攝影機係配置成與被檢查體之偏光膜對向,且於藉由照明裝置進行照明之狀態下,CCD攝影機係自偏光膜側拍攝被檢查體。又,輸出自CCD攝影機之影像信號係以預定之臨限值二值化。在糊中的氣泡之表面,來自照明裝置之光會反射,因此,於利用藉由前述二值化而獲得之影像資料來表示的圖像中,氣泡部分全面可明亮地觀察。又,於該圖像上全面明亮地表示之氣泡部分之面積係作成對應的氣泡之形狀特徵量來計測。Conventionally, a bubble inspection device disclosed in Patent Document 1 is known. This bubble inspection device performs inspection of bubbles in the paste in the test object (bonded plate-like body) having the following structure, that is, a transparent polarizing film (plate shape) on which one side of the paste (adhesive) is applied The body is adhered to the glass substrate (plate-like body) by the paste. Specifically, the illuminating device and the CCD camera are disposed to face the polarizing film of the object to be inspected, and the CCD camera photographs the object to be inspected from the side of the polarizing film while being illuminated by the illuminating device. Further, the image signal output from the CCD camera is binarized with a predetermined threshold value. In the surface of the bubble in the paste, the light from the illumination device is reflected. Therefore, in the image represented by the image data obtained by the binarization described above, the bubble portion is completely brightly observed. Further, the area of the bubble portion which is fully brightly displayed on the image is measured by the shape feature amount of the corresponding bubble.

先行技術文獻Advanced technical literature 專利文獻Patent literature

[專利文獻1]日本專利公開公報特開平8-189903號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. Hei 8-189903

發明概要Summary of invention

在如前述般的習知氣泡檢查裝置中,由於將來自CCD攝影機之影像信號以預定之臨限值二值化,藉此,生成影像資料,因此,於影像信號中以低於前述臨限值之水平的水平來表現的氣泡並無法進行檢測。舉例言之,未在CCD攝影機之焦點位置及其附近的氣泡會無法鮮明地拍攝,且於影像信號中以低於前述臨限值之水平的水平來表示。故,無法以良好之精度,檢測散佈在接著劑(糊)中的多數氣泡。In the conventional bubble inspection device as described above, since the image signal from the CCD camera is binarized by a predetermined threshold value, image data is generated, and therefore, the image signal is lower than the aforementioned threshold value. Bubbles at the level of the level are not detected. For example, bubbles that are not in the focus position of the CCD camera and in the vicinity thereof may not be vividly captured, and are represented in the image signal at a level lower than the aforementioned threshold level. Therefore, it is impossible to detect many bubbles dispersed in the adhesive (paste) with good precision.

本發明係有鑑於此種情形而作成,並提供可獲得以下資訊之貼合板狀體檢查裝置及方法,即:可針對散佈在接著2個具有透光性之板狀體之接著劑中的多數氣泡,以良好之精度表示其尺寸者。The present invention has been made in view of such circumstances, and provides a laminated plate-shaped inspection apparatus and method capable of obtaining the following information, that is, a majority of an adhesive which is spread over two subsequent light-transmissive plate-like bodies Bubbles, whose size is expressed with good precision.

有關本發明之貼合板狀體檢查裝置係構成以下構造,即:根據拍攝貼合板狀體而獲得之檢查圖像資訊,進行關於接著劑中的氣泡之檢查,且前述貼合板狀體係構成為藉由前述接著劑,貼合2片具有透光性之板狀體者,又,前述貼合板狀體檢查裝置包含有:線感測器攝影機,係配置成與前述貼合板狀體之其中一者之板狀體對向者; 照明機構,係自前述貼合板狀體之另一者之板狀體側,朝前述線感測器攝影機照明者;及處理單元,係處理於藉由前述照明機構進行照明之狀態下前述線感測器攝影機掃描前述貼合板狀體時自該線感測器攝影機輸出之影像信號者;前述處理單元具有檢查圖像資訊生成機構,且該檢查圖像資訊生成機構係根據來自前述線感測器攝影機之影像信號,生成由像素單位之濃淡值所構成的檢查圖像資訊,又,前述照明機構及前述線感測器攝影機之光學條件係調整為在利用由前述像素單位之濃淡值所構成的前述檢查圖像資訊來表示的檢查圖像中,氣泡部分係於明亮背景中以暗環來表現,而前述處理單元更具有氣泡尺寸資訊生成機構,且該氣泡尺寸資訊生成機構係從獲得自前述檢查圖像資訊之將前述暗環橫切的方向之濃淡值剖面,根據對應於前述暗環之2個暗部間於前述檢查圖像上之距離,生成表示氣泡之尺寸的氣泡尺寸資訊作為檢查結果資訊。The laminated plate-shaped object inspection apparatus according to the present invention is configured to perform inspection of air bubbles in an adhesive agent based on inspection image information obtained by photographing a laminated plate-like body, and the laminated plate-like system is configured to borrow In the above-mentioned adhesive, two sheets having a light-transmissive plate-like body are bonded, and the laminated plate-shaped object inspection device includes a line sensor camera that is disposed in one of the bonded plate-shaped bodies. The opposite of the plate body; The illuminating mechanism is configured to illuminate the line sensor camera from the side of the plate-like body of the other of the bonded plate-like bodies; and the processing unit is configured to process the line sense in a state of being illuminated by the illumination mechanism The detector camera scans the image signal output from the line sensor camera when the plate body is pasted; the processing unit has an inspection image information generating mechanism, and the inspection image information generating mechanism is based on the line sensor from the line sensor The image signal of the camera generates inspection image information composed of the gradation value of the pixel unit, and the optical conditions of the illumination mechanism and the line sensor camera are adjusted to use the gradation value of the pixel unit In the inspection image indicated by the inspection image information, the bubble portion is represented by a dark ring in a bright background, and the processing unit further has a bubble size information generating mechanism, and the bubble size information generating mechanism is obtained from the foregoing Checking the image information for the gradation value of the direction in which the dark ring is transversely cut, according to the two dark portions corresponding to the aforementioned dark ring On the aforementioned inspection image, the bubble size information indicating the size of the bubble is generated as the inspection result information.

又,有關本發明之貼合板狀體檢查方法係構成以下構造,即:使用貼合板狀體檢查裝置,進行關於接著劑中的氣泡之檢查,且前述貼合板狀體檢查裝置包含有:線感測器攝影機,係配置成與構成為藉由前述接著劑貼合2片具有透光性之板狀體的貼合板狀體之其中一者之板狀體對向者;照明機構,係自前述貼合板狀體之另一者之板狀體側,朝前述線感測器攝影機照明者;及處理單元,係處理於藉由前述照明機構進行照明之狀態下前述線感測器攝影機掃描前述貼合板狀體時自該線感測器攝影機輸出之影像 信號者;前述貼合板狀體檢查方法具有檢查圖像資訊生成步驟,且該檢查圖像資訊生成步驟係前述處理單元根據來自前述線感測器攝影機之影像信號,生成由像素單位之濃淡值所構成的檢查圖像資訊,又,前述照明機構及前述線感測器攝影機之光學條件係調整為在利用由前述像素單位之濃淡值所構成的前述檢查圖像資訊來表示的檢查圖像中,氣泡部分係於明亮背景中以暗環來表現,而前述貼合板狀體檢查方法更具有氣泡尺寸資訊生成步驟,且該氣泡尺寸資訊生成步驟係前述處理單元更進一步從獲得自前述檢查圖像資訊之將前述暗環橫切的方向之濃淡值剖面,根據對應於前述暗環之2個暗部間之距離,生成表示氣泡之尺寸的氣泡尺寸資訊作為檢查結果資訊。Moreover, the laminated plate-shaped object inspection method according to the present invention has a structure in which an inspection of bubbles in an adhesive is performed using a bonded plate-shaped inspection device, and the bonded plate-shaped inspection device includes a line sense. The detector camera is disposed in a plate-like body opposite to one of the bonded plate-like members configured to bond two sheets of the light-transmissive plate-like body by the above-mentioned adhesive; the illumination mechanism is from the foregoing a plate-like body side of the other of the plate-shaped body, facing the line sensor camera illuminator; and a processing unit for processing the line sensor camera to scan the sticker in a state of being illuminated by the illumination mechanism Image output from the line sensor camera when the plate is folded a signal detecting unit having the inspection image information generating step, wherein the inspection image information generating step is performed by the processing unit generating the gradation value of the pixel unit according to the image signal from the line sensor camera In the inspection image information of the configuration, the optical conditions of the illumination unit and the line sensor camera are adjusted to be in an inspection image represented by the inspection image information composed of the gradation values of the pixel units. The bubble portion is represented by a dark ring in a bright background, and the above-mentioned laminated plate inspection method further has a bubble size information generating step, and the bubble size information generating step is further obtained from the aforementioned inspection image information by the processing unit. The gradation value cross section in the direction in which the dark ring is transversely cut generates bubble size information indicating the size of the bubble as the inspection result information based on the distance between the two dark portions corresponding to the dark ring.

若藉由該等有關本發明之貼合板狀體檢查裝置及方法,則可獲得以下資訊,即:可針對存在於接著2個具有透光性之板狀體之接著劑中的多數氣泡,以良好之精度表示其尺寸者。According to the laminated plate-like inspection apparatus and method according to the present invention, it is possible to obtain information on a plurality of bubbles existing in the adhesive agent of the two light-transmissive plate-like bodies. Good precision indicates its size.

圖式簡單說明Simple illustration

第1A圖係顯示屬於貼合板狀體之一例的感測器面板組件之結構截面圖。Fig. 1A is a structural sectional view showing a sensor panel assembly which is an example of a laminated plate-like body.

第1B圖係顯示屬於貼合板狀體之一例的感測器面板組件之結構平面圖。Fig. 1B is a plan view showing the structure of a sensor panel assembly which is an example of a laminated plate-like body.

