TWI477466B - 玻璃薄形化系統 - Google Patents
玻璃薄形化系統 Download PDFInfo
- Publication number
- TWI477466B TWI477466B TW100139973A TW100139973A TWI477466B TW I477466 B TWI477466 B TW I477466B TW 100139973 A TW100139973 A TW 100139973A TW 100139973 A TW100139973 A TW 100139973A TW I477466 B TWI477466 B TW I477466B
- Authority
- TW
- Taiwan
- Prior art keywords
- glass
- etching
- chamber
- storage tank
- cleaning
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110067633A KR101277161B1 (ko) | 2011-07-08 | 2011-07-08 | 글라스 박형화 시스템 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201302647A TW201302647A (zh) | 2013-01-16 |
TWI477466B true TWI477466B (zh) | 2015-03-21 |
Family
ID=47442328
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW100139973A TWI477466B (zh) | 2011-07-08 | 2011-11-02 | 玻璃薄形化系統 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR101277161B1 (ko) |
CN (1) | CN102863153B (ko) |
TW (1) | TWI477466B (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101665537B1 (ko) * | 2015-03-05 | 2016-10-13 | 주식회사엠시스 | 유리기판용 식각 시스템 및 이를 이용한 식각방법 |
CN110357445B (zh) * | 2019-08-23 | 2024-02-09 | 泰兴美视智能光电有限公司 | 一种柔性电子玻璃基板的制备装置及基于其的制备方法 |
CN111453998B (zh) * | 2020-05-25 | 2022-07-12 | 福建和达玻璃技术有限公司 | 高效率玻璃机壳金属质感表面处理设备及方法 |
CN115159820B (zh) * | 2022-07-12 | 2024-03-05 | 河北视窗玻璃有限公司 | 一种玻璃插片冷弯装置及其使用方法 |
CN116375353B (zh) * | 2023-04-04 | 2023-10-20 | 惠州吉祥达机械设备有限公司 | 一种玻璃液抛装置及生产线 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6551443B2 (en) * | 2000-12-30 | 2003-04-22 | Lg.Philips Lcd Co., Ltd. | Apparatus for etching glass substrate in fabrication of LCD |
TW200932695A (en) * | 2008-01-09 | 2009-08-01 | Econy Co Ltd | An apparatus for etching a glass wafer, and a glass sheet manufactured by the same |
WO2009107332A1 (ja) * | 2008-02-29 | 2009-09-03 | 三洋電機株式会社 | 排水処理装置および排水処理方法 |
CN101255012B (zh) * | 2007-02-27 | 2010-08-18 | 睿明科技股份有限公司 | Tft lcd玻璃基板的蚀刻装置及其蚀刻方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3194245B2 (ja) * | 1996-12-26 | 2001-07-30 | 松下電器産業株式会社 | 非晶質シリコン層を形成された基板の処理方法 |
JP4071220B2 (ja) * | 2004-03-17 | 2008-04-02 | 西山ステンレスケミカル株式会社 | ガラス基板の製造方法 |
KR100875870B1 (ko) | 2004-10-14 | 2008-12-26 | 에프. 호프만-라 로슈 아게 | 항암제로서의 신규 아자인돌 티아졸리논 |
KR100835745B1 (ko) * | 2006-12-29 | 2008-06-09 | 최찬규 | 하향식 유리 박형화 방법 |
KR20090070792A (ko) * | 2007-12-27 | 2009-07-01 | 주식회사 디에스티 | 유리기판의 식각장치 |
JP2011071385A (ja) | 2009-09-28 | 2011-04-07 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
-
2011
- 2011-07-08 KR KR1020110067633A patent/KR101277161B1/ko not_active IP Right Cessation
- 2011-10-08 CN CN201110306816.3A patent/CN102863153B/zh not_active Expired - Fee Related
- 2011-11-02 TW TW100139973A patent/TWI477466B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6551443B2 (en) * | 2000-12-30 | 2003-04-22 | Lg.Philips Lcd Co., Ltd. | Apparatus for etching glass substrate in fabrication of LCD |
CN101255012B (zh) * | 2007-02-27 | 2010-08-18 | 睿明科技股份有限公司 | Tft lcd玻璃基板的蚀刻装置及其蚀刻方法 |
TW200932695A (en) * | 2008-01-09 | 2009-08-01 | Econy Co Ltd | An apparatus for etching a glass wafer, and a glass sheet manufactured by the same |
WO2009107332A1 (ja) * | 2008-02-29 | 2009-09-03 | 三洋電機株式会社 | 排水処理装置および排水処理方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102863153A (zh) | 2013-01-09 |
KR20130005929A (ko) | 2013-01-16 |
TW201302647A (zh) | 2013-01-16 |
KR101277161B1 (ko) | 2013-06-20 |
CN102863153B (zh) | 2015-09-02 |
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Legal Events
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MM4A | Annulment or lapse of patent due to non-payment of fees |