TWI471461B - Electroplating tank (1) - Google Patents

Description

Plating tank (1)

The contents of the scope, the specification, the drawings, and the abstract of the claims of Japanese Patent Application No. 2005-323028 are incorporated herein by reference.

Field of invention

The present invention relates to a technique of plating a plate-like workpiece such as a printed circuit board in a surface treatment apparatus such as a plating apparatus.

Background of the invention

In the surface treatment apparatus (electroplating apparatus for printed circuit boards), the plate-shaped workpiece W is fixedly mounted on the gantry so that the slab-shaped workpiece W does not sway, and the gantry is transported while the surface is applied. deal with. However, since it is troublesome to mount the plate-like workpiece W on the gantry, and the load applied to the apparatus is large and the apparatus is enlarged, a gantry-free surface treatment apparatus is proposed.

A non-stand type surface treatment apparatus is disclosed in Japanese Laid-Open Patent Publication No. 2002-363796 (Patent Document 1). The structure of the surface treatment apparatus will be described below using Figs. Fig. 14 is a plan view of the surface treatment apparatus 300 as viewed from above. Fig. 15 is a side view of the surface treatment apparatus 300 shown in Fig. 14 as seen from the α direction.

As shown in Figs. 14 and 15, the surface treatment apparatus 300 is a so-called push type surface treatment apparatus having guide rails 10 to 13 for carrying and holding a plate-like workpiece W such as a printed circuit board. The transport hanger 15 is provided along the guide rails with a pretreatment tank 1 for performing a pre-plating treatment process, a plating tank 2 for performing a plating process, a recovery tank 3 for performing a post-plating treatment process, and a water washing tank. 4; an unloading portion 5 for performing detachment of the plate-like workpiece W; a peeling groove 6 for performing a peeling process (a hanger returning process); a washing tank 7 for performing a post-suspension post-treatment process; and a plate-shaped workpiece Mounted loading section 8.

When the elevating rails 10 and 12 shown in FIG. 14 are lowered, the plate-like workpiece W is immersed in each of the processing tanks (the plating tank 2, the stripping tank 6, the washing tank, the hot water washing tank, the washing tank, etc.). Further, in a state where the elevation rails 10, 12 shown in Fig. 15 are lowered, the rails 10 to 13 constitute one annular guide rail.

By lowering the elevating rail 12 shown in FIGS. 14 and 15 , the plate-like workpiece W is guided into the treatment liquid at the immersion position of the plating tank 2 (the position (X) of FIG. 14 ), and the plate immersed in the treatment liquid. The workpiece W is movable in the plating tank 2.

As shown in FIG. 9, the transport hanger 15 used in the above-described gantry-free surface treatment apparatus 300 includes a workpiece holding member 47 having a plurality of tongs 48 that hold the plate-shaped workpiece W; A sliding member 35 that is in sliding contact with the fixed rail 11 and a connecting member 44 that connects the workpiece holding member 47 and the sliding member 35. The transport hanger 15 holds the upper end portion of the plate-like workpiece W by the clamp 48.

However, in the above-described bench-less surface treatment apparatus, for the purpose of achieving uniform plating quality and uniform plating film thickness, the discharge device disposed on both sides of the plate-like workpiece W is oriented in the plating tank. The plate-like workpiece W is sprayed with a plating liquid jet for processing. However, since the gantry is not used, the plate-shaped workpiece W may be shaken during transportation and the distance from the electrode may not be kept constant, and the thickness of the plating film may become uneven, or the current may be directed to the end of the plate-shaped workpiece W. The concentration of the plating film at the end portion of the plate-shaped workpiece W is abnormally increased.

Therefore, in the surface treatment apparatus without a gantry type, it is a problem that the sway of the plate-like workpiece W is suppressed and the current is not concentrated to the end portion of the plate-shaped workpiece W.

Therefore, in the above Patent Document 1, in order to prevent the current from being concentrated toward the front and rear end portions of the plate-like workpiece W, the plating tank 2 is quickly fed to a distance of the front and rear plate-like workpieces W by a predetermined distance (for example, 5 mm). The position to adjust the interval. Further, in the surface treatment tank such as the plating tank, a linear body guide device made of Teflon (registered trademark) for preventing the sway of the plate-like workpiece W is provided, or a current is prevented from being supplied to the plate-like workpiece W. In the case of a mask, etc., which is concentrated at the end, Japanese Patent Laid-Open Publication No. 2000-178784 (Patent Document 2) and JP-A-2002-13000 (Patent Document 3).

Furthermore, when a printed circuit board (hereinafter referred to as a thin-plate substrate) having a thickness of 0.1 mm or less is used as a plate-like workpiece, the purpose of smoothly immersing the plate-like workpiece W into each processing tank is proposed. A guide device or the like as shown in Fig. 16 is provided in the tank (JP-A-2004-346391 (Patent Document 4)).

The guide device shown in Patent Document 4 is formed by disposing a pair of rectifying members 131 (constructed by the inclined descending rectifying plates 131a and 131b) at a lowered position of the thin plate substrate. As shown in Fig. 16, the upper side of the inclined-down rectifying plates 131a and 131b is formed in a substantially V shape, and the discharge pipe 132 is provided in the vicinity of the upper end portion of the inclined-down rectifying plates 131a and 131b. Further, a liquid suction pipe 133 is disposed at a lower portion of the inclined descending flow regulating plates 131a and 131b, and the liquid suction pipe 133 discharges the drawn plating liquid from the discharge pipe 132. Thereby, the plating solution is ejected from the obliquely descending rectifying plates 131a and 131b and flows downward, and at the same time, the thin plate substrate can be quickly guided.

Patent Document 1 Japanese Patent Laid-Open Publication No. 2002-363796

Patent Document 2 Japanese Patent Laid-Open Publication No. 2000-178784

Patent Document 3 Japanese Patent Laid-Open Publication No. 2002-13000

Patent Document 4 Japanese Patent Laid-Open Publication No. 2004-346391

However, in the prior art as described above, although current concentration at the front and rear end portions of the plate-like workpiece W can be prevented, it is sometimes impossible to achieve uniform mass by the jet flow of the plating solution, and it is not possible to prevent current from flowing to the plate-like workpiece W. The upper and lower ends are concentrated to achieve a uniform plating film thickness.

For example, in Patent Documents 2 and 3, the plating liquid jet is rectified by a louver to achieve uniform plating quality, and the louver may have a current masking effect or more, which may cause plating. The efficiency is low, or the plating quality is deteriorated. Further, although the mask plate is provided at the lower end portion of the plate-like workpiece W, current bypassing sometimes occurs ( The current mask effect is not sufficiently obtained, so that current may be concentrated on the upper end portion and the lower end portion of the plate-like workpiece W, and the plating film thickness is deviated.

Further, in order to prevent the plate-like workpiece W from being shaken, the linear body made of Teflon is used as the guide, but the linear body made of Teflon is easily broken by coming into contact with the plate-like workpiece W, and as a result, it may not be prevented. The sway of the plate-like workpiece W. Further, a metal core material may be provided in the linear body made of the Teflon so as not to be broken, but when the Teflon resin is peeled off and the metal core material is exposed, the plate-shaped workpiece W may come into contact with each other. The exposed metal core material causes scratches, or sometimes the plating layer adhered to the metal core material is mixed into the treatment liquid to deteriorate the plating quality. In particular, when the plate-shaped workpiece W is a thin-plate substrate having a thickness of 0.1 mm or less, sway or skew is likely to occur due to the plating jet, and the plate-like workpiece W is easily moved while slidingly contacting the plate-like workpiece W. Produce a scratch.

Summary of invention

The present invention has been made to solve the above problems, and an object of the invention is to provide a plating tank which is provided in a surface treatment apparatus such as a plateless plating (in particular, a plate-shaped workpiece such as a printed circuit board is held in a vertical state for transporting In the plating apparatus, the printed circuit board, in particular, a plate-shaped workpiece such as a thin printed circuit board having a thickness of 0.1 mm or less is not damaged, and the plate-shaped workpiece can be safely conveyed and immersed, and can be achieved. Uniform plating quality and plating thickness.

