TWI478807B - 板狀接合體的製造方法及板狀接合體 - Google Patents

板狀接合體的製造方法及板狀接合體 Download PDF

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Publication number
TWI478807B
TWI478807B TW098112478A TW98112478A TWI478807B TW I478807 B TWI478807 B TW I478807B TW 098112478 A TW098112478 A TW 098112478A TW 98112478 A TW98112478 A TW 98112478A TW I478807 B TWI478807 B TW I478807B
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Taiwan
Prior art keywords
plate
joint
shaped
end portion
joined body
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TW098112478A
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English (en)
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TW201002509A (en
Inventor
Naoyuki Matsuo
Kanji Nishida
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Nitto Denko Corp
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Publication of TW201002509A publication Critical patent/TW201002509A/zh
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
    • B29C65/1635—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1677—Laser beams making use of an absorber or impact modifier
    • B29C65/1683—Laser beams making use of an absorber or impact modifier coated on the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
    • B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
    • B29C65/5042—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like covering both elements to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
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    • B29C66/114—Single butt joints
    • B29C66/1142—Single butt to butt joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/74—Joining plastics material to non-plastics material
    • B29C66/742—Joining plastics material to non-plastics material to metals or their alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81266—Optical properties, e.g. transparency, reflectivity
    • B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8145—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/81457—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the constructional aspects of the pressing elements, e.g. of the welding jaws or clamps comprising a block or layer of deformable material, e.g. sponge, foam, rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C66/80—General aspects of machine operations or constructions and parts thereof
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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    • B29C66/90—Measuring or controlling the joining process
    • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
    • B29C53/36—Bending and joining, e.g. for making hollow articles
    • B29C53/38—Bending and joining, e.g. for making hollow articles by bending sheets or strips at right angles to the longitudinal axis of the article being formed and joining the edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
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    • B29C65/1612—Infrared [IR] radiation, e.g. by infrared lasers
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B29C65/1629—Laser beams characterised by the way of heating the interface
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    • B29C65/1638—Laser beams characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. laser transmission welding focusing the laser beam on the interface
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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    • B29C65/16—Laser beams
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    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
