TWI480917B - Methods for constructing an optimal endpoint algorithm - Google Patents

Methods for constructing an optimal endpoint algorithm Download PDF

Info

Publication number
TWI480917B
TWI480917B TW099121511A TW99121511A TWI480917B TW I480917 B TWI480917 B TW I480917B TW 099121511 A TW099121511 A TW 099121511A TW 99121511 A TW99121511 A TW 99121511A TW I480917 B TWI480917 B TW I480917B
Authority
TW
Taiwan
Prior art keywords
endpoint
feature
algorithm
signal
end point
Prior art date
Application number
TW099121511A
Other languages
Chinese (zh)
Other versions
TW201112302A (en
Inventor
Jiangxin Wang
Andrew James Perry
Vijayakumar C Venugopal
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of TW201112302A publication Critical patent/TW201112302A/en
Application granted granted Critical
Publication of TWI480917B publication Critical patent/TWI480917B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/3299Feedback systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • H01L21/31105Etching inorganic layers
    • H01L21/31111Etching inorganic layers by chemical means
    • H01L21/31116Etching inorganic layers by chemical means by dry-etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05HPLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00Generating plasma; Handling plasma
    • H05H1/24Generating plasma
    • H05H1/46Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy

Description

最佳終點演算法的建構方法Construction method of optimal endpoint algorithm

本發明係關於最佳終點演算法的構建方法。The present invention relates to a method of constructing an optimal endpoint algorithm.

本申請案主張共同擁有的臨時專利申請案「電漿處理機具的先進設備控制/先進製程控制之方法與系統」之優先權,其美國專利申請案第61/222,102號、代理人案號第P2012P/LMRX-P183P1號,由發明人Venugopal等人於2009年6月30日提出申請,全文內容併入本文以供參考。The present application claims the priority of the co-owned provisional patent application "Method and System for Advanced Equipment Control/Advanced Process Control of Plasma Processing Equipment", U.S. Patent Application No. 61/222,102, and Agent No. P2012P /LMRX-P183P1, filed on June 30, 2009 by the inventor of the s.

本部分連續案主張共同受讓之專利申請案「辨識在製程模組階段的未受控制事件之佈置與其方法」之優先權與權益,其申請序號第12/555,674號、代理人案號第P2002/LMRX-P179號,由發明人Huang等人於2009年9月8日提出申請,該案係相關於並主張共同受讓之臨時專利申請案「辨識在製程模組階段的未受控制事件之佈置與其方法」之優先權,其申請序號第61/222,024號、代理人案號第P2002P/LMRX-P179P1號,由發明人Huang等人於2009年6月30日提出申請,全文內容併入本文以供參考。This section of the continuation claims the priority and interest of the commonly assigned patent application "identification of the arrangement and method of uncontrolled incidents at the process module stage". Application No. 12/555,674, Agent Case No. P2002 /LMRX-P179, filed by the inventor Huang et al. on September 8, 2009, which is related to and claims a co-transfer of a provisional patent application "identifying an uncontrolled event at the process module stage The priority of the arrangement and its method, the application number No. 61/222,024, the agent's case number P2002P/LMRX-P179P1, was filed by the inventor Huang et al. on June 30, 2009, the full text of which is incorporated herein. for reference.

為易於論述,定義數個詞彙如下。For ease of discussion, define a few words as follows.

資料組-測量記錄,其為處理機具參數之時間函數。Data set - measurement record, which is a time function for processing implement parameters.

變化點-若干變化發生時之時間序列上的一點。Change point - A point in the time series when several changes occur.

終點-一製程(如矽層蝕刻)已達到或接近完成時之時間點。The end point - a process (such as ruthenium etching) has reached or near the point in time when it is completed.

終點域-在資料組中預期終點要發生期間之區間。終點域通常相當寬且係基於使用者預估。Endpoint field - The interval during which the expected end point is expected to occur in the data set. The endpoint domain is usually quite wide and based on user estimates.

部分最小平方鑑別分析(PLS-DA,Partial Least Squares Discriminant Analysis)-找出二組資料之間關係的方法。當有多個自變數(在輸入矩陣X中)與多個可能應變數(在輸出矩陣Y)時可使用PLS-DA。在PLS-DA中,Y變數並不連續,而是由一組獨立的離散值或集合組成。PLS-DA會嘗試找出X變數的線性組合,其可用以將輸入資料分類至離散集合之其中一者中。Partial Least Squares Discriminant Analysis (PLS-DA) - A method for finding the relationship between two sets of data. PLS-DA can be used when there are multiple independent variables (in the input matrix X) and multiple possible strain numbers (in the output matrix Y). In PLS-DA, the Y variable is not continuous, but consists of a set of independent discrete values or sets. PLS-DA will attempt to find a linear combination of X variables that can be used to classify the input data into one of the discrete sets.

預終點域-在終點域之前的資料組部分。Pre-terminating field - the part of the data set before the end point field.

後終點域-在終點域之後的資料組部分。Back end field - the part of the data set after the end point field.

特徵記號-在一參數或參數組合的推展中之一特殊的變化點(或變化點之組合),其指示一製程的終點。該參數組合與該變化本質通常形成一特徵記號之部分。Feature Notation - A special point of change (or combination of points of change) in the progression of a parameter or combination of parameters that indicates the end of a process. This combination of parameters and the nature of the change typically form part of a feature mark.

逐步迴歸-意指在有限的暫時資料(從一個別感測器管道而來)區間中,使用最小平方配適演算法為資料值配適一直線。Stepwise regression - means that in the interval of limited temporary data (from a different sensor pipeline), the least squares fit algorithm is used to match the data values.

電漿處理之進展已提供半導體產業的成長。為取得具競爭性的優勢,半導體元件製造商需保持對處理環境的嚴密掌控,俾使消耗最少並生產高品質的半導體元件。Advances in plasma processing have provided growth in the semiconductor industry. To achieve competitive advantages, semiconductor component manufacturers need to maintain tight control of the processing environment, minimizing consumption and producing high quality semiconductor components.

保持嚴密掌控的一種方法係藉由辨識一製程終點。如本文所論,詞彙終點意指一製程(如矽層蝕刻)已達到或接近完成時之時間點。辨識終點的程序可像辨識具最大變化的信號一樣簡單。然而,信號變化不一定總與終點同時。其他因素(如管道雜訊)會導致信號圖形改變。One way to maintain tight control is by identifying a process endpoint. As used herein, a terminology term refers to the point in time at which a process (such as a germanium layer etch) has reached or is near completion. The procedure for identifying the endpoint can be as simple as identifying the signal with the greatest change. However, signal changes do not always coincide with the end point. Other factors, such as pipe noise, can cause signal patterns to change.

為利於討論,圖1呈現建構終點演算法之一種簡單方法。舉例而言,如圖1所述的方法係經常由專家使用者手動執行之。To facilitate discussion, Figure 1 presents a simple method of constructing an endpoint algorithm. For example, the method as described in Figure 1 is often performed manually by an expert user.

舉例而言,考量測試基板正被處理中的情況。因為有不同類型的基板,所以測試基板的類型傾向與用於生產環境中的基板類型相同。舉例而言,若在生產期間使用特定圖形的基板,使用相似圖形的基板作為測試基板。For example, consider the situation in which the test substrate is being processed. Since there are different types of substrates, the type of test substrate tends to be the same as the type of substrate used in a production environment. For example, if a substrate of a particular pattern is used during production, a substrate of similar pattern is used as the test substrate.

在第一步驟102,為基板取得資料。在一實例中,當處理基板時,感測器(如壓力計、光學放射光譜儀(OES,optical emission spectrometer)、溫度感測器等等)取得資料。可從數以百計(若非數以千計)的感測器管道蒐集資料。In a first step 102, data is acquired for the substrate. In one example, a sensor (such as a pressure gauge, an optical emission spectrometer (OES), a temperature sensor, etc.) acquires data when processing the substrate. Data can be collected from hundreds (if not thousands) of sensor pipelines.

在已處理基板之後,可分析已蒐集的資料。因為有過多資料可用,在數以千計的信號流中要找出終點是相當具有挑戰性的任務,經常需要具備該機具與配方的深度知識。因此,專家使用者通常負責執行該分析任務。After the substrate has been processed, the collected data can be analyzed. Because there is too much data available, finding the end point in thousands of signal streams is a challenging task, often requiring in-depth knowledge of the tool and recipe. Therefore, the expert user is usually responsible for performing the analysis task.

在下一步驟104,專家使用者會針對一個以上的信號檢視信號圖形的變化。專家使用者利用一個以上的軟體程式來協助分析。在一實例中,軟體程式為一簡單分析工具,執行簡單計算與分析。在另一實例中,軟體程式為簡單的資料視覺化程式,舉例而言,係用以圖形化描繪信號歷程。In the next step 104, the expert user will review the changes in the signal pattern for more than one signal. Expert users use more than one software program to assist with analysis. In one example, the software program is a simple analysis tool that performs simple calculations and analysis. In another example, the software program is a simple data visualization program, for example, to graphically depict a signal history.

然而,即使有專家使用者的專業知識與經驗,由感測器取得且可用以分析的資料量仍會多到難以招架。因此,辨識終點特徵記號的任務可能是令人卻步的任務。在一實例中,在OES感測器管道中有超過2,000個波長測量結果。因為終點資料亦可在其他感測器管道(如提供關於溫度、壓力、電壓等等資料的感測器管道)中找到,若是需要分析每個信號與信號組合,專家使用者會面臨無法克服的任務。However, even with the expertise and experience of expert users, the amount of data that can be obtained by the sensor and that can be analyzed can be overwhelming. Therefore, the task of identifying the endpoint feature tokens can be a daunting task. In one example, there are more than 2,000 wavelength measurements in the OES sensor pipeline. Because the endpoint data can also be found in other sensor pipelines (such as sensor pipelines that provide information on temperature, pressure, voltage, etc.), if you need to analyze each signal and signal combination, expert users will face insurmountable task.

如可預期的,根據應用,若干信號可提供優於其他信號的終點資料。舉例而言,二信號A與B皆具有終點資料。然而,因為信號B具有少於信號A的雜訊,信號B可提供較佳的終點特徵記號。假設有幾十或幾百個信號,為了終點特徵記號分析資料組的任務(更別提最佳終點特徵記號)會變得極度乏味且耗時的過程。As can be expected, depending on the application, several signals can provide endpoint data that is superior to other signals. For example, both signals A and B have endpoint data. However, since signal B has less noise than signal A, signal B provides a better end point signature. Assuming tens or hundreds of signals, the task of analyzing the data set for the end point feature notation (not to mention the best end point feature mark) can become extremely tedious and time consuming.

專家使用者在分析資料時會找尋信號變化(如信號圖形的變化)作為終點的徵兆。舉例而言,若是信號為向下傾斜,信號斜率的峰值便代表變化。雖然在過去手動辨識信號變化一直為乏味的任務,然而近年來,隨著信號變化變得較不明顯,此任務變得更加困難。對於用以處理基板上的小型開放區域之配方而言更是如此。在一實例中,正被處理(如蝕刻)的開放區域小到(如<1%的基板區域)信號變化極為細微,以致人眼幾乎無法察覺。Expert users will look for signal changes (such as changes in signal patterns) as a sign of the endpoint when analyzing the data. For example, if the signal is tilted downward, the peak value of the signal slope represents a change. Although manual identification of signal changes has been a tedious task in the past, in recent years, as signal changes have become less noticeable, this task has become more difficult. This is especially true for formulations that process small open areas on the substrate. In one example, the open area being processed (e.g., etched) is so small (e.g., <1% of the substrate area) that the signal changes are so subtle that the human eye is barely noticeable.

為利於分析,專家使用者會刪除其認為與辨識終點無關的資料值。縮小資料組的一種方法包括辨識並刪除專家使用者不預期終點會發生的信號流之區域。換句話說,專家使用者限縮其終點搜尋於信號流中的標的區域,其係經常位於預終點域與後終點域之間。因為找出並琢磨終點特徵記號的成本很高(在專家時間上),所以目標為令預終點與後終點域盡可能地大,以限制剩餘要找尋終點的區域。To facilitate analysis, expert users delete data values that they believe are not related to the endpoint of the identification. One way to narrow down a data set involves identifying and deleting areas of the signal flow that the expert user would not expect to end. In other words, the expert user limits its endpoint to the target area in the signal stream, which is often located between the pre- and post-end fields. Since the cost of finding and honing the end point feature is high (in expert time), the goal is to make the pre- and post-end fields as large as possible to limit the area in which the remaining end points are sought.

因為專家使用者通常熟悉製程,專家使用者可藉由僅分析精選信號進一步縮小資料組。精選信號包括基於專家使用者的經驗會包含終點資料之信號或信號組合。通常,當信號組合係作為一群組來分析時,該信號組合經常來自單一信號感測器來源。一般而言,因為感測器之間的差異會使得相關性分析難以(若非無法)手動執行,所以不會結合來自不同感測器來源的資料。Because expert users are often familiar with the process, expert users can further narrow down the data set by analyzing only the selected signals. The featured signal includes a signal or combination of signals that will contain the endpoint data based on the experience of the expert user. Typically, when signal combinations are analyzed as a group, the combination of signals often comes from a single source of signal sensors. In general, because differences between sensors can make correlation analysis difficult, if not impossible, to perform manually, data from different sensor sources is not combined.

