TWI476134B - 玻璃基板用容器 - Google Patents

玻璃基板用容器 Download PDF

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Publication number
TWI476134B
TWI476134B TW099104739A TW99104739A TWI476134B TW I476134 B TWI476134 B TW I476134B TW 099104739 A TW099104739 A TW 099104739A TW 99104739 A TW99104739 A TW 99104739A TW I476134 B TWI476134 B TW I476134B
Authority
TW
Taiwan
Prior art keywords
glass substrate
reinforcing member
container
container body
side wall
Prior art date
Application number
TW099104739A
Other languages
English (en)
Chinese (zh)
Other versions
TW201041788A (en
Inventor
Yoshio Hirobe
Shinsuke Hayashi
Original Assignee
Sekisui Plastics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Plastics filed Critical Sekisui Plastics
Publication of TW201041788A publication Critical patent/TW201041788A/zh
Application granted granted Critical
Publication of TWI476134B publication Critical patent/TWI476134B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B65D81/05—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents
    • B65D81/07—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage maintaining contents at spaced relation from package walls, or from other contents using resilient suspension means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Buffer Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW099104739A 2009-02-16 2010-02-12 玻璃基板用容器 TWI476134B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009032752A JP5227827B2 (ja) 2009-02-16 2009-02-16 ガラス基板用容器

Publications (2)

Publication Number Publication Date
TW201041788A TW201041788A (en) 2010-12-01
TWI476134B true TWI476134B (zh) 2015-03-11

Family

ID=42561762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099104739A TWI476134B (zh) 2009-02-16 2010-02-12 玻璃基板用容器

Country Status (5)

Country Link
JP (1) JP5227827B2 (ko)
KR (1) KR101573301B1 (ko)
CN (1) CN202089455U (ko)
TW (1) TWI476134B (ko)
WO (1) WO2010092920A1 (ko)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101920816B (zh) * 2010-08-24 2012-04-18 友达光电股份有限公司 包装缓冲装置
JP5826569B2 (ja) * 2011-09-12 2015-12-02 積水化成品工業株式会社 板状体の搬送用容器
CN102616488B (zh) * 2012-04-13 2014-04-02 深圳市华星光电技术有限公司 一种液晶玻璃包装盒
US8777007B2 (en) 2012-04-13 2014-07-15 Shenzhen China Star Optoelectronics Technology Co., Ltd. Packaging box for liquid crystal glass
TWI432367B (zh) * 2012-04-13 2014-04-01 Au Optronics Corp 緩衝包裝盒
JP2014009020A (ja) * 2012-06-29 2014-01-20 Sekisui Plastics Co Ltd 梱包材および梱包体
TWI462211B (zh) * 2012-06-29 2014-11-21 Au Optronics Corp 承載裝置與承載裝置及被載物之組合
JP5917316B2 (ja) * 2012-06-29 2016-05-11 積水化成品工業株式会社 梱包材および梱包体
CN102849355B (zh) * 2012-09-26 2015-02-25 深圳市华星光电技术有限公司 液晶玻璃面板包装结构
TWI447054B (zh) * 2012-10-09 2014-08-01 Au Optronics Corp 箱體及裝載顯示面板的箱體
CN102923394B (zh) * 2012-10-17 2016-03-30 深圳市华星光电技术有限公司 一种用于容纳板体的包装箱
KR200473820Y1 (ko) * 2012-11-29 2014-07-31 주식회사 삼일이노팩 디스플레이장치용 스티로폼 포장재
TWI561443B (en) * 2012-11-30 2016-12-11 Au Optronics Corp Packing box
CN103204291B (zh) * 2013-04-19 2015-09-09 深圳市华星光电技术有限公司 一种包装装置
KR101497422B1 (ko) * 2013-10-22 2015-03-02 주식회사 삼진엘앤디 디스플레이 패널 보호용 슬롯
TWM477042U (en) * 2013-12-05 2014-04-21 Sekisui Plastics Co Ltd Reinforcing member and panel transportation vessel
CN103723386B (zh) * 2014-01-08 2016-03-16 友达光电（苏州）有限公司 面板承载箱
CN104185415B (zh) * 2014-08-21 2018-01-16 昆山龙腾光电有限公司 基板定位承载装置、基板组立系统及基板组立方法
CN104401598B (zh) * 2014-10-31 2017-02-01 京东方科技集团股份有限公司 显示面板的包装装置
JP3198009U (ja) * 2015-03-31 2015-06-11 積水化成品工業株式会社 梱包材及び梱包体
WO2017199372A1 (ja) * 2016-05-18 2017-11-23 堺ディスプレイプロダクト株式会社 収納容器
KR101687758B1 (ko) * 2016-06-24 2016-12-19 (주) 다쓰테크 유연기판 또는 유리기판 위에 도금하기 위한 전기 도금장치용 스테이지
WO2018016077A1 (ja) * 2016-07-22 2018-01-25 堺ディスプレイプロダクト株式会社 収納容器
JP6357218B2 (ja) * 2016-12-28 2018-07-11 積水化成品工業株式会社 梱包材および梱包体
KR20220022003A (ko) 2020-08-14 2022-02-23 삼성디스플레이 주식회사 표시 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI281901B (en) * 2003-09-16 2007-06-01 Dainippon Printing Co Ltd Storing container of clad laminate
TWM326523U (en) * 2007-08-08 2008-02-01 Ynidyi Entpr Co Ltd Packaging box for LCD panel with enhanced buffering function

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI281901B (en) * 2003-09-16 2007-06-01 Dainippon Printing Co Ltd Storing container of clad laminate
TWM326523U (en) * 2007-08-08 2008-02-01 Ynidyi Entpr Co Ltd Packaging box for LCD panel with enhanced buffering function

Also Published As

Publication number Publication date
KR20110115997A (ko) 2011-10-24
JP5227827B2 (ja) 2013-07-03
CN202089455U (zh) 2011-12-28
JP2010189013A (ja) 2010-09-02
WO2010092920A1 (ja) 2010-08-19
KR101573301B1 (ko) 2015-12-01
TW201041788A (en) 2010-12-01

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