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Description

板狀接合體的製造方法及板狀接合體 發明領域
本發明係有關板狀接合體之製造方法與板狀接合體，更詳而言之，係有關於一種將板狀構件之端部等相抵對齊並以接合構件接合前述端部等之板狀接合體的製造方法，與一種使板狀構件之端部等相抵對齊並以接合構件將前述端部等接合而成之板狀接合體。
 發明背景
過去將帶狀之板狀構件連續供給於加工機中進行加工時，為板狀構件一片接著一片供給於加工機，乃先行於業經加工之板狀構件末端部接合新的板狀構件之前端部。
又，除前述場合外，亦廣泛用於接合板狀構件等之端部以製作板狀接合體。
該板狀接合體容易形成其接合部之接合強度低於板狀構件本身之強度之狀態，因此提升接合強度乃一直以來追求之目標。
因此，藉由感壓接著劑(黏著劑)於膠帶基材上形成有接著劑層之所謂的“黏著膠帶”，以往常用於各種物品之接合，製造前述片狀接合體時亦用於接合端部等。
使用該黏著膠帶之板狀接合體製造方法，係使一個板狀構件之端部與另一板狀構件之端部形成相抵對齊狀態，並將黏著膠帶以覆蓋該相抵對齊之部位之狀態接著於板狀構件表面。
該板狀接合體製造方法係將黏著膠帶以從一板狀構件之端部跨至另一板狀構件之端部之狀態貼於板狀構件表面，因此藉由改變黏著膠帶之接著位置或所用黏著膠帶之寬度等，可調整各個板狀構件與黏著膠帶之疊合面積。
即，調整接著面積容易達到提升接合強度之效果，舉例言之，將寬的黏著膠帶貼於板狀構件之兩面等，可使接著穩固。
此外，黏著膠帶係經感壓接著貼於被黏著物上，因此為發揮良好接著性，一般係於形成前述接著劑層時使用柔軟之黏著劑。
如此一來，容易造成黏著劑從黏著膠帶周圍滲出，且因該黏著劑於常溫下具有黏著性，恐將附著於周邊之機器或構件上，抑或髒垢等附著於滲出之黏著劑上以致美觀性降低。
又，將板狀構件浸入藥水之程序中，例如將板狀構件浸於鹼液中以進行皂化處理時，若於板狀接合部使用黏著膠帶則黏著劑之成分將於鹼液中熔融析出，恐致該鹼液中混入異物。
再者，通常黏著膠帶係捲繞於芯材上，使用時從外側剝離，故膠帶基材上，與形成有接著劑層一側相反另一側的表面上乃施有表面處理，以提高剝離性。
因此，假如於板狀構件施以塗敷處理時，貼有黏著膠帶之部位恐因前述表面處理而導致塗敷液無法附著。
為防止上述問題，可考慮僅於與塗敷液塗敷面相反之另一面上使用黏著膠帶進行接合，但因黏著膠帶之接著僅止於單面，恐無法確保充足之接合強度。
又，浸漬藥水之程序中，有關黏著劑成分(例如從接縫部分)滲出等導致問題產生之部分尚無法完全解決。
針對上述問題，近年持續研究用以製造限用黏著劑但仍具有優良接合強度之板狀接合體之製造方法。
對此，下列專利文獻1中所記載者，係將欲接合之板狀構件之端部等相抵對齊，使其端面相接觸，並對該端面照射雷射光進行熔接。
該專利文獻1記載之方法，係藉由板狀構件等之熔接製作板狀接合體，故可抑制黏著劑之使用。
但專利文獻1記載之板狀接合體製造方法之問題在於僅以板狀構件之端面這樣有限之區域作為接著區域，故對於所製得之板狀接合體難以賦予優良之接合強度。
如此一來，習知之板狀接合體製造方法，恐難以製造限用黏著劑且仍具有優良接合強度之板狀接合體。
【先前技術文獻】 【專利文獻】
【專利文獻1】日本專利公開公報特開平第5-278112號
發明概要
本發明之課題在於提供一種可限制黏著劑之使用、且具有優良接合強度之板狀接合體。
本發明之板狀接合體製造方法，係將板狀構件之端部等相抵對齊，以含有熱塑性樹脂之接合構件被覆該對齊部分，並於被覆有前述接合構件之部位照射雷射光使前述板狀構件與前述接合構件熔接，藉以接合前述端部等製成板狀接合體。
又，本發明之板狀接合體，係將板狀構件之端部等相抵對齊後藉由接合構件使前述端部等接合而成者；該板狀接合體係藉由於前述端部等相抵對齊之部分被覆含有熱塑性樹脂之接合構件，並於經該接合構件被覆之部位照射雷射光而熔接前述板狀構件與前述接合構件，使前述端部等接合而成者。
本發明係以雷射光使含熱塑性樹脂之接合構件與板狀構件熔接，故可將該熔接所產生之接合強度賦予板狀接合體。
且，本發明係將前述接合構件被覆於板狀構件之端部等相抵對齊之部分上，再於被覆有該接合構件之部位照射雷射光進行前述熔接，故可增加接合構件之被覆面積使熔接區域擴大，從而可提升接合強度。