如可預期的,僅由一過濾資料組運作會增加不慎將最佳終點特徵記號刪除之風險。換句話說,藉由過濾資料,專家使用者假定終點特徵記號(更別提最佳終點特徵記號)係位於過濾後所剩信號的其中之一。因此,在所剩信號中所辨識的終點特徵記號不必然是最佳終點特徵記號。As can be expected, the operation of only one filter data set will increase the risk of inadvertently deleting the best endpoint feature mark. In other words, by filtering the data, the expert user assumes that the endpoint feature signature (not to mention the best endpoint signature) is one of the remaining signals after filtering. Therefore, the endpoint feature signature identified in the remaining signal is not necessarily the best endpoint signature.

在已辨識信號變化之後,專家使用者執行驗證分析,判定信號變化作為終點候選值之穩健性。舉例而言,專家使用者會分析信號歷程,判定該信號變化之獨特性。若是該信號變化並不獨特(即在信號歷程中發生不止一次),該信號便從資料組中刪除。專家使用者接著便重回其乏味的任務,在其他信號中辨識「難以捉摸」的終點。After the signal change has been identified, the expert user performs a verification analysis to determine the robustness of the signal change as the endpoint candidate. For example, an expert user analyzes the signal history and determines the uniqueness of the signal change. If the signal change is not unique (ie, occurs more than once in the signal history), the signal is removed from the data set. Expert users then return to their tedious tasks and identify "hard-to-find" endpoints in other signals.

在下一步驟106,一組過濾器(如一組數位過濾器)係用在資料組中以移除雜訊並平順資料。舉例而言,可用的過濾器實例非限制性地包括時序過濾器、頻率過濾器。雖然對資料組使用過濾器會減少資料組的雜訊,但因為過濾器亦會增加信號的即時延遲,所以通常會審慎使用過濾器。In the next step 106, a set of filters (such as a set of digital filters) is used in the data set to remove noise and smooth the data. For example, examples of filters that may be used include, without limitation, a timing filter, a frequency filter. Although the use of filters for data sets reduces the noise of the data set, filters are often used with caution because they also increase the immediate delay of the signal.

在若干情況下,執行多變量分析(如主成分分析或部分最小平方法)以分析資料。執行多變量分析以進一步縮小資料組。為了使用多變量分析,專家使用者需要定義終點特徵的形狀(如曲線)。換句話說,即使尚未辨識出終點候選值,專家使用者被指望要預設終點的形狀。藉由預定終點形狀,多變量分析本質上刪除未呈現預期形狀的信號。在一實例中,若是終點形狀係定義為波峰,未呈現此形狀的信號便被刪除。因此,若是最佳終點特徵記號不具有「期望」形狀,就會錯過該最佳終點特徵記號。In several cases, multivariate analysis (such as principal component analysis or partial least squares methods) is performed to analyze the data. Perform multivariate analysis to further narrow down the data set. In order to use multivariate analysis, expert users need to define the shape of the endpoint feature (such as a curve). In other words, even if the end point candidate value has not been recognized, the expert user is expected to predetermine the shape of the end point. By predetermining the endpoint shape, multivariate analysis essentially removes signals that do not exhibit the desired shape. In one example, if the end shape is defined as a peak, the signal that does not exhibit this shape is deleted. Therefore, if the best end point feature mark does not have the "expected" shape, the best end point feature mark will be missed.

如由前述可知,從過多資料中辨識單一終點特徵記號之任務可為令人卻步的任務且執行起來耗時(若非以週計算)。另外,一旦辨識出終點特徵記號,僅會執行極少或不執行信號或信號組合作為終點特徵記號的合適性之定量分析。在一實例中,為驗證作為終點特徵記號的信號變化,專家使用者分析其他信號,在約略相同的時間帶中找尋相似的信號變化。然而,考量專家使用者已花費大量時間辨識第一終點特徵記號,專家使用者可能不會總是有時間、資源以及/或是意願驗證結果。As can be seen from the foregoing, the task of identifying a single endpoint feature token from too much data can be a prohibitive task and can be time consuming to perform (if not weekly). In addition, once the endpoint feature signature is identified, only a minimal or no execution signal or combination of signals is performed as a quantitative analysis of the suitability of the endpoint signature. In one example, to verify signal changes as endpoint feature signatures, the expert user analyzes other signals to find similar signal changes in approximately the same time zone. However, considering that the expert user has spent a significant amount of time identifying the first endpoint feature token, the expert user may not always have time, resources, and/or willingness to verify the outcome.

在下一步驟108,專家使用者基於轉變的本質挑選終點演算法的型態。通常,終點演算法的型態係基於譜線的形狀,舉例而言,其代表終點。在一實例中,終點可由斜率變化代表。因此,專家使用者會提議取決於斜率的演算法。In the next step 108, the expert user selects the type of the endpoint algorithm based on the nature of the transition. Typically, the type of endpoint algorithm is based on the shape of the line, which for example represents the endpoint. In one example, the endpoint can be represented by a change in slope. Therefore, expert users will propose algorithms that depend on the slope.

此外,終點演算法係基於可提供最佳終點特徵記號之導數。然而,終點特徵記號的一階導數(如斜率的變化)可能無法提供最佳終點演算法。舉例而言,斜率的二階導數(如反曲點)反而可提供較佳的終點演算法。不僅能辨識終點特徵記號還能辨識終點特徵記號所相關的最佳終點演算法之能力需要少數使用者(即使是專家使用者)擁有的專業知識。In addition, the endpoint algorithm is based on the derivative that provides the best endpoint signature. However, the first derivative of the endpoint signature (such as a change in slope) may not provide an optimal endpoint algorithm. For example, the second derivative of the slope (such as the inflection point) may provide a better endpoint algorithm. The ability to identify not only the endpoint signature but also the best endpoint algorithm associated with the endpoint signature requires the expertise of a small number of users, even expert users.

在下一步驟110,最佳化以及/或是測試演算法的設定值。一旦已辨識出終點演算法,終點演算法便轉化為生產終點演算法。因為測試環境與生產環境之間存有差異,在將終點演算法移至生產前需要調整終點演算法的設定值。舉例而言,要調整的設定值非限制性地包括平順過濾器、延遲時間、演算法型態的特定設定值等等。In the next step 110, the settings of the algorithm are optimized and/or tested. Once the endpoint algorithm has been identified, the endpoint algorithm is transformed into a production endpoint algorithm. Because there is a difference between the test environment and the production environment, the setpoint of the endpoint algorithm needs to be adjusted before moving the endpoint algorithm to production. For example, the set values to be adjusted include, without limitation, a smoothing filter, a delay time, a specific set value of an algorithm type, and the like.

在一實例中,在測試環境中用以平順資料的過濾器在生產環境中可能導致無法接受的即時延遲。如本文所論,即時延遲意指未過濾信號變化與過濾信號變化之間的時間差。舉例而言,信號的波峰可能發生在製程中的第40秒。然而,在使用過濾器之後,直到5秒之後才會產生波峰。若是終點演算法係偕同過濾器設定值一起使用,在終點演算法辨識終點之前基板可能會蝕刻過度。為了使即時延遲最小,必須調整過濾器。In one example, filters used to smooth data in a test environment can cause unacceptable immediate delays in a production environment. As discussed herein, immediate delay refers to the time difference between an unfiltered signal change and a filtered signal change. For example, the peak of the signal may occur in the 40th second of the process. However, after using the filter, peaks are not generated until after 5 seconds. If the endpoint algorithm is used with the filter setpoint, the substrate may be over-etched before the endpoint algorithm recognizes the endpoint. In order to minimize the immediate delay, the filter must be adjusted.

在將終點演算法移向生產之前,會執行測試以判定是否已最佳化設定值。在一實例中,使用終點演算法於已用來建構終點演算法的資料組上。若是終點演算法使用調整的設定值正確辨識終點,就視該設定值為最佳。然而,若是終點演算法無法正確辨識終點,就必須調整設定值。在設定值為最佳之前必須執行多次測試(透過試誤法)。Before moving the endpoint algorithm to production, a test is performed to determine if the setpoint has been optimized. In one example, an endpoint algorithm is used on the data set that has been used to construct the endpoint algorithm. If the endpoint algorithm correctly recognizes the endpoint using the adjusted setpoint, the setpoint is considered to be optimal. However, if the endpoint algorithm does not correctly identify the endpoint, the setpoint must be adjusted. Multiple tests must be performed before the set value is optimal (through trial and error).

在下一步驟112,針對在終點演算法執行穩健性測試進行判定。若是已執行穩健性測試(步驟114),便使用該終點演算法於與其他基板相關的資料組。在一實例中,可處理第二測試基板並蒐集資料。接著就使用終點演算法於第二資料組中。若是該終點演算法能夠辨識終點,就視該終點演算法為穩健,並沿用該終點演算法到生產上(步驟116)。然而,若是終點演算法無法辨識終點,就視該終點演算法為不夠穩健,而專家使用者便回到步驟104,重新開始辨識另一終點候選值與建構另一終點演算法之任務。At next step 112, a determination is made for performing a robustness test at the endpoint algorithm. If the robustness test has been performed (step 114), the endpoint algorithm is used for the data sets associated with the other substrates. In one example, the second test substrate can be processed and data collected. The endpoint algorithm is then used in the second data set. If the endpoint algorithm is able to recognize the endpoint, then the endpoint algorithm is considered robust and proceeds to production using the endpoint algorithm (step 116). However, if the endpoint algorithm is unable to recognize the endpoint, then the endpoint algorithm is considered to be less robust, and the expert user returns to step 104 to resume recognizing the other endpoint candidate and constructing another endpoint algorithm.

考量穩健性測試需要時間來執行與分析,許多終點演算法係被沿用到生產環境中而未經歷穩健性測試。換句話說,步驟112經常被視為建構終點演算法的選擇性步驟。Considering the robustness test takes time to perform and analyze, many end-point algorithms are used in the production environment without undergoing robustness testing. In other words, step 112 is often viewed as an optional step in constructing an endpoint algorithm.

如由圖1可知,建構終點演算法的方法大多為手動程序,其經常由具專業知識與經驗的專家執行複雜的分析。考量資源的限制,移至生產上的終點演算法可能缺乏量化支持。另外,因為在合理時間內,單一人員不可能有辦法分析所有信號以及/或是信號組合,所建構的終點演算法對該製程而言可能不總是最佳終點演算法。As can be seen from Figure 1, most of the methods for constructing the endpoint algorithm are manual procedures, which often perform complex analysis by experts with expertise and experience. Considering the limitations of resources, the endpoint algorithm that moves to production may lack quantitative support. In addition, because within a reasonable time, a single person cannot have a way to analyze all signals and/or signal combinations, the constructed end-point algorithm may not always be the best end-point algorithm for the process.

因此,建構穩健的終點演算法之簡化方法備受期待。Therefore, a simplified approach to constructing robust endpoint algorithms is highly anticipated.

本發明一實施例係關於一種自動辨識一最佳終點演算法之方法,其用以鑑定在一電漿處理系統中處理基板的期間之一製程終點。該方法包括在該電漿處理系統中處理至少一個基板的期間, 從數個感測器接收感測器資料,其中該感測器資料包括從數個感測器管道而來的數個信號流。該方法亦包括辨識一終點域,其中該終點域為預計會發生該製程終點的一概略區間。該方法更包括分析該感測器資料以產生一組可能終點特徵記號。該方法還包括轉化該組可能終點特徵記號成為一組最佳終點演算法。該方法另外尚包括引入該組最佳終點演算法的一最佳終點演算法至生產環境中。An embodiment of the invention is directed to a method of automatically identifying an optimal endpoint algorithm for identifying a process endpoint during processing of a substrate in a plasma processing system. The method includes during processing of at least one substrate in the plasma processing system, The sensor data is received from a plurality of sensors, wherein the sensor data includes a plurality of signal streams from a plurality of sensor tubes. The method also includes identifying a endpoint domain, wherein the endpoint domain is a summary interval at which an end of the process is expected to occur. The method further includes analyzing the sensor data to generate a set of possible endpoint feature signatures. The method also includes converting the set of possible endpoint feature tokens into a set of optimal endpoint algorithms. The method additionally includes introducing an optimal endpoint algorithm of the set of optimal endpoint algorithms into the production environment.

上述發明內容係僅關於本文所揭露之本發明眾多實施例的其中一者,而非意圖用以限制本發明範疇,其係在本文申請專利範圍中提出。本發明的這些及其他特點將在下述本發明的實施方式中偕同隨附圖式而予以詳述。The above summary is only one of the many embodiments of the invention disclosed herein, and is not intended to limit the scope of the invention. These and other features of the present invention will be described in detail in the embodiments of the invention described below.

本發明現將參照如隨附圖式所示的數個實施例詳細描述之。在下列描述中,為提供對本發明的透徹了解,提出大量具體細節。然而,熟習本技術者當可明白在不具若干或全部該具體細節下,仍可施行本發明。在其他狀況下,為避免不亦要的干擾本發明,並未詳述熟知的製程步驟以及/或是結構。The invention will now be described in detail with reference to a number of embodiments as illustrated in the accompanying drawings. In the following description, numerous specific details are set forth However, it will be apparent to those skilled in the art that the present invention may be practiced without some or all of the specific details. In other instances, well known process steps and/or structures have not been described in detail to avoid undesired interference with the present invention.