Several independent aspects of the invention are shown below.

(1) The plating tank of the present invention is a plating tank for plating a plate-like workpiece, characterized in that the plating tank has a processing tank main body which extends in a moving direction of the plate-like workpiece and holds the treatment liquid An anode device; a discharge device that ejects a treatment liquid from a side surface of the treatment tank main body toward the plate-like workpiece; and a restriction roller device having a plurality of rollers inside the treatment tank main body to be both sides Clamping the moving plate-like workpiece from the upper portion to the lower portion of the processing tank main body, and being continuous and arranged to be rotatable in the traveling direction of the plate-like workpiece; and a current masking device that prevents current flow The ends of the plate-like workpiece are concentrated.

Thereby, the uprightness of the plate-like workpiece is maintained by the restriction roller device. In addition, since the roller is used, it does not cause scratches on the plate-like workpiece. Thereby, uniform processing can be performed.

(2) The plating tank according to the present invention is characterized in that the regulating roller device is a device in which a plurality of roller standing bodies are provided in a traveling direction of the plate-like workpiece, and the roller standing body is disposed in the vertical direction There are a plurality of rollers, and the interval between the adjacent roller uprights is formed to be wider than the other portions at the discharge position of the discharge device.

Therefore, the processing liquid is uniformly applied to the plate-shaped workpiece (in particular, a thin plate-shaped workpiece having a thickness of 0.1 mm or less) by the discharge device, and the uprightness of the plate-shaped workpiece is maintained by the restriction roller device. In addition, since the roller is used, the plate-like workpiece is not scratched. Thereby, uniform processing can be performed.

(3) The plating tank according to the present invention is characterized in that the substrate end deflection is provided in the vicinity of the lower end portion of the plate-like workpiece at the discharge position of the discharge device. Prevent parts.

Therefore, it is possible to appropriately prevent the lower end portion of the plate-like workpiece (in particular, a thin plate-like workpiece having a thickness of 0.1 mm or less) from being bent.

(4) The plating tank of the present invention is characterized in that at least one of the above-mentioned rolls is disposed per predetermined unit area in a region where the above-described regulating roller device is disposed.

Therefore, it is possible to prevent the plate-like workpiece (in particular, a thin plate-like workpiece having a thickness of 0.1 mm or less) from being shaken or deflected in the traveling direction and the vertical direction, and it is possible to maintain the distance between the plate-shaped workpiece and the anode constant. Thereby, a uniform plating film thickness can be obtained.

(5) The plating tank according to the present invention is characterized in that the regulating roller device is a device in which a plurality of roller standing bodies are provided in a traveling direction of the plate-like workpiece, and the roller standing body is disposed in the vertical direction There are a plurality of rolls, and the upper and lower intervals of the rolls in the roll stand are arranged at 50 to 100 mm.

Therefore, it is possible to prevent the plate-like workpiece (in particular, a thin plate-like workpiece having a thickness of 0.1 mm or less) from being shaken or deflected in the vertical direction, and it is possible to maintain the uprightness. Thereby, the distance between the plate-shaped workpiece and the anode can be maintained constant, and a uniform plating film thickness can be obtained.

(6) The plating tank according to the present invention is characterized in that the regulating roller device is a device in which a plurality of roller standing bodies are provided in a traveling direction of the plate-like workpiece, and the roller standing body is disposed in the vertical direction There are a plurality of rollers, and among these rollers, rollers disposed at a height exceeding 50 mm from the lower end of the plate-like workpiece are disposed such that the upper and lower positions of the rollers are different between the roller uprights.

Thereby, it is possible to prevent the current mask effect from being generated by the roller at a predetermined height. Thereby, uneven plating can be prevented, and uniform plating can be performed.

(7) The plating tank of the present invention is characterized in that the current masking device has: an upper mask plate that prevents current from being concentrated toward an upper end portion of the plate-like workpiece; and/or a lower mask plate that prevents current Concentrated at the lower end.

Therefore, it is possible to prevent current from being concentrated toward both the upper end portion and the lower end portion of the plate-like workpiece. Thereby, the thickness of the plating film can be made uniform.

(8) The plating tank according to the present invention is characterized in that the upper mask plate and/or the lower mask plate are formed of a plurality of mask plates between the plate-like workpiece and the anode device, and The plurality of mask plates are arranged such that the closer to the plate-like workpiece, the smaller the overlap with the plate-like workpiece becomes.

Thereby, it is possible to prevent the current from being bypassed by only one mask. Thereby, even if it is a plate-shaped workpiece in which the area (the margin) of the current mask can be made small, the plating film thickness can be made uniform. Further, since the current masking effect can be sufficiently obtained without lowering the current value, productivity can be improved.

(9) The plating tank of the present invention is characterized in that the plurality of mask plates arranged in a single body are integrally formed and can be raised and lowered.

Thereby, even if the size of the plate-like workpiece is changed, the plating film thickness can be made uniform.

The invention also has the independent aspects shown below.

(a) The plate-shaped workpiece impregnation apparatus of the present invention has: a treatment tank for immersing the plate-like workpiece in the treatment liquid; and a substrate guide having: a lower guide plate which is paralleled by a predetermined interval Arranged to be a substrate guide for guiding a plate-like workpiece that has been lowered to the processing tank; and an upper guide plate that is arranged in a tapered shape so as to be spaced apart in the vertical direction, and is provided with a cut In the hole, the substrate guiding device is disposed such that a front end of the upper substrate guide plate protrudes from the liquid surface, and the cut hole is immersed in the processing liquid, and a liquid flow generator disposed outside the substrate guiding device.

Thereby, the liquid flow from the outside of the substrate guiding device can be guided to the lower side in the substrate guiding device through the slit hole, and the plate-shaped workpiece can be smoothly guided along the substrate guiding device. In particular, when the treatment liquid is an acidic cleaning agent containing a foamable substance such as a surfactant, it is possible to prevent the deterioration of the plating treatment quality caused by the bubbles generated on the liquid surface, and to smoothly form the plate shape. The workpiece is guided.

(b) The plate-shaped workpiece impregnation apparatus of the present invention is characterized in that the liquid flow generator is an ejector that ejects a jet flow in a substantially horizontal direction toward the slit hole, or a bubble generation tube disposed at a substantially intermediate height in the treatment tank .

Therefore, in a state where the liquid level in the substrate guiding device does not generate bubbles, the liquid flow from the ejector that is ejected in the substantially horizontal direction toward the cutting hole can be guided through the slit hole to the lower side of the substrate guiding device. The plate-shaped workpiece is smoothly guided along the substrate guide.

(c) The plate-shaped workpiece impregnation apparatus of the present invention is characterized in that the liquid flow generator is an ejector that faces the upper portion of the cut-out hole and ejects a jet flow upward in the horizontal direction.

Therefore, in a state where bubbles are not generated on the liquid surface in the substrate guiding device, the liquid flow from the upper portion toward the above-mentioned cutting hole and the jet that ejects the jet upward in the horizontal direction can be guided through the slit hole. Below the substrate guide, the plate-like workpiece can be guided more smoothly along the substrate guide.

(d) The plate-shaped workpiece impregnation apparatus of the present invention is characterized in that the liquid flow generator is a bubble generation tube that discharges gas upward.

Therefore, in a state where bubbles are not generated on the liquid surface in the substrate guiding device, the liquid flow from the bubble generating tube that discharges the gas upward can be guided to the lower side in the substrate guiding device by the slit hole, thereby being simple The structure is configured to smoothly guide the plate-like workpiece along the substrate guiding device.

(e) The plate-shaped workpiece impregnation method of the present invention is a plate-shaped workpiece impregnation method for guiding a plate-like workpiece descending into a treatment tank by using a substrate guiding device, the substrate guiding device having: a lower guide plate spaced apart by a predetermined And the upper guide plate is disposed in a tapered shape in such a manner as to be spaced apart in a direction perpendicular to the vertical direction, and is provided with a cut hole. The plate-shaped workpiece dipping method is characterized in that the substrate guide device is configured to be configured The tip end of the upper substrate guide plate constituting the substrate guide is protruded from the liquid surface, and the cut hole is immersed in the treatment liquid, and the liquid flow which is disposed outside the substrate guide and disposed under the liquid surface of the treatment liquid occurs. The device generates a liquid flow, and the plate-like workpiece is lowered into the treatment tank and immersed in the treatment liquid.

Thereby, the liquid flow from the outside of the substrate guiding device can be guided through the slit hole to the lower side in the substrate guiding device, and the plate-shaped workpiece can be smoothly guided along the substrate guiding device. In particular, when the treatment liquid is a plating treatment liquid, it is possible to prevent the deterioration of the plating treatment quality caused by the bubbles generated on the liquid surface, and to smoothly guide the plate-shaped workpiece.

Other objects, uses, and effects will be apparent to those skilled in the art in view of the appended claims.

Simple illustration

Fig. 1 is a view showing an α-α cross section of the plating tank 2 (Fig. 14).

Fig. 2 is a view showing a structure in the plating tank 2 as seen from the β direction of Fig. 1.

Fig. 3 is a plan view showing the plating tank 2 as seen from the γ direction of Fig. 1 .

Fig. 4 is a detailed view of the roller upright viewed from the β direction of Fig. 1.

Fig. 5 is a view showing the deflection preventing members 122 (122a, 122b) in detail.

Fig. 6 is a detailed view showing the structure of the substrate immersing apparatus 600.

Fig. 7 is a perspective view showing the structure of the substrate guiding device 62.

Fig. 8 is a view showing the jet nozzle 64 in detail.

Fig. 9 is a view showing the configuration of the transport hanger 15.

Fig. 10 is a central sectional view of the transport hanger 15.

Fig. 11 is a plan view showing the configuration of the planar intermittent conveying device 17 provided on the upper portion of the elevating rail 10.

Fig. 12 is a view showing the configuration of the positioning conveyance device 18.

Fig. 13 is a view showing the structure of a substrate immersing apparatus.

Fig. 14 is a plan view of the surface treatment apparatus 300 as viewed from above.

Fig. 15 is a side view showing the surface treatment apparatus 300 shown in Fig. 14 as seen from the α direction.

Fig. 16 is a view showing the structure of a conventional guide device.

Fig. 17 is a view showing the configuration of the discharge device 302.

Fig. 18 is a view showing the mask device 303.

Fig. 19 is a view of the reinforcing connecting member 216 as seen from the side of the thin plate substrate W.

Fig. 20 is a view showing the structure of the anode 102.

Fig. 21 is a view showing a length in which the thin plate substrate W overlaps with the mask.

Fig. 22 is a view showing the structure of the lower portion of the roller upright 120.

Fig. 23 is a view of the substrate W which is shaken as seen from the transport direction.

Fig. 24 is a view showing the substrate W which is shaken as viewed from above the plating tank.

Fig. 25 is a view showing the structure of the upper end portion of the roller upright 120.

Fig. 26 is a view showing the relationship between the number of rollers 116 and the predetermined area of the thin-plate substrate W to be conveyed.

Detailed description of the preferred embodiment detailed description Plating tank

The basic structure of the surface treatment apparatus is the same as that of Figs. Fig. 14 is a plan view of the surface treatment apparatus 300 as viewed from above. Fig. 15 is a side view of the surface treatment apparatus 300 shown in Fig. 14 as seen from the α direction.

As shown in Figs. 14 and 15, the surface treatment apparatus 300 includes guide rails 10 to 13 for transporting a transport hanger 15 for holding a plate-like workpiece W such as a printed circuit board, and setting along these guide rails There are: a pretreatment tank 1 for performing a pre-plating treatment process; a plating tank 2 for performing a plating process; a recovery tank 3 and a water washing tank 4 for performing a post-plating treatment process; and for disassembling the plate-like workpiece W The unloading portion 5; the peeling groove 6 for performing the peeling step (the hanger returning step) for peeling and peeling off the plating layer attached to the conveying hanger 15, and the washing tank 7 for performing the hanger peeling post-treatment step; A loading portion 8 for mounting a plate-like workpiece.

When the elevating rails 10 and 12 shown in FIG. 14 are lowered, the plate-shaped workpiece W is immersed in each of the processing tanks (pretreatment tank 1, plating tank 2, recovery tank 3, washing tank 4, and separation tank 6, etc.). . Further, in a state where the elevation rails 10, 12 shown in Fig. 15 are lowered, the rails 10 to 13 constitute one annular guide rail.

Fig. 1 shows an α-α cross section of a plating tank 2 (Fig. 14) according to an embodiment of the present invention. The plating tank main body 100 (including an overflow tank 202 and a drain 200 which will be described later) is filled with a plating liquid. The upper end portion of the thin plate substrate W as a plate-like workpiece processed in the processing tank main body 100 filled with the plating solution is held by the clamp 48 of the transport hanger 15 . The thin plate substrate W also moves in the processing tank main body 100 by the movement of the conveying hanger 15.

The processing tank main body 100 is provided with an anode device 301 for supplying metal ions for electroplating, a discharge device 302 for ejecting a plating solution toward the thin plate substrate W, and a masking device 303 for masking current so that The current is not concentrated to the end of the thin plate substrate W; the regulating roller device 304 is configured to hold the thin plate substrate W, and the regulating roller device 304 is kept upright when the thin plate substrate W travels inside the processing tank main body 100 . The specific configurations of the anode device 301, the discharge device 302, the mask device 303, and the restriction roller device 304 will be described below.

The anode device 301 is constituted by the following portions shown in Fig. 1 : a pair of anodes 102, 104 are provided at a predetermined interval along the traveling direction of the thin plate substrate W; and a power supply rail 224 along the traveling direction of the thin plate substrate W Disposed on the processing tank main body 100, the anodes 102 and 104 are suspended and energized.

The ejection device 302 is composed of the following portions shown in Fig. 1: a spray box 204 for equalizing the pressure of the plating solution; a pair of injectors 106 closer to the thin plate substrate W than the anodes 102, 104. At a position, the plating solution is ejected from both sides of the thin plate substrate W toward the thin plate substrate W; and the pipe 210 and the loop pump 208 filter the plating solution discharged from the liquid discharge device 200 or the overflow tank 202 by a screening program. The plating solution is returned to the spray box 204 through the conduit 210.

The mask device 303 has four mask plates as shown in Fig. 1 . A lower substrate mask 108 is provided at a lower end portion of the thin plate substrate W, and the lower substrate mask 108 is brought close to the thin plate substrate W in the traveling direction of the thin plate substrate W. On the other hand, an upper substrate mask 109 is provided in the vicinity of the upper end portion of the thin plate substrate W, and the upper substrate mask 109 is also placed close to the thin plate substrate W in the traveling direction of the thin plate substrate W. Further, between the anode 102 and the ejector 106, and between the anode 104 and the ejector 106, in the traveling direction of the thin plate substrate W, near the lower end portions of the anodes 102, 104, the lower electrode mask is provided adjacent to the anodes 102, 104. The plate 112 is provided with an upper electrode mask 113 near the anodes 102, 104 near the upper ends of the anodes 102, 104. Further, the mask device 303 has a height adjusting device 220 that adjusts the heights of the lower substrate mask 108 and the lower electrode mask 112 according to the size of the thin substrate W, and in FIG. 1, the thin substrate The left side of W corresponds to the thin plate substrate W having a large size, and the height is lowered, and the right side of the thin plate substrate W is adjusted to a state in which the height is increased in accordance with the thin plate substrate W having a small size.

The regulating roller device 304 is constituted by the following portion shown in Fig. 1 : a roller standing body 120 which is erected on the upper surface of the lower substrate mask 108 at a height substantially reaching the vicinity of the upper portion of the thin plate substrate W; and a deflection preventing member 122. The restriction roller unit 304 can adjust the height according to the size of the thin substrate W together with the lower substrate mask 108 and the lower electrode mask 112 by the height adjustment device 220 described above.