第1C圖係顯示藉由接著劑貼合第1A及1B圖所示之感測器面板組件與液晶面板組件之結構的觸碰面板式液晶顯 示面板之結構截面圖。FIG. 1C shows a touch panel type liquid crystal display in which the structure of the sensor panel assembly and the liquid crystal panel assembly shown in FIGS. 1A and 1B is adhered by an adhesive. A structural sectional view of the display panel.

第2圖係放大顯示感測器面板組件之截面之放大截面圖。Figure 2 is an enlarged cross-sectional view showing a section of the sensor panel assembly in an enlarged manner.

第3A圖係顯示自有關本發明之實施一形態之貼合板狀體檢查裝置(感測器面板組件檢查裝置)之側方觀看的基本構造圖。Fig. 3A is a view showing a basic configuration of a side view of a laminated plate-shaped inspection device (sensor panel assembly inspection device) according to an embodiment of the present invention.

第3B圖係顯示自有關本發明之實施一形態之貼合板狀體檢查裝置(感測器面板組件檢查裝置)之上方觀看的基本構造圖。Fig. 3B is a view showing a basic configuration seen from above the laminated plate-shaped inspection device (sensor panel assembly inspection device) according to the embodiment of the present invention.

第4A圖係顯示線感測器攝影機與照明單元之關係圖(其1)。Figure 4A shows a diagram of the relationship between the line sensor camera and the lighting unit (1).

第4B圖係顯示線感測器攝影機與照明單元之關係圖(其2)。Figure 4B shows a diagram of the relationship between the line sensor camera and the lighting unit (2).

第5圖係顯示有關本發明之實施一形態之貼合板狀體檢查裝置(感測器面板組件檢查裝置)之處理系統的基本構造圖。Fig. 5 is a view showing a basic configuration of a processing system of a laminated plate-shaped inspection device (sensor panel assembly inspection device) according to an embodiment of the present invention.

第6圖係顯示有關氣泡尺寸資訊之生成之處理順序之流程圖。Figure 6 is a flow chart showing the processing sequence for generating bubble size information.

第7圖係顯示於感測器面板組件中前進的來自照明單元之照明光與該照明光於反射板之反射光之狀態(其1)圖。Fig. 7 is a view showing a state (1) of the illumination light from the illumination unit and the reflected light of the illumination light on the reflection plate which are advanced in the sensor panel assembly.

第8圖係顯示於感測器面板組件中前進的來自照明單元之照明光與該照明光於反射板之反射光之狀態(其2)圖。Fig. 8 is a view showing a state (2) of the illumination light from the illumination unit and the reflected light of the illumination light on the reflection plate which are advanced in the sensor panel assembly.

第9圖係顯示於感測器面板組件中前進的來自照明單元之照明光與該照明光於反射板之反射光之狀態(其3)圖。Fig. 9 is a view showing a state (3) of the illumination light from the illumination unit and the reflected light of the illumination light on the reflection plate which are advanced in the sensor panel assembly.

第10圖係顯示包含氣泡部分(暗環)之檢查圖像之一例 之圖。Figure 10 shows an example of an inspection image containing a bubble portion (dark ring). Picture.

第11A圖係顯示表示包含於檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係(其1)圖。Fig. 11A is a view showing a relationship (1) between the dark ring of the bubble portion included in the inspection image and the gradation value profile in the direction (main scanning direction) in which the dark ring is transversely cut.

第11B圖係顯示表示包含於檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係(其2)圖。Fig. 11B is a view showing a relationship (2) between the dark ring of the bubble portion included in the inspection image and the gradation value profile in the direction (main scanning direction) in which the dark ring is transversely cut.

第11C圖係顯示表示包含於檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係(其3)圖。Fig. 11C is a view showing a relationship (3) between the dark ring of the bubble portion included in the inspection image and the gradation value profile in the direction (main scanning direction) in which the dark ring is transversely cut.

第12圖係顯示於接著劑中位於線感測器攝影機之焦點位置的氣泡及位於焦點位置之前後的氣泡例之截面圖。Fig. 12 is a cross-sectional view showing an example of a bubble which is located at a focus position of the line sensor camera in the adhesive and a bubble which is located before the focus position.

第13A圖係顯示表示對應於位於線感測器攝影機之焦點位置跟前的氣泡之檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係圖。Fig. 13A is a view showing the relationship between the dark ring of the bubble portion corresponding to the inspection image of the bubble located at the focus position of the line sensor camera and the gradation value of the direction (main scanning direction) transverse to the dark ring. Figure.

第13B圖係顯示表示對應於位於線感測器攝影機之焦點位置的氣泡之檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係圖。Fig. 13B is a diagram showing the relationship between the dark ring of the bubble portion corresponding to the inspection image of the bubble located at the focus position of the line sensor camera and the gradation value of the direction (main scanning direction) transverse to the dark ring. .

第13C圖係顯示表示對應於位於比線感測器攝影機之焦點位置後方的氣泡之檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係圖。Fig. 13C is a view showing a condensed value of a dark ring corresponding to a bubble portion of an inspection image of a bubble located behind a focus position of a line sensor camera and a direction (main scanning direction) transverse to the dark ring relation chart.

第14圖係顯示求取自將表示氣泡部分之暗環橫切的主掃描方向之濃淡值剖面的氣泡尺寸與求取自將該暗環橫切的副掃描方向之濃淡值剖面的氣泡尺寸之關係相關圖。Fig. 14 is a view showing the bubble size of the gradation value section in the main scanning direction in which the dark ring of the bubble portion is transversely cut, and the bubble size of the gradation value section obtained from the sub-scanning direction transverse to the dark ring. Relationship correlation diagram.

第15圖係顯示自將對應於檢查圖像中的氣泡部分之暗環橫切的方向之濃淡值剖面,測量對應於前述暗環之2個暗部間於前述檢查圖像上之距離的方法之另一例之圖。Fig. 15 is a view showing a method of measuring a gradation value from a direction transverse to a dark ring of a bubble portion in an inspection image, and measuring a distance corresponding to a distance between two dark portions of the dark ring on the inspection image. A picture of another example.

用以實施發明之形態Form for implementing the invention

以下,使用圖式,說明本發明之實施形態。Hereinafter, embodiments of the present invention will be described using the drawings.

參照第1A至1C圖,說明構成檢查對象的貼合板狀體之一例。該例係使用在觸碰面板式液晶顯示面板的感測器面板組件。另,第1A圖係顯示感測器面板組件10之結構截面圖,第1B圖係顯示感測器面板組件10之結構平面圖,第1C圖係顯示藉由接著劑貼合感測器面板組件10與液晶面板組件20之結構的觸碰面板式液晶顯示面板之結構截面圖。An example of a laminated plate-like body constituting an inspection object will be described with reference to Figs. 1A to 1C. This example uses a sensor panel assembly that touches a panel type liquid crystal display panel. 1A is a cross-sectional view showing the structure of the sensor panel assembly 10, FIG. 1B is a plan view showing the structure of the sensor panel assembly 10, and FIG. 1C is a view showing the sensor panel assembly 10 being bonded by an adhesive. A structural cross-sectional view of a touch panel type liquid crystal display panel having a structure of the liquid crystal panel assembly 20.

於第1A及1B圖中,該感測器面板組件10係構成以下結構,即:業已排列形成感測器元件或柵極等之電路零件的感測器面板11(板狀體)與蓋玻璃12(板狀體)係藉由業已塗佈於該感測器面板11之全面且具有透光性之接著劑13(樹脂)來貼合者。感測器面板11係構成於玻璃基板上形成電路零件之結構,並構成全體具有透光性之透光領域(不過,電路零件之部分為不透光)。又,蓋玻璃12係周邊部構成預定寬度之不透光領域12b(黑色領域),其內側之領域則構成具有透光性之透光領域12a。In FIGS. 1A and 1B, the sensor panel assembly 10 is configured to be a sensor panel 11 (plate-like body) and a cover glass in which circuit components such as a sensor element or a gate are arranged. 12 (plate-shaped body) is attached by a total of light-transmitting adhesive 13 (resin) which has been applied to the sensor panel 11. The sensor panel 11 is configured to form a circuit component on a glass substrate, and constitutes a light transmissive field (although part of the circuit component is opaque). Further, the peripheral portion of the cover glass 12 constitutes an opaque region 12b (black field) having a predetermined width, and the inner region of the cover glass 12 constitutes a light-transmitting region 12a having a light transmissive property.

如第1C圖所示,此種結構之感測器面板組件10係藉由具有透光性之接著劑15,接著於液晶面板組件20(藉 由液晶面板、濾色器、偏光板等所構成)。於依此所形成的觸碰面板式液晶顯示面板中,藉由液晶面板組件20進行圖像顯示,同時自對應於用手指觸碰的蓋玻璃12上之位置之感測器面板11上的感測器元件輸出信號。又,藉由自該感測器面板11之各感測器元件輸出的信號,可控制利用液晶面板組件20來進行的圖像顯示。As shown in FIG. 1C, the sensor panel assembly 10 of such a structure is bonded to the liquid crystal panel assembly 20 by a light transmissive adhesive 15 It consists of a liquid crystal panel, a color filter, a polarizing plate, etc.). In the touch panel type liquid crystal display panel formed thereby, image display by the liquid crystal panel assembly 20 while sensing from the sensor panel 11 corresponding to the position on the cover glass 12 touched with a finger The device outputs a signal. Moreover, image display by the liquid crystal panel assembly 20 can be controlled by signals output from the respective sensor elements of the sensor panel 11.

