TWI475076B - 可固化環氧樹脂組合物及其固化體 - Google Patents
可固化環氧樹脂組合物及其固化體 Download PDFInfo
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- TWI475076B TWI475076B TW097115113A TW97115113A TWI475076B TW I475076 B TWI475076 B TW I475076B TW 097115113 A TW097115113 A TW 097115113A TW 97115113 A TW97115113 A TW 97115113A TW I475076 B TWI475076 B TW I475076B
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- epoxy resin
- component
- group
- resin composition
- curable epoxy
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- BLVSOZQAHVWNSE-UHFFFAOYSA-N [Bi].S(O)(O)(=O)=O Chemical compound [Bi].S(O)(O)(=O)=O BLVSOZQAHVWNSE-UHFFFAOYSA-N 0.000 description 1
- MMJGHBIXGOTKRR-UHFFFAOYSA-N [Ti].C(C)CC#N.C(C)CC#N Chemical compound [Ti].C(C)CC#N.C(C)CC#N MMJGHBIXGOTKRR-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- NBJODVYWAQLZOC-UHFFFAOYSA-L [dibutyl(octanoyloxy)stannyl] octanoate Chemical compound CCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCC NBJODVYWAQLZOC-UHFFFAOYSA-L 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- YHWCPXVTRSHPNY-UHFFFAOYSA-N butan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCC[O-].CCCC[O-].CCCC[O-].CCCC[O-] YHWCPXVTRSHPNY-UHFFFAOYSA-N 0.000 description 1
- DLIJPAHLBJIQHE-UHFFFAOYSA-N butylphosphane Chemical compound CCCCP DLIJPAHLBJIQHE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- IXZRZNDEKDISIT-UHFFFAOYSA-N cyclohexa-2,5-diene-1,4-dione;phosphane Chemical compound P.O=C1C=CC(=O)C=C1 IXZRZNDEKDISIT-UHFFFAOYSA-N 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- JQZRVMZHTADUSY-UHFFFAOYSA-L di(octanoyloxy)tin Chemical compound [Sn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O JQZRVMZHTADUSY-UHFFFAOYSA-L 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- BVURNMLGDQYNAF-UHFFFAOYSA-N dimethyl(1-phenylethyl)amine Chemical compound CN(C)C(C)C1=CC=CC=C1 BVURNMLGDQYNAF-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 150000002012 dioxanes Chemical class 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- BRWZYZWZBMGMMG-UHFFFAOYSA-J dodecanoate tin(4+) Chemical compound [Sn+4].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O BRWZYZWZBMGMMG-UHFFFAOYSA-J 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 150000004965 peroxy acids Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003304 ruthenium compounds Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940113165 trimethylolpropane Drugs 0.000 description 1
- AUOZNINQGUNWOV-UHFFFAOYSA-N triphenyl borate;triphenylphosphane Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C=1C=CC=CC=1OB(OC=1C=CC=CC=1)OC1=CC=CC=C1 AUOZNINQGUNWOV-UHFFFAOYSA-N 0.000 description 1
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Silicon Polymers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007130547A JP5473196B2 (ja) | 2007-05-16 | 2007-05-16 | 硬化性エポキシ樹脂組成物およびその硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200904901A TW200904901A (en) | 2009-02-01 |
| TWI475076B true TWI475076B (zh) | 2015-03-01 |
Family
ID=39591435
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097115113A TWI475076B (zh) | 2007-05-16 | 2008-04-24 | 可固化環氧樹脂組合物及其固化體 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100234520A1 (enExample) |
| EP (1) | EP2147052A1 (enExample) |
| JP (1) | JP5473196B2 (enExample) |
| KR (1) | KR101486221B1 (enExample) |
| CN (1) | CN101679751B (enExample) |
| TW (1) | TWI475076B (enExample) |
| WO (1) | WO2008142997A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5473195B2 (ja) * | 2007-05-16 | 2014-04-16 | 東レ・ダウコーニング株式会社 | 架橋シリコーン粒子およびその製造方法 |
| US20120219804A1 (en) * | 2011-02-28 | 2012-08-30 | Kazuho Uchida | Layered body |