即，利用本發明，將可藉由熔接對板狀接合體賦予接合強度，且該強度之提升容易，故可製造限制黏著劑之使用且仍具有優良接合強度之板狀接合體。
圖式簡單說明
第1圖係顯示一實施型態之板狀接合體製造方法之側視圖；(a)係準備程序、(b)係接合程序、(c)係取出程序。
第2圖係顯示另一實施型態之板狀接合體製造方法之側視圖；(a)係準備程序、(b)係接合程序、(c)係取出程序。
第3圖係顯示實施例1之板狀接合體製造方法之側視圖。
 用以實施發明之最佳形態
以下，針對本發明之較佳實施型態(參照附圖)進行說明。
第1(a)圖~第1(c)圖係顯示板狀接合體製造方法中製造板狀接合體之狀態之側視圖，如該第1圖所示，本實施型態中係藉由接合構件30接合第一板狀構件10與第二板狀構件20兩片板狀構件製造板狀接合體1。
另，第1(a)圖係顯示本實施型態之板狀接合體製造方法中準備程序之狀態之側視圖。
又，第1(b)圖係顯示前述準備程序後實施之接合程序之狀態之側視圖，第1(c)圖係顯示前述接合程序後實施之取出程序之狀態之側視圖。
各程序說明如下。
前述準備程序(第1(a)圖)，係將第一板狀構件10之端部11與第二板狀構件20之端部21置於平盤狀之平台40上面中央部，並將第一板狀構件10與第二板狀構件20配置成該等端部相抵對齊之狀態，再於該第一板狀構件10之端部11與第二板狀構件20之端部21相抵對齊之部位以被覆之狀態配置前述接合構件30。
即，以由第一板狀構件10之端部11跨至第二板狀構件20之端部21之方式，將前述接合構件30載置於該等板狀構件上。
於配置如上之接合構件30上方配置一透明玻璃板50，並朝下方側(平台側)按壓該透明玻璃板50，藉由該按壓力使第一板狀構件10、第二板狀構件20及接合構件30之位置固定。
另，此時為了對接合構件30全面均勻施加壓力，亦可於透明玻璃板50與接合構件30間，或者，第一板狀構件10或第二板狀構件20與平台40間，擇一插入低硬度且對所使用之雷射光波長呈高透光性之緩衝板材。
上述材質之緩衝板材，舉例言之，如矽膠片、胺酯橡膠片等均可使用，該緩衝板材於常溫(例如23℃)中之硬度(JIS K6253所訂定之A型硬度計硬度)宜為90°以下，若為70°以下更佳。
前述接合程序(第1(b)圖)，係持續以前述透明玻璃板50按壓前述接合構件30，同時由透明玻璃板50之上方側朝接合構件30被覆第一板狀構件10之端部11與第二板狀構件20之端部21之部位照射雷射光R。
接著令照射之雷射光R通過透明玻璃板50，到達接合構件30與第一板狀構件10接觸之界面，及接合構件30與第二板狀構件20接觸之界面部，以照射之雷射光R為主，經該界面部吸收後將光能轉換為熱能，藉以進行接合構件30與第一板狀構件10之熔接，及接合構件30與第二板狀構件20之熔接。
另，假設該界面部中雷射光R吸收不完全，亦可預先於前述準備程序時，在第一板狀構件10與前述接合構件30之界面或前述第二板狀構件20與前述接合構件30之界面等，加入染料、顏料、碳黑之類可作為光吸收劑使用之物質，使光吸收性(發熱性)提升。
該界面中加入光吸收劑之形式，方法有將該等物質塗佈於板狀構件10、20或接合構件30之表面，或使用含有光吸收劑之接合構件，使光吸收劑留在板狀構件10、20與接合構件30之界面上。
關於該接合程序中前述雷射光R之照射方法，並無特別限制，舉例言之，可採用以點波束依預定速度掃瞄接合構件30被覆第一板狀構件10端部11與第二板狀構件20端部21之部位之方法，或採用以線光源對同一部位進行無掃瞄照射之方法。
此外，為縮短熔接所需之時間，可由複數光源照射雷射光束，亦可使用光點形狀呈沿掃瞄方向延伸之橢圓形狀之雷射光束，以延長雷射光於一個部位上之照射時間同時縮短熔接所需時間。
又，照射雷射光R時，以前述透明玻璃板50進行之按壓，係為提高第一板狀構件10或第二板狀構件20與接合構件30間之接合強度而實施者，接合構件30、第一板狀構件10及第二板狀構件20之材質，或雷射光R之照射強度等亦有此作用，但宜對接合構件30施加0.5kgf/cm2 以上100kgf/cm2 以下範圍內之壓力，若施以1kgf/cm2 以上50kgf/cm2 以下範圍內之壓力則更佳。