在製造如前述般的結構之感測器面板組件10(貼合板狀體)之過程中,舉例言之,如第2圖所示,有時會在接著劑13內發生氣泡BL。關於依此在接著劑13中產生的氣泡BL之檢查裝置,即,感測器面板組件檢查裝置係例如構成如第3A及3B圖所示。另,第3A圖係顯示自感測器面板組件檢查裝置之側方觀看的基本構造,第3B圖係顯示自感測器面板組件檢查裝置之上方觀看的基本構造。In the process of manufacturing the sensor panel assembly 10 (bonding plate-like body) having the structure as described above, for example, as shown in Fig. 2, the bubble BL may be generated in the adhesive 13 in some cases. The inspection device for the bubble BL generated in the adhesive 13 in accordance with this, that is, the sensor panel assembly inspection device is constructed, for example, as shown in FIGS. 3A and 3B. In addition, the 3A diagram shows the basic configuration viewed from the side of the sensor panel assembly inspection device, and the 3B diagram shows the basic configuration viewed from above the sensor panel assembly inspection device.

於第3A及3B圖中,該感測器面板組件檢查裝置包含有:線感測器攝影機50、照明單元51、反射板52(照明機構)及移動機構60。移動機構60係以預定速度,使感測器面板組件10直線移動,且該感測器面板組件10係分別將感測器面板11朝向上方,將蓋玻璃12朝向下方而設置在移動路徑上。線感測器攝影機50係包含例如藉由CCD元件列所構成的線感測器50a及透鏡群(可包含用以擴展視野之放大透鏡)等之光學系統(省略圖示),並固定配置成與移動路徑上的感測器面板組件10之感測器面板11對向。又,線感測器攝影機50之姿勢係調整為線感測器50a之延伸方向將感測器面板組件10之移動方向A橫切(例如與移動方向A呈正 交),且其光軸AOPT1 與感測器面板組件10(感測器面板11)之表面正交。反射板52係具有業已加工成將入射光擴散反射之反射面,且於移動路徑上的感測器面板組件10之附近,固定配置成其反射面與感測器面板組件10之蓋玻璃12對向。藉由於依此所配置的反射板52(反射面)之反射光(照明光),自感測器面板組件10之蓋玻璃12側,朝線感測器攝影機50進行照明。In the 3A and 3B drawings, the sensor panel assembly inspection device includes a line sensor camera 50, a lighting unit 51, a reflector 52 (illumination mechanism), and a moving mechanism 60. The moving mechanism 60 linearly moves the sensor panel assembly 10 at a predetermined speed, and the sensor panel assembly 10 is disposed on the moving path with the sensor panel 11 facing upward and the cover glass 12 facing downward. The line sensor camera 50 includes, for example, an optical system (not shown) including a line sensor 50a and a lens group (which may include a magnifying lens for expanding a field of view) constituted by a CCD element array, and is fixedly arranged Opposite the sensor panel 11 of the sensor panel assembly 10 on the moving path. Moreover, the posture of the line sensor camera 50 is adjusted such that the direction of extension of the line sensor 50a crosses the moving direction A of the sensor panel assembly 10 (for example, orthogonal to the moving direction A), and its optical axis A The OPT 1 is orthogonal to the surface of the sensor panel assembly 10 (sensor panel 11). The reflector 52 has a reflective surface that has been processed to diffuse and reflect incident light, and is disposed in the vicinity of the sensor panel assembly 10 on the moving path, and is fixedly disposed with its reflective surface and the cover glass 12 of the sensor panel assembly 10. to. The reflected light (illumination light) of the reflecting plate 52 (reflecting surface) thus arranged is illuminated from the side of the cover glass 12 of the sensor panel assembly 10 toward the line sensor camera 50.

照明單元51係於移動路徑上的感測器面板組件10之移動方向A中的線感測器攝影機50之下游側,即,後述線感測器攝影機50之掃描方向B中的該線感測器攝影機50之上游側,配置成與感測器面板11對向。照明單元51之姿勢係調整為自感測器面板組件10之斜上方,具體而言,自相對於感測器面板組件10(感測器面板11)之表面之法線方向,其光軸AOPT2 構成預定角度α之方向,照明感測器面板組件10之表面,且不會橫切線感測器攝影機50之光軸AOPT1 。又,如第4A及4B圖所示,照明單元51係就預定距離,朝感測器面板組件10之移動方向A之下游側(線感測器攝影機50之掃描方向B之上游側),遠離感測器面板組件10之表面中的線感測器攝影機50之拍攝線Lc,並照射朝沿著該拍攝線Lc之方向延伸的預定領域(以下稱作照明領域)EL 。利用照明單元51於感測器面板組件10之表面的前述照明領域EL 位於與前述感測器面板組件10之移動方向A正交之方向中的中央之照明線LL 與線感測器攝影機50於感測器面板組件10之表面的前述拍攝線Lc係維持為預定間隔,且前述照明 領域EL 並未重疊於線感測器攝影機50之前述拍攝領域EC (未包含)。The illumination unit 51 is attached to the downstream side of the line sensor camera 50 in the moving direction A of the sensor panel assembly 10 on the moving path, that is, the line sensing in the scanning direction B of the line sensor camera 50 described later. The upstream side of the camera 50 is disposed to face the sensor panel 11. The posture of the illumination unit 51 is adjusted to be obliquely above the self-sensor panel assembly 10, specifically, from the normal direction with respect to the surface of the sensor panel assembly 10 (sensor panel 11), its optical axis A The OPT 2 forms the direction of the predetermined angle a, illuminating the surface of the sensor panel assembly 10 and does not traverse the optical axis A OPT1 of the line sensor camera 50. Further, as shown in FIGS. 4A and 4B, the illumination unit 51 is at a predetermined distance toward the downstream side of the moving direction A of the sensor panel assembly 10 (the upstream side of the scanning direction B of the line sensor camera 50), away from The photographing line Lc of the line sensor camera 50 in the surface of the sensor panel assembly 10 illuminates a predetermined area (hereinafter referred to as an illumination field) E L extending in the direction along the photographing line Lc. By the illumination unit 51 in the lighting field E L of the surface of the sensor panel assembly 10 located in the center of the illumination line perpendicular to a direction of the moving direction of the panel assembly 10 of the sensor A and the line sensor camera L L The aforementioned photographing line Lc on the surface of the sensor panel assembly 10 is maintained at a predetermined interval, and the aforementioned illumination area E L does not overlap the aforementioned photographing area E C (not included) of the line sensor camera 50.

在如前述般的結構之感測器面板組件檢查裝置中,感測器面板組件10係藉由移動機構60,於移動路徑上朝方向A移動,藉此,維持線感測器攝影機50與照明單元51之相對位置關係,且線感測器攝影機50係朝與前述移動方向A呈相反之方向B,以光學方式掃描感測器面板組件10。藉由該掃描,進行利用線感測器攝影機50來進行的感測器面板組件10之拍攝。另,由於線感測器50a之長度之制約而無法藉由線感測器攝影機50一次朝方向B之掃描來掃描感測器面板組件10之全面時,使拍攝領域EC 朝與掃描方向B呈正交之方向階段地移動,並藉由複數次掃描,進行關於感測器面板組件10之全面之拍攝。In the sensor panel assembly inspection device of the foregoing structure, the sensor panel assembly 10 is moved in the direction A on the moving path by the moving mechanism 60, thereby maintaining the line sensor camera 50 and illumination The relative positional relationship of the units 51, and the line sensor camera 50 optically scans the sensor panel assembly 10 in a direction B opposite to the aforementioned moving direction A. By this scanning, photographing of the sensor panel assembly 10 by the line sensor camera 50 is performed. In addition, due to the limitation of the length of the line sensor 50a, the entire area of the sensor panel assembly 10 cannot be scanned by the line sensor camera 50 scanning in the direction B at one time, so that the shooting area E C is directed to the scanning direction B. The phase is moved in an orthogonal direction, and a full shot of the sensor panel assembly 10 is performed by a plurality of scans.

感測器面板組件檢查裝置之處理系統係構成如第5圖所示。The processing system of the sensor panel assembly inspection device is constructed as shown in Fig. 5.

於第5圖中,線感測器攝影機50、顯示單元71及操作單元72係與處理單元70連接。又,處理單元70係根據來自與利用移動機構60來進行的感測器面板組件10之移動同步而以光學方式掃描感測器面板組件10的線感測器攝影機50之影像信號,生成表示感測器面板組件10之圖像(檢查圖像)的檢查圖像資訊。即,處理單元70係具有檢查圖像資訊生成機構,且該檢查圖像資訊生成機構係根據來自線感測器攝影機50之影像信號,生成檢查圖像資訊。又,處理單元70係根據前述檢查圖像資訊,使感測器面板組件10之 檢查圖像顯示於顯示單元71。於該檢查圖像可顯現感測器面板11之電路零件或感測器面板組件10之接著劑13中的異物,進而是接著劑13之緣端部以及如後述般接著劑13中的氣泡。另,處理單元70可取得有關因應操作單元72之操作的各種指示之資訊,同時自前述檢查圖像生成各種資訊(氣泡或異物之尺寸、接著劑13之緣端部之位置等),並將其作成檢查結果資訊而顯示於顯示單元71。In FIG. 5, the line sensor camera 50, the display unit 71, and the operation unit 72 are connected to the processing unit 70. Moreover, the processing unit 70 generates an image sense by optically scanning the image signal of the line sensor camera 50 of the sensor panel assembly 10 in synchronization with the movement of the sensor panel assembly 10 by the moving mechanism 60. The inspection image information of the image (inspection image) of the detector panel assembly 10. That is, the processing unit 70 has an inspection image information generating mechanism that generates inspection image information based on the image signal from the line sensor camera 50. Moreover, the processing unit 70 causes the sensor panel assembly 10 to perform the inspection image information according to the foregoing The inspection image is displayed on the display unit 71. The inspection image can reveal the foreign matter in the circuit component of the sensor panel 11 or the adhesive 13 of the sensor panel assembly 10, and further the edge of the adhesive 13 and the air bubbles in the adhesive 13 as will be described later. In addition, the processing unit 70 can obtain information about various instructions in response to the operation of the operating unit 72, and generate various information (the size of the bubble or foreign matter, the position of the edge of the adhesive 13, etc.) from the aforementioned inspection image, and It is displayed on the display unit 71 as the inspection result information.

