TWI479964B - A printing method, a printing apparatus, and a method of manufacturing a solar cell using the same - Google Patents
A printing method, a printing apparatus, and a method of manufacturing a solar cell using the same Download PDFInfo
- Publication number
- TWI479964B TWI479964B TW102123933A TW102123933A TWI479964B TW I479964 B TWI479964 B TW I479964B TW 102123933 A TW102123933 A TW 102123933A TW 102123933 A TW102123933 A TW 102123933A TW I479964 B TWI479964 B TW I479964B
- Authority
- TW
- Taiwan
- Prior art keywords
- printing
- printing material
- filling
- concave portion
- plate
- Prior art date
Links
- 238000007639 printing Methods 0.000 title claims description 268
- 238000000034 method Methods 0.000 title claims description 111
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000011049 filling Methods 0.000 claims description 68
- 239000000463 material Substances 0.000 claims description 58
- 229920006302 stretch film Polymers 0.000 claims description 31
- 230000000994 depressogenic effect Effects 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 25
- 238000001035 drying Methods 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 10
- 230000000903 blocking effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000007664 blowing Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010297 mechanical methods and process Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000008602 contraction Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000007645 offset printing Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000007646 gravure printing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F9/00—Rotary intaglio printing presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
- B41F17/24—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on flat surfaces of polyhedral articles
- B41F17/26—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on flat surfaces of polyhedral articles by rolling contact
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Printing Methods (AREA)
- Photovoltaic Devices (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/083488 WO2014102904A1 (ja) | 2012-12-25 | 2012-12-25 | 印刷方法、印刷装置及びこれを用いた太陽電池の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201427514A TW201427514A (zh) | 2014-07-01 |
| TWI479964B true TWI479964B (zh) | 2015-04-01 |
Family
ID=51020064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102123933A TWI479964B (zh) | 2012-12-25 | 2013-07-04 | A printing method, a printing apparatus, and a method of manufacturing a solar cell using the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5889439B2 (ja) |
| TW (1) | TWI479964B (ja) |
| WO (1) | WO2014102904A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017022275A (ja) * | 2015-07-10 | 2017-01-26 | 三菱電機株式会社 | 太陽電池および太陽電池の製造方法 |
| JP6421103B2 (ja) * | 2015-09-24 | 2018-11-07 | 富士フイルム株式会社 | 印刷方法および印刷装置 |
| GB2542834B (en) * | 2015-10-01 | 2017-10-04 | De La Rue Int Ltd | Method and apparatus for producing a printed product |
| GB201613051D0 (en) | 2016-07-28 | 2016-09-14 | Landa Labs (2012) Ltd | Applying an electrical conductor to a substrate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11105405A (ja) * | 1997-10-03 | 1999-04-20 | Dainippon Printing Co Ltd | 厚膜印刷方法 |
| JP2000255025A (ja) * | 1999-03-10 | 2000-09-19 | Canon Inc | オフセット印刷装置、オフセット印刷方法、およびそれを用いて得られる高精細パターン基板 |
| JP2000335073A (ja) * | 1999-05-26 | 2000-12-05 | Canon Inc | オフセット印刷方法及び画像形成装置の製造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63246249A (ja) * | 1987-03-31 | 1988-10-13 | Nissha Printing Co Ltd | 薄膜形成方法とその装置 |
| JP2935851B2 (ja) * | 1989-06-16 | 1999-08-16 | 大日本印刷株式会社 | 微細パターンの印刷方法 |
| JP2001096882A (ja) * | 1999-09-30 | 2001-04-10 | Hitachi Chem Co Ltd | 精密パターンの形成方法及び半導体装置 |
| JP2004181814A (ja) * | 2002-12-04 | 2004-07-02 | Dainippon Printing Co Ltd | 凹版印刷装置 |
| JP5020642B2 (ja) * | 2007-01-15 | 2012-09-05 | 阪本 順 | 印刷装置、印刷方法および多層構造形成方法 |
| JP2011192858A (ja) * | 2010-03-16 | 2011-09-29 | Sekisui Chem Co Ltd | レリーフパターンの形成方法及びレリーフパターン付着基材 |
-
2012
- 2012-12-25 WO PCT/JP2012/083488 patent/WO2014102904A1/ja active Application Filing
- 2012-12-25 JP JP2014553914A patent/JP5889439B2/ja not_active Expired - Fee Related
-
2013
- 2013-07-04 TW TW102123933A patent/TWI479964B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11105405A (ja) * | 1997-10-03 | 1999-04-20 | Dainippon Printing Co Ltd | 厚膜印刷方法 |
| JP2000255025A (ja) * | 1999-03-10 | 2000-09-19 | Canon Inc | オフセット印刷装置、オフセット印刷方法、およびそれを用いて得られる高精細パターン基板 |
| JP2000335073A (ja) * | 1999-05-26 | 2000-12-05 | Canon Inc | オフセット印刷方法及び画像形成装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201427514A (zh) | 2014-07-01 |
| WO2014102904A1 (ja) | 2014-07-03 |
| JP5889439B2 (ja) | 2016-03-22 |
| JPWO2014102904A1 (ja) | 2017-01-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |