KR20110055494A - Plating tank - Google Patents

Abstract

PURPOSE: A plating bath is provided to achieve uniform plating quality and thickness and to enable a printed board to be transported or dipped without damage. CONSTITUTION: A plating bath comprises a bath, a board guide and a flow generator. The bath makes a plate-shape workpiece sink in solution. The board guide guides the plate-shape workpiece to the bath and comprises lower guide plates and an upper guide plate. The lower guide plates are arranged in parallel and the upper guide plate is arranged to be tapered and comprises a notch hole. The board guide enables the leading end of the upper guide board to be protruded from the surface of the solution and the notch hole to be sunken in the solution. The flow generator is arranged outside of the board guide.

Description

Plating Tank

TECHNICAL FIELD This invention relates to the technique of electroplating plate-like workpieces, such as a printed board, in surface treatment apparatuses, such as an electroplating apparatus.

In the conventional surface treatment apparatus (electroplating apparatus of a printed circuit board), the plate-shaped workpiece W was fixedly attached to the rack so that shaking did not occur, and the surface treatment was carried out while conveying the rack. However, a rackless type surface treatment apparatus has been proposed in the case where the attachment of the plate-shaped workpiece W to the rack is complicated work or the load on the apparatus is large, so that the apparatus is enlarged.

As such a rackless type surface treatment apparatus, Unexamined-Japanese-Patent No. 2002-363796 (patent document 1) etc. are mentioned. The structure of the said surface treatment apparatus is demonstrated below using FIG. 14, FIG. 14 is a plan view of the surface treatment apparatus 300 viewed from above. FIG. 15 is a side view of the surface treatment apparatus 300 shown in FIG. 14 seen from the α direction.

As shown in FIG. 14 and FIG. 15, the surface treatment apparatus 300 is what is called a pusher type surface treatment apparatus, The guide rail for conveying the conveyance hanger 15 which supported the plate-shaped workpiece W, such as a printed board. 10 to 13, the pretreatment tank 1 for carrying out the plating pretreatment process along these guide rails, the plating tank 2 for carrying out the electroplating process, and the plating post treatment process for carrying out Recovery tank 3, washing tank 4, unloading part 5 for separating plate-shaped workpiece W, stripping tank 6 for performing peeling step (hanger return step), hanger peeling post-treatment The washing tank 7 which performs a process and the rod part 8 which adheres a plate-shaped workpiece are provided.

As the elevating guide rails 10 and 12 shown in FIG. 14 descend, the plate-shaped workpiece W falls in each processing tank (plating tank 2, peeling tank 6, washing tank, washing tank, cleaner tank, etc.). Is immersed. In addition, the guide rails 10-13 comprise one annular guide rail in the state which the lifting guide rails 10 and 12 shown in FIG. 15 fell.

The plate-shaped workpiece W is guided into the processing liquid at the immersion position (the position in FIG. 14) of the plating bath 2 by the drop of the elevating guide rail 12 shown in FIGS. 14 and 15. The plate-like workpiece W contained therein moves the plating bath 2.

As shown in FIG. 9, the conveyance hanger 15 used for the said rackless type surface treatment apparatus 300 supports to-be-processed object which was equipped with the clamp 48 which supports the plate-shaped workpiece W. As shown in FIG. It has the member 47, the sliding member 35 which slide-contacts with respect to the fixed guide rail 11, and the connection member 44 which connects these. The conveyance hanger 15 supports the upper end of the plate-shaped workpiece W by the clamp 48.

By the way, in the rackless type surface treatment apparatus as described above, the plating liquid classification from the jetting means arranged on both sides of the plate-shaped workpiece W in the plating bath for the purpose of realizing uniform plating quality and uniform plating film thickness. Is processed so as to touch the plate-shaped workpiece W. However, since the plate-shaped workpiece W is shaken during transportation because the rack is not used, the distance from the electrode is not constant, resulting in uneven plating thickness or current concentrated at the end of the plate-shaped workpiece W. The plating film thickness of the edge part might become thick more than that.