處理單元70係依據第6圖所示之順序,實行用以檢測存在於感測器面板組件10之接著劑13中的氣泡之尺寸之處理。The processing unit 70 performs a process for detecting the size of the air bubbles present in the adhesive 13 of the sensor panel assembly 10 in the order shown in FIG.

於第6圖中,處理單元70係控制成於進行來自照明單元51之照明之狀態下,藉由移動機構60使感測器面板組件10移動,且線感測器攝影機50係以光學方式掃描感測器面板組件10(S11)。於該過程中,在移動線感測器攝影機50之拍攝領域EC 對應於蓋玻璃12之透光領域12a之部分時,以預定角度α傾斜地入射至感測器面板11之表面(參照第3A圖)來自照明單元51之照明光RL1 係例如像是第7至9圖所示,於感測器面板11(透光領域)、接著劑13及蓋玻璃12(透光領域12a)內折射並通過而到達反射板52。又,該照明光RL1 係於反射板52擴散反射,且其反射光之一部分係作成照明光RL2 而自感測器面板組件10之蓋玻璃12(透光領域12a)側朝線感測器攝影機50前進。依此,線感測器攝影機50係於進行利用照明單元51之來自感測器面板11側之照明(照明光RL1 )與利用反射板52之來自蓋玻璃12側之照明(照明光 RL2 )之狀態下,掃描感測器面板組件10。In FIG. 6, the processing unit 70 is controlled to move the sensor panel assembly 10 by the moving mechanism 60 in a state where illumination from the illumination unit 51 is performed, and the line sensor camera 50 is optically scanned. Sensor panel assembly 10 (S11). In the process, when the photographing area E C of the moving line sensor camera 50 corresponds to a portion of the light transmitting region 12a of the cover glass 12, it is obliquely incident on the surface of the sensor panel 11 at a predetermined angle α (refer to the third aspect). The illumination light R L1 from the illumination unit 51 is refracted in the sensor panel 11 (transparent field), the adhesive 13 and the cover glass 12 (transparent field 12a), for example, as shown in FIGS. 7 to 9. And pass through to the reflector 52. Moreover, the illumination light R L1 is diffused and reflected by the reflection plate 52, and a part of the reflected light is made into the illumination light R L2 and is sensed from the side cover glass 12 (light transmission field 12a) of the sensor panel assembly 10 Camera 50 advances. Accordingly, the line sensor camera 50 is configured to perform illumination (illumination light R L1 ) from the side of the sensor panel 11 using the illumination unit 51 and illumination from the side of the cover glass 12 by the reflection plate 52 (illumination light R L2 ) In the state of the sensor panel assembly 10 is scanned.

於前述掃描之過程中,舉例言之,如第7圖所示,若來自反射板52之前述照明光RL2 (反射光)係於感測器面板組件10中的接著劑13無氣泡BL之部分前進,則會直接通過感測器面板11而入射至線感測器攝影機50。舉例言之,如第8圖所示,若利用反射板52之前述照明光RL2 係穿過接著劑13中的氣泡BL之外表部,則該照明光RL2 會藉由於氣泡BL之外表部之折射或散射(例如米氏散射)而無法充分地入射至線感測器攝影機50。舉例言之,如第9圖所示,若照明光RL2 係穿過氣泡BL之中央部,則該照明光RL2 會散射(例如布里元散射),且可入射至線感測器攝影機50。In the foregoing scanning process, as an example, as shown in FIG. 7, if the illumination light R L2 (reflected light) from the reflecting plate 52 is attached to the sensor panel 10, the adhesive 13 is free of bubbles BL. Partial advancement is incident on the line sensor camera 50 directly through the sensor panel 11. For example, as shown in FIG. 8, if the illumination light R L2 by the reflection plate 52 passes through the outer surface of the bubble BL in the adhesive 13, the illumination light R L2 will pass through the surface of the bubble BL. The refraction or scattering (e.g., Mie scattering) is not sufficiently incident on the line sensor camera 50. For example, as shown in FIG. 9, if the illumination light R L2 passes through the central portion of the bubble BL, the illumination light R L2 is scattered (for example, Brill scattering) and can be incident on the line sensor camera. 50.

回到第6圖,如前述,處理單元70(處理單元70所具有的檢查圖像資訊生成機構)係根據於藉由來自反射板52之照明光RL2 進行照明之狀態下線感測器攝影機50掃描感測器面板組件10時輸出自該線感測器攝影機50之影像信號,生成由像素(對應於CCD元件)單位之濃淡值(例如256階度)所構成的檢查圖像資訊(S12)。如第7至9圖所示,由於來自反射板52之照明光RL2 係顯示依照接著劑13中的氣泡BL之有無而不同之舉動,因此,於利用前述檢查圖像資訊來表示的檢查圖像I中,舉例言之,如第10圖所示,各氣泡部分IBL1 、IBL2 、IBL3 係分別於明亮背景中以暗環來表現。Returning to Fig. 6, as described above, the processing unit 70 (the inspection image information generating mechanism included in the processing unit 70) is in accordance with the state in which the line sensor camera 50 is illuminated by the illumination light R L2 from the reflection plate 52. When the sensor panel assembly 10 is scanned, the image signal output from the line sensor camera 50 is generated, and inspection image information composed of the gradation value (for example, 256 gradation) of the pixel (corresponding to the CCD element) is generated (S12). . As shown in FIGS. 7 to 9, since the illumination light R L2 from the reflection plate 52 is different in accordance with the presence or absence of the bubble BL in the adhesive 13, the inspection chart indicated by the aforementioned inspection image information is used. For example, in I, as shown in Fig. 10, each of the bubble portions I BL1 , I BL2 , and I BL3 is represented by a dark ring in a bright background.

線感測器攝影機50之焦點位置係設定在感測器面板組件10之接著劑13之厚度方向之大略中央部,同時線感測器攝影機50之其他光學條件(相對於感測器面板組件 10之位置、縮距等),以及照明單元51及反射板52之光學條件(相對於感測器面板組件10之位置、斜度、光量等)係調整為接著劑中的氣泡BL於檢查圖像I中會如前述般於明亮背景中以暗環盡量明確地表現。The focus position of the line sensor camera 50 is set at a substantially central portion of the thickness direction of the adhesive 13 of the sensor panel assembly 10, while other optical conditions of the line sensor camera 50 (relative to the sensor panel assembly) The position of the 10, the reduction, etc., and the optical conditions of the illumination unit 51 and the reflector 52 (relative to the position, slope, amount of light, etc. of the sensor panel assembly 10) are adjusted to the bubble BL in the adhesive. As in the case of I, the dark ring is expressed as clearly as possible in the bright background as described above.

若處理單元70如前述般生成表示氣泡部分可於明亮背景中以暗環來表現的檢查圖像I之檢查圖像資訊(像素單位之濃淡值)(S12),則自所獲得的檢查圖像資訊,抽出包含氣泡部分之檢查領域(例如矩形領域)(S13)。另,該檢查領域亦可根據在根據前述檢查圖像資訊而顯示於顯示單元71之檢查圖像上使用者使用操作單元72來特定的領域而抽出,又,亦可藉由將包含如前述般的暗環之領域進行圖像處理而抽出。If the processing unit 70 generates the inspection image information (the gradation value of the pixel unit) of the inspection image I expressed by the dark ring in the bright background as described above (S12), the processing image obtained from the processing unit 70 Information, extracting an inspection field (for example, a rectangular field) containing a bubble portion (S13). In addition, the inspection field may also be extracted according to an area specified by the user using the operation unit 72 on the inspection image displayed on the display unit 71 according to the inspection image information, or may be included as described above. The field of the dark ring is image-processed and extracted.

處理單元70係自將表示包含於自檢查圖像資訊抽出的檢查領域之氣泡部分的暗環,例如於其最大徑位置橫切的主掃描方向之濃淡值剖面,根據對應於該暗環之2個暗部間之距離,生成表示該氣泡之尺寸的第1氣泡尺寸資訊Dx(S14)。具體而言,如第11A至11C圖所示,自將表示氣泡部分IBLS 、IBLM 、IBLL 之暗環於其最大徑位置橫切的主掃描方向之濃淡值剖面PFS 、PFM 、PFL (256階度之濃淡值剖面),檢測對應於該暗環之2個最低值之像素位置PB1 、PB2 。又,根據該像素位置PB1 、PB2 間之距離,生成第1氣泡尺寸資訊DxS 、DxM 、DxL 。此時,獲得自最小之氣泡部分IBLS (參照第11A圖)的第1氣泡尺寸資訊DxS 係構成最小之值,獲得自最大之氣泡部分IBLL (參照第11C圖)的第1氣泡尺寸資訊DxL 係構成最大之值。又,獲得自大於最小之氣泡部分IBLS 並小於最大之氣泡部分IBLL 之氣泡部分IBLM (參照第11B圖)的第1氣泡尺寸資訊DxM 係構成大於DxS 並小於DxL 之值。The processing unit 70 is configured to convert a dark ring representing a bubble portion included in the inspection field extracted from the self-inspection image information, for example, a gradation value section of the main scanning direction transverse to the maximum diameter position thereof, according to the dark ring corresponding to the dark ring The distance between the dark portions generates the first bubble size information Dx indicating the size of the bubble (S14). Specifically, as shown in FIGS. 11A to 11C, the gradation value profiles PF S and PF M in the main scanning direction which are transverse to the dark ring of the bubble portions I BLS , I BLM , and I BLL are shown . PF L (the gradation of the 256th order) detects the pixel positions P B1 and P B2 corresponding to the two lowest values of the dark ring. Further, the first bubble size information Dx S , Dx M , and Dx L are generated based on the distance between the pixel positions P B1 and P B2 . At this time, the first bubble size information Dx S obtained from the smallest bubble portion I BLS (see FIG. 11A ) constitutes the smallest value, and the first bubble size obtained from the largest bubble portion I BLL (see FIG. 11C ) is obtained. The information Dx L system constitutes the largest value. Further, the first bubble size information Dx M obtained from the bubble portion I BLM (refer to FIG. 11B) larger than the smallest bubble portion I BLS and smaller than the largest bubble portion I BLL constitutes a value larger than Dx S and smaller than Dx L .