前述取出程序(第1(c)圖)，係視需要進行熔接部等之冷卻後，解除透明玻璃板50之按壓並取出板狀接合體1。
另，該第1(a)圖~第1(c)圖中所示者，係由雷射光照射第一板狀構件10之端部11與第二板狀構件20之端部21相抵對齊之部位之表面側(上側)進行被覆，但以第2(a)圖~第2(c)圖所載者為例，由裏面側(下側)被覆第一板狀構件10之端部11與第二板狀構件20之端部21相抵對齊之部位亦屬本發明之技術範圍內。
又，該第2圖所示之型態中，亦可使用緩衝板材或光吸收劑。
進而，該第1圖、第2圖中所示者，係製作僅於第一板狀構件10與第二板狀構件20之一面側接著有接合構件30、呈單面接合之板狀接合體1，但舉例言之，亦可使接合構件接著於第一板狀構件10之端部11與第二板狀構件20之端部21相抵對齊之部位之兩面，再經與上述相同之程序製作呈兩面接合之板狀接合體。
此時，可採用經由上述所示一連串程序，製成在單面側接著接合構件30形成單面接合之板狀接合體1後，於另一面側接著新的接合構件之方法等。
上述所用之方法，舉例言之，可將藉由第1(a)圖~第1(c)圖所示之方法形成單面接合之板狀接合體1，形成使業已接著之接合構件30朝下面側之狀態後載置於前述平台40上，並將新的接合構件配置於板狀構件之相抵對齊部位後，同前述接合程序一樣，進行該新的接合構件之接著。
此外，亦可於藉由第2(a)圖~第2(c)圖所示之方法形成下面側單面接合之板狀接合體1之相抵對齊部位，由上面側被覆新的接合構件，再如第(a)圖~第1(c)圖一樣進行該新的接合構件之接著。
本實施型態之板狀接合體之製造方法中所使用之第一板狀構件10及第二板狀構件20，其材質並無特殊限定，無論板狀之組成為單層構造或積層構造等，均無特別限制。該等板狀構件，舉例言之，可採用由聚乙烯樹脂(PE)、聚丙烯樹脂(PP)、聚對苯二甲酸乙二酯樹脂(PET)、三醋酸纖維素(TAC)、冰片烯樹脂(PCPD)等環烯樹脂(COP)，丙烯酸樹脂、聚乙烯醇樹脂(PVA)、熱塑性聚醯亞胺樹脂(PI)、聚醯胺醯亞胺樹脂(PAI)、聚醚碸樹脂(PES)、聚芳酯樹脂(PAR)、聚丁二烯(BDR)、聚碳酸酯樹脂(PC)、聚萘二甲酸乙二酯(PEN)、聚甲基戊烯樹脂(TPX)、聚胺酯樹脂(PU)、聚苯乙烯樹脂(PS)、聚苯硫醚樹脂(PPS)、液晶聚合物(LCP)、聚醚醚酮(PEEK)等熱塑性樹脂，環氧樹脂(EP)、酚甲醛樹脂(PF)等熱固性樹脂，天然橡膠(NR)、乙烯丙烯二烯三共聚物(EPDM)等橡膠中任1種以上所組成之聚合物板；由合成纖維、天然纖維及其等之混紡品等形成之織布或不織布；用鋁、銅、鐵及其等之合金做成之金屬板；及，上述各種材質做成之複合板。
惟，至少用以與前述接合構件熔接之表面，宜為經雷射光加熱時會軟化之樹脂材料所形成者。
或者，若表面為金屬材料之類、實際上難以因受熱而軟化之材料所形成者，則至少接合構件進行熔接之端部之表面宜經過粗化處理。
另，若板狀構件採用供接合構件進行熔接側之表面設有由金屬材料形成之金屬層，並於該金屬層背面側設有用熱塑性樹脂組成之樹脂層之積層板，則接合構件上所用之熱塑性樹脂經雷射後將軟化而熔接於前述金屬層上，因此在錨固效應下可發揮優良接合強度。
且，藉由金屬材料之優異導熱性可使樹脂層之熱塑性樹脂軟化，故可發揮藉由該業已軟化之樹脂層之熱塑性樹脂進行板狀構件之背面側及端面之接著之優異效果。
意即，藉由金屬層之加熱軟化樹脂層，使一邊之積層板之樹脂層與另一邊之積層板之樹脂層於背面側熔化相融，且經軟化之樹脂流入相抵對齊之端面等之間，將可進行積層板等之接著。
又，第一板狀構件10及第二板狀構件20等所用之板狀構件之厚度，宜為500μm以下，若厚度於5~200μm之範圍內則更為理想。
關於該板狀構件之材質、積層構造、厚度等，第一板狀構件10與第二板狀構件20無須相同，即使不同亦無妨。
又，本實施型態中例示者，係使用第一板狀構件10與第二板狀構件20之兩片板狀構件，但亦可接合三片以上之板狀構件製成板狀接合體。
進而，亦可將一片板狀構件之一端部與另一端部接合，製成環狀之板狀接合體。
前述接合構件30，須為含有熱塑性樹脂者，可採用僅由該熱塑性樹脂、或由含有熱塑性樹脂與各種摻合劑之樹脂組成物形成各種型態者。
該接合構件30之型態以板狀為宜，以使雷射光容易透過接合構件與板狀構件之界面，且易於確保接著面積。