以下描述包括方法與技術之各式實施例。應當謹記在心本發明可能亦涵蓋製造產品,包括用以執行本發明技術實施例的電腦可讀指令所儲存之電腦可讀媒體。舉例而言,電腦可讀媒體包括半導體、磁性、光磁性、光學式、或用以儲存電腦可讀編碼的其他形式之電腦可讀媒體。另外,本發明亦涵蓋施行本發明實施例之設備。此類設備包括電路(專用以及/或是可程式化)以執行本發明實施例有關任務。此類設備的實例包括經適當程式撰寫的通用型電腦以及/或是專用運算裝置,並包括適合本發明實施例有關的各式任務之電腦/運算裝置與專用/可程式化電路之組合。The following description includes various embodiments of the methods and techniques. It should be borne in mind that the present invention may also cover manufactured products, including computer readable media stored by computer readable instructions for performing embodiments of the present technology. By way of example, computer readable media includes semiconductor, magnetic, photomagnetic, optical, or other forms of computer readable media for storing computer readable code. In addition, the present invention also encompasses an apparatus for carrying out embodiments of the present invention. Such devices include circuitry (dedicated and/or programmable) to perform the tasks associated with embodiments of the present invention. Examples of such devices include general purpose computers and/or dedicated computing devices that are suitably programmed and include a combination of computer/computing devices and special/programmable circuits suitable for the various tasks associated with embodiments of the present invention.

依照本發明實施例,提供用以自動發覺並最佳化終點演算法之方法。本發明實施例包括建構終點演算法之方法,其判定一製程的最佳終點。本發明實施例亦包括在生產環境中使用終點演算 法之就地方法。In accordance with an embodiment of the present invention, a method for automatically detecting and optimizing an endpoint algorithm is provided. Embodiments of the invention include methods of constructing an endpoint algorithm that determines the optimal endpoint of a process. Embodiments of the invention also include the use of endpoint calculus in a production environment Local method of law.

在本文件中,各式實施例係使用終點作為實例來討論。然而,本發明並非限於終點,而是包括會發生在製程中的任何變化點。因此,這些論述係意圖作為實例,而本發明並不限於所示實例。In this document, various embodiments are discussed using an endpoint as an example. However, the invention is not limited to the end point, but includes any point of change that can occur in the process. Accordingly, the discussion is intended as an example, and the invention is not limited to the illustrated examples.

在本發明實施例中,提供建構終點演算法之方法。本方法包括簡單、具親和性、自動化的方法,無論專家與非專家使用者皆可使用。該方法包括取得感測器資料、自動定義概略終點期間、自動分析資料、自動判定一組可能終點特徵記號、與自動引入最佳終點演算法至生產上。In an embodiment of the invention, a method of constructing an end point algorithm is provided. The method includes a simple, affinitive, automated method that can be used by both expert and non-expert users. The method includes obtaining sensor data, automatically defining a rough endpoint, automatically analyzing data, automatically determining a set of possible endpoint feature tokens, and automatically introducing an optimal endpoint algorithm to production.

在先前技術中,單一人員純粹是因為資料量而無法在合理的時間期間內能分析所有信號。不像先前技術,在實施例中的分析涉及極少或完全沒有人為介入。取而代之,在一實施例中,可運用演算法引擎來執行分析。因為資料係自動而非手動分析,所以可分析更多(若非全部)的資料。在一實施例中,所有可能信號皆受分析,且各信號係以其與可能終點特徵記號的相關性為特徵。此外,因為現由演算法引擎執行分析,分析就不再僅限於從單一基板而來的資料檔。所以,可分析更多資料以建構一組穩健的最佳終點演算法。In the prior art, a single person was unable to analyze all signals within a reasonable period of time simply because of the amount of data. Unlike prior art, the analysis in the examples involved little or no human intervention. Instead, in one embodiment, an algorithmic engine can be employed to perform the analysis. Because the data is analyzed automatically, not manually, more (if not all) of the data can be analyzed. In one embodiment, all possible signals are analyzed and each signal is characterized by its correlation with possible endpoint feature signatures. In addition, because the analysis is now performed by the algorithmic engine, the analysis is no longer limited to data files from a single substrate. Therefore, more information can be analyzed to construct a robust set of optimal endpoint algorithms.

演算法引擎為一軟體程式,其係基於與終點之標的區域(如終點域)相關的時間函數。一旦使用者已定義概略終點區域(如終點域),便可使用該演算法引擎分析資料,發覺一組最佳終點特徵記號。The algorithm engine is a software program based on a time function associated with the region of the endpoint (such as the endpoint field). Once the user has defined a rough end point area (such as the end point field), the algorithm engine can be used to analyze the data and find a set of best end point feature marks.

在一實施例中,演算法引擎辨識一組可能形狀,其代表多變量分析中的可能終點特徵記號。不像先前技術,使用者不需要對於每個可能終點特徵記號的形狀擁有先前知識(如波峰、波谷、間距等等)。取而代之的是,一旦演算法引擎已辨識可能終點特徵記號,演算法引擎會產生可能形狀的列表。因此,由演算法引擎所辨識的可能終點特徵記號並不限於單一形狀(如曲線)。在一實施例中,演算法引擎係配置為執行已知終點候選值之資料調節與測試,以辨識一製程的最佳終點特徵記號。作為時間函數之各參數 變異性可藉由執行逐步迴歸導出,俾使在整個製程歷程的一串有限時間區間中,判定各資料輸入參數的斜率。在一實施例中,用在計算斜率的時間區間係可設定為在接續資料中去除雜訊,且一併去除與終點不相關之資料慢速偏移。In an embodiment, the algorithm engine identifies a set of possible shapes that represent possible endpoint feature tokens in the multivariate analysis. Unlike prior art, the user does not need to have prior knowledge (such as peaks, troughs, spacing, etc.) for the shape of each possible endpoint feature token. Instead, once the algorithm engine has identified the possible endpoint feature tokens, the algorithm engine produces a list of possible shapes. Therefore, the possible endpoint feature signatures recognized by the algorithm engine are not limited to a single shape (such as a curve). In one embodiment, the algorithm engine is configured to perform data conditioning and testing of known endpoint candidate values to identify the best endpoint feature token for a process. Parameters as a function of time The variability can be derived by performing a stepwise regression to determine the slope of each data input parameter over a finite time interval throughout the manufacturing process. In one embodiment, the time interval used to calculate the slope can be set to remove noise in the splicing data and to remove the slow drift of the data unrelated to the endpoint.

在一實施例中,OES信號會根據隨製程推展而可見的變異性之變化程度(即斜率)分組。在一實例中,會把具相似斜率變異的連續波長分在一起。藉由依斜率分組OES信號,需要分析的信號量與該信號中的雜訊會大幅減少。此結果會以信號與信號群組的列表呈現,其最可能包含與終點相關的資訊。In one embodiment, the OES signals are grouped according to the degree of change (i.e., slope) of the variability that is visible as the process progresses. In one example, successive wavelengths with similar slope variations are grouped together. By grouping the OES signals by the slope, the amount of signal to be analyzed and the noise in the signal are greatly reduced. This result is presented as a list of signal and signal groups, most likely containing information related to the endpoint.

在一實施例中,執行揀選以減少可能的終點特徵記號量。在一實施例中,穩健的終點特徵記號為存在於所有已處理基板中的信號。在一實例中,若是一終點特徵記號並非在所有或極大部分的測試基板中之特徵,則該終點特徵記號並不穩健而可刪除。然而,若是一終點特徵記號出現在控制基板上,因為控制基板為並未接受蝕刻而因此不應產生終點特徵記號之基板,所以該終點特徵記號亦可刪除。In an embodiment, picking is performed to reduce the amount of possible end point feature tokens. In an embodiment, the robust endpoint feature symbol is a signal present in all processed substrates. In one example, if an endpoint feature signature is not a feature in all or a very large portion of the test substrate, the endpoint feature signature is not robust and can be deleted. However, if an end point feature mark appears on the control substrate, the end point feature mark can also be deleted because the control substrate is a substrate that does not receive etching and therefore should not produce an end point feature mark.

在一實施例中執行多變量分析。在一實例中,由該分析所得結果係用作為部分最小平方鑑別分析(PLS-DA,Partial Least Squares Discriminant Analysis)的輸入,俾使在每個依斜率群組中的各個別信號之權重為最佳。在一實施例中,並非要求使用者輸入終點曲線的預期形狀(如先前技術所要求),而是PLS-DA會依照終點之標的區域以及由演算法引擎所提供之形狀。Multivariate analysis is performed in an embodiment. In one example, the results obtained from the analysis are used as input to Partial Least Squares Discriminant Analysis (PLS-DA), so that the weight of each individual signal in each group of slopes is the highest. good. In one embodiment, the user is not required to enter the desired shape of the endpoint curve (as required by the prior art), but rather the area under which the PLS-DA will follow the endpoint and the shape provided by the algorithm engine.

在一實施例中,由OES信號而來經PLS-DA的結果可與其他感測器信號聯合並結合。在一實施例中,可重複PLS-DA於新的聯合信號組,以產生精實的最佳可能終點特徵記號組合,其具有高對比與即時終點計算的低運算負荷。In one embodiment, the results of the PLS-DA from the OES signal can be combined and combined with other sensor signals. In one embodiment, the PLS-DA can be repeated to the new joint signal set to produce a refined best possible endpoint feature signature combination with high computational load for high contrast and immediate endpoint calculations.

在一實施例中,可能終點特徵記號係轉化為具最小可能延遲時間的終點演算法。不能轉化為具最小即時延遲的即時終點演算法之可能終點特徵記號會被刪除。換句話說,若是與演算法相關的即時延遲超過最大可容許的即時延遲,則該即時終點演算法便 會被捨棄。In an embodiment, the possible endpoint feature token is converted to an endpoint algorithm with the smallest possible delay time. Possible end feature signatures that cannot be converted to an immediate endpoint algorithm with minimal immediate delay are deleted. In other words, if the immediate delay associated with the algorithm exceeds the maximum allowable immediate delay, then the immediate endpoint algorithm Will be abandoned.

在一實施例中,會基於有用資訊對無關資訊之比率(此後稱為保真率)以及/或是即時延遲將可能終點演算法分等。在一實例中,具高保真率與低即時延遲之演算法係視為較穩健的演算法。一旦已執行分等,即時終點演算法之其中一者會被選出並移至生產中。In one embodiment, the possible endpoint algorithms are ranked based on the ratio of useful information to irrelevant information (hereinafter referred to as fidelity) and/or immediate delay. In one example, algorithms with high fidelity and low real-time latency are considered to be more robust algorithms. Once the grading has been performed, one of the immediate endpoint algorithms will be selected and moved to production.

參照圖式與下列論述可更加了解本發明的特徵與優點。The features and advantages of the present invention will become more apparent from the understanding of the appended claims.

圖2呈現在本發明實施例中的一簡單流程圖,描繪建構終點演算法之方法。2 presents a simplified flow diagram depicting a method of constructing an end point algorithm in an embodiment of the present invention.

在第一步驟202,藉由處理腔室中的一組感測器取得資料。舉例而言,考慮測試基板正被處理中的情況。當基板正被處理中,資料(例如光放射、電子信號、壓力資料、電漿資料等等)係藉由一組感測器蒐集。In a first step 202, data is retrieved by a set of sensors in the processing chamber. For example, consider the case in which the test substrate is being processed. When the substrate is being processed, data (eg, light emissions, electrical signals, pressure data, plasma data, etc.) are collected by a set of sensors.

在一實施例中,用以建構最佳終點演算法的資料可能來自不止一個測試基板。藉由併入由不同測試基板而來的資料,可消除與基板之間的材料差異或製程變異性有關的雜訊。在一實施例中,資料可來自不同腔室所處理的測試基板。藉由併入來自不同腔室的資料,亦可消除與腔室之間的差異相關的雜訊。In one embodiment, the data used to construct the optimal endpoint algorithm may come from more than one test substrate. By incorporating data from different test substrates, noise associated with material differences or process variability between the substrates can be eliminated. In an embodiment, the data may be from test substrates processed in different chambers. By incorporating data from different chambers, noise associated with differences between the chambers can also be eliminated.

在下一步驟204,辨識預計會發生製程終點之概略時間期間。換句話說,定義一終點域。不像先前技術,終點域為一概略且相對寬廣的時間區間,而演算法引擎將在其中搜尋有效的終點特徵記號。舉例而言,由於搜尋的高速,使用者可擴展終點域以併入在先前技術中為預終點域之若干部分。藉由如此,演算法引擎能辨識在製程中較早發生的終點特徵記號。這些提早的終點降低該製程損害下面半導體層之風險。In the next step 204, a summary time period in which the end of the process is expected to occur is identified. In other words, define a destination field. Unlike the prior art, the endpoint field is a rough and relatively wide time interval in which the algorithm engine will search for valid endpoint feature signatures. For example, due to the high speed of the search, the user can extend the endpoint field to incorporate portions of the prior art that are pre-finished domains. In this way, the algorithm engine can identify the end point signatures that occur earlier in the process. These early endpoints reduce the risk that the process will damage the underlying semiconductor layer.

在下一步驟206,啟動演算法引擎以執行資料分析與產生一組最佳終點演算法。在一實施例中,因為並非手動執行資料分析,所以可分析來自不止一個基板的資料檔。熟習本技術者知悉即使涉及較大量的資料,因為未在受分析基板中共同尋得之終點特徵會被刪除,所以由多個基板而來的資料檔所建構之終點演算法傾向較為穩健。In the next step 206, the algorithm engine is launched to perform data analysis and generate a set of optimal endpoint algorithms. In one embodiment, data files from more than one substrate can be analyzed because data analysis is not performed manually. Those skilled in the art are aware that even if a relatively large amount of data is involved, the endpoint algorithm constructed by the plurality of substrates tends to be more robust because the endpoint features that are not commonly found in the analyzed substrate are deleted.