其次,與前述主掃描方向之情形相同,處理單元70係自將表示包含於前述檢查領域之氣泡部分的暗環於其最大徑位置橫切的副掃描方向之濃淡剖面,根據對應於該暗環之2個最低值之像素位置間之距離,生成表示該氣泡之尺寸的第2氣泡尺寸資訊Dy(S15)。又,處理單元70係判定前述第1氣泡尺寸資訊Dx與前述第2氣泡尺寸資訊Dy之差是否為預定值△以下(S16)。若前述第1氣泡尺寸資訊Dx與前述第2氣泡尺寸資訊Dy之差為預定值△以下(於S16中為YES),則處理單元70係將第1氣泡尺寸資訊Dx作成關於氣泡之尺寸之檢查結果資訊D而顯示(輸出)於顯示單元71。另一方面,當前述第1氣泡尺寸資訊Dx與前述第2氣泡尺寸資訊Dy之差大於預定值△時(於S16中為NO),處理單元70係將前述第1氣泡尺寸資訊Dx與前述第2氣泡尺寸資訊Dy之平均值資訊((Dx+Dy)/2)作成關於氣泡之尺寸之檢查結果資訊而顯示(輸出)於顯示單元71。即,處理單元70係具有氣泡尺寸資訊生成機構,且該氣泡尺寸資訊生成機構係生成表示氣泡之尺寸的氣泡尺寸資訊作為檢查結果資訊。Next, in the same manner as in the case of the main scanning direction described above, the processing unit 70 is a gradation section in a sub-scanning direction in which a dark ring indicating a bubble portion included in the inspection region is transversely cut at a maximum diameter position thereof, according to the dark ring corresponding thereto. The distance between the pixel positions of the two lowest values generates the second bubble size information Dy indicating the size of the bubble (S15). Further, the processing unit 70 determines whether or not the difference between the first bubble size information Dx and the second bubble size information Dy is equal to or smaller than a predetermined value Δ (S16). When the difference between the first bubble size information Dx and the second bubble size information Dy is equal to or less than a predetermined value Δ (YES in S16), the processing unit 70 forms the first bubble size information Dx as a check about the size of the bubble. The result information D is displayed (output) on the display unit 71. On the other hand, when the difference between the first bubble size information Dx and the second bubble size information Dy is larger than a predetermined value Δ (NO in S16), the processing unit 70 sets the first bubble size information Dx and the foregoing The average value information ((Dx+Dy)/2) of the bubble size information Dy is displayed (output) on the display unit 71 in accordance with the inspection result information on the size of the bubble. That is, the processing unit 70 has a bubble size information generating mechanism, and the bubble size information generating mechanism generates bubble size information indicating the size of the bubble as the inspection result information.

處理單元70係針對業已抽出的各檢查圖像領域,實行前述處理(S13至S17或S13至S16、S18)(S19)。又,若針對所有檢查圖像領域完成處理(於S19中為YES),則處理單元70係結束有關氣泡之尺寸檢測之處理。The processing unit 70 performs the aforementioned processing (S13 to S17 or S13 to S16, S18) for each of the inspection image fields that have been extracted (S19). Further, if the processing is completed for all the inspection image fields (YES in S19), the processing unit 70 ends the processing regarding the size detection of the air bubbles.

不過,如前述,線感測器攝影機50之焦點位置係設定在感測器面板組件10之接著劑13之厚度方向之大略中央部。然而,於接著劑13中,舉例言之,如第12圖所示,不僅是位於焦點位置SFOCUS 上的焦點上狀態之氣泡BLON ,亦可能存在有位於比焦點位置SFOCUS 更靠近線感測器攝影機50之位置的焦點內狀態之氣泡BLIN ,或位於比焦點位置SFOCUS 更遠離線感測器攝影機50之位置的焦點外狀態之氣泡BLOUT 。此時,無法鮮明地拍攝未在焦點位置SFOCUS 之氣泡BLIN 、BLOUT 。相較於例如第13B圖所示之焦點上狀態之氣泡BLON (暗環IBLON ),焦點內狀態之氣泡BLIN 係例如像是第13A圖所示,於檢查圖像上能以細的暗環IBLIN 來表現。又,相較於前述焦點上狀態之氣泡BLON (暗環IBLON ),關於焦點外狀態之氣泡BLOUT 則例如像是第13C圖所示,於檢查圖像上能以淺而模糊的暗環IBLOUT 來表現。However, as described above, the focus position of the line sensor camera 50 is set at a substantially central portion of the thickness direction of the adhesive 13 of the sensor panel assembly 10. However, in the adhesive 13, for example words, as shown in FIG. 12, not only the state of the focus positioned on a focus position S FOCUS bubbles BL ON, there may also be located closer than the focal position of the sense lines S FOCUS The bubble BL IN in the in-focus state at the position of the detector camera 50 or the bubble BL OUT in the out-of-focus state located farther from the position of the line sensor camera 50 than the focus position S FOCUS . At this time, the bubbles BL IN and BL OUT which are not in the focus position S FOCUS cannot be vividly captured. The bubble BL IN in the in- focus state is, for example, as shown in FIG. 13A, as compared with the bubble BL ON (dark ring IBL ON ) in the in-focus state shown in FIG. 13B, and can be fine on the inspection image. Dark ring IBL IN to perform. Further, compared with the bubble BL ON (dark ring IBL ON ) in the above-described state of focus, the bubble BL OUT with respect to the out-of-focus state is, for example, as shown in FIG. 13C, and can be shallow and blurred on the inspection image. Ring IBL OUT to perform.

依此,按照氣泡於接著劑13中的厚度方向之位置,檢查圖像中的氣泡部分之濃淡狀態會不同,然而,無論作成何者,如第13A至13C圖所示,該氣泡部分皆能以暗環來表現。依此,只要能以暗環來表現,無論是前述焦點內狀態、焦點上狀態及焦點外狀態之何種氣泡BLIN 、BLON 、BLOUT ,皆可依據前述處理(S13至S17或S13至S16、S18),如第13A至13C圖所示,自將表示氣泡部分IBLIN 、IBLON 、IBLOUT 之暗環於其最大徑位置橫切的主掃描方向之濃淡值剖面PFIN 、PFON 、PFOUT ,檢測對應於該暗環之2個最低值之像素位置PB1 、PB2 。又,根據該像素位置PB1 、PB2 間之距 離,生成第1氣泡尺寸資訊DxIN 、DxON 、DxOUT 。又,同樣地作成,自將暗環於其最大徑位置橫切的副掃描方向之濃淡剖面,生成第2氣泡尺寸資訊。Accordingly, according to the position of the bubble in the thickness direction of the adhesive 13, the darkness state of the bubble portion in the inspection image is different, however, regardless of the composition, as shown in Figs. 13A to 13C, the bubble portion can be Dark ring to express. Accordingly, as long as the dark ring can be expressed, any of the bubbles BL IN , BL ON , and BL OUT in the in- focus state, the in-focus state, and the out-of-focus state can be processed according to the foregoing (S13 to S17 or S13 to S16, S18), as shown in Figs. 13A to 13C, the gradation profile PF IN , PF ON in the main scanning direction which indicates the dark ring of the bubble portions I BLIN , I BLON , and I BLOUT at the maximum diameter position thereof PF OUT detects the pixel positions P B1 and P B2 corresponding to the two lowest values of the dark ring. Further, the first bubble size information Dx IN , Dx ON , and Dx OUT are generated based on the distance between the pixel positions P B1 and P B2 . Further, in the same manner, the second bubble size information is generated from the shading section in the sub-scanning direction in which the dark ring is transversely cut at the maximum radial position.

若藉由如前述般的檢查裝置,則可根據來自掃描構成為藉由接著劑13貼合感測器面板11與蓋玻璃12之感測器面板組件10的線感測器攝影機50之影像信號,生成檢查圖像資訊,並自將利用該檢查圖像資訊來表示的檢查圖像中以氣泡部分來表現的暗環橫切的主掃描方向(副掃描方向)之濃淡剖面,根據對應於前述暗環之2個暗部(最低值位置)間於檢查圖像上之距離,生成表示氣泡之尺寸的第1氣泡尺寸資訊Dx(第2氣泡尺寸Dy)。藉此,位於線感測器攝影機50之焦點位置SFOCUS 的氣泡BLON 是理所當然的,且即使是未在該焦點位置SFOCUS 之各種氣泡BLIN 、BLOUT ,亦可獲得能以良好之精度表示其尺寸的資訊,且無需改變線感測器攝影機50之光學條件(例如焦點位置)。According to the inspection apparatus as described above, the image signal of the line sensor camera 50 configured to sandwich the sensor panel 11 of the sensor panel 11 and the cover glass 12 by the adhesive 13 can be used. And generating a check image information, and a gradation profile of a main scanning direction (sub-scanning direction) transverse to the dark ring represented by the bubble portion in the inspection image indicated by the inspection image information, according to the foregoing The distance between the two dark portions (the lowest value position) of the dark ring on the inspection image generates the first bubble size information Dx (the second bubble size Dy) indicating the size of the bubble. Accordingly, the line sensor camera positioned 50 the focal position of the bubble BL ON S FOCUS granted, and not even in the focal position of the various S FOCUS bubbles BL IN, BL OUT, it can be obtained with good accuracy can be Information indicating its size, and without changing the optical conditions (e.g., focus position) of the line sensor camera 50.