該板狀之接合構件(以下稱「接合板」)，若其厚度過薄，恐難以使板狀接合體之接合強度充分提升，反之，厚度過厚時接合板將造成樹脂接合體上形成極大高低差。
基於上述原因，接合板厚度宜於5~500μm之範圍內，若厚度於10~150μm之範圍內則更佳。
又，接合板之寬度並無特別限制，通常藉由使用做成寬版之接合板，使被覆板狀構件端部之面積擴大，即可增加熔接之接著面積，並可達到提高接合強度之效果。
該接合板(接合構件)所用之前述熱塑性樹脂，舉例言之有：聚對苯二甲酸乙二酯樹脂(PET)、聚乙烯樹脂(PE)、聚丙烯樹脂(PP)、聚苯乙烯樹脂(PS)、聚碳酸酯樹脂(PC)、冰片烯樹脂(PCPD)、甲酚甲醛樹脂(CF)、聚胺酯樹脂(PU)、三醋酸纖維素(TAC)、丙烯酸樹脂、聚乙烯醇樹脂(PVA)、等環烯樹脂(COP)、熱塑性聚醯亞胺樹脂(PI)、聚醯胺醯亞胺樹脂(PAI)、聚醚碸樹脂(PES)、聚芳酯樹脂(PAR)、聚丁二烯(BDR)、聚甲基戊烯樹脂(TPX)、聚苯硫醚樹脂(PPS)、液晶聚合物(LCP)、聚醚醚酮(PEEK)、聚萘二甲酸乙二酯(PEN)等。
此外可與前述熱塑性樹脂一同包含於前述樹脂組成物中之摻合劑，有抗老化劑、耐候劑等機能性藥劑、各種填充劑、顏料等。
此外，若有需要，亦可使樹脂組成物中含有黏著劑而使接合板表面具有黏著性(膠黏性)，或於接合板表面設置黏著劑層，藉以賦予接合板對板狀構件之預接著性，但由防止黏著劑之附著等問題之觀點言之，宜使樹脂組成物中不含黏著劑、或不於接合板設置黏著劑層。
即，板狀構件之接合，不宜使用黏著劑，且前述接合板宜為非黏著性者。
另，所謂的黏著劑，過去廣泛使用者有苯乙烯-丁二烯嵌段共聚物或苯乙烯-異戊二烯共聚物之類用有熱塑性彈性體之橡膠系黏著劑、以丙烯酸酯共聚物為主成分之丙烯酸系黏著劑、以矽橡膠與矽樹脂為主成分之矽系黏著劑、以乙烯基醚系聚合物為原料之乙烯基系黏著劑等。
通常，該等中含有許多遷移性高之成分(例如：低分子量成分等)，若進行將板狀接合體浸漬藥水等之程序，恐因低分子量成分自黏著劑熔融析出而污染藥水。
反之，依上述方式不使用黏著劑進行接合之板狀接合體，藥水受污染之疑慮低，並可防止因該等因素而造成用途上之限制，從而達到擴大用途之效果。
前述透明玻璃板50，通常無特別限制，凡對熔接所用之雷射光之透過性能佳，且具有可承受對接合構件按壓之強度者即可。
又，透明玻璃板可改用圓柱狀、圓筒狀、球狀等各種形狀之透明玻璃材料進行接合構件之按壓。
此外，視需要亦可改由透明樹脂形成之構件進行接合構件之按壓。
前述雷射光R，可採用半導體雷射、Nd-YAG雷射、光纖雷射等由各種振盪機構所發出之雷射光，其振盪方法並無限定，可採用連續照射雷射光之所謂的CW雷射(Continuous Wave Laser)，或採用飛秒雷射等脈衝雷射。
其中又以半導體雷射、光纖雷射等紅外線雷射在接合構件與板狀構件之界面之發熱性尤為良好。
用以吸收前述雷射光之光吸收劑，舉例言之，有：酞青系或萘酞青系之用有卟啉系化合物的顏料、染料、碳黑等。
又，上述以外之可用成分，舉例言之，有：聚次甲基系吸收劑、二苯甲烷系吸收劑、三苯甲烷系吸收劑、醌系吸收劑、偶氮系吸收劑等。
使用具有800~1200nm之波長之雷射光時，舉例言之，可使用美國Gentex公司販實之商品「Clearweld」。
用以塗佈該等光吸收劑之機構，舉例言之，可使用配量器、噴墨印刷機、絲網印刷、二液式、單液式或超音波式噴塗、壓印機等一般手法。
另，凡於不顯著損害本發明之效果之範圍內，習知公知之板狀接合體製造方法及板狀接合體之技術事項均可用於本發明之板狀接合體製造方法及板狀接合體，在此則不再詳述。
【實施例】
以下列舉實施例詳加說明本發明，但本發明並非以該等實施例為限。
(實施例1)
使用下述構件製成實施例1之板狀接合體。
(使用構件)
．板狀構件A：聚對苯二甲酸乙二酯樹脂(PET)製板材(長50mm×寬50mm×厚50μm)
．板狀構件B：聚對苯二甲酸乙二酯樹脂(PET)製板材(長50mm×寬50mm×厚50μm)
．接合板C：聚對苯二甲酸乙二酯樹脂(PET)製板材(長50mm×寬3mm×厚50μm)
實施例1之板狀接合體，係藉由下列雷射光照射裝置將上述使用構件接合製成者。
(使用雷射光照射裝置)
．雷射光源：半導體雷射
．雷射光波長：940nm