圖3A與3B呈現本發明實施例的一簡單流程圖,描繪執行資料組分析及產生最佳終點演算法列表之步驟與演算法引擎。為利於討論,將偕同圖5一併討論圖3A與3B。圖5呈現一方塊圖,描繪在一實施例中資料組推展成為最佳終點演算法列表之實例。3A and 3B present a simplified flow diagram of an embodiment of the present invention depicting the steps and algorithm engine for performing a data set analysis and generating a list of best end point algorithms. To facilitate discussion, Figures 3A and 3B will be discussed in conjunction with Figure 5. Figure 5 presents a block diagram depicting an example of a data set progression as a list of best end-point algorithms in an embodiment.

在第一步驟302,演算法引擎對可用資料組(初始資料群組502)執行線性配適。換句話說,各信號係基於時間區間分成均勻片段(資料群組504)。為使雜訊最少並使辨識終點特徵之可能性最大,片段的長度相當重要。若片段長度太長,終點會被平均掉而錯過該終點。若片段太短,斜率(如之後在步驟304所述)會受雜訊影響。在一實施例中,可預定片段長度的最小與最大量。在一實施例中,最小片段長度較1/10秒長。在另一實施例中,針對在10Hz所蒐集的資料,最大片段長度較2秒短。In a first step 302, the algorithm engine performs a linear adaptation of the available data sets (initial data group 502). In other words, each signal is divided into uniform segments (data group 504) based on time intervals. In order to minimize noise and maximize the likelihood of identifying endpoint characteristics, the length of the segment is quite important. If the segment length is too long, the end point will be averaged out and the end point will be missed. If the segment is too short, the slope (as described later in step 304) will be affected by noise. In an embodiment, the minimum and maximum amounts of segment length may be predetermined. In an embodiment, the minimum segment length is longer than 1/10 seconds. In another embodiment, the maximum segment length is shorter than 2 seconds for data collected at 10 Hz.

在下一步驟304,演算法引擎會針對各片段計算斜率及其相應的斜率雜訊值(配適斜率的不確定性)。在一實例中,若是信號A已被分成十個片段,便會判定信號A的十個斜率與斜率雜訊值(資料群組506A)。在一實施例中,斜率雜訊值可用以使該斜率標準化(資料群組506B)。In the next step 304, the algorithm engine calculates the slope and its corresponding slope noise value for each segment (adjusting the uncertainty of the slope). In one example, if signal A has been divided into ten segments, the ten slopes and slope noise values of signal A are determined (data group 506A). In an embodiment, the slope noise value can be used to normalize the slope (data group 506B).

此外或另外,演算法引擎會使用由斜率雜訊值所縮放的斜率作為輸入來執行多變量分析(如部分最小平方分析),基於來自感測器管道組合的資料,產生斜率與斜率雜訊值的額外列表(亦包括於資料群組506A)。在一實施例中,斜率雜訊值可用以使斜率標準化(亦包括於資料群組506B)。Additionally or alternatively, the algorithm engine uses the slope scaled by the slope noise value as an input to perform multivariate analysis (eg, partial least squares analysis), based on data from the sensor pipeline combination, to generate slope and slope noise values. An additional list (also included in data group 506A). In an embodiment, the slope noise value can be used to normalize the slope (also included in data group 506B).

一旦已建構各片段的斜率與斜率雜訊值列表(資料群組506A),在下一步驟306,演算法引擎會辨識帶有終點資料的信號候選值。在一實例中,演算法引擎分析各信號(與其片段),量化各信號斜率的變異量。量化斜率變異量的一種方法包括計算標準化斜率的標準差。在一實例中,高標準差代表斜率發生變化的信號。在此實例中,高標準差代表帶有可能終點資料之信號。因此,具高斜率變異(相對於斜率雜訊)之信號會被辨識為信號候選值(資料群組508)。Once the slope and slope noise value lists for each segment have been constructed (data group 506A), in the next step 306, the algorithm engine will identify the signal candidate values with the endpoint data. In one example, the algorithm engine analyzes each signal (with its fragments) and quantifies the amount of variation in the slope of each signal. One method of quantifying the amount of slope variation involves calculating the standard deviation of the normalized slope. In one example, the high standard deviation represents a signal that the slope changes. In this example, the high standard deviation represents a signal with possible endpoint data. Therefore, a signal with a high slope variation (relative to slope noise) is recognized as a signal candidate (data group 508).

因為OES資料包括大量的波長測量結果(至少2,000個信號),在下一步驟308,演算法引擎會藉由結合具相似斜率變異的連續波長至信號波長頻帶(資料群組510)來減少OES信號量。在一實例中,若是在255奈米與208奈米之間有100個波長測量結果,且該波長測量結果具有相似的斜率變異,則該100個波長測量結果會被結合至一個單一信號波長頻帶,且在分析中被視為一個單一單元。舉例而言,若是有2,000個波長測量結果,則可能僅需分析10個信號波長頻帶。藉由將波長測量結果分組,因為需要分析的物件量已大幅減少,所以可減輕運算負荷。Since the OES data includes a large number of wavelength measurements (at least 2,000 signals), in the next step 308, the algorithm engine reduces OES semaphores by combining successive wavelengths with similar slope variations to the signal wavelength band (data group 510). . In one example, if there are 100 wavelength measurements between 255 nm and 208 nm and the wavelength measurements have similar slope variations, the 100 wavelength measurements are combined into a single signal wavelength band. And is considered a single unit in the analysis. For example, if there are 2,000 wavelength measurements, then only 10 signal wavelength bands may need to be analyzed. By grouping the wavelength measurement results, the amount of objects that need to be analyzed has been greatly reduced, so that the computational load can be reduced.

在下一步驟310,演算法引擎辨識標準化信號列表(資料群組506B),其會在下面製程中捕捉偏移與雜訊。換句話說,演算法引擎辨識適於標準化的信號,因其具有高斜率但低變異(相對於斜率雜訊)。標準化信號(資料群組512)代表在感測器信號中移除一般模式變化(如偏移、雜訊等等)之可能候選值。In the next step 310, the algorithm engine recognizes the normalized signal list (data group 506B), which captures the offset and noise in the following process. In other words, the algorithm engine identifies signals that are suitable for normalization because of its high slope but low variation (relative to slope noise). The normalized signal (data group 512) represents a possible candidate value for removing general mode variations (eg, offset, noise, etc.) in the sensor signal.

在下一步驟312,演算法引擎藉由結合具相似斜率變異的連續波長至標準化信號波長頻帶(資料群組514)來減少標準化OES信號量。步驟312在某種程度上與步驟308類似,除步驟312係用在標準化OES信號。In the next step 312, the algorithm engine reduces the normalized OES semaphore by combining successive wavelengths with similar slope variations to the normalized signal wavelength band (data group 514). Step 312 is somewhat similar to step 308 except that step 312 is used to normalize the OES signal.

在下一步驟314,演算法針對所有信號管道產生高對比感測器信號(資料群組508)、高對比感測器信號波長頻帶(資料群組510)、標準化信號(資料群組512)、與標準化波長頻帶(資料群組514)之列表。在一實施例中,將各資料組中的信號分等。因為已量化各信號中的終點資料之可能性,所以可將各資料組中的信號分等。在一實例中,相較具低斜率變異的信號,具高斜率變異的信號具有較高分等。In the next step 314, the algorithm generates a high contrast sensor signal (data group 508), a high contrast sensor signal wavelength band (data group 510), a normalized signal (data group 512), and A list of standardized wavelength bands (data group 514). In one embodiment, the signals in each data set are graded. Since the possibility of endpoint data in each signal has been quantified, the signals in each data set can be graded. In one example, signals with high slope variability have higher grading than signals with low slope variability.

在下一步驟316,演算法引擎搜尋高對比感測器信號以及/或是頻帶以尋找終點域中的可能終點特徵記號(資料群組516)。在一實施例中,終點特徵記號可透過一組分類特徵(波峰、波谷、反曲點等等)而辨識。在一實施例中可預定該組分類特徵。可在不同的信號導數中搜尋該組分類特徵。In the next step 316, the algorithm engine searches for high contrast sensor signals and/or frequency bands to find possible endpoint feature signatures in the endpoint domain (data group 516). In an embodiment, the endpoint feature symbol can be identified by a set of classification features (peaks, troughs, inflection points, etc.). The set of classification features can be predetermined in an embodiment. The set of classification features can be searched for in different signal derivatives.

在一實施例中,可應用過濾器於資料群組508與510上,以移除雜訊並平順資料。在一實施例中,應用在資料群組上的過濾器為時間對稱過濾器。時間對稱過濾器在一特定點之前與之後使用等量的點以計算平均值。此過濾器僅能用於後處理模式,而非在即時的製程執行期間。不像時間不對稱過濾器,時間對稱過濾器傾向引起最小的時間扭曲以及/或是振幅扭曲。所以,過濾資料會經歷最小的即時延遲。In an embodiment, filters may be applied to data groups 508 and 510 to remove noise and smooth data. In an embodiment, the filter applied to the data group is a time symmetric filter. The time symmetric filter uses an equal number of points before and after a particular point to calculate an average. This filter can only be used in post-processing mode, not during immediate process execution. Unlike time-asymmetric filters, time-symmetric filters tend to cause minimal time warping and/or amplitude distortion. Therefore, filtering data will experience minimal immediate delay.

如由前述可知,各資料群組包括過量的信號。在一實施例中,因為已將各資料群組分等,所以資料分析時間可藉由減少搜尋值而大幅降低。在一實例中,並非搜尋資料群組508中的所有物件,而是僅分析前10個高對比感測器信號。可搜尋的物件量可能不同。執行回收遞減分析以判定最佳數量。As can be seen from the foregoing, each data group includes an excess of signals. In an embodiment, since each data group has been graded, the data analysis time can be greatly reduced by reducing the search value. In one example, instead of searching for all of the items in the data group 508, only the top 10 high contrast sensor signals are analyzed. The amount of objects that can be searched may vary. Perform a recycling reduction analysis to determine the optimal amount.

在下一步驟318,演算法引擎搜尋高對比感測器信號/頻帶(資料群組508與510)對標準化感測器信號/頻帶(資料群組512與514)之比率以尋找終點域中的可能終點特徵記號(資料群組518)。藉由採用各高對比感測器信號/頻帶對各標準化感測器信號/頻帶之比率,可辨識的可能終點特徵記號會具有較高的保真率。In the next step 318, the algorithm engine searches for a ratio of high contrast sensor signals/bands (data groups 508 and 510) to normalized sensor signals/bands (data groups 512 and 514) to find possible in the endpoint domain. Endpoint feature symbol (data group 518). By using the ratio of each high contrast sensor signal/band to each normalized sensor signal/band, the identifiable possible end feature signature will have a higher fidelity.

在下一步驟320,演算法引擎搜尋資料結果(資料群組516與518)以將組合(資料群組520)分等。換句話說,執行匹配以結合具相似形狀與時間期間之終點特徵記號,以增進對比與信號對雜訊比率(SNR,the signal-to-noise ratio)。在一實施例中,在相同導數上執行線性組合。換句話說,即使發生在第一導數的峰值與發生在第二導數的峰值在相同的時間區間內發生,仍不會結合兩者。In the next step 320, the algorithm engine searches for data results (data groups 516 and 518) to rank the combination (data group 520). In other words, matching is performed to combine endpoint signatures with similar shapes and time periods to enhance the signal-to-noise ratio (SNR). In an embodiment, linear combining is performed on the same derivative. In other words, even if the peak occurring in the first derivative occurs in the same time interval as the peak occurring in the second derivative, the two are not combined.

在下一步驟322,演算法引擎執行穩健性測試以移除可能的非重複性終點特徵記號。在一實施例中,穩健性測試會確認多個基板間的一致性。在一實例中,若是可能終點特徵記號在多個基板間並不一致,舉例而言,因為該終點特徵記號可能為雜訊/偏移的結果,所以會捨棄該可能終點特徵記號。In the next step 322, the algorithm engine performs a robustness test to remove possible non-repetitive endpoint feature signatures. In an embodiment, the robustness test will confirm consistency between multiple substrates. In an example, if the possible end point feature mark does not coincide between the plurality of substrates, for example, because the end point feature mark may be the result of the noise/offset, the possible end point feature mark is discarded.

在另一實例中,穩健性測試會確認測試基板與控制基板(或一組控制基板)之間的相似性。舉例而言,考量測試基板為具有一部 分為裸露矽區的光阻遮罩之基板。控制基板具有與測試基板相同的特性,除了控制基板係全由光阻遮罩所覆蓋。測試基板與控制基板兩者皆經歷相同的基板處理。然而,因為控制基板的全部表面皆由光阻遮罩覆蓋,所以控制基板應當不會呈現蝕刻的跡象。因此,控制基板應當不具有終點。因此,若是控制基板的變化匹配可能終點特徵記號之其中一者,則會捨棄該匹配的可能終點特徵記號。In another example, the robustness test confirms the similarity between the test substrate and the control substrate (or a set of control substrates). For example, consider the test substrate as having one The substrate is divided into a photoresist mask of the exposed area. The control substrate has the same characteristics as the test substrate except that the control substrate is entirely covered by the photoresist mask. Both the test substrate and the control substrate undergo the same substrate processing. However, since the entire surface of the control substrate is covered by the photoresist mask, the control substrate should not exhibit signs of etching. Therefore, the control substrate should have no end point. Therefore, if the change of the control substrate matches one of the possible end point signatures, the matching possible end feature signature will be discarded.