又,由於自獲得自將暗環於其最大徑位置橫切的主掃描方向之濃淡剖面的第1氣泡尺寸資訊Dx,與獲得自將該暗環於其最大徑位置橫切的副掃描方向之濃淡剖面的第2氣泡尺寸資訊Dy,生成可表示氣泡之尺寸的資訊,因此,可獲得能以良好之精度表示氣泡之尺寸的資訊。Further, the first bubble size information Dx obtained from the shading profile in the main scanning direction transverse to the maximum diameter position of the dark ring is obtained from the sub-scanning direction obtained by crossing the dark ring at its maximum radial position. The second bubble size information Dy of the shading profile generates information indicating the size of the bubble, so that information indicating the size of the bubble with good precision can be obtained.

另,於前述檢查裝置中,對於各大小之氣泡,舉例言之,如第14圖所示,可調整線感測器攝影機50之姿勢或位置、照明單元51及反射板52之斜度或位置等,使獲得自主掃描方向之濃淡值剖面的第1氣泡尺寸資訊Dx與獲得 自副掃描方向之濃淡值剖面的第2氣泡尺寸資訊Dy大略相等。藉由依此作成,無需使用第1氣泡尺寸資訊Dx與第2氣泡尺寸資訊Dy之平均值資訊(參照S18),而可藉由較高之精度,檢查氣泡之尺寸。Further, in the above-described inspection apparatus, for the bubbles of respective sizes, as shown in FIG. 14, the posture or position of the line sensor camera 50, the inclination or position of the illumination unit 51 and the reflection plate 52 can be adjusted. Etc., obtaining the first bubble size information Dx of the gradation value profile of the autonomous scanning direction and obtaining The second bubble size information Dy from the gradation value section in the sub-scanning direction is substantially equal. By doing so, it is not necessary to use the average information of the first bubble size information Dx and the second bubble size information Dy (refer to S18), and the size of the bubble can be checked with high precision.

具體而言,舉例言之,可將線感測器攝影機50之姿勢或位置,以良好之精度調整為線感測器50a之延伸方向將感測器面板組件10之移動方向A(例如與移動方向A呈正交)橫切,且其光軸AOPT1 與感測器面板組件10(感測器面板11)之表面及反射板52正交,並調整為來自照明單元51之照明光RL1與線感測器攝影機50之光軸AOPT1 於反射板52之表面以良好之精度交叉(參照第7至9圖)。藉由此種調整,舉例言之,如第9圖所示,照明光RL1 係於反射板52之表面擴散反射,屬於其反射光之一部分的照明光RL2 係沿著線感測器攝影機50之光軸AOPT1 前進,並自正下方照明氣泡BL,且線感測器攝影機50會接收業已自氣泡BL之正下方通過該氣泡BL的照明光RL2 。其結果,於根據輸出自線感測器攝影機50之影像信號而生成的檢查圖像資訊中,氣泡BL之2方向(主掃描方向、副掃描方向)之直徑可構成大略相等。此在將氣泡BL假設為完整之球體時是理所當然的,然而,即使是稍微歪斜之形狀的氣泡BL,相較於該氣泡BL係自傾斜方向照射之情形,第1氣泡尺寸資訊Dx與第2氣泡尺寸資訊Dy之差會減小,且該等之差構成預定值△以下的機率會提高。其結果,無需使用第1氣泡尺寸資訊Dx與第2氣泡尺寸資訊Dy之平均值資訊,可藉由較高之精度檢查氣泡之尺寸的機 率會提高。Specifically, for example, the posture or position of the line sensor camera 50 can be adjusted with good precision as the direction of extension of the line sensor 50a to move the direction A of the sensor panel assembly 10 (eg, and move). The direction A is orthogonally transected, and its optical axis A OPT1 is orthogonal to the surface of the sensor panel assembly 10 (sensor panel 11) and the reflector 52, and is adjusted to the illumination light RL1 from the illumination unit 51. The optical axis A OPT1 of the line sensor camera 50 intersects on the surface of the reflecting plate 52 with good precision (refer to Figs. 7 to 9). By such adjustment, for example, as shown in FIG. 9, the illumination light R L1 is diffused and reflected on the surface of the reflection plate 52, and the illumination light R L2 belonging to a part of the reflected light is along the line sensor camera. The optical axis A OPT1 of 50 advances, and the bubble BL is illuminated from directly below, and the line sensor camera 50 receives the illumination light R L2 that has passed through the bubble BL directly from the bubble BL. As a result, in the inspection image information generated by the image signal output from the line sensor camera 50, the diameters of the two directions (the main scanning direction and the sub-scanning direction) of the bubble BL can be substantially equal. This is a natural matter when the bubble BL is assumed to be a complete sphere. However, even in the case of the bubble BL having a slightly skewed shape, the first bubble size information Dx and the second are compared with the case where the bubble BL is irradiated from the oblique direction. The difference between the bubble size information Dy is reduced, and the probability that the difference is equal to or less than the predetermined value Δ is increased. As a result, it is not necessary to use the average information of the first bubble size information Dx and the second bubble size information Dy, and the probability of checking the size of the bubble with higher precision is improved.

又,在調整線感測器攝影機50之姿勢或位置、照明單元51及反射板52之斜度或位置等時,若使用預先存在有分為屬於球體的氣泡之感測器面板組件10(貼合基板),且所獲得的前述第1氣泡尺寸資訊Dx與前述第2氣泡尺寸資訊Dy大略相等,則可判斷為業已進行精度良好之前述調整。Further, when adjusting the posture or position of the line sensor camera 50, the inclination or position of the illumination unit 51 and the reflection plate 52, etc., if the sensor panel assembly 10 in which bubbles belonging to the sphere are present in advance is used, When the first bubble size information Dx obtained is substantially equal to the second bubble size information Dy, it can be determined that the above-described adjustment with good precision has been performed.

於前述例中,將反射來自照明單元51之光的反射板52作成照明機構,並自蓋玻璃12側朝與感測器面板11對向之線感測器攝影機50進行照明,然而,亦可作成將照明單元配置成與蓋玻璃12對向,且該照明單元直接自蓋玻璃12側朝線感測器攝影機50照明。In the foregoing example, the reflecting plate 52 that reflects the light from the illumination unit 51 is used as an illumination mechanism, and the line sensor camera 50 that is opposite to the sensor panel 11 is illuminated from the side of the cover glass 12, however, The illumination unit is configured to face the cover glass 12, and the illumination unit is illuminated directly from the cover glass 12 side toward the line sensor camera 50.

又,作成將暗環於其最大徑位置橫切的主掃描方向或副掃描方向之濃淡剖面,獲得氣泡尺寸資訊(第1氣泡尺寸資訊、第2氣泡尺寸資訊),然而,並不限於此,亦可自將暗環橫切的任意方向之濃淡剖面,獲得氣泡尺寸資訊,又,亦可自於最大徑位置以外之預定位置橫切的方向之濃淡剖面,獲得氣泡尺寸資訊。In addition, the bubble size information (the first bubble size information and the second bubble size information) is obtained by creating a gradation cross section in the main scanning direction or the sub-scanning direction in which the dark ring is transversely cut at the maximum diameter position. However, the present invention is not limited thereto. The bubble size information may also be obtained from the gradation profile in any direction transversely cut by the dark ring, or the bubble size information may be obtained from the gradation profile in the direction transverse to the predetermined position other than the maximum diameter position.

再者,對應於前述暗環之2個最低值之像素位置PB1 、PB2 間之距離係作成對應於該暗環之2個暗部間之距離來檢測,然而,並不限於此。舉例言之,如第15圖所示,亦可自將暗環於其最大徑位置橫切的方向之濃淡剖面PF,檢測該暗環之2個暗部之寬度W1、W2,並檢測各寬度W1、W2之中心位置P1、P2間之距離,作為對應於該暗環之2個暗部間之距離。Furthermore, the distance between the pixel positions P B1 and P B2 corresponding to the two lowest values of the dark ring is detected as the distance between the two dark portions of the dark ring, but is not limited thereto. For example, as shown in FIG. 15, the widths W1 and W2 of the two dark portions of the dark ring may be detected from the shading profile PF of the direction in which the dark ring is transversely cut at the maximum diameter position, and the width W1 is detected. The distance between the center positions P1 and P2 of W2 is the distance between the two dark portions corresponding to the dark ring.

