KR101374440B1 - 첩합 판상체 검사 장치 및 방법 - Google Patents

첩합 판상체 검사 장치 및 방법 Download PDF

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Publication number
KR101374440B1
KR101374440B1 KR1020120063026A KR20120063026A KR101374440B1 KR 101374440 B1 KR101374440 B1 KR 101374440B1 KR 1020120063026 A KR1020120063026 A KR 1020120063026A KR 20120063026 A KR20120063026 A KR 20120063026A KR 101374440 B1 KR101374440 B1 KR 101374440B1
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South Korea
Prior art keywords
line sensor
sensor camera
bubble
inspection
inspection image
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Expired - Fee Related
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KR1020120063026A
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English (en)
Korean (ko)
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KR20130004079A (ko
Inventor
요시노리 하야시
히로시 와카바
오사무 이즈츠
카츠토시 세키
요코 오노
타카노리 곤도
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시바우라 메카트로닉스 가부시키가이샤
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Publication of KR20130004079A publication Critical patent/KR20130004079A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G01N21/896—Optical defects in or on transparent materials, e.g. distortion, surface flaws in conveyed flat sheet or rod
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8874—Taking dimensions of defect into account

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Textile Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
KR1020120063026A 2011-06-30 2012-06-13 첩합 판상체 검사 장치 및 방법 Expired - Fee Related KR101374440B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011146833 2011-06-30
JPJP-P-2011-146833 2011-06-30
JPJP-P-2012-129946 2012-06-07
JP2012129946A JP6032696B2 (ja) 2011-06-30 2012-06-07 貼り合せ板状体検査装置及び方法

Publications (2)

Publication Number Publication Date
KR20130004079A KR20130004079A (ko) 2013-01-09
KR101374440B1 true KR101374440B1 (ko) 2014-03-17

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KR1020120063026A Expired - Fee Related KR101374440B1 (ko) 2011-06-30 2012-06-13 첩합 판상체 검사 장치 및 방법

Country Status (3)

Country Link
JP (1) JP6032696B2 (enExample)
KR (1) KR101374440B1 (enExample)
TW (1) TWI485358B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017224670A (ja) * 2016-06-14 2017-12-21 株式会社ディスコ 保護部材形成装置
JP7137439B2 (ja) * 2018-11-02 2022-09-14 株式会社安永 検査装置、検査方法、及び検査プログラム
TWI779268B (zh) 2019-02-28 2022-10-01 日商Ｉｈｉ股份有限公司 超音波探傷裝置
JP7709877B2 (ja) * 2021-09-15 2025-07-17 株式会社Ｓｃｒｅｅｎホールディングス 端部状態確認装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332096B2 (ja) * 1992-11-17 2002-10-07 株式会社東芝 欠陥検査方法および装置
JP2003248228A (ja) 2002-02-22 2003-09-05 Shibaura Mechatronics Corp 基板貼合装置および基板貼合方法
JP2004257776A (ja) 2003-02-25 2004-09-16 Kiyousera Opt Kk 光透過体検査装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH055710A (ja) * 1991-06-18 1993-01-14 Fuji Electric Co Ltd 瓶口天面の外観検査における２値化用しきい値の決定方法
JP3342143B2 (ja) * 1993-03-19 2002-11-05 オリンパス光学工業株式会社 プリズム異物検出方法
JPH08189903A (ja) * 1995-01-10 1996-07-23 Sekisui Chem Co Ltd 気泡検査装置
JPH08285789A (ja) * 1995-04-18 1996-11-01 Nippon Sheet Glass Co Ltd 欠点検出方法における２値化レベルの決定方法
JP3048342B2 (ja) * 1997-08-19 2000-06-05 三菱化学株式会社 透明板中の気泡検出装置
JP3551188B2 (ja) * 2002-01-10 2004-08-04 オムロン株式会社 表面状態検査方法および基板検査装置
JP2004170329A (ja) * 2002-11-22 2004-06-17 Nippon Steel Corp バンプ電極およびバンプ電極用ボール検査方法
JP4581424B2 (ja) * 2004-02-24 2010-11-17 パナソニック電工株式会社 外観検査方法及び画像処理装置
JP2007013112A (ja) * 2005-06-01 2007-01-18 Technos Kk 基板検査装置及び検査方法
TWI277719B (en) * 2005-08-03 2007-04-01 Chi-Cheng Ye Image inspection method and structure for attachment machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3332096B2 (ja) * 1992-11-17 2002-10-07 株式会社東芝 欠陥検査方法および装置
JP2003248228A (ja) 2002-02-22 2003-09-05 Shibaura Mechatronics Corp 基板貼合装置および基板貼合方法
JP2004257776A (ja) 2003-02-25 2004-09-16 Kiyousera Opt Kk 光透過体検査装置

Also Published As

Publication number Publication date
TW201305527A (zh) 2013-02-01
KR20130004079A (ko) 2013-01-09
JP2013033028A (ja) 2013-02-14
TWI485358B (zh) 2015-05-21
JP6032696B2 (ja) 2016-11-30

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