在另一實例中,穩健性測試包括測試獨特性。在一實例中,被測試的可能終點特徵記號具有波峰特徵。分析信號的剩餘部分以判定其他的波峰特徵是否發生在該可能終點特徵記號發生之前或之後。若辨識出其他波峰,就刪除該可能終點特徵記號。In another example, the robustness test includes test uniqueness. In an example, the possible endpoint feature signature being tested has a peak feature. The remainder of the signal is analyzed to determine if other peak features occur before or after the possible endpoint feature signature occurs. If other peaks are identified, the possible end feature signature is deleted.

上述為不同的穩健性評斷標準實例,其可用以刪除非真正的終點特徵記號之特徵記號。藉由應用穩健性測試於可能終點特徵記號上,就可進一步確定真正終點之可能終點特徵記號列表。The above are examples of different robustness criteria that can be used to delete feature signatures for non-true endpoint feature tokens. By applying a robustness test to the possible endpoint feature tokens, a list of possible endpoint feature tokens for the true endpoint can be further determined.

在一實施例中,演算法引擎執行多變量相關性分析,例如基於相關性的部分最小平方鑑別分析(PLS-DA),以使可能終點特徵記號列表為最佳。如先前所提,多變量分析(如基於相關性的PLS分析)通常要求先定義終點特徵記號的形狀。換句話說,多變量分析需要知道特徵記號曲線的預期形狀。在先前技術中,使用者通常為必須提供終點特徵記號形狀(如波峰、波谷、斜率等等)的人。考量判定終點候選值的形狀(在先前技術中)耗時(若非以週計算),使用者通常僅能提供一個形狀特徵作為多變量分析的輸入。不像先前技術,由演算法引擎所辨識的可能終點特徵記號具有不同的形狀特徵。因此,可輸入至多變量相關性分析的輸入量係依照已被辨識的可能終點特徵記號的形狀。In an embodiment, the algorithmic engine performs a multivariate correlation analysis, such as a partial least squares discriminant analysis (PLS-DA) based on correlation, to optimize the list of possible endpoint feature tokens. As previously mentioned, multivariate analysis (such as correlation-based PLS analysis) typically requires the shape of the endpoint feature signature to be defined first. In other words, multivariate analysis requires knowledge of the expected shape of the signature curve. In the prior art, the user is typically a person who must provide an endpoint signature shape (such as a crest, trough, slope, etc.). Considering that the shape of the endpoint candidate value (in the prior art) is time consuming (if not calculated in weeks), the user typically can only provide one shape feature as an input to the multivariate analysis. Unlike prior art, the possible endpoint feature signatures recognized by the algorithm engine have different shape characteristics. Thus, the input that can be input to the multivariate correlation analysis is in accordance with the shape of the possible endpoint feature signature that has been identified.

在一實施例中,使形狀/多個形狀(由可能終點特徵記號列表所決定)與各信號相關聯,以產生可能終點特徵記號與各感測器管道中信號之間的相關矩陣。相關矩陣包括可應用至每個信號的最佳權重以及/或是單位,用以使各可能終點特徵記號的對比最佳。雖然多變量分析可幫助最佳化可能終點特徵記號列表(資料群組 522),並不需要多變量相關性分析以辨識最佳終點演算法列表。並且,即使相關性的PLS分析係用於前述實例中,本發明並非限於相關性的PLS分析,而可為任何型態之相關性的多變量分析。In one embodiment, the shape/shapes (as determined by the list of possible endpoint feature tokens) are associated with each signal to produce a correlation matrix between the possible endpoint signatures and the signals in each of the sensor conduits. The correlation matrix includes the optimal weights and/or units that can be applied to each signal to optimize the comparison of the possible endpoint feature signatures. Although multivariate analysis can help optimize the list of possible endpoint feature markers (data groups) 522), multivariate correlation analysis is not required to identify the best endpoint algorithm list. Moreover, even if a correlated PLS analysis is used in the foregoing examples, the invention is not limited to a correlated PLS analysis, but can be a multivariate analysis of the correlation of any type.

在下一步驟324,演算法引擎轉化剩餘的可能終點特徵記號(資料群組522)成具最小即時延遲的即時終點演算法(資料群組524)。換句話說,演算法引擎係配置為轉化可能終點特徵記號成以最小即時延遲於生產期間執行的終點演算法。在一實施例中,會自動計算各終點演算法所需的設定值。在一實例中,即時過濾器的設定值係自動最佳化為以最小過濾器延遲在每個處理測試基板上召喚終點。即時過濾器係成串並使用串列記憶體組件的初始值以最小化發生於無限脈衝回應過濾器的初始瞬變脈波。這對於終點接近資料歷程開端之終點演算法係特別重要。In the next step 324, the algorithm engine converts the remaining possible endpoint feature tokens (data group 522) into an immediate endpoint algorithm with a minimum immediate delay (data group 524). In other words, the algorithmic engine is configured to translate the possible endpoint feature tokens into an endpoint algorithm that is executed during production with minimal immediate delay. In one embodiment, the setpoints required for each endpoint algorithm are automatically calculated. In one example, the set value of the instant filter is automatically optimized to summon the endpoint on each processed test substrate with a minimum filter delay. The instant filters are serialized and use the initial values of the serial memory components to minimize the initial transient pulses that occur in the infinite impulse response filter. This is especially important for the end-point algorithm that ends at the beginning of the data history.

演算法引擎會針對各可能終點特徵記號提供即時終點演算法。在一實施例中,若是演算法引擎無法建構即時終點演算法,則不會提供終點演算法。在一實例中,若是演算法引擎無法建構能在每個處理測試基板上召喚/辨識終點之即時終點演算法,則不會提供終點演算法。The algorithm engine provides an immediate endpoint algorithm for each possible endpoint feature token. In an embodiment, if the algorithm engine cannot construct an immediate endpoint algorithm, the endpoint algorithm will not be provided. In one example, if the algorithmic engine is unable to construct an immediate endpoint algorithm that can summon/identify the endpoint on each processing test substrate, then the endpoint algorithm will not be provided.

在下一步驟326,演算法引擎刪除超過最大可容許即時延遲的終點演算法。在一實例中,若是辨識終點所需時間超過預定門檻,因為該即時延遲會導致生產期間的過度蝕刻基板,所以會刪除該終點演算法。In the next step 326, the algorithm engine deletes the endpoint algorithm that exceeds the maximum allowable immediate delay. In one example, if the time required to identify the endpoint exceeds a predetermined threshold, the endpoint algorithm will be deleted because the immediate delay will result in over-etching of the substrate during production.

在下一步驟328,演算法引擎刪除未通過一組穩健性評斷標準之即時終點演算法。穩健性評斷標準實例包括以最小即時延遲在所有測試基板上辨識終點。換句話說,各終點演算法係需要在所有測試基板上辨識終點。穩健性評斷標準的另一實例包括不在控制基板上辨識終點。換句話說,若是終點演算法能在控制基板上辨識終點,該終點演算法就不夠穩健,而會被捨棄該終點演算法。In the next step 328, the algorithm engine deletes the immediate endpoint algorithm that does not pass a set of robustness criteria. Examples of robustness criteria include identifying endpoints on all test substrates with minimal immediate delay. In other words, each endpoint algorithm needs to identify the endpoint on all test substrates. Another example of a robustness criteria includes not identifying an endpoint on a control substrate. In other words, if the endpoint algorithm can identify the endpoint on the control substrate, the endpoint algorithm is not robust enough and the endpoint algorithm will be discarded.

在下一步驟330,演算法引擎會將即時終點演算法分等。在一實施例中,分等係基於保真率以及/或是即時延遲。在一實例中,若是二個即時終點演算法具有相同的保真率,則具有較小即時延 遲的終點演算法之分等會較高。在另一實例中,若是二個終點演算法具有相同的即時延遲,則具有較高保真率的終點演算法會具有較高等級。In the next step 330, the algorithm engine will classify the immediate endpoint algorithm. In an embodiment, the rating is based on fidelity and/or immediate delay. In an example, if two instant endpoint algorithms have the same fidelity, then there is a small delay. The late endpoint algorithm will be ranked higher. In another example, if the two endpoint algorithms have the same immediate delay, the endpoint algorithm with higher fidelity will have a higher rank.

回頭參照圖2,在下一步驟208,即時終點演算法係移至生產上。在一實施例中,具最高分等的即時終點演算法係自動移至生產上。在另一實施例中,移至生產上的即時終點演算法係可由使用者控制,因而讓使用者能選擇最符合其需求的終點演算法。在一實例中,即時延遲為元件製造商所擔憂。為此,該元件製造商會寧願選擇較不穩健的終點演算法,若是其可提供較短的延遲時間。Referring back to Figure 2, in the next step 208, the immediate endpoint algorithm is moved to production. In one embodiment, the instant score algorithm with the highest score is automatically moved to production. In another embodiment, the instant endpoint algorithm moved to production is controllable by the user, thereby allowing the user to select the endpoint algorithm that best meets their needs. In an example, immediate latency is a concern for component manufacturers. To this end, the component manufacturer would prefer a less robust endpoint algorithm if it provides a shorter delay.

實證經驗顯示藉由自動化製程,建構最佳的即時終點演算法之任為可在幾分鐘內執行。另外,因為演算法引擎係配置為在人員輸入為最小的情況下執行分析,建構終點演算法的程序現可由非專家使用者執行。因此,若是該方法無法針對已知終點域產出可接受的終點演算法列表,使用者可迅速重新定義終點域並回傳給演算法引擎,以在數分鐘內產生新的終點演算法列表。Empirical evidence shows that by automating the process, the best real-time endpoint algorithm can be implemented in minutes. In addition, because the algorithmic engine is configured to perform analysis with minimal human input, the procedure for constructing the endpoint algorithm can now be performed by non-expert users. Thus, if the method fails to produce an acceptable endpoint algorithm list for the known endpoint domain, the user can quickly redefine the endpoint field and pass it back to the algorithm engine to generate a new endpoint algorithm list in minutes.

圖4呈現本發明實施例的一簡單流程圖,其用以實行即時終點演算法於生產環境中。4 presents a simplified flow diagram of an embodiment of the present invention for implementing an instant endpoint algorithm in a production environment.

在第一步驟402執行一配方。A recipe is executed in a first step 402.

在下一步驟404,藉由一組感測器在基板處理期間取得資料。In the next step 404, data is acquired during substrate processing by a set of sensors.

在下一步驟406,就地利用終點演算法,分析資料以辨識製程終點。在一實施例中,利用運算引擎分析資料。因為可能蒐集大量的資料,運算引擎配置為處理大量資料的高速處理模組。資料會從感測器直接送出,而不需先經過製造主控制器或甚至是製程模組控制器。由Huang等人於2009年9片8日提出申請的美國專利申請案第12/555,674號描述適合用以執行該分析之分析電腦實例。In the next step 406, the endpoint algorithm is used in situ to analyze the data to identify the end of the process. In one embodiment, the data is analyzed using a computing engine. Because it is possible to collect a large amount of data, the computing engine is configured as a high-speed processing module that processes large amounts of data. The data is sent directly from the sensor without going through the manufacturing master or even the process module controller. An example of an analytical computer suitable for performing this analysis is described in U.S. Patent Application Serial No. 12/555,674, filed on Jan.

在下一步驟408,系統作出關於是否辨識終點之判定。At next step 408, the system makes a determination as to whether to identify the end point.

若是尚未辨識終點,則系統會回到步驟404。If the endpoint has not been identified, the system will return to step 404.

然而,若是已辨識終點,則在下一步驟410就停止配方。However, if the endpoint has been identified, the recipe is stopped at the next step 410.

如由前述可知,本發明一個以上的實施例提供辨識最佳的即時終點演算法之方法。藉由自動化分析,該方法本質上刪除對專家使用者之需求。經由如本文所述的方法,可將較穩健的終點演算法移至生產中。並且,因為構建終點演算法所需時間已大幅減少,更新或建構新的終點演算法係不再是資源密集及耗時的任務。As can be appreciated from the foregoing, one or more embodiments of the present invention provide a method of identifying an optimal instant endpoint algorithm. By automated analysis, this approach essentially removes the need for expert users. A more robust endpoint algorithm can be moved into production via the methods as described herein. And because the time required to build an endpoint algorithm has been greatly reduced, updating or constructing a new endpoint algorithm is no longer a resource-intensive and time-consuming task.

雖然已用數個較佳實施例描述本發明,但仍有落在本發明範疇中的變更、替換、與均等物。雖然本文提供各式實例,該實例係意圖為作為例證而非限制本發明。並且,即使本文件自始至終皆使用終點作為實例,本發明亦可用於變化點,其為發生在處理期間的信號變化事件。Although the invention has been described in terms of several preferred embodiments, modifications, alternatives, and equivalents are possible within the scope of the invention. While the examples are provided herein, the examples are intended to be illustrative and not restrictive. Moreover, even though the document uses the end point as an example throughout, the present invention can also be used for a change point, which is a signal change event that occurs during processing.