10‧‧‧感測器面板組件(貼合板狀體)10‧‧‧Sensor panel assembly (fitting panel)

11‧‧‧感測器面板(板狀體)11‧‧‧Sensor panel (plate body)

12‧‧‧蓋玻璃(板狀體)12‧‧‧Cover glass (plate-like body)

12a‧‧‧透光領域12a‧‧‧Transparent field

12b‧‧‧不透光領域12b‧‧‧ opaque field

13,15‧‧‧接著劑13,15‧‧‧Binder

20‧‧‧液晶面板組件20‧‧‧LCD panel components

50‧‧‧線感測器攝影機50‧‧‧ line sensor camera

50a‧‧‧線感測器50a‧‧‧ line sensor

51‧‧‧照明單元(照明機構)51‧‧‧Lighting unit (lighting mechanism)

52‧‧‧反射板(照明機構)52‧‧‧Reflecting plate (lighting mechanism)

60‧‧‧移動機構60‧‧‧Mobile agencies

70‧‧‧處理單元70‧‧‧Processing unit

71‧‧‧顯示單元71‧‧‧Display unit

72‧‧‧操作單元72‧‧‧Operating unit

A‧‧‧移動方向A‧‧‧ moving direction

AOPT1 ,AOPT2 ‧‧‧光軸A OPT1 , A OPT2 ‧‧‧ optical axis

B‧‧‧掃描方向B‧‧‧Scanning direction

BL,BLIN ,BLON ,BLOUT ‧‧‧氣泡BL, BL IN , BL ON , BL OUT ‧‧‧ bubbles

D‧‧‧檢查結果資訊D‧‧‧Check result information

Dx,DxIN ,DxL ,DxM ,DxON ,DxOUT ,DxS ‧‧‧第1氣泡尺寸資訊Dx, Dx IN , Dx L , Dx M , Dx ON , Dx OUT , Dx S ‧‧‧1st bubble size information

Dy‧‧‧第2尺寸資訊Dy‧‧‧2nd size information

EC ‧‧‧拍攝領域E C ‧‧‧The field of photography

EL ‧‧‧照明領域E L ‧‧‧Lighting field

I‧‧‧檢查圖像I‧‧‧Check the image

IBLIN ,IBLON ,IBLOUT ‧‧‧暗環IBL IN , IBL ON , IBL OUT ‧‧‧ Dark Ring

IBL1 ,IBL2 ,IBL3 ,IBLIN ,IBLL ,IBLM ,IBLON ,IBLOUT ,IBLS ‧‧‧氣泡部分I BL1 , I BL2 , I BL3 , I BLIN , I BLL , I BLM , I BLON , I BLOUT , I BLS ‧‧‧ bubble part

Lc‧‧‧拍攝線Lc‧‧‧ shooting line

LL ‧‧‧照明線L L ‧‧‧Lighting line

P1,P2‧‧‧中心位置P1, P2‧‧‧ central location

PB1 ,PB2 ‧‧‧像素位置P B1 , P B2 ‧ ‧ pixel position

PF,PFIN ,PFL ,PFM ,PFON ,PFOUT ,PFS ‧‧‧濃淡值剖面PF, PF IN , PF L , PF M , PF ON , PF OUT , PF S ‧ ‧ 浓 值

RL1 ,RL2 ‧‧‧照明光R L1 , R L2 ‧‧‧ illumination light

SFOCUS ‧‧‧焦點位置S FOCUS ‧‧‧ focus position

S11~S19‧‧‧步驟S11~S19‧‧‧Steps

W1,W2‧‧‧寬度W1, W2‧‧‧ width

α‧‧‧預定角度α‧‧‧Predetermined angle

第1A圖係顯示屬於貼合板狀體之一例的感測器面板組件之結構截面圖。Fig. 1A is a structural sectional view showing a sensor panel assembly which is an example of a laminated plate-like body.

第1B圖係顯示屬於貼合板狀體之一例的感測器面板組件之結構平面圖。Fig. 1B is a plan view showing the structure of a sensor panel assembly which is an example of a laminated plate-like body.

第1C圖係顯示藉由接著劑貼合第1A及1B圖所示之感測器面板組件與液晶面板組件之結構的觸碰面板式液晶顯示面板之結構截面圖。Fig. 1C is a cross-sectional view showing the structure of a touch panel type liquid crystal display panel in which the structure of the sensor panel assembly and the liquid crystal panel assembly shown in Figs. 1A and 1B is bonded by an adhesive.

第2圖係放大顯示感測器面板組件之截面之放大截面圖。Figure 2 is an enlarged cross-sectional view showing a section of the sensor panel assembly in an enlarged manner.

第3A圖係顯示自有關本發明之實施一形態之貼合板狀體檢查裝置(感測器面板組件檢查裝置)之側方觀看的基本構造圖。Fig. 3A is a view showing a basic configuration of a side view of a laminated plate-shaped inspection device (sensor panel assembly inspection device) according to an embodiment of the present invention.

第3B圖係顯示自有關本發明之實施一形態之貼合板狀體檢查裝置(感測器面板組件檢查裝置)之上方觀看的基本構造圖。Fig. 3B is a view showing a basic configuration seen from above the laminated plate-shaped inspection device (sensor panel assembly inspection device) according to the embodiment of the present invention.

第4A圖係顯示線感測器攝影機與照明單元之關係圖(其1)。Figure 4A shows a diagram of the relationship between the line sensor camera and the lighting unit (1).

第4B圖係顯示線感測器攝影機與照明單元之關係圖(其2)。Figure 4B shows a diagram of the relationship between the line sensor camera and the lighting unit (2).

第5圖係顯示有關本發明之實施一形態之貼合板狀體檢查裝置(感測器面板組件檢查裝置)之處理系統的基本構造圖。Fig. 5 is a view showing a basic configuration of a processing system of a laminated plate-shaped inspection device (sensor panel assembly inspection device) according to an embodiment of the present invention.

第6圖係顯示有關氣泡尺寸資訊之生成之處理順序之流程圖。Figure 6 is a flow chart showing the processing sequence for generating bubble size information.

第7圖係顯示於感測器面板組件中前進的來自照明單元之照明光與該照明光於反射板之反射光之狀態(其1)圖。Fig. 7 is a view showing a state (1) of the illumination light from the illumination unit and the reflected light of the illumination light on the reflection plate which are advanced in the sensor panel assembly.

第8圖係顯示於感測器面板組件中前進的來自照明單元之照明光與該照明光於反射板之反射光之狀態(其2)圖。Fig. 8 is a view showing a state (2) of the illumination light from the illumination unit and the reflected light of the illumination light on the reflection plate which are advanced in the sensor panel assembly.

第9圖係顯示於感測器面板組件中前進的來自照明單元之照明光與該照明光於反射板之反射光之狀態(其3)圖。Fig. 9 is a view showing a state (3) of the illumination light from the illumination unit and the reflected light of the illumination light on the reflection plate which are advanced in the sensor panel assembly.

第10圖係顯示包含氣泡部分(暗環)之檢查圖像之一例之圖。Fig. 10 is a view showing an example of an inspection image including a bubble portion (dark ring).

第11A圖係顯示表示包含於檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係(其1)圖。Fig. 11A is a view showing a relationship (1) between the dark ring of the bubble portion included in the inspection image and the gradation value profile in the direction (main scanning direction) in which the dark ring is transversely cut.

第11B圖係顯示表示包含於檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係(其2)圖。Fig. 11B is a view showing a relationship (2) between the dark ring of the bubble portion included in the inspection image and the gradation value profile in the direction (main scanning direction) in which the dark ring is transversely cut.

第11C圖係顯示表示包含於檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係(其3)圖。Fig. 11C is a view showing a relationship (3) between the dark ring of the bubble portion included in the inspection image and the gradation value profile in the direction (main scanning direction) in which the dark ring is transversely cut.

第12圖係顯示於接著劑中位於線感測器攝影機之焦點位置的氣泡及位於焦點位置之前後的氣泡例之截面圖。Fig. 12 is a cross-sectional view showing an example of a bubble which is located at a focus position of the line sensor camera in the adhesive and a bubble which is located before the focus position.

第13A圖係顯示表示對應於位於線感測器攝影機之焦點位置跟前的氣泡之檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係圖。Fig. 13A is a view showing the relationship between the dark ring of the bubble portion corresponding to the inspection image of the bubble located at the focus position of the line sensor camera and the gradation value of the direction (main scanning direction) transverse to the dark ring. Figure.

第13B圖係顯示表示對應於位於線感測器攝影機之焦點位置的氣泡之檢查圖像之氣泡部分的暗環與將該暗環橫 切的方向(主掃描方向)之濃淡值剖面之關係圖。Fig. 13B is a view showing a dark ring representing a bubble portion corresponding to an inspection image of a bubble located at a focus position of the line sensor camera, and a horizontal ring of the dark ring A plot of the gradation profile of the cut direction (main scan direction).

第13C圖係顯示表示對應於位於比線感測器攝影機之焦點位置後方的氣泡之檢查圖像之氣泡部分的暗環與將該暗環橫切的方向(主掃描方向)之濃淡值剖面之關係圖。Fig. 13C is a view showing a condensed value of a dark ring corresponding to a bubble portion of an inspection image of a bubble located behind a focus position of a line sensor camera and a direction (main scanning direction) transverse to the dark ring relation chart.

第14圖係顯示求取自將表示氣泡部分之暗環橫切的主掃描方向之濃淡值剖面的氣泡尺寸與求取自將該暗環橫切的副掃描方向之濃淡值剖面的氣泡尺寸之關係相關圖。Fig. 14 is a view showing the bubble size of the gradation value section in the main scanning direction in which the dark ring of the bubble portion is transversely cut, and the bubble size of the gradation value section obtained from the sub-scanning direction transverse to the dark ring. Relationship correlation diagram.

第15圖係顯示自將對應於檢查圖像中的氣泡部分之暗環橫切的方向之濃淡值剖面,測量對應於前述暗環之2個暗部間於前述檢查圖像上之距離的方法之另一例之圖。Fig. 15 is a view showing a method of measuring a gradation value from a direction transverse to a dark ring of a bubble portion in an inspection image, and measuring a distance corresponding to a distance between two dark portions of the dark ring on the inspection image. A picture of another example.