| KR101840642B1 (ko) | 2011-06-07 | 2018-03-21 | 한국전자통신연구원 | 분산 안테나 무선 통신 시스템 및 그 방법 |
| JP2013203865A (ja) * | 2012-03-28 | 2013-10-07 | Kyocera Chemical Corp | 半導体封止用樹脂組成物および半導体装置 |
| JP2013227446A (ja) | 2012-04-26 | 2013-11-07 | Dow Corning Toray Co Ltd | 新規なオルガノポリシロキサン、それを含む熱硬化性樹脂用添加剤、およびそれを含む熱硬化性樹脂組成物 |
| WO2015125760A1 (ja) * | 2014-02-19 | 2015-08-27 | 日本化薬株式会社 | 樹脂変性フィラー、エポキシ樹脂組成物、およびその硬化物 |
| EP3001544A1 (de) * | 2014-09-29 | 2016-03-30 | Siemens Aktiengesellschaft | Aktivteil als Rotor oder Stator, ein Verfahren zur Herstellung eines solchen Aktivteils und eine elektrische Maschine |
| JP6547220B2 (ja) * | 2014-12-16 | 2019-07-24 | リンテック株式会社 | ダイ接着用接着剤 |
| JP6707516B2 (ja) * | 2015-02-25 | 2020-06-10 | ダウ・東レ株式会社 | 硬化性粒状シリコーン組成物、およびその製造方法 |
| TWI814835B (zh) * | 2018-12-29 | 2023-09-11 | 大陸商廣東生益科技股份有限公司 | 樹脂組合物、預浸料、層壓板、覆金屬箔層壓板和印刷電路板 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851481A (en) * | 1986-11-13 | 1989-07-25 | Sunstar Giken Kabushiki Kaisha | Epoxy resin composition |
| TW200613435A (en) * | 2004-07-29 | 2006-05-01 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58219218A (ja) | 1982-06-15 | 1983-12-20 | Toray Silicone Co Ltd | 熱硬化性エポキシ樹脂組成物 |
| DE3634084A1 (de) * | 1986-10-07 | 1988-04-21 | Hanse Chemie Gmbh | Modifiziertes reaktionsharz, verfahren zu seiner herstellung und seine verwendung |
| JPH07733B2 (ja) * | 1986-11-13 | 1995-01-11 | サンスタ−技研株式会社 | エポキシ樹脂組成物 |
| US4847154A (en) * | 1987-05-29 | 1989-07-11 | Basf Corporation | Thermosetting resin systems containing secondary amine-terminated siloxane modifiers |
| US4892918A (en) | 1987-05-29 | 1990-01-09 | Basf Corporation | Secondary amine terminated siloxanes, methods for their preparation and use |
| JP2508550B2 (ja) | 1991-02-21 | 1996-06-19 | 信越化学工業株式会社 | アミノ基含有シリコ―ンエラストマ―微粉末の製造方法 |
| JP3206222B2 (ja) * | 1993-06-28 | 2001-09-10 | 東レ株式会社 | ポリエステル組成物 |
| JP4693953B2 (ja) * | 2000-02-29 | 2011-06-01 | 東レ・ダウコーニング株式会社 | 水性塗料組成物の製造方法 |
| JP4469052B2 (ja) * | 2000-02-29 | 2010-05-26 | 東レ・ダウコーニング株式会社 | 架橋シリコーン粒子の製造方法 |
| DE10228649A1 (de) * | 2002-06-26 | 2004-01-22 | Bakelite Ag | Verfahren zur Herstellung eines faserverstärkten Produktes auf Epoxidharzbasis |
| WO2004074344A1 (ja) * | 2003-02-18 | 2004-09-02 | Sumitomo Bakelite Company Limited | エポキシ樹脂組成物及び半導体装置 |
| EP1651734A1 (en) | 2003-07-16 | 2006-05-03 | Dow Corning Corporation | Coating compositions comprising epoxy resins and aminofunctional silicone resins |
-
2007
- 2007-05-16 JP JP2007130547A patent/JP5473196B2/ja active Active
-
2008
- 2008-04-24 TW TW097115113A patent/TWI475076B/zh not_active IP Right Cessation
- 2008-04-25 US US12/600,142 patent/US20100234520A1/en not_active Abandoned
- 2008-04-25 WO PCT/JP2008/058506 patent/WO2008142997A1/en not_active Ceased
- 2008-04-25 CN CN2008800163247A patent/CN101679751B/zh not_active Expired - Fee Related
- 2008-04-25 EP EP08752398A patent/EP2147052A1/en not_active Withdrawn
- 2008-04-25 KR KR1020097023769A patent/KR101486221B1/ko active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4851481A (en) * | 1986-11-13 | 1989-07-25 | Sunstar Giken Kabushiki Kaisha | Epoxy resin composition |
| TW200613435A (en) * | 2004-07-29 | 2006-05-01 | Sumitomo Bakelite Co | Epoxy resin composition and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101679751B (zh) | 2012-08-29 |
| WO2008142997A1 (en) | 2008-11-27 |
| EP2147052A1 (en) | 2010-01-27 |
| JP5473196B2 (ja) | 2014-04-16 |
| US20100234520A1 (en) | 2010-09-16 |
| KR101486221B1 (ko) | 2015-01-27 |
| JP2008285553A (ja) | 2008-11-27 |
| KR20100016552A (ko) | 2010-02-12 |
| TW200904901A (en) | 2009-02-01 |
| CN101679751A (zh) | 2010-03-24 |
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