For this reason, in a rackless type surface treatment apparatus, it is a big problem to suppress shaking of the plate-shaped workpiece W and to prevent an electric current from concentrating on the end of the plate-shaped workpiece W.

Then, the said patent document 1 makes the distance of the plate-shaped workpiece W before and behind in the plating tank 2 into a predetermined distance (for example, 5 mm) in order to prevent the current concentration to the plate-shaped workpiece W front-and-back end part. The distance is quickly adjusted to the position. In addition, a linear plate made of Teflon (registered trademark) for preventing the shaking of the plate-shaped workpiece W in a surface treatment tank such as a plating bath, or a shielding plate for preventing current concentration to the end of the plate-shaped workpiece W A method such as a provision is carried out (Japanese Patent Laid-Open No. 2000-178784 (Patent Document 2) and Japanese Laid-Open Patent Publication No. 2002-13000 (Patent Document 3)).

In the case where a printed substrate having a thickness of 0.1 mm or less (hereinafter referred to as a thin substrate) is used as a plate-shaped workpiece, it is shown in FIG. 16 for the purpose of smoothly immersing the plate-shaped workpiece W into each processing tank. It is proposed to arrange such a guide guide and the like in a tank (Japanese Patent Laid-Open No. 2004-346391 (Patent Document 4)).

The guide guide shown in patent document 4 arrange | positions a pair of rectifying member 131 (it consists of inclination falling flow plates 131a and 131b) in the fall position of a thin board | substrate. As shown in FIG. 16, the inclined downward flow plates 131a and 131b have an upper side formed in a substantially V-shape, and an ejection pipe 132 is provided along the upper end of the inclined downward flow plates 131a and 131b. . Further, a liquid absorbing tube 133 is provided below the inclined downward flow plates 131a and 131b, and the liquid absorbing tube 133 ejects the sucked plating liquid from the spray pipe 132. As a result, the thin plate substrate can be promptly guided along with the flow toward the bottom by ejecting from the inclined downward flow plates 131a and 131b.

Patent Document 1: Japanese Unexamined Patent Publication No. 2002-363796

Patent Document 2: Japanese Unexamined Patent Publication No. 2000-178784

Patent Document 3: Japanese Unexamined Patent Publication No. 2002-13000

Patent Document 4 Japanese Unexamined Patent Publication No. 2002-363796

However, in the conventional technique as described above, although the current concentration at the front and rear ends of the plate-shaped workpiece W can be prevented, the current concentration to the upper and lower ends of the plate-shaped workpiece W can be prevented while achieving uniform quality by the classification of the plating liquid. There was a case where it was possible to interfere and to achieve a uniform plating film thickness.

For example, Patent Documents 2 and 3 aim to achieve a uniform plating quality by rectifying the plating liquid classification with a louver. However, the louver may act as a current shielding effect more than necessary, resulting in poor plating efficiency or plating. The quality may deteriorate. In addition, although a shielding plate is provided at the lower end of the plate-shaped workpiece W, the current shielding effect may not be sufficiently obtained due to inflow of current, and the current is concentrated at the upper end and the lower end of the plate-shaped workpiece W. There is a possibility that the plating film thickness may fluctuate.

In addition, the Teflon filigree is used as a guide to prevent the shaking of the plate-shaped workpiece W, but the teflon filigree is easily broken in contact with the plate-shaped workpiece W, and as a result, the shake of the plate-shaped workpiece W is prevented. I could not do it. In addition, a metal core material may be provided on the teflon-like structure so as not to be cut off, but when the teflon resin is peeled off and the metal core material is exposed, the plate-shaped workpiece W may come into contact with the exposed metal core material and scratches may occur. In some cases, plating adhered to the metal core material was mixed in the treatment liquid, resulting in poor plating quality. Particularly, in the case of a thin plate substrate having a thickness of 0.1 mm or less, the plate-shaped workpiece W is easily shaken or distorted by the plating classification, and the plate-shaped workpiece W is in sliding contact with the plate-shaped workpiece W, so it is easy to cause scratches. .