The roller upright 120 has a shaft 114 which is erected on the lower substrate mask 108, and a roller 116 which is mounted so as to be rotatable throughout the vertical direction of the shaft 114. Also, the roller 116 can be fixed to the shaft 114 so that the shaft 114 itself can be rotated.

Specifically, as shown in FIG. 4, which is a detailed view of the roll upright viewed from the β direction of FIG. 1, the roll stand 120 is mounted such that the shaft 114 is inserted into the roll 116 formed of a resin such as PP and the adjustment In the insertion hole of the member 116e, the adjustment member 116e is interposed between the upper and lower rollers 116, thereby adjusting the distance between the upper and lower rollers 116, and a fixing member 116g is attached near the upper end of the shaft 114 to make the roller 116 and The adjustment member 116e does not come off.

Here, as shown in Fig. 25, the fixing member 116g is attached to the upper end of the uppermost roller 116 at intervals (L70). Therefore, it is possible to prevent the roller 116 from being suspended in the plating solution, the rollers 116 and the regulating member 116e from rubbing or the like to cause a rotation failure, and the sheet substrate W is prevented from being scratched by contact with the roller 116.

Fig. 2 shows the structure in the plating tank 2 when viewed in the β direction of Fig. 1 . It is understood that a plurality of roller standing bodies 120 are provided throughout the traveling direction C of the thin plate substrate W.

Fig. 3 is a plan view showing the plating tank 2 when viewed in the γ direction of Fig. 1 . The thin plate substrate W is conveyed between the opposed roll standing bodies 120. In other words, the thin plate substrate W is conveyed in a straight state (holding in an upright state) while being restricted by the roller 116 of the roller standing body 120. However, in order to keep the thin plate substrate W in a straight state (upright state), the above-described regulating roller device 304 arranges the roller standing body 120 and the roller 116 as will be described below.

First, the arrangement of the roller uprights 120 will be described. As shown in Fig. 22, the opposed roller uprights 120 are disposed such that the distance L40 between the roller 116 and the thin plate substrate W is 1 to 5 mm (here, 4 mm). When the thickness is less than 1 mm, the roller 116 is always in contact with the thin plate substrate W, and scratches may occur on the surface of the thin plate substrate W. Further, when it exceeds 5 mm, the thin plate substrate W may be skewed in the up and down direction (Fig. 23), so that a uniform plating film thickness cannot be formed.

Further, in the present embodiment, at the position of the ejector 106 (indicated as N in FIG. 4), the interval L3 of the roller standing body 120 is formed to be larger than the interval L2 of the other portions. In the present embodiment, an interval L3 larger than the diameter of the roller 116 is provided at the position N of the ejector 106. At a position other than this, an interval L2 smaller than the diameter of the roller 116 is formed. Therefore, it is possible to reduce the hindrance of the jet flow of the plating liquid ejected from the ejector 106 by the roll erecting body 120, and it is possible to effectively spread the jet flow of the plating liquid over the surface of the thin plate substrate W.

However, as described above, when a large interval L3 is formed, the thin plate substrate W may be bent by the jet flow from the ejector 106 at this portion, and the bent portion may enter between the roller erecting bodies 120 to cause a poor conveyance. . Therefore, in the present embodiment, the deflection preventing member 122a is provided at the lower end portion of the roller standing body 120, and the skew preventing member 122b is provided at the intermediate height. In particular, it is very important to provide the skew preventing member 122a at the lower end portion so that the lower end of the thin plate substrate W is not bent.

Fig. 5 shows the deflection preventing members 122 (122a, 122b) in detail. Fig. 5A is a view as seen from the upper portion, and Fig. 5B is a view as seen from the side. As can be seen from Fig. 5B, the deflection preventing member 122a is fixed to the lower end portion of the shaft 114 (0 to 50 mm from the upper surface of the lower substrate mask 108, particularly in the range of 0 to 20 mm: 5 mm here). . The roller 116 is rotatable relative to the roller 116, and the deflection preventing member 122a is not rotated. Further, as shown in FIG. 5A, a transfer space 124 of the thin plate substrate W is provided between the pair of skew preventing members 122a. Thus, it is possible to prevent the end portion of the thin plate substrate W from being bent between the roller standing bodies 120 or being deflected from the lower substrate masking plate 108 in the vicinity of the ejector 106. Further, the skew preventing member 122b also has the same configuration as the skew preventing member 122a.

Next, the arrangement of the rolls 116 will be described. As shown in Fig. 26, at least one roller 116 is disposed in every predetermined area (for example, 100 mm × 100 mm) in a region where 10 to 12 roll uprights 120 are disposed. Here, as shown in Fig. 26, the region in which the roller erecting body 120 is disposed is an arrangement region when the roller erecting body 120 disposed along the traveling direction of the thin plate substrate W is viewed from a direction orthogonal to the traveling direction. . In this region, the roller 116 that restricts the sway of the thin plate substrate W is disposed so that at least one of the predetermined areas comes into contact with the thin plate substrate W, thereby effectively suppressing the occurrence of rattling on the thin plate substrate W. The reason why the roller 116 is disposed in a predetermined area is that the sway of the thin plate substrate W has a sway in the traveling direction and a sway in the vertical direction, thereby restricting the two kinds of swaying. Further, it is preferable to make the predetermined area a maximum of 100 mm × 100 mm.

Therefore, in addition to preventing the thin plate substrate W from losing the erectability due to the plating liquid jet flow, as shown in Figs. 23 and 24, the distance from the anodes 102, 104 is changed, and as a result, the plating film thickness is deviated, and It is prevented that the front end portion (the front end toward the traveling direction) of the thin plate substrate W is swung and bent into the gap of the roller standing body 120 to cause a conveyance failure. Further, Fig. 24 is a view of the thin plate substrate W which is swayed from the upper side of the plating tank.

Further, the upper and lower installation intervals between the rolls 116 in the roll stand 120 are arranged at 50 to 100 mm. Here, the upper and lower installation intervals mean the vertical interval of the disk portion of the roller 116 (L30 shown in FIG. 4). When it is less than 50 mm, the roller 116 serves as an electric mask for the thin plate substrate W, and the plating film thickness may vary. On the other hand, when it exceeds 100 mm, the thin plate substrate W is bent between the rolls 116 to lose the uprightness, so that as shown in Fig. 23, the thin plate substrate W partially changes in the longitudinal direction from the anodes 102, 104, sometimes There is a deviation in the thickness of the plating film. In addition, FIG. 23 is a view of the thin plate substrate W which is shaken as seen from the conveyance direction.

Further, Fig. 4 shows an arrangement state of the roller uprights 120. In the arrangement of the plurality of roll uprights 120, 10 to 20 roll uprights 120 are arranged as one unit in the traveling direction of the thin plate substrate W, and the positions of the rolls 116 in the height direction are different from each other. . For example, it is configured to have no roller at the same height H as the roller 116a near the center. For other rolls, there are no more than two rolls having the same height. This is to prevent the occurrence of rib-like "spots" on the plating layer of the thin-plate substrate W due to contact with the roller 116 at the same height, and to prevent the electrical shadow generated by the roller 116 on the surface of the thin-plate substrate W from being formed at a certain height. The thickness of the plating film which is a part of the shadow is made thin.

However, the lower portion of the roller standing body 120 which is 50 mm or less from the upper surface of the lower substrate mask 108 allows the roller 116 to be at the same height. The lowermost roller 116b of the roller upright 120 is 50 mm or less from the upper surface of the lower substrate mask 108, and is particularly provided at 20 mm or less. This is because, as shown in Fig. 23, when the thin plate substrate W loses its uprightness due to the jet of the plating solution, the lower end of the thin plate substrate W becomes higher, and in the lowermost portion, as close as possible to the lower end portion of the thin plate substrate W. The roller 116 is provided to prevent the lower end portion of the thin plate substrate W from being deflected from the gap formed by the lower substrate mask 108.