並且,為求方便,本文提供標題與發明內容,但其不應用以建構本文的申請專利範圍之範疇。另外,摘要係撰寫為高度簡化的形式,且為求方便而提供於此,因而不應用以建構或限制整體發明,其係陳述於申請專利範圍中。若是本文使用詞彙「組」,該詞彙係意圖具有一般理解的數學意義,包括零、一、或多於一的構件。應當注意實行本發明的方法與設備有許多替代方式。因而應解釋下列隨附申請專利範圍為包括所有變更、替換、與均等物,只要其係落在本發明的真實精神與範疇中。Moreover, for the sake of convenience, the headings and the inventive content are provided herein, but they are not intended to be used in the scope of the patent application scope herein. In addition, the abstract is written in a highly simplified form and is provided for convenience, and thus is not intended to constitute or limit the overall invention, which is set forth in the claims. If the term "group" is used herein, the vocabulary is intended to have a general understanding of the mathematical meaning, including zero, one, or more than one component. It should be noted that there are many alternative ways of implementing the methods and apparatus of the present invention. Therefore, the following claims are intended to cover all such modifications, alternatives, and equivalents, as long as they fall within the true spirit and scope of the invention.

102-116‧‧‧步驟102-116‧‧‧Steps

202-208‧‧‧步驟202-208‧‧‧Steps

302-330‧‧‧步驟302-330‧‧‧Steps

402-410‧‧‧步驟402-410‧‧‧Steps

502‧‧‧初始資料群組502‧‧‧Initial data group

504‧‧‧信號均勻片段504‧‧‧Signal uniform fragment

506A、506B、508-524‧‧‧資料群組506A, 506B, 508-524‧‧‧ data groups

本發明藉由隨附圖式的圖中實例非限制性地說明之,且其中類似的參考數字表示相似的元件,以及其中:圖1呈現建構終點演算法之一種簡單方法。The present invention is illustrated by way of non-limiting example in the accompanying drawings, in which like reference numerals refer to the like elements, and in which: FIG. 1 shows a simple method of constructing an end point algorithm.

圖2呈現本發明實施例的一簡單流程圖,描繪建構終點演算法的一種方法。2 presents a simplified flow diagram of an embodiment of the present invention depicting a method of constructing an end point algorithm.

圖3A與3B呈現本發明實施例的一簡單流程圖,描繪執行發覺最佳終點演算法的步驟與演算法引擎。3A and 3B present a simplified flow diagram of an embodiment of the present invention depicting the steps and algorithm engine for performing the discovery of the best endpoint algorithm.

圖4呈現本發明實施例的一簡單流程圖,其用以實行該最佳終點演算法於生產環境中。4 presents a simplified flow diagram of an embodiment of the present invention for implementing the best endpoint algorithm in a production environment.

圖5呈現本發明實施例的一方塊圖,描繪資料組推展為最佳 終點演算法列表之實例。Figure 5 shows a block diagram of an embodiment of the present invention, depicting the data set to be the best An example of a list of endpoint algorithms.

202-208...步驟202-208. . . step

Claims (14)

一種自動辨識一最佳終點演算法之方法,其用以鑑定在一電漿處理系統中處理基板的期間之一製程終點,包含:在該電漿處理系統中處理至少一個基板的期間,從數個感測器接收感測器資料,其中該感測器資料包括從數個感測器管道而來的數個信號流,該感測器資料係從多於一個的基板蒐集而來;辨識一終點域,其中該終點域為預計會發生該製程終點的一概略期間;分析該感測器資料以產生一組可能終點特徵記號;轉化該組可能終點特徵記號成為一組最佳終點演算法;以及引入該組最佳終點演算法的一最佳終點法至生產環境中,其中該感測器資料之該分析包括對該感測器資料執行線性配適,以將從該數個信號流而來的各信號流基於時間區間分成數個片段。 A method for automatically identifying an optimal endpoint algorithm for identifying a process endpoint during processing of a substrate in a plasma processing system, comprising: during processing of at least one substrate in the plasma processing system Sensors receive sensor data, wherein the sensor data includes a plurality of signal streams from a plurality of sensor tubes, the sensor data is collected from more than one substrate; a endpoint field, wherein the endpoint field is a rough period at which an end point of the process is expected to occur; analyzing the sensor data to generate a set of possible endpoint feature signatures; converting the set of possible endpoint feature tokens into a set of optimal endpoint algorithms; And introducing an optimal endpoint method of the set of optimal endpoint algorithms into the production environment, wherein the analyzing of the sensor data comprises performing linear adaptation on the sensor data to be from the plurality of signal streams Each of the incoming signal streams is divided into segments based on the time interval. 如申請專利範圍第1項之自動辨識一最佳終點演算法之方法,其中該數個片段之各片段係均勻的。 For example, the method of automatically identifying an optimal endpoint algorithm in claim 1 of the patent scope, wherein each segment of the plurality of segments is uniform. 如申請專利範圍第1項之自動辨識一最佳終點演算法之方法,其中為了產生該組可能終點特徵記號之第一組可能終點特徵記號,該感測器資料之該分析包括針對該感測器資料,計算第一組斜率與第一組相應斜率雜訊值,其中針對該數個片段之各片段計算一斜率與一相應斜率雜訊值,計算該斜率的斜率變異,以從該數個信號流中辨識出一組高對比信號,其中該組高對比信號具有高斜率變異,結合具相似斜率變異的連續波長成為一組信號波長頻帶,把該高對比信號分等,把該組信號波長頻帶分等,以及藉由應用一組分類特徵於至少部分的該高對比信號與該組信 號波長頻帶,辨識該第一組可能終點特徵記號,其中該組分類特徵包括波峰、波谷、與反曲點之其中至少一者。 A method of automatically identifying an optimal endpoint algorithm as in claim 1 wherein the analysis of the sensor data includes the sensing for generating the first set of possible endpoint feature tokens of the set of possible endpoint feature tokens Data, calculating a first set of slopes and a first set of corresponding slope noise values, wherein a slope and a corresponding slope noise value are calculated for each of the plurality of segments, and a slope variation of the slope is calculated to obtain from the plurality of segments A set of high contrast signals is identified in the signal stream, wherein the set of high contrast signals has a high slope variation, and a continuous wavelength having a similar slope variation becomes a set of signal wavelength bands, the high contrast signal is graded, and the set of signal wavelengths is set. Band grading, and by applying a set of classification features to at least a portion of the high contrast signal and the set of letters The first wavelength endpoint identifies the first set of possible endpoint feature signatures, wherein the set of classification features includes at least one of a peak, a trough, and an inflection point. 如申請專利範圍第3項之自動辨識一最佳終點演算法之方法,其中為了產生該組可能終點特徵記號之第二組可能終點特徵記號,該感測器資料之該分析包括藉由結合由該第一組斜率的相應斜率雜訊值所縮放之斜率以及該第一組相應斜率雜訊值,執行多變量分析,以產生一組標準化的斜率與一組標準化的相應斜率雜訊值,計算該組標準化的斜率之斜率變異,以從該數個信號流中辨識出標準化信號,其中該標準化信號具有高斜率與低變異,結合具相似斜率變異的連續波長成為一組標準化信號波長頻帶,把該標準化信號分等,把該組標準化信號波長頻帶分等,以及應用一組分類特徵於該高對比信號與一組信號波長頻帶對該標準化信號與該組標準化信號波長頻帶之比率,以產生該第二組可能終點特徵記號。 A method for automatically identifying an optimal endpoint algorithm as in claim 3, wherein the analysis of the sensor data comprises combining by a second set of possible endpoint feature signatures for the set of possible endpoint feature signatures Performing a multivariate analysis to generate a set of normalized slopes and a set of normalized corresponding slope noise values, the slope of the first set of slopes corresponding to the slope of the slope and the first set of corresponding slope noise values, to calculate A slope variation of the normalized slope of the set to identify a normalized signal from the plurality of signal streams, wherein the normalized signal has a high slope and a low variation, and a continuous wavelength having a similar slope variation becomes a set of standardized signal wavelength bands, The normalized signal is categorized to classify the set of normalized signal wavelength bands and apply a set of classification features to the high contrast signal and a set of signal wavelength bands to the ratio of the normalized signal to the set of normalized signal wavelength bands to produce the The second set of possible endpoint feature tokens. 如申請專利範圍第3項之自動辨識一最佳終點演算法之方法,其中轉化該組可能終點特徵記號成為該組最佳終點演算法包括若是該組可能終點特徵記號之第一可能終點特徵記號與第二可能終點特徵記號具有相似的形狀與時間期間,結合該第一可能終點特徵記號與該第二可能終點特徵記號,執行一穩健性測試以從該組可能終點特徵記號中移除可能的非重複性終點特徵記號,執行一多變量相關性分析以辨識該組可能終點特徵記號的一組最佳終點特徵記號,轉化該組最佳終點特徵記號成為一組具最小即時延遲之即時 終點演算法,其中該即時延遲係基於過濾器延遲,藉由執行下列之至少一者產生該組最佳終點演算法移除具有大於一預定門檻的相應即時延遲之即時終點演算法,以及若是該即時終點演算法無法通過一穩健性測試,刪除該即時終點演算法,以及把該組最佳終點演算法之各最佳終點演算法分等,其中該分等係基於保真率與該即時延遲之其中至少一者。 For example, the method of automatically identifying an optimal end point algorithm in claim 3, wherein converting the set of possible end point feature tokens into the set of best end point algorithms includes the first possible end point feature mark of the set of possible end point feature marks During a shape and time period similar to the second possible endpoint feature token, in conjunction with the first possible endpoint feature token and the second possible endpoint feature token, a robustness test is performed to remove possible from the set of possible endpoint feature tokens Non-repetitive endpoint feature signatures, performing a multivariate correlation analysis to identify a set of optimal endpoint signatures for the set of possible endpoint feature tokens, transforming the set of optimal endpoint signatures into a set of instants with minimal immediate delay An end point algorithm, wherein the immediate delay is based on filter delay, by performing at least one of: generating the set of best endpoint algorithms to remove an immediate endpoint algorithm having a corresponding immediate delay greater than a predetermined threshold, and if so The immediate endpoint algorithm cannot pass a robustness test, deletes the immediate endpoint algorithm, and ranks the best endpoint algorithms of the set of best endpoint algorithms based on the fidelity rate and the immediate delay. At least one of them. 如申請專利範圍第4項之自動辨識一最佳終點演算法之方法,其中轉化該組可能終點特徵記號成為該組最佳終點演算法包括若是該組可能終點特徵記號之第一可能終點特徵記號與第二可能終點特徵記號具有相似的形狀與時間期間,結合該第一可能終點特徵記號與該第二可能終點特徵記號,執行一穩健性測試以從該組可能終點特徵記號中移除可能的非重複性終點特徵記號,執行一多變量相關性分析以辨識該組可能終點特徵記號的一組最佳終點特徵記號,轉化該組最佳終點特徵記號成為一組具最小即時延遲之即時終點演算法,其中該即時延遲係基於過濾器延遲,藉由執行下列之至少一者產生該組最佳終點演算法移除具有大於一預定門檻的相應即時延遲之即時終點演算法,以及若是該即時終點演算法無法通過一穩健性測試,刪除該即時終點演算法,以及把該組最佳終點演算法之各最佳終點演算法分等,其中該分等係基於保真率與該即時延遲之其中至少一者。 For example, the method for automatically identifying an optimal end point algorithm in claim 4, wherein converting the set of possible end point feature tokens into the set of best end point algorithms includes the first possible end point feature mark of the set of possible end point feature marks During a shape and time period similar to the second possible endpoint feature token, in conjunction with the first possible endpoint feature token and the second possible endpoint feature token, a robustness test is performed to remove possible from the set of possible endpoint feature tokens Non-repetitive endpoint feature signatures, performing a multivariate correlation analysis to identify a set of optimal endpoint feature signatures for the set of possible endpoint feature tokens, transforming the set of optimal endpoint signatures into a set of immediate endpoint calculus with minimal immediate delay The method, wherein the immediate delay is based on a filter delay, by performing at least one of: generating the set of optimal endpoint algorithms to remove an immediate endpoint algorithm having a corresponding immediate delay greater than a predetermined threshold, and if the immediate endpoint The algorithm cannot pass a robustness test, delete the instant endpoint algorithm, and Each of the best endpoint algorithms of the set of best endpoint algorithms is categorized, wherein the score is based on at least one of a fidelity rate and the immediate delay. 如申請專利範圍第1項之自動辨識一最佳終點演算法之方法,其中該最佳終點演算法之引入係基於分等與一組使用者定義 條件之其中至少一者。 For example, the method for automatically identifying an optimal endpoint algorithm in claim 1 of the patent scope, wherein the introduction of the optimal endpoint algorithm is based on grading and a set of user definitions At least one of the conditions. 一種在一處理腔室中處理基板的期間鑑定一終點之方法,包含:在一基板上執行一配方;在基板處理期間從一組感測器接收處理資料;藉由應用一最佳終點演算法分析該處理資料;辨識一製程終點;以及停止該基板處理,其中該最佳終點演算法係由下列敘述所建構:在該電漿處理系統中處理至少一個基板的期間,從數個感測器接收感測器資料,其中該感測器資料包括從數個感測器管道而來的數個信號流,該感測器資料係從多於一個的基板蒐集而來;辨識一終點域,其中該終點域為預計會發生該製程終點的一概略期間;分析該感測器資料以產生一組可能終點特徵記號;轉化該組可能終點特徵記號成為一組最佳終點演算法;以及引入該組最佳終點演算法的一最佳終點法至生產環境中,其中該感測器資料之該分析包括對該感測器資料執行線性配適,以把從該數個信號流而來的各信號流基於時間區間分成數個片段。 A method of identifying an endpoint during processing of a substrate in a processing chamber, comprising: executing a recipe on a substrate; receiving processing data from a set of sensors during substrate processing; applying an optimal endpoint algorithm Analyzing the processing data; identifying a process endpoint; and stopping the substrate processing, wherein the optimal endpoint algorithm is constructed by the following description: during processing of the at least one substrate in the plasma processing system, from a plurality of sensors Receiving sensor data, wherein the sensor data includes a plurality of signal streams from a plurality of sensor tubes, the sensor data being collected from more than one substrate; identifying a destination region, wherein The endpoint is a rough period at which an end of the process is expected to occur; the sensor data is analyzed to generate a set of possible endpoint feature tokens; the set of possible endpoint feature tokens is converted to a set of optimal endpoint algorithms; and the group is introduced An optimal endpoint method of the best endpoint algorithm into the production environment, wherein the analysis of the sensor data includes performing linear adaptation of the sensor data to Each signal stream from the plurality of signal streams based on the time interval is divided into several segments. 如申請專利範圍第8項之在一處理腔室中處理基板的期間鑑定一終點之方法,其中為了產生該組可能終點特徵記號之第一組可能終點特徵記號,該感測器資料之該分析包括針對該感測器資料,計算第一組斜率與第一組相應斜率雜訊值,其中針對該數個片段之各片段計算一斜率與一相應斜率雜訊值,計算該斜率的斜率變異,以從該數個信號流中辨識出一組高對比信號,其中該組高對比信號具有高斜率變異,結合具相似斜率變異的連續波長成為一組信號波長頻帶, 把該高對比信號分等,把該組信號波長頻帶分等,以及藉由應用一組分類特徵於至少部分的該高對比信號與該組信號波長頻帶,辨識該第一組可能終點特徵記號,其中該組分類特徵包括波峰、波谷、與反曲點之其中至少一者。 A method of identifying an endpoint during processing of a substrate in a processing chamber as in claim 8 wherein the analysis of the sensor data is performed to generate a first set of possible endpoint signatures for the set of possible endpoint signatures Included, for the sensor data, calculating a first set of slopes and a first set of corresponding slope noise values, wherein a slope and a corresponding slope noise value are calculated for each of the plurality of segments, and a slope variation of the slope is calculated, Identifying a set of high contrast signals from the plurality of signal streams, wherein the set of high contrast signals has a high slope variation, and a continuous wavelength having a similar slope variation becomes a set of signal wavelength bands, Classifying the high contrast signal, classifying the set of signal wavelength bands, and identifying the first set of possible end point signatures by applying a set of classification features to at least a portion of the high contrast signal and the set of signal wavelength bands, The group classification feature includes at least one of a peak, a trough, and an inflection point. 如申請專利範圍第9項之在一處理腔室中處理基板的期間鑑定一終點之方法,其中為了產生該組可能終點特徵記號之第二組可能終點特徵記號,該感測器資料之該分析包括藉由結合由該第一組斜率的相應斜率雜訊值所縮放之斜率以及該第一組相應斜率雜訊值,執行多變量分析,以產生一組標準化的斜率與一組標準化的相應斜率雜訊值,計算該組標準化的斜率之斜率變異,以從該數個信號流中辨識出標準化信號,其中該標準化信號具有高斜率與低變異,結合具相似斜率變異的連續波長成為一組標準化信號波長頻帶,把該標準化信號分等,把該組標準化信號波長頻帶分等,以及應用一組分類特徵於該高對比信號與一組信號波長頻帶對該標準化信號與該組標準化信號波長頻帶之比率,以產生該第二組可能終點特徵記號。 A method of identifying an endpoint during processing of a substrate in a processing chamber as in claim 9 wherein the analysis of the sensor data is performed to generate a second set of possible endpoint signatures for the set of possible endpoint signatures The performing multivariate analysis is performed by combining a slope scaled by respective slope noise values of the first set of slopes and the first set of corresponding slope noise values to generate a set of normalized slopes and a set of normalized respective slopes a noise value, a slope variation of the normalized slope of the set is calculated to identify a normalized signal from the plurality of signal streams, wherein the normalized signal has a high slope and a low variation, and the continuous wavelengths with similar slope variations become a set of normalization a signal wavelength band, classifying the normalized signal, classifying the set of normalized signal wavelength bands, and applying a set of classification features to the high contrast signal and a set of signal wavelength bands to the normalized signal and the set of normalized signal wavelength bands Ratio to generate the second set of possible endpoint feature signatures. 如申請專利範圍第9項之在一處理腔室中處理基板的期間鑑定一終點之方法,其中轉化該組可能終點特徵記號成為該組最佳終點演算法包括若是該組可能終點特徵記號之第一可能終點特徵記號與第二可能終點特徵記號具有相似的形狀與時間期間,結合該第一可能終點特徵記號與該第二可能終點特徵記號,執行一穩健性測試以從該組可能終點特徵記號中移除可能的非重複性終點特徵記號, 執行一多變量相關性分析以辨識該組可能終點特徵記號的一組最佳終點特徵記號,轉化該組最佳終點特徵記號成為一組具最小即時延遲之即時終點演算法,其中該即時延遲係基於過濾器延遲,藉由執行下列之至少一者產生該組最佳終點演算法移除具有大於一預定門檻的相應即時延遲之即時終點演算法,以及若是該即時終點演算法無法通過一穩健性測試,刪除該即時終點演算法,以及把該組最佳終點演算法之各最佳終點演算法分等,其中該分等係基於保真率與該即時延遲之其中至少一者。 A method of identifying an end point during processing of a substrate in a processing chamber as in claim 9 wherein converting the set of possible endpoint feature tokens into the set of optimal endpoint algorithms includes the first possible feature of the set of endpoint characteristics A possible end point feature mark has a similar shape and time period with the second possible end point feature mark, in conjunction with the first possible end point feature mark and the second possible end point feature mark, performing a robustness test to mark from the set of possible end point features Remove possible non-repetitive endpoint feature tokens, Performing a multivariate correlation analysis to identify a set of optimal endpoint feature tokens of the set of possible endpoint feature tokens, converting the set of optimal endpoint feature tokens into a set of instant endpoint algorithms with minimal immediate delay, wherein the instant delay system Based on the filter delay, the set of best endpoint algorithms is performed by performing at least one of the following to remove an immediate endpoint algorithm having a corresponding immediate delay greater than a predetermined threshold, and if the instant endpoint algorithm fails to pass a robustness Testing, deleting the immediate endpoint algorithm, and classifying each of the best endpoint algorithms of the set of optimal endpoint algorithms, wherein the ranking is based on at least one of a fidelity rate and the immediate delay. 如申請專利範圍第10項之在一處理腔室中處理基板的期間鑑定一終點之方法,其中轉化該組可能終點特徵記號成為該組最佳終點演算法包括若是該組可能終點特徵記號之第一可能終點特徵記號與第二可能終點特徵記號具有相似的形狀與時間期間,結合該第一可能終點特徵記號與該第二可能終點特徵記號,執行一穩健性測試以從該組可能終點特徵記號中移除可能的非重複性終點特徵記號,執行一多變量相關性分析以辨識該組可能終點特徵記號的一組最佳終點特徵記號,轉化該組最佳終點特徵記號成為一組具最小即時延遲之即時終點演算法,其中該即時延遲係基於過濾器延遲,藉由執行下列之至少一者產生該組最佳終點演算法移除具有大於一預定門檻的相應即時延遲之即時終點演算法,以及若是該即時終點演算法無法通過一穩健性測試,刪除該即時終點演算法,以及把該組最佳終點演算法之各最佳終點演算法分等,其中該分 等係基於保真率與該即時延遲之其中至少一者。 A method of identifying an end point during processing of a substrate in a processing chamber, as in claim 10, wherein converting the set of possible endpoint feature signatures into the set of optimal endpoint algorithms includes the first possible feature of the set of endpoint characteristics A possible end point feature mark has a similar shape and time period with the second possible end point feature mark, in conjunction with the first possible end point feature mark and the second possible end point feature mark, performing a robustness test to mark from the set of possible end point features Removing a possible non-repetitive endpoint feature signature, performing a multivariate correlation analysis to identify a set of optimal endpoint feature tokens for the set of possible endpoint feature tokens, converting the set of optimal endpoint feature tokens into a group with minimal instant A delayed immediate endpoint algorithm, wherein the immediate delay is based on filter delay, by performing at least one of the following: generating the set of optimal endpoint algorithms to remove an immediate endpoint algorithm having a corresponding immediate delay greater than a predetermined threshold, And if the instant endpoint algorithm fails to pass a robustness test, delete the instant Algorithms, and the algorithms of the end of each set of the best best classification algorithms end, wherein the sub- The system is based on at least one of a fidelity rate and the immediate delay. 如申請專利範圍第8項之在一處理腔室中處理基板的期間鑑定一終點之方法,其中該最佳終點演算法之該引入係基於分等與一組使用者定義條件之其中至少一者。 A method of identifying an end point during processing of a substrate in a processing chamber as in claim 8 wherein the introduction of the optimal endpoint algorithm is based on at least one of a ranking and a set of user defined conditions . 如申請專利範圍第8項之在一處理腔室中處理基板的期間鑑定一終點之方法,其中該數個片段之各片段係均勻的。A method of identifying an end point during processing of a substrate in a processing chamber as in claim 8 of the patent application, wherein each of the plurality of fragments is uniform.
TW099121511A 2009-06-30 2010-06-30 Methods for constructing an optimal endpoint algorithm TWI480917B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US22210209P 2009-06-30 2009-06-30
US22202409P 2009-06-30 2009-06-30