．輸出功率：20W
．雷射光點直徑：2mmΦ
．掃瞄速度：100mm/s
利用上述構件及雷射光照射裝置製作實施例1之板狀接合體時，係藉由以下所示方法進行(參照第3圖：板狀接合體之製造方法之側視圖)。
首先，將板狀構件A與板狀構件B排列於平台上使其等之端部相抵對齊之狀態，並將接合板C以由該相抵對齊之板狀構件A之端部跨至板狀構件B之端部之狀態載置於該等板狀構件上。
即，接合板C係沿板狀構件A與板狀構件B之界線配置，形成該寬3mm之接合板C於板狀構件A端部與板狀構件B端部之上面各被覆1.5mm之狀態。
另，於板狀構件A及板狀構件B與接合板C之界面，進行染料(光吸收劑)液之塗佈，以提升雷射光之吸收性。
於組裝如上之板狀構件A、板狀構件B及接合板C之上部載置透明玻璃板，並以該透明玻璃板按壓接合板C，於接合板C施加約0.1MPa之壓力，且對經該接合板C被覆之部位照射輸出功率20W之雷射光。
此時，使直徑2mm之雷射光點之中心部沿著板狀構件A與板狀構件B之界線移動，以100mm/s之速度掃瞄雷射光之照射位置，使接合板與板狀構件A、及接合板與板狀構件B同時熔接，製成實施例1之板狀接合體。
從該實施例1之板狀接合體裁出寬10mm之長條狀試樣，且裁成板狀構件A與板狀構件B之相抵對齊部(熔接部位)直角橫切長條狀試樣之長向中央部之狀態。
將一端側為板狀構件A、另一端側為板狀構件B且中間間隔該長向中央之熔接部位所形成之長條狀試樣之兩端部，分別夾在拉伸試驗機(島津製作所公司製，「AUTOGRAPH AG-5000A」)之夾具中，並朝拉開板狀構件A與板狀構件B之方向以50mm/min之速度進行拉伸試驗後，測知其接合強度(接合體破裂時之應力(N)除以試樣寬度(1cm)所得之數值)約為100N/cm。
由上述內容亦可知，藉由本發明可製得在不使用黏著劑之情形下仍具有優良接合強度之板狀接合體。
(實施例2)
將用以接合之2片板狀構件，由聚對苯二甲酸乙二酯樹脂(PET)製板材改為以厚度25μm之不銹鋼(SUS)層與厚度25μm之聚醯亞胺樹脂(PI)層積層而成之積層板材(長50mm×寬50mm×厚50μm)，並於SUS層側接著接合板(長50mm×寬3mm×厚50μm之PET板)，且雷射光點之掃瞄速度設為50mm/s，除此之外，實施例2之板狀接合體之製作則同於實施例1之板狀接合體。
製得之實施例2之板狀接合體，可確定接合板與SUS層表面間發揮了錨固效應。
又，進行該接合部之截面觀察後，確定位於SUS層背面側之PI層經SUS層之熱傳遞後造成熔融，且PI層等產生熔接。
進而亦可確認，接合板之PET流入相抵對齊之板狀構件之端部上產生有些微間隙之部位中。
接著採用與實施例1之板狀接合體相同之方式測試該實施例2之板狀接合體之接合強度，測知接合強度約為210N/cm。
由此亦可知，藉由本發明可製得在不使用黏著劑之情形下仍具有優良接合強度之板狀接合體。
(實施例3)
將用以接合之2片板狀構件，由聚對苯二甲酸乙二酯樹脂(PET)製板材改為富士軟片(Fujifilm)公司製之厚度80μm之三醋酸纖維素樹脂(TAC)製長板材(寬1330mm)，並備有相同之TAC板(長1330mm×寬5mm×厚80μm)作為接合板。
於該接合板之一面中央部塗佈10nL/mm2 之光吸收劑(Gentex公司製，商品名「Clearweld LD120C」)並形成約3mm之寬度，再同上述實施例1一樣進行雷射熔接。
另，接合板之加壓力，由約0.1MPa改施以15kgf/cm2 。
此外，除將輸出功率由20W改為30W外，以100mm/s之速度進行波長940nm之雷射光(光點直徑2mmΦ)掃瞄之部分則以與實施例1相同之條件進行熔接。
對製得之板狀接合體(長板)施以300N之張力，進行由一邊之滾筒送出再捲繞於另一邊之滾筒上之“捲繞式輸送”(roll-to-roll)，結果該接合部未產生切斷之問題且輸送情形良好。
(實施例4)
用以接合之2片板狀構件，使用日本瑞翁(ZEON)公司製之厚度70μm之冰片烯樹脂製長板材(商品名「ZEONOR」，寬1000mm)，並備有相同之冰片烯樹脂板(長1000mm×寬5mm×厚70μm)作為接合板。
於該接合板之一面中央部塗佈15nL/mm2 之光吸收劑(Gentex公司製，商品名「Clearweld LD120C」)並形成約3mm之寬度，再同上述實施例3一樣進行雷射熔接。