As described above, the roller upright 120 is erected on the lower substrate mask 108, and is lifted and lowered integrally with the lower substrate mask 108. Therefore, even if the height of the lower substrate mask 108 is adjusted according to the size of the thin substrate W, the positional relationship between the lower substrate mask 108 and the lowermost roller 116b or the deflection preventing member 122a of the roller upright 120 is not changed, Therefore, it is possible to perform the same effect on the thin-plate substrates W of various sizes with a simple structure.

As described above, in the restriction roll device 304 of the present embodiment, the arrangement of the rolls 116 is determined in order to limit the five elements in order to improve the quality of plating. That is, in order to achieve the following aspects, the arrangement of the rollers 116 and the like is determined, that is, (I) maintaining the upright posture of the thin plate substrate W; (II) suppressing the current mask effect by the roller 116; (III) maintaining the discharge device by the discharge device The effect of the generated electroplating jet flow; (IV) the conveyance failure of preventing the thin plate substrate W from entering the gap of the roller standing body 120; (V) preventing the scratch caused by the roller 116.

Specifically, in order to achieve the above (I), at least one of the rollers 116 is disposed within a predetermined unit area (for example, 100 mm × 100 mm), and further, in order to more effectively suppress the bending of the thin plate substrate W in the longitudinal direction, The interval between the roll 116 and the thin plate substrate W is 1 to 5 mm (not wider than 5 mm), and the interval between the upper and lower rolls 116 is 50 to 100 mm (not wider than 100 mm). In order to achieve the above (II), the interval between the upper and lower rolls 116 is 50 to 100 mm (not narrower than 50 mm), and between 10 and 20 roll uprights 120 are not provided with the rolls 116 at the same upper and lower positions. In order to achieve the above (III), the interval between the roller standing bodies 120 is disposed at a position L3 wider than the other portions at the position where the ejector 106 is disposed. In order to achieve the above (IV), the roller 116 is allowed to be disposed at the same height position in the lower portion of the roll stand 120, and the skew preventing member 122 is disposed at the position where the roll stand 120 is disposed at the interval L3, and the roll stand is disposed. The body 120 is disposed at a position L2 narrower than the diameter of the roller 116 at a position where the ejector 106 is not disposed. Finally, in order to achieve the above (V), the gap is separated from the upper end of the uppermost roller 116, fixed by the fixing member 116g, and smoothly rotated in the plating solution, and the distance between the roller 116 and the thin plate substrate W is 1 to 5 mm (not narrower than 1 mm).

These various combinations can be appropriately selected by the elements to be limited, but are preferably all provided.

Fig. 17 is a view showing the discharge device 302, and the anode device 301, the restriction roller device 304, and the mask device 303 are omitted. In Fig. 17, the discharge device 302 discharges the plating liquid from the ejector 106 to the thin plate substrate W. The plating solution ejected from the ejector 106 is discharged from the processing tank main body 100 by the liquid discharging device 200 or the overflow tank 202, subjected to a filtering process by the screening program 209, and then returned to the ejection box 204 by the loop pump 208 through the pipe 210. In the spray box 204, after the pressure of the plating solution is equalized, it returns to the ejector 106 again to perform the loop.

The spray box 204 is provided in plurality along the traveling direction of the thin plate substrate W on the bottom surface of the processing tank main body 100. As shown in Fig. 17, the spray box 204 is bolted to the bottom plate of the processing tank main body 100, and the height can be adjusted. A communication hole is provided in a side wall of the spray box 204, and the pipe 210 is connected in order to allow a liquid flow therethrough. Further, the reinforcing member 204a is attached to the spray box 204, and it is possible to prevent the pressure of the plating tank 204 from being deformed by the pressure of the plating liquid sent from the loop pump 208 without equalizing the pressure of the plating liquid.

As shown in Fig. 17, the ejector 106 is configured such that a plurality of jet nozzles 106a for discharging the plating solution are mounted on the nozzle tube 106b at predetermined intervals. The nozzle tube 106b is erected on the spray box 204, and the lower end of the spray box 204 and the nozzle tube 106b are connected through a communication hole so that the liquid flow can be passed. On the other hand, the upper end of the nozzle tube 106b is fitted into a hole provided in the nozzle fixing member 212, and the nozzle fixing member 212 is mounted in the traveling direction of the thin plate substrate W to prevent the injector 106 from being ejected when the plating solution is ejected. The pressure is inclined (tilted) or vibrated in the opposite direction to the thin plate substrate W, so that the jet flow of the plating solution to the thin plate substrate W can be stabilized.

As shown in Fig. 17, the heights of the jet nozzles 106a provided on the right side of the thin plate substrate W and the injectors 106 on the left side are staggered with each other. This is because a pressure difference is generated between the plating liquid jet pressure on the surface of the thin plate substrate W, so that the liquid flow can be efficiently passed through the through holes provided in the thin plate substrate W.

Fig. 18 is a view showing the mask device 303. A part of the anode device 301 and the discharge device 302 are omitted. As shown in Fig. 18, the mask device 303 is composed of an upper substrate mask 109; an upper electrode mask 113; a lower substrate mask 108; a lower electrode mask 112 having a rotating mechanism 150; The lower substrate mask 108 and the lower electrode mask 112 are connected into an integrated plate 110 and a reinforcing connecting member 216; and a height adjusting device 220 that integrally lifts the lower substrate mask 108 and the lower electrode mask 112 And a guide table 214 and a post 155 that guide the lower substrate mask 108 and the lower electrode mask 112 when height adjustment is performed.

The upper substrate mask 109 and the upper electrode mask 113 are attached to the nozzle fixing member 212 as shown in Fig. 18. Both the upper substrate mask 109 and the upper electrode mask 113 have long holes in the up and down direction of the drawing, and the upper substrate mask 109 and the upper electrode mask 113 are bolted to the nozzle fixing member 212 through the long holes. The height can be adjusted in the up and down direction of the drawing.

The upper substrate mask 109 and the upper electrode mask 113 are used in combination to effectively shield the current from the substrate end of the thin substrate W to a minute area of 1 to 5 mm. By the upper substrate mask 109, it is possible to locally control the concentration of current to the upper end portion of the thin plate substrate W, and at the same time, control is performed by the upper electrode mask 113 so that the current that cannot be controlled by the upper substrate mask 109 does not wind. It is to the vicinity of the upper end of the thin plate substrate W.

Further, in the present embodiment, as shown in Fig. 18, in order to effectively prevent current from being concentrated toward the lower end portion of the thin plate substrate W, the mask plate as the lower end portion of the substrate has the lower substrate mask 108 and the lower electrode mask. Board 112. The reason why the lower substrate mask 108 and the lower electrode mask 112 are used in combination with the upper substrate mask 109 and the upper electrode mask 113 is the same.

Here, the mask plates 108 and 112 and the mask plates 109 and 113 are set such that the shorter the distance from the thin plate substrate W, the overlapping length from the end portion of the thin plate substrate W (shown in FIG. 21) The length of the thin plate substrate W overlapping the mask plate: hereinafter referred to as "coverage value") L60 is smaller. For example, as shown in FIG. 21, the coverage value of the lower substrate mask 108 having a short distance from the thin substrate W is set to be smaller than the coverage value of the lower electrode mask 112.

Further, it is preferable to set the distance L50 (Fig. 22) of the substrate masks 108 and 109 from the thin substrate W in the range of 1 to 50 mm. Therefore, it is possible to effectively prevent the current from being concentrated toward the end portion of the thin plate substrate W without lowering the amount of energization required for plating (reducing the plating efficiency).

Specifically, the upper substrate mask 109 is disposed so as to overlap the upper end portion of the thin plate substrate W by 1 to 15 mm (here, 10 mm), and the upper electrode mask 113 is disposed to overlap the upper end portion of the thin plate substrate W by 10 to 10 60mm (50mm here). Further, the upper substrate mask 109 (the L-shaped bottom end) is provided at a distance of 25 mm from the thin substrate W.