Publications (2)

Publication Number Publication Date
TW201112302A TW201112302A (en) 2011-04-01
TWI480917B true TWI480917B (en) 2015-04-11

Family

ID=43411705

Family Applications (5)

Application Number Title Priority Date Filing Date
TW099121513A TWI495970B (en) 2009-06-30 2010-06-30 Method and arrangement for detecting in-situ fast transient event
TW099121516A TWI509375B (en) 2009-06-30 2010-06-30 Methods and arrangements for implementing automatic in-situ process control scheme during execution of recipe
TW099121515A TWI484435B (en) 2009-06-30 2010-06-30 Methods and apparatus to predict etch rate uniformity for qualification of a plasma chamber
TW099121511A TWI480917B (en) 2009-06-30 2010-06-30 Methods for constructing an optimal endpoint algorithm
TW099121519A TWI536193B (en) 2009-06-30 2010-06-30 Methods and apparatus for predictive preventive maintenance of processing chambers

Family Applications Before (3)

Application Number Title Priority Date Filing Date
TW099121513A TWI495970B (en) 2009-06-30 2010-06-30 Method and arrangement for detecting in-situ fast transient event
TW099121516A TWI509375B (en) 2009-06-30 2010-06-30 Methods and arrangements for implementing automatic in-situ process control scheme during execution of recipe
TW099121515A TWI484435B (en) 2009-06-30 2010-06-30 Methods and apparatus to predict etch rate uniformity for qualification of a plasma chamber

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW099121519A TWI536193B (en) 2009-06-30 2010-06-30 Methods and apparatus for predictive preventive maintenance of processing chambers

Country Status (6)

Country Link
JP (5) JP5693573B2 (en)
KR (5) KR101741272B1 (en)
CN (5) CN102474968B (en)
SG (5) SG176565A1 (en)
TW (5) TWI495970B (en)
WO (5) WO2011002804A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102332383B (en) * 2011-09-23 2014-12-10 中微半导体设备(上海)有限公司 End point monitoring method for plasma etching process
US10128090B2 (en) 2012-02-22 2018-11-13 Lam Research Corporation RF impedance model based fault detection
US9502221B2 (en) 2013-07-26 2016-11-22 Lam Research Corporation Etch rate modeling and use thereof with multiple parameters for in-chamber and chamber-to-chamber matching
TWI677264B (en) * 2013-12-13 2019-11-11 美商蘭姆研究公司 Rf impedance model based fault detection
US10192763B2 (en) * 2015-10-05 2019-01-29 Applied Materials, Inc. Methodology for chamber performance matching for semiconductor equipment
US10269545B2 (en) * 2016-08-03 2019-04-23 Lam Research Corporation Methods for monitoring plasma processing systems for advanced process and tool control
US9972478B2 (en) * 2016-09-16 2018-05-15 Lam Research Corporation Method and process of implementing machine learning in complex multivariate wafer processing equipment
US11067515B2 (en) * 2017-11-28 2021-07-20 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for inspecting a wafer process chamber
CN108847381A (en) * 2018-05-25 2018-11-20 深圳市华星光电半导体显示技术有限公司 The method for testing substrate and extended testing system substrate service life
US10651097B2 (en) 2018-08-30 2020-05-12 Lam Research Corporation Using identifiers to map edge ring part numbers onto slot numbers
DE102019209110A1 (en) * 2019-06-24 2020-12-24 Sms Group Gmbh Industrial plant, in particular plant in the metal-producing industry or the aluminum or steel industry, and method for operating an industrial plant, in particular a plant in the metal-producing industry or the aluminum or steel industry
JP7289992B1 (en) * 2021-07-13 2023-06-12 株式会社日立ハイテク Diagnostic apparatus and diagnostic method, plasma processing apparatus and semiconductor device manufacturing system
US20230195074A1 (en) * 2021-12-21 2023-06-22 Applied Materials, Inc. Diagnostic methods for substrate manufacturing chambers using physics-based models
US20230260767A1 (en) * 2022-02-15 2023-08-17 Applied Materials, Inc. Process control knob estimation