DxM ‧‧‧第1氣泡尺寸資訊Dx M ‧‧‧1st bubble size information

IBLM ‧‧‧氣泡部分I BLM ‧‧‧ bubble section

PFM ‧‧‧濃淡值剖面PF M ‧‧‧dense profile

PB1 ,PB2 ‧‧‧像素位置P B1 , P B2 ‧ ‧ pixel position

Claims (10)

一種貼合板狀體檢查裝置,係根據拍攝貼合板狀體而獲得之檢查圖像資訊,進行關於接著劑中的氣泡之檢查,且前述貼合板狀體係構成為藉由前述接著劑,貼合2片具有透光性之板狀體者,又,前述貼合板狀體檢查裝置包含有:線感測器攝影機,係配置成與前述貼合板狀體之其中一者之板狀體對向者;照明機構,係自前述貼合板狀體之另一者之板狀體側,朝前述線感測器攝影機照明者;及處理單元,係處理於藉由前述照明機構進行照明之狀態下前述線感測器攝影機掃描前述貼合板狀體時自該線感測器攝影機輸出之影像信號者;前述處理單元具有檢查圖像資訊生成機構,且該檢查圖像資訊生成機構係根據來自前述線感測器攝影機之影像信號,生成由像素單位之濃淡值所構成的檢查圖像資訊,又,前述照明機構及前述線感測器攝影機之光學條件係調整為在利用由前述像素單位之濃淡值所構成的前述檢查圖像資訊來表示的檢查圖像中,前述氣泡部分係於明亮背景中以暗環來表現,而前述處理單元更具有氣泡尺寸資訊生成機構,且該氣泡尺寸資訊生成機構係從獲得自前述檢查圖像資訊之將前述暗環橫切的方向之濃淡值剖面,根據對應於 前述暗環之2個暗部間於前述檢查圖像上之距離,生成表示氣泡之尺寸的氣泡尺寸資訊作為檢查結果資訊。 A laminated plate-shaped object inspection device that performs inspection of air bubbles in an adhesive agent based on inspection image information obtained by photographing a laminated plate-like body, and the laminated plate-like system is configured to be bonded by the above-mentioned adhesive The sheet-shaped body having a light-transmissive property, wherein the laminated plate-shaped object inspection apparatus includes: a line sensor camera disposed to face the plate-like body of one of the bonded plate-shaped bodies; The illuminating mechanism is configured to illuminate the line sensor camera from the side of the plate-like body of the other of the bonded plate-like bodies; and the processing unit is configured to process the line sense in a state of being illuminated by the illumination mechanism The detector camera scans the image signal output from the line sensor camera when the plate body is pasted; the processing unit has an inspection image information generating mechanism, and the inspection image information generating mechanism is based on the line sensor from the line sensor The image signal of the camera generates inspection image information composed of the gradation value of the pixel unit, and the optical conditions of the illumination mechanism and the line sensor camera are adjusted to In the inspection image represented by the aforementioned inspection image information composed of the gradation values of the pixel units, the bubble portion is expressed by a dark ring in a bright background, and the processing unit further has a bubble size information generating mechanism. And the bubble size information generating mechanism is obtained from the gradation value section obtained from the inspection image information in a direction transverse to the dark ring, according to The distance between the two dark portions of the dark ring on the inspection image generates bubble size information indicating the size of the bubble as the inspection result information. 如申請專利範圍第1項之貼合板狀體檢查裝置,其中前述氣泡尺寸資訊生成機構係將獲得自前述濃淡值剖面之與對應於前述暗環之2個暗部中的最低值對應之像素位置間之距離,使用作為前述2個暗部間之距離。 The bonding plate inspecting device according to claim 1, wherein the bubble size information generating mechanism obtains a pixel position corresponding to a lowest value of the dark portion corresponding to the dark portion of the dark ring. The distance is used as the distance between the two dark portions. 如申請專利範圍第1或2項之貼合板狀體檢查裝置,其中前述氣泡尺寸資訊生成機構係從獲得自前述檢查圖像資訊之將前述暗環橫切的前述線感測器攝影機之主掃描方向之濃淡值剖面,生成前述氣泡尺寸資訊。 The laminated plate inspection device according to claim 1 or 2, wherein the bubble size information generating mechanism is a main scanning of the line sensor camera that crosses the dark ring obtained from the inspection image information. The faint and light value profile of the direction generates the bubble size information. 如申請專利範圍第1或2項之貼合板狀體檢查裝置,其中前述氣泡尺寸資訊生成機構係從獲得自前述檢查圖像資訊之將前述暗環橫切的前述線感測器攝影機之副掃描方向之濃淡值剖面,生成前述氣泡尺寸資訊。 The laminated plate inspection device according to claim 1 or 2, wherein the bubble size information generating mechanism is a sub-scan of the line sensor camera that crosses the dark ring obtained from the inspection image information. The faint and light value profile of the direction generates the bubble size information. 如申請專利範圍第1或2項之貼合板狀體檢查裝置,其中前述氣泡尺寸資訊生成機構係從獲得自前述檢查圖像資訊之將前述暗環橫切的複數方向之濃淡值剖面,生成前述氣泡尺寸資訊。 The laminated plate-shaped object inspection apparatus according to the first or second aspect of the invention, wherein the bubble size information generating means generates the gradation value profile in a plurality of directions obtained by traversing the dark ring from the inspection image information. Bubble size information. 如申請專利範圍第5項之貼合板狀體檢查裝置,其中將前述暗環橫切的複數方向係包含前述線感測器攝影機之主掃描方向及副掃描方向。 The laminated plate-shaped inspection device according to claim 5, wherein the plurality of directions in which the dark ring is transversely cut includes a main scanning direction and a sub-scanning direction of the line sensor camera. 如申請專利範圍第5項之貼合板狀體檢查裝置,其中前述氣泡尺寸資訊生成機構係自前述複數方向之濃淡值剖面,取得對應於前述暗環之2個暗部間在前述檢查圖 像上之複數距離,並根據該等複數距離,生成前述氣泡尺寸資訊。 The laminated plate-shaped object inspection apparatus according to claim 5, wherein the bubble size information generating means obtains a gradation value profile from the plurality of directions, and obtains between the two dark portions corresponding to the dark ring in the inspection chart. The bubble size information is generated based on the complex distances above and based on the complex distances. 如申請專利範圍第6項之貼合板狀體檢查裝置,其中前述氣泡尺寸資訊生成機構係自前述複數方向之濃淡值剖面,取得對應於前述暗環之2個暗部間在前述檢查圖像上之複數距離,並根據該等複數距離,生成前述氣泡尺寸資訊。 The laminated plate-shaped object inspection apparatus according to claim 6, wherein the bubble size information generating means obtains a gradation value profile from the plurality of directions, and obtains between the two dark portions corresponding to the dark ring on the inspection image. The plurality of distances are generated, and the bubble size information is generated based on the complex distances. 一種貼合板狀體檢查方法,係使用貼合板狀體檢查裝置,進行關於接著劑中的氣泡之檢查,且前述貼合板狀體檢查裝置包含有:線感測器攝影機,係配置成與構成為藉由前述接著劑貼合2片具有透光性之板狀體的貼合板狀體之其中一者之板狀體對向者;照明機構,係自前述貼合板狀體之另一者之板狀體側,朝前述線感測器攝影機照明者;及處理單元,係處理於藉由前述照明機構進行照明之狀態下前述線感測器攝影機掃描前述貼合板狀體時自該線感測器攝影機輸出之影像信號者;前述貼合板狀體檢查方法具有檢查圖像資訊生成步驟,且該檢查圖像資訊生成步驟係前述處理單元根據來自前述線感測器攝影機之影像信號,生成由像素單位之濃淡值所構成的檢查圖像資訊,又,前述照明機構及前述線感測器攝影機之光學條件係調整為在利用由前述像素單位之濃淡值所構成的 前述檢查圖像資訊來表示的檢查圖像中,前述氣泡部分係於明亮背景中以暗環來表現,而前述貼合板狀體檢查方法更具有氣泡尺寸資訊生成步驟,且該氣泡尺寸資訊生成步驟係前述處理單元更進一步從獲得自前述檢查圖像資訊之將前述暗環橫切的方向之濃淡值剖面,根據對應於前述暗環之2個暗部間之距離,生成表示氣泡之尺寸的氣泡尺寸資訊作為檢查結果資訊。 A method for inspecting a laminated plate-like body is to perform inspection of air bubbles in an adhesive using a laminated plate-shaped inspection device, and the laminated plate-shaped inspection device includes a line sensor camera configured to be configured and configured a plate-shaped body facing member of one of the bonded plate-like members having two light-transmissive plate-like members bonded thereto by the above-mentioned adhesive; and an illumination mechanism from the other of the bonded plate-shaped members a side of the body, facing the line sensor camera illuminator; and a processing unit for processing the line sensor from the line sensor when the line sensor camera scans the laminated plate in a state of being illuminated by the illumination mechanism The image signal outputted by the camera; the laminated plate inspection method has an inspection image information generation step, and the inspection image information generation step is performed by the processing unit according to the image signal from the line sensor camera to generate a pixel unit The inspection image information composed of the gradation value, and the optical conditions of the illumination mechanism and the line sensor camera are adjusted to utilize the pixel unit Concentrated In the inspection image indicated by the inspection image information, the bubble portion is expressed by a dark ring in a bright background, and the laminated plate inspection method further has a bubble size information generating step, and the bubble size information generating step And the processing unit further generates a bubble size profile indicating a size of the bubble according to a distance between the two dark portions corresponding to the dark ring, obtained from the cross-sectional value of the direction in which the dark ring is transversely cut from the inspection image information. Information as a result of the inspection results. 如申請專利範圍第9項之貼合板狀體檢查方法,其中前述氣泡尺寸資訊生成步驟係將獲得自前述濃淡值剖面之與對應於前述暗環之2個暗部中的最低值對應之像素位置間之距離,使用作為前述2個暗部間之距離。 The method for inspecting a laminated plate according to claim 9 wherein the bubble size information generating step is obtained from a pixel position corresponding to a lowest value of the two dark portions corresponding to the dark ring of the darkness value profile. The distance is used as the distance between the two dark portions.
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