On the other hand, the height of the lower substrate mask 108 is set to be 1 to 10 mm (here, 5 mm) with respect to the lower end portion of the thin plate substrate W. Further, the height of the lower electrode mask 112 is set to overlap 50 to 75 mm (here, 65 mm) with respect to the lower end portion of the thin plate substrate W. Further, the lower substrate mask 108 is disposed at a distance of 4 mm from the thin substrate W.

However, if the setting of the coverage value of the substrate mask and the electrode mask changes, the current mask effect also changes. Therefore, as described above, the lower substrate mask 108 and the lower electrode mask 112 can be integrally adjusted in height by the height adjusting device 220 so that even if the size of the thin substrate W is changed, the substrate mask and the electrode mask are The coverage value will not change.

In Fig. 18, the lower substrate mask 108 is mounted on a flat plate 110 which is coupled to the lower electrode shield 112 by a reinforcing connecting member 216 such that the lower electrode mask 112 and the lower substrate mask 108 Being integrated. Also, the reinforcing connecting member 216 is also fixed to the upper surface of the lower substrate mask 108, thereby preventing the flat plate 110 from being deflected (bent).

As shown in Fig. 18, a guide table 214 for guiding the lower electrode mask 112 is attached to the bottom plate of the processing tank main body 100, and the guide table 214 is attached to accommodate the injection box 204 below. A pillar 155 is vertically provided on the upper surface of the guide table 214, and the upper end of the pillar 155 is fixed to the nozzle fixing member 212 by bolts. The lower electrode mask 112 is fixed to the side surface of the guide table 214 by bolts (not shown) by a long hole in the longitudinal direction, and the rotating mechanism 150 provided on the lower electrode mask 112 passes through the roller. 150a is engageable on the above-mentioned support 155 so as to be movable up and down. Thus, the lower electrode mask 112 is guided by the guide table 214 and the post 155, whereby the lower substrate mask 108, the lower electrode mask 112, and the roller stand 120 are adjusted when the height is adjusted by the height adjusting device 220. It is guided by one.

In Fig. 18, the height adjusting device 220 is composed of a drive motor 220a, a pulley 220b, a connecting wire rope 220c, and a drive belt 220d. One end of the connecting wire rope 220c is fixed to the pulley 220b, and the other end is connected to the reinforcing connecting member. By driving the driving motor 220a, the wire rope 220c is wound around the pulley 220b, whereby the lower substrate mask 108, the lower electrode mask 112, and the roller standing body 120 are integrally raised.

Fig. 19 is a view of the reinforcing connecting member 216 as seen from the side of the thin plate substrate W. The connecting wire rope 220c is connected to the upper surface of the reinforcing connecting member 216 by a wire joint 218 as shown in Fig. 19.

Fig. 20 is a view showing the structure of the anode 102. The anode 102 constituting the anode device 301 has an anode cover 102a that accommodates a plated metal material such as a copper ball, a handle 102d attached to the side surface of the anode cover 102a, and a hook portion 102e provided at a lower end portion of the handle 102d. 102e is for mounting the anode cover 102a on the power supply rail 224 shown in Fig. 1. The upper end of the handle 102d is at a height substantially reaching the opening portion 102b. Further, in the upper opening portion 102b of the anode cover 102a, four rod-shaped guides 102c are attached at equal intervals (two sheets are overlapped in the direction in which the paper faces in the drawing, and are not visible). The upper end of the rod-shaped guide 102c extends to the vicinity of the insertion hole 100b for inserting a plating metal material provided on the cover 100a of the processing tank main body 100. Further, 100c is a cover for the insertion hole 100b.

When the plating operation is continuously performed, it is necessary to supply the plating metal material to the anode cover 102a. Due to the presence of the rod-shaped guide 102c, it is possible to prevent the plating metal material from being dropped into the anode cover 102a and falling into the treatment tank main body 100 when the plating metal material is thrown from the input hole 100b.

Further, when the plating operation is continuously performed, the anode cover 102a must be removed for maintenance (cleaning). However, in order to avoid the shortage of the plating metal material, it is necessary to excessively apply the plating metal material (to the plating metal material to the extent that it overflows from the opening portion 102b), and conventionally, the cylindrical guiding device is fitted into the insertion hole 100b to prevent The plated metal material falls into the processing tank body 100. However, in the case of using a cylindrical guide, it is extremely difficult to remove the plating metal material that is excessively supplied, and the operation of disassembling the anode cover 102a is laborious during maintenance. By forming the rod-shaped guide 102c, the plating metal material that is excessively loaded can be easily removed from the input hole 100b, so that the anode cover 102a can be easily removed during maintenance.

2. Substrate impregnation device

In the plating tank 2 of the above-described embodiment, a substrate immersing device is provided in the substrate immersing portion 2a (see FIG. 15) in which the thin plate substrate W is immersed. The structure of the substrate immersing apparatus will be described using Fig. 13 . 13A is a cross-sectional view of the substrate immersion device 600 in a state where the substrate is lowered at the position (x) of FIG. 14, and FIG. 13B is a view of the substrate immersing device 600 shown in FIG. 13A as viewed from above. Figure.

As shown in Fig. 13A, the substrate dipping apparatus 600 has a processing tank main body 60 that stores plating liquid for immersing the thin plate substrate W, and a substrate guiding device 62 for pairing the thin plate substrate W that is lowered into the processing tank main body 60. Guided by a bubble generator 68 as a liquid flow generator disposed outside the substrate guide 62.

As shown in Fig. 13A, the substrate guiding device 62 has a lower guide plate 62a which is disposed in parallel at a predetermined interval t, and an upper guide plate 62b which is disposed in a tapered manner so as to be widened in the vertical direction. And a slit 62c as a slit hole; and a rectifying plate 62d which diffuses a liquid flow generated by air agitation without becoming weak. Further, as shown in Fig. 13A, the substrate guiding device 62 is disposed such that the front end 62e of the upper guide plate 62b protrudes from the liquid surface, and the cut hole 62c is immersed in the plating liquid. Fig. 7 is a perspective view showing the structure of the substrate guiding device 62.

The bubble generation tube 68 as the liquid flow generator receives the supply of air from the duct 66 shown in Fig. 13A, and discharges the air upward. Therefore, it is conceivable that as the air rises, the plating liquid in the periphery thereof rises, and accordingly, the outer plating liquid separated by the rectifying plate 62d flows in from the lower end portion of the rectifying plate 62d, thereby generating an upward flow of the plating liquid, and rising. The plating solution passes through the slit 62c, and then becomes a liquid flow downward between the lower guide plates 62a, and flows in again from the lower end portion of the rectifying plate 62d to generate a loop liquid flow. Therefore, the thin plate substrate W can be smoothly guided and immersed along the substrate guiding device 62. Further, as a result of the experiment, the bubble generating tube 68 is disposed at the same height as the slit 62c or in the vicinity of the lower end portion of the rectifying plate 62d, and the bubble generating tube 68 is disposed in the center in the depth direction of the processing tank main body 60. When you are nearby, you can guide more smoothly. Further, as a result of the same experiment, the slit 62c is provided on the lower guide plate 62a, and the slit 62c is provided on the upper guide plate 62b to guide the thin plate substrate W more smoothly.

With the above configuration, the front end 62e of the upper guide plate 62b protrudes from the liquid surface, and the slit 62c is placed on the upper guide plate 62b at a position immersed in the plating solution. In this state, the substrate guide device The liquid flow is generated by the liquid flow generator disposed outside the substrate guide 62, so that the thin plate substrate W can be smoothly immersed in the plating liquid.