另，接合板之加壓力，由15kgf/cm2 改施以10kgf/cm2 。
此外，除將輸出功率由30W改為50W外，以100mm/s之速度進行波長940nm之雷射光(光點直徑2mmΦ)掃瞄之部分則以與實施例3相同之條件進行熔接。
對製得之板狀接合體(長板)施以300N之張力，進行“捲繞式輸送”(roll-to-roll)，結果該接合部未產生切斷之問題且輸送情形良好。
由上述內容可知，雖停止使用黏著劑，但藉由本發明仍可形成具有優異接合強度之板狀接合體。
(比較例1)
準備與實施例3相同之TAC製長板，將該長板之端部等相抵對齊，並對該相抵對齊之部位黏貼以拉伸聚丙烯薄膜為基材之寬50mm黏著膠帶(日東電工公司製，商品名「當普龍膠帶(日文：)」，厚70μm(基材厚度40μm+黏著劑層厚度30μm))後，同實施例3一樣製成長形板狀接合體。
藉由將該黏著膠帶貼於相抵對齊部之兩面施以300N之張力，可製得與實施例3同樣可進行捲繞式輸送之板狀接合體，但該板狀接合體因使用黏著劑，恐因塵埃等附著而導致美觀度降低，或部分成分因鹼性溶液等而熔融析出，且因兩面黏著寬50mm之膠帶，於“捲繞式輸送”時當接合部通過受兩根滾筒夾壓之部位時，將造成巨大衝擊。
(比較例2)
準備與實施例3相同之TAC製長板，將該長板之端部等相抵對齊，並對該相抵對齊之部位塗佈光吸收劑(Gentex公司製，商品名「Clearweld LD120C」)，且依前述專利文獻1(日本專利公開公報特開平第5-278112號)所載方法照射雷射光使端面等熔接。
具體言之，係藉由透明玻璃板施加10kgf/cm2 之壓力，並對相抵對齊之部位以50mm/s之速度掃瞄波長940nm之雷射光(光點直徑1mmΦ，輸出50W)，進行熔接。
對於製得之板狀接合體，同實施例1、2一樣以拉伸試驗機進行接合強度之測試，結果僅有10N/cm之接合強度，若施以300N之張力進行“捲繞式輸送”，結果板狀接合體將沿著該接合部破裂。
1．．．板狀接合體
10．．．第一板狀構件
11．．．端部
20．．．第二板狀構件
21．．．端部
30．．．接合構件
40．．．平台
50．．．透明玻璃板
R．．．雷射光
第1圖係顯示一實施型態之板狀接合體製造方法之側視圖；(a)係準備程序、(b)係接合程序、(c)係取出程序。
第2圖係顯示另一實施型態之板狀接合體製造方法之側視圖；(a)係準備程序、(b)係接合程序、(c)係取出程序。
第3圖係顯示實施例1之板狀接合體製造方法之側視圖。
1．．．板狀接合體
10．．．第一板狀構件
11．．．端部
20．．．第二板狀構件
21．．．端部
30．．．接合構件
40．．．平台
50．．．透明玻璃板
R．．．雷射光

Claims (4)

  1. 一種板狀接合體的製造方法，其特徵在於，將一帶狀之板狀構件末端部與另一板狀構件前端部相抵對齊，以含有熱塑性樹脂而成之接合構件被覆該相抵對齊部分，並將經前述接合構件被覆之部位置於平盤狀之平台上，以透明玻璃自上方朝下方側施加壓力按壓使前述接合構件固定，同時通過前述透明玻璃朝前述部位照射雷射光，使前述板狀構件與前述接合構件熔接，藉以接合前述端部彼此而使多數板狀體連接成帶狀。
  2. 如申請專利範圍第1項之板狀接合體的製造方法，其中前述接合係不使用黏著劑而實施。
  3. 一種板狀接合體，係將一帶狀之板狀構件末端部與另一板狀構件前端部相抵對齊後藉由接合構件使前述末端部與前述前端部接合者，其特徵在於：該板狀接合體係於前述末端部與前述前端部相抵對齊之部分被覆含有熱塑性樹脂而成之接合構件，並將經該接合構件被覆之部位置於平盤狀之平台上，以透明玻璃自上方朝下方側施加壓力按壓使前述接合構件固定，同時通過前述透明玻璃朝前述部位照射雷射光而熔接前述板狀構件與前述接合構件，藉此使前述末端部與前述前端部接合而使多數帶狀板狀體連接而形成。
  4. 如申請專利範圍第3項之板狀接合體，其中前述端部等係不使用黏著劑接合。
TW098112478A 2008-05-16 2009-04-15 板狀接合體的製造方法及板狀接合體 TWI478807B (zh)

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