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09306894A (en) * 1996-05-17 1997-11-28 Sony Corp Optimum emission spectrum automatic detecting system
JP2003151955A (en) * 2001-11-19 2003-05-23 Nec Kansai Ltd Plasma etching method
US20040004708A1 (en) * 2002-05-29 2004-01-08 Tokyo Electron Limited Method and system for data handling, storage and manipulation
WO2004102642A2 (en) * 2003-05-09 2004-11-25 Unaxis Usa Inc. Envelope follower end point detection in time division multiplexed processes
US6969619B1 (en) * 2003-02-18 2005-11-29 Novellus Systems, Inc. Full spectrum endpoint detection
TW200701293A (en) * 2005-06-16 2007-01-01 Unaxis Usa Inc Process change detection through the use of evolutionary algorithms

Family Cites Families (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272872A (en) * 1992-11-25 1993-12-28 Ford Motor Company Method and apparatus of on-board catalytic converter efficiency monitoring
JP3301238B2 (en) * 1994-10-25 2002-07-15 三菱電機株式会社 Etching method
JPH08148474A (en) * 1994-11-16 1996-06-07 Sony Corp Dry etching end point detecting method and device
US6197116B1 (en) * 1996-08-29 2001-03-06 Fujitsu Limited Plasma processing system
JP3630931B2 (en) * 1996-08-29 2005-03-23 富士通株式会社 Plasma processing apparatus, process monitoring method, and semiconductor device manufacturing method
US5993615A (en) * 1997-06-19 1999-11-30 International Business Machines Corporation Method and apparatus for detecting arcs
JP2001516940A (en) * 1997-09-17 2001-10-02 東京エレクトロン株式会社 Apparatus and method for detecting and preventing arcing in RF plasma systems
US5986747A (en) 1998-09-24 1999-11-16 Applied Materials, Inc. Apparatus and method for endpoint detection in non-ionizing gaseous reactor environments
US8617351B2 (en) * 2002-07-09 2013-12-31 Applied Materials, Inc. Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction
JP2001338856A (en) * 2000-05-30 2001-12-07 Tokyo Seimitsu Co Ltd Process controller for semiconductor manufacturing system
JP4554037B2 (en) * 2000-07-04 2010-09-29 東京エレクトロン株式会社 Consumable consumption level prediction method and deposited film thickness prediction method
US6567718B1 (en) * 2000-07-28 2003-05-20 Advanced Micro Devices, Inc. Method and apparatus for monitoring consumable performance
US6391787B1 (en) * 2000-10-13 2002-05-21 Lam Research Corporation Stepped upper electrode for plasma processing uniformity
US6821794B2 (en) 2001-10-04 2004-11-23 Novellus Systems, Inc. Flexible snapshot in endpoint detection
US6825050B2 (en) * 2002-06-07 2004-11-30 Lam Research Corporation Integrated stepwise statistical process control in a plasma processing system
US20040031052A1 (en) 2002-08-12 2004-02-12 Liberate Technologies Information platform
US6781383B2 (en) * 2002-09-24 2004-08-24 Scientific System Research Limited Method for fault detection in a plasma process
TWI233008B (en) * 2002-09-30 2005-05-21 Tokyo Electron Ltd Method and apparatus for the monitoring and control of a semiconductor manufacturing process
EP1556936B1 (en) * 2002-10-25 2016-12-07 S & C Electric Company Method and apparatus for control of an electric power system in response to circuit abnormalities
JP4365109B2 (en) * 2003-01-29 2009-11-18 株式会社日立ハイテクノロジーズ Plasma processing equipment
JP2004295348A (en) * 2003-03-26 2004-10-21 Mori Seiki Co Ltd Maintenance management system of machine tool
JP2004335841A (en) * 2003-05-09 2004-11-25 Tokyo Electron Ltd Prediction system and prediction method for plasma treatment apparatus
US20060006139A1 (en) * 2003-05-09 2006-01-12 David Johnson Selection of wavelengths for end point in a time division multiplexed process
US7062411B2 (en) * 2003-06-11 2006-06-13 Scientific Systems Research Limited Method for process control of semiconductor manufacturing equipment
JP4043408B2 (en) * 2003-06-16 2008-02-06 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
US6902646B2 (en) * 2003-08-14 2005-06-07 Advanced Energy Industries, Inc. Sensor array for measuring plasma characteristics in plasma processing environments
KR100567745B1 (en) * 2003-09-25 2006-04-05 동부아남반도체 주식회사 Life predictive apparatus for a target of sputtering equipment and its operating method
US8036869B2 (en) * 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US7930053B2 (en) * 2003-12-23 2011-04-19 Beacons Pharmaceuticals Pte Ltd Virtual platform to facilitate automated production
US7233878B2 (en) * 2004-01-30 2007-06-19 Tokyo Electron Limited Method and system for monitoring component consumption
US7146237B2 (en) * 2004-04-07 2006-12-05 Mks Instruments, Inc. Controller and method to mediate data collection from smart sensors for fab applications
JP2006004992A (en) * 2004-06-15 2006-01-05 Seiko Epson Corp Polishing device managing system, managing device, control program thereof and control method thereof
TWI336823B (en) * 2004-07-10 2011-02-01 Onwafer Technologies Inc Methods of and apparatuses for maintenance, diagnosis, and optimization of processes
US7292045B2 (en) * 2004-09-04 2007-11-06 Applied Materials, Inc. Detection and suppression of electrical arcing
JP4972277B2 (en) * 2004-11-10 2012-07-11 東京エレクトロン株式会社 Substrate processing apparatus recovery method, apparatus recovery program, and substrate processing apparatus
US7828929B2 (en) * 2004-12-30 2010-11-09 Research Electro-Optics, Inc. Methods and devices for monitoring and controlling thin film processing
JP4707421B2 (en) * 2005-03-14 2011-06-22 東京エレクトロン株式会社 Processing apparatus, consumable part management method for processing apparatus, processing system, and consumable part management method for processing system
JP2006328510A (en) * 2005-05-30 2006-12-07 Ulvac Japan Ltd Plasma treatment method and device
US7409260B2 (en) * 2005-08-22 2008-08-05 Applied Materials, Inc. Substrate thickness measuring during polishing
US7302363B2 (en) * 2006-03-31 2007-11-27 Tokyo Electron Limited Monitoring a system during low-pressure processes
US7413672B1 (en) * 2006-04-04 2008-08-19 Lam Research Corporation Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement
US7829468B2 (en) * 2006-06-07 2010-11-09 Lam Research Corporation Method and apparatus to detect fault conditions of plasma processing reactor
KR20080006750A (en) * 2006-07-13 2008-01-17 삼성전자주식회사 Plasma doping system for fabrication of semiconductor device
US20080063810A1 (en) * 2006-08-23 2008-03-13 Applied Materials, Inc. In-situ process state monitoring of chamber
CN100587902C (en) * 2006-09-15 2010-02-03 北京北方微电子基地设备工艺研究中心有限责任公司 On-line predication method for maintaining etching apparatus
JP2008158769A (en) * 2006-12-22 2008-07-10 Tokyo Electron Ltd Substrate processing system, controller, setting information monitoring method, and storage medium with setting information monitoring program stored
US7548830B2 (en) * 2007-02-23 2009-06-16 General Electric Company System and method for equipment remaining life estimation
US7674636B2 (en) * 2007-03-12 2010-03-09 Tokyo Electron Limited Dynamic temperature backside gas control for improved within-substrate process uniformity
US8055203B2 (en) * 2007-03-14 2011-11-08 Mks Instruments, Inc. Multipoint voltage and current probe system
JP2008311338A (en) * 2007-06-13 2008-12-25 Harada Sangyo Kk Vacuum treatment apparatus and abnormal discharge precognition device used therefor, and control method of vacuum treatment apparatus
KR100892248B1 (en) * 2007-07-24 2009-04-09 주식회사 디엠에스 Endpoint detection device for realizing real-time control of a plasma reactor and the plasma reactor comprising the endpoint detection device and the endpoint detection method
US20090106290A1 (en) * 2007-10-17 2009-04-23 Rivard James P Method of analyzing manufacturing process data
JP4983575B2 (en) * 2007-11-30 2012-07-25 パナソニック株式会社 Plasma processing apparatus and plasma processing method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09306894A (en) * 1996-05-17 1997-11-28 Sony Corp Optimum emission spectrum automatic detecting system
JP2003151955A (en) * 2001-11-19 2003-05-23 Nec Kansai Ltd Plasma etching method
US20040004708A1 (en) * 2002-05-29 2004-01-08 Tokyo Electron Limited Method and system for data handling, storage and manipulation
JP2005527983A (en) * 2002-05-29 2005-09-15 東京エレクトロン株式会社 Method and system for data handling, storage and operation
US6969619B1 (en) * 2003-02-18 2005-11-29 Novellus Systems, Inc. Full spectrum endpoint detection
WO2004102642A2 (en) * 2003-05-09 2004-11-25 Unaxis Usa Inc. Envelope follower end point detection in time division multiplexed processes
TW200701293A (en) * 2005-06-16 2007-01-01 Unaxis Usa Inc Process change detection through the use of evolutionary algorithms

Also Published As

Publication number Publication date
JP2012532464A (en) 2012-12-13
CN102473590A (en) 2012-05-23
SG176147A1 (en) 2011-12-29
WO2011002810A3 (en) 2011-04-14
CN102804353B (en) 2015-04-15
JP5693573B2 (en) 2015-04-01
KR20120037420A (en) 2012-04-19
WO2011002811A3 (en) 2011-02-24
CN102804929B (en) 2015-11-25
KR101741272B1 (en) 2017-05-29
CN102473590B (en) 2014-11-26
WO2011002800A3 (en) 2011-04-07
JP2012532461A (en) 2012-12-13
KR20120047871A (en) 2012-05-14
TW201115288A (en) 2011-05-01
KR101708078B1 (en) 2017-02-17
JP2012532462A (en) 2012-12-13
SG176564A1 (en) 2012-01-30
JP2012532460A (en) 2012-12-13
KR20120101293A (en) 2012-09-13
CN102473631A (en) 2012-05-23
JP5599882B2 (en) 2014-10-01
WO2011002810A4 (en) 2011-06-03
TWI509375B (en) 2015-11-21
CN102473631B (en) 2014-11-26
SG176567A1 (en) 2012-01-30
TWI484435B (en) 2015-05-11
TW201129884A (en) 2011-09-01
KR20120037421A (en) 2012-04-19
WO2011002803A3 (en) 2011-03-03
WO2011002803A2 (en) 2011-01-06
JP5629770B2 (en) 2014-11-26
KR101741274B1 (en) 2017-05-29
WO2011002804A3 (en) 2011-03-03
KR20120037419A (en) 2012-04-19
JP2012532463A (en) 2012-12-13
CN102474968B (en) 2015-09-02
CN102804353A (en) 2012-11-28
WO2011002800A2 (en) 2011-01-06
WO2011002804A2 (en) 2011-01-06
TW201129936A (en) 2011-09-01
WO2011002810A2 (en) 2011-01-06
TW201108022A (en) 2011-03-01
TWI495970B (en) 2015-08-11
KR101708077B1 (en) 2017-02-17
CN102804929A (en) 2012-11-28
WO2011002811A2 (en) 2011-01-06
JP5624618B2 (en) 2014-11-12
TW201112302A (en) 2011-04-01
SG176566A1 (en) 2012-01-30
SG176565A1 (en) 2012-01-30
CN102474968A (en) 2012-05-23
TWI536193B (en) 2016-06-01
KR101741271B1 (en) 2017-05-29

Similar Documents

Publication Publication Date Title
TWI480917B (en) Methods for constructing an optimal endpoint algorithm
US10734261B2 (en) Search apparatus and search method
TWI549007B (en) Method for searching and analyzing process parameters and computer program product thereof
US11189470B2 (en) Search device, search method and plasma processing apparatus
US20160180226A1 (en) Method and system for evaluating sequences
US20040044484A1 (en) Method and apparatus for analyzing defect information
CN107408522B (en) Determining key parameters using a high-dimensional variable selection model
US8538572B2 (en) Methods for constructing an optimal endpoint algorithm
US9142014B2 (en) System and method for identifying systematic defects in wafer inspection using hierarchical grouping and filtering
JP2020170327A (en) Abnormality detection device, abnormality detection method, and computer program
JP2008250910A (en) Data mining method and process management method
JP5207695B2 (en) Process management method and system using the method
CN113255541B (en) Process parameter denoising method of self-adaptive flow industrial process based on eigenmode function recombination signal relative entropy
JP7443135B2 (en) Information processing device and database generation method
KR100987249B1 (en) Method for quantifying uniformity patterns and inclusion of expert knowledge for tool development and control
JP2006072659A (en) Signal identification method and signal identification device
CN110489810B (en) Automatic trend extraction method based on data blocks
JP2002324206A (en) Data analyzing method and its device
JP2004357050A (en) System and method for evaluating waveform quality
JP4866520B2 (en) Data analysis method, data analysis program, and data analysis apparatus
JP2008258486A (en) Distribution analysis method and system, abnormality facility estimation method and system, program for causing computer to execute its distribution analysis method or its abnormality facility estimation method, and recording medium readable by computer having its program recorded therein
US5768157A (en) Method of determining an indication for estimating item processing times to model a production apparatus
JP2023148974A (en) Feature extraction method, program and device
US7324863B2 (en) Automatically selecting wafers for review
JP4448653B2 (en) Data analysis method