Further, in the above-mentioned Fig. 13, the substrate immersing device is disposed at the position of the immersion substrate of the plating tank 2, and the bubble generating tube 68 is used as the liquid flow generator, but the treatment in the through hole or the via hole of the thin plate substrate W is improved. In the case of the effect, or in the case where the pickling cleaning process is performed in the pretreatment tank 1 where foaming is desired, for example, as shown in Fig. 6A, the jet nozzle 64 can be used as the liquid flow generator. In this case, the jet nozzle 64 is ejected in a substantially horizontal direction toward the slit 62c. Thereby, the liquid flow directed downward between the lower guide plates 62a is subsequently generated by the slits 62c, and the thin plate substrate W can be smoothly guided and immersed along the substrate guide 62.

Further, as a result of the experiment, as compared with the direct injection of the jet toward the slit, as shown in Fig. 8, when the upper portion R is ejected toward the slit, the thin plate substrate W can be guided more smoothly. In Fig. 8, the jet is jetted upward with respect to the horizontal plane.

As shown in FIG. 6B, the jet nozzles 64 are arranged at equal intervals in the traveling direction (D direction) of the transport hanger 15, and as shown in FIG. 6A, the jet nozzles 64 are fixedly disposed. The cut holes 62c of the substrate guide 62 have the same height.

Further, an air blow may be provided on the liquid surface near the outer side of the substrate guiding device 62 so that the air ejection direction faces the opposite side of the substrate guiding device, and the air discharged from the bubble generating tube 68 is at the liquid level. Blow it off before it becomes a bubble. Thereby, it is possible to prevent the foam from adhering to the surface of the thin plate substrate W, and the treatment effect of the treatment liquid can be sufficiently obtained.

In the above embodiment, the case where the plating tank is applied has been described, but it may be applied to other processing tanks for performing the cleaning treatment or the like.

3. Surface treatment device and structure of the transport hanger

As shown in Figs. 14 and 15, the surface treatment apparatus 300 includes guide rails 10 to 13 for transporting a transport hanger 15 for holding a thin substrate W such as a printed circuit board, and along these guide rails : a pretreatment tank 1 for performing a pre-plating treatment process; a plating tank 2 for performing a plating process; a recovery tank 3 and a water washing tank 4 for performing a post-plating treatment process; and for performing a plate-shaped workpiece (thin substrate) The unloading portion 5 for removing the W; the peeling groove 6 for performing the peeling step (the hanger returning step) for peeling and removing the plating layer or the like attached to the transport hanger 15; and the washing for the post-suspension peeling treatment step The groove 7; and the loading portion 8 for mounting the plate-shaped workpiece (thin substrate) W.

The elevating rails 10 and 12 shown in Fig. 15 are the guide rails for attaching and detaching the plate-like workpiece (thin substrate) W to the transport hanger 15 and immersing the plate-shaped workpiece (thin substrate) W in the groove. A guide rail that is lifted and lowered during the pretreatment tank 1, the plating tank 2, the recovery tank 3, or the washing tank 4, etc. The fixed rails 11 and 13 are rails that are fixed to each other to transport the transport hangers 15 that have been lowered into the plating tank 2 and the peeling grooves 6.

The configuration of the transport hanger 15 of the present invention will be described with reference to Fig. 9 and the like.

As shown in Fig. 9, the transport hanger 15 has a workpiece holding member 47 having a plurality of grippers 48 that hold a plate-like workpiece (thin sheet substrate W), and a sliding member 35 that is in sliding contact with the fixed rails 11. And a connecting member 44 that connects the workpiece holding member 47 and the sliding member 35. As a material of the sliding member 35 and the connecting member 44, copper, brass, or the like can be used.

The width L0 of the workpiece holding member 47 shown in Fig. 9 can be calculated from the width W0 of the plate-like workpiece W (thin board substrate W) and the nip margin W1. For example, when the nip margin W1 is provided at both ends of the plate-like workpiece W (width W0), the width L0 of the workpiece holding member 47 is calculated as L0 = W0 - 2 × W1.

Further, as shown in Fig. 10, a bearing 36 is fixed to the upper portion of the sliding member 35, and the bearing 36 has a one-way clutch gear 40 that meshes with the chain belt 39 (constituting the fixed rail conveying device 19 shown in Fig. 14). . Therefore, the gear 40 that meshes with the fastener tape 39 on the fixed rails 11, 13 can be rotated only in the B direction shown in Fig. 9 at the time of feeding.

The pusher abutment surface 37 shown in FIG. 9 is a portion where the transfer devices of the transport hanger 15 , that is, the pushers 16 and 21 ( FIG. 11 ) of the intermittent transfer devices 17 and 22 are in contact with each other.

The claw abutting portion 32 of the drawing 10 is a portion where the conveying device of the conveying hanger 15 , that is, the conveying claw 27 ( FIG. 14 ) of the positioning conveying device 18 abuts. Each of the conveying devices of the conveying hangers 15 will be described below.

4. Each conveying device of the transport hanger 15

The transport hanger 15 shown in FIG. 9 is transported by the following apparatus in the surface treatment apparatus 300: the intermittent conveyance apparatuses 17 and 22, the positioning conveyance apparatuses 18 and 23, the fixed rail conveyance apparatuses 19 and 24, and the delivery conveyance apparatus. 20, 25.

First, the intermittent conveyance devices 17 and 22 provided on the upper portions of the elevation rails 10 and 12 shown in Fig. 15 are placed at the positions (c) to (f) and (h) to (k) of the elevation rail 19, respectively. The hanger 15 is intermittently conveyed one by one by the push rods 16a to 16d and 21a to 21d (Fig. 11). Fig. 11 is a plan view showing the configuration of the intermittent transfer device 17 provided on the upper portion of the elevation rail 10.

The positioning conveyance device 18 shown in Fig. 15 is provided along the fixed rails 11 and is lowered from the (x) position on the upper side of the plating tank 2 to the transport hanger 15 in the workpiece immersed portion (substrate immersed portion) 2a (refer to Fig. 15) Shifting to the fixed rail 11 and feeding it to the position (b), and at the same time, the plate-like workpiece W (thin substrate W) in the plating tank 2 and the front position (left side of Fig. 15) (a) The interval between the plate-like workpieces W (thin board substrates W) is adjusted to a predetermined width L1 (for example, L1 = 5 mm).

Fig. 12 shows the structure of the positioning conveyance device 18. The positioning conveyance device 18 shown in Fig. 12 is movable back and forth along the guide rails in the X and Y directions, the guide rails are separately provided along the fixed rails 11, and the positioning conveyance device 18 has the conveyance claws 30, and the conveyance claws 30 In the state shown in Fig. 12A, the spring is applied with an elastic force in the Z direction. Therefore, when the transport hanger 15 is transported, first, when moving in the X direction, the spring contracts and passes through the claw abutting portion 32 shown in Fig. 10 (state of Fig. 12B), and then reverses (the Y direction in the FIG. 12C) is moved, and the transport claw 30 is hooked on the claw abutting portion 32 of the transport hanger 15, and the transport hanger 15 is transported in the C direction shown in FIG. At this time, the moving speed of the positioning conveyance device 18 must be faster than the moving speed of the fixed rail conveying device 19 (that is, the moving speed of the chain belt 39) so as to catch up with the conveying hanger 15 before being transported by the fixed rail conveying device 19. Further, the positioning conveyance device 23 on the side of the separation groove 6 performs the same operation as the positioning conveyance device 18 on the plating tank 2 side shown in FIG. 12, and has the same configuration as the positioning conveyance device 18.

The fixed rail transporting devices 19 and 24 transport the transporting hangers 15 that are fed by the positioning transporting devices 18 and 23 while maintaining a predetermined interval (L1 in Fig. 15) (in the direction of the arrow C in Fig. 14).

The delivery conveyance devices 20 and 25 transport the fixed rail transporting devices 19 and 24 to the transport hangers 15 at the positions (g) and (o), respectively, and transfer them to the (h) and (f) of the elevating guide rails 12 and 10, respectively. ) Location (Figure 14). The configuration and operation of the delivery conveyance devices 20 and 25 are the same as those of the positioning conveyance device 18 shown in Fig. 12 .

5. Other implementations

Further, in the above embodiment, the mask plate for the thin plate substrate W has two mask plates of an upper (lower) substrate mask and an upper (lower) electrode mask, but it is also possible to cover the substrate. A mask plate is added between the cover plate and the electrode mask.

Further, in the above-described embodiment, the upper substrate mask and the upper electrode mask are independently lifted and lowered, but they may be formed to be integrally lifted and lowered.

1. . . Pretreatment tank

2. . . Plating tank

2a. . . Substrate impregnation

3. . . Recovery tank

4. . . Washing tank

5. . . Unloading department

6. . . Stripping groove

7. . . Washing tank

8. . . Loading department

10~13. . . Lifting rail

11. . . Fixed rail

15. . . Transport hanger

16,21. . . Putt

16,16a ~ 16d, 21, 21a ~ 21d. . . Putt

17,22. . . Plane intermittent conveying device

18,23. . . Positioning conveyor

19,24. . . Fixed rail conveying device

20,25. . . Delivery conveyor

27,30. . . Transport claw

32. . . Claw abutment

35. . . Sliding part

36. . . Bearing

37. . . Push rod abutment

39. . . Chain belt

40. . . gear

44. . . Connecting part

47. . . Object holding member

48. . . clamp

60. . . Processing tank body

62. . . Substrate guide

62a. . . Lower guide plate

62b. . . Upper guide plate

62c. . . Slit

62d. . . Rectifier

62e. . . front end

64. . . Jet nozzle

66. . . pipeline

68. . . Bubble generating tube

100. . . Processing tank body

100a. . . cover

100b. . . Input hole

102,104. . . anode

102a. . . Anode cover

102b. . . Opening

102c. . . Rod guide

102d. . . handle

102e. . . Hook

106. . . Ejector

106a. . . Jet nozzle

106b. . . Nozzle tube

108. . . Lower substrate mask

109. . . Upper substrate mask

110. . . flat

112. . . Lower electrode mask

113. . . Upper electrode mask

114. . . axis

116,116b. . . Roll

116e. . . Adjustment component

120. . . Roller stand

122, 122a, 122b. . . Skew prevention

124. . . Transport space

131. . . Rectifying component

131a, 131b. . . Oblique down rectifier

132. . . Ejection tube

133. . . Pipette

150. . . Rotating mechanism

155. . . pillar

200. . . Drainage device

202. . . Overflow trough

204. . . Spray box

204a. . . Reinforcement

208. . . Loop pump

209. . . Screening program

210. . . pipeline

212. . . Nozzle fixing part

214. . . Boot table

216. . . Connecting part

220. . . Height adjustment device

220a. . . electric motor

220b. . . Pulley

220c. . . Wire rope

220d. . . Drive belt

224. . . Power supply rail

300. . . Surface treatment device

301. . . Anode device

302. . . Ejection device

303. . . Mask device

304. . . Limit roller device

600. . . Substrate immersion device

C. . . arrow

L0, L1. . . width

L2, L3, L30, L70. . . interval

L40, L50. . . distance

L60. . . Overlap length

W. . . Thin plate substrate

W0. . . width

W1. . . Clamping allowance

Fig. 1 is a view showing an α-α cross section of the plating tank 2 (Fig. 14).

Fig. 2 is a view showing a structure in the plating tank 2 as seen from the β direction of Fig. 1.

Fig. 3 is a plan view showing the plating tank 2 as seen from the γ direction of Fig. 1 .

Fig. 4 is a detailed view of the roller upright viewed from the β direction of Fig. 1.

5A and 5B are views showing the deflection preventing members 122 (122a, 122b) in detail.

6A and 6B are detailed views showing the structure of the substrate immersing apparatus 600.

Fig. 7 is a perspective view showing the structure of the substrate guiding device 62.

Fig. 8 is a view showing the jet nozzle 64 in detail.

Fig. 9 is a view showing the configuration of the transport hanger 15.

Fig. 10 is a central sectional view of the transport hanger 15.

Fig. 11 is a plan view showing the configuration of the planar intermittent conveying device 17 provided on the upper portion of the elevating rail 10.

12A and B are views showing the configuration of the positioning conveyance device 18.

13A and B are views showing the structure of the substrate immersing apparatus.

Fig. 14 is a plan view of the surface treatment apparatus 300 as viewed from above.

Fig. 15 is a side view showing the surface treatment apparatus 300 shown in Fig. 14 as seen from the α direction.

Fig. 16 is a view showing the structure of a conventional guide device.

Fig. 17 is a view showing the configuration of the discharge device 302.

Fig. 18 is a view showing the mask device 303.

Fig. 19 is a view of the reinforcing connecting member 216 as seen from the side of the thin plate substrate W.

Fig. 20 is a view showing the structure of the anode 102.

Fig. 21 is a view showing a length in which the thin plate substrate W overlaps with the mask.

Fig. 22 is a view showing the structure of the lower portion of the roller upright 120.

Fig. 23 is a view of the substrate W which is shaken as seen from the transport direction.

Fig. 24 is a view showing the substrate W which is shaken as viewed from above the plating tank.

Fig. 25 is a view showing the structure of the upper end portion of the roller upright 120.

Fig. 26 is a view showing the relationship between the number of rollers 116 and the predetermined area of the thin-plate substrate W to be conveyed.

2. . . Plating tank

15. . . Transport hanger

48. . . clamp

100. . . Processing tank body

102,104. . . anode

106. . . Ejector

108. . . Lower substrate mask

109. . . Upper substrate mask

110. . . flat

112. . . Lower electrode mask

113. . . Upper electrode mask

114. . . axis

116. . . Roll

120. . . Roller stand

122. . . Skew prevention component

150. . . Rotating mechanism

155. . . pillar

200. . . Drainage device

202. . . Overflow trough

204. . . Spray box

208. . . Loop pump

210. . . pipeline

224. . . Power supply rail

Claims (7)

A plate-shaped workpiece impregnation device, comprising: a treatment tank for immersing a plate-shaped workpiece in a treatment liquid; and a substrate guiding device for guiding a plate-shaped workpiece descending to the treatment tank, and having a pair of lower guide plates which are arranged in parallel at a predetermined interval; and a pair of upper guide plates which are arranged in a tapered shape so as to be widened in a direction perpendicular to the vertical direction, and provided with cut holes and a substrate The guide device is disposed such that the front end of the upper guide plate protrudes from the liquid surface, and the cut hole is immersed in the treatment liquid; and the liquid flow generator is disposed on the outer side of the substrate guide device. The plate-shaped workpiece impregnation apparatus according to claim 1, wherein the liquid flow generator sprays the jet flow toward the slit hole in a horizontal direction. The plate-shaped workpiece impregnation apparatus according to claim 1, wherein the liquid flow generator sprays the jet flow toward the upper portion of the slit hole toward the upper side than the horizontal direction. The plate-shaped workpiece immersing apparatus according to claim 1, wherein the liquid flow generator is disposed at a predetermined height in the treatment tank to discharge the gas upward. The plate-shaped workpiece impregnation apparatus according to claim 4, wherein the liquid flow generator is disposed at an intermediate height in the treatment tank. A plate-shaped workpiece impregnation method for guiding a plate-like workpiece descending to a treatment tank using a substrate guide device, wherein the substrate guide device has: a pair of lower guide plates which are arranged in parallel at predetermined intervals; a pair of upper guide plates that are spaced apart in a vertically upward direction The plate-shaped workpiece immersing method is characterized in that the front end of the upper guide plate constituting the substrate guide is protruded from the liquid surface, and the cut hole is immersed in the treatment liquid. Disposing the substrate guiding device, and generating a liquid flow by a liquid flow generator disposed outside the substrate guiding device and under the liquid surface of the processing liquid, and lowering the plate-shaped workpiece to the processing tank to be immersed in the treatment liquid. A substrate guiding device for guiding a plate-like workpiece descending to the processing tank, characterized by comprising: a pair of lower guiding plates arranged in parallel at predetermined intervals; and a pair of upper guiding The plate is disposed in a tapered shape so as to be widened in a direction perpendicular to the vertical direction, and is provided with a cut hole.