SUMMARY OF THE INVENTION The present invention solves the above problems, and in a surface treatment apparatus such as a rackless type electroplating (in particular, an electroplating apparatus for supporting and conveying a plate-like workpiece such as a printed circuit board in a vertical state), the printed board In particular, it provides a plating bath that can be safely transported or immersed without damaging plate-shaped workpieces such as thin printed boards having a thickness of 0.1 mm or less, and can achieve uniform plating quality and plating film thickness. It aims to do it.

Several independent aspects of the present invention are shown below.

(1) The plating bath of the present invention is a plating bath for electroplating plate-like workpieces,

A treatment tank main body which extends in the moving direction of the plate-shaped workpiece and holds the treatment liquid;

With anode means,

A jetting means for jetting the treatment liquid toward the plate-shaped workpiece from the side of the treatment tank main body;

A plurality of rollers rotatably installed in the processing tank main body so as to sandwich the plate-shaped workpiece to be moved from both sides, from the top to the bottom of the processing tank main body or continuously in the advancing direction of the plate-shaped workpiece. Regulating roller means having,

And a current shielding means for preventing current from concentrating on the end of the plate-shaped workpiece.

Therefore, the uprightness of a plate-shaped workpiece is maintained by the regulation roller means. Moreover, since a roller is used, a scratch does not arise in a plate-shaped workpiece. This enables uniform processing.

(2) In the plating bath of the present invention, the regulating roller means is provided with a plurality of roller fitting bodies in which a plurality of rollers are arranged in the vertical direction in the advancing direction of the plate-shaped workpiece, and at the ejection position of the jetting means. It characterized by making the space | interval of adjoining roller dents wider than another site | part.

Therefore, the processing liquid is uniformly supplied to the plate-shaped workpiece (particularly, the thin workpiece having a thickness of 0.1 mm or less) by the jetting means, and the uprightness of the plate-shaped workpiece is maintained by the regulating roller means. Moreover, since a roller is used, a scratch does not arise in a plate-shaped workpiece. This enables uniform processing.

(3) The plating bath of the present invention is characterized in that a substrate end detachment preventing member is provided so as to sandwich the plate-like workpiece moving near the lower end of the plate-like workpiece at the ejection position of the jetting means from both sides.

Therefore, the bending at the lower end of the plate-shaped workpiece (particularly, the plate-shaped workpiece of 0.1 mm or less in thickness) can be appropriately prevented.

(4) The plating bath of the present invention is characterized by arranging at least one roller per predetermined unit area in a region where the regulating roller means is arranged.

Therefore, it is possible to prevent shaking and distortion in the advancing direction and the vertical direction of the plate-shaped workpiece (particularly, the thin-shaped workpiece of 0.1 mm or less in thickness), and to maintain a constant distance between the plate-shaped workpiece and the anode. Thereby, uniform plating film thickness can be obtained.

(5) In the plating bath of the present invention, the regulating roller means is provided with a plurality of roller tongues in which a plurality of rollers are arranged in an up and down direction in the advancing direction of the plate-like workpiece, and in the roller tongues It is characterized by arrange | positioning the vertical space | interval of a roller at 50-100 mm.

Therefore, the shaking and distortion of the plate-shaped workpiece (particularly, the sheet-shaped workpiece of 0.1 mm or less in thickness) in the vertical direction can be prevented and the uprightness can be maintained. Thereby, the distance between a plate-shaped workpiece and an anode can be kept constant, and uniform plating film thickness can be obtained.

(6) In the plating bath of the present invention, the regulating roller means is a plurality of roller fitting bodies having a plurality of rollers arranged in a vertical direction in a traveling direction of the plate-shaped workpiece, wherein the plate-shaped workpiece of the roller It is characterized in that arranged at a height of more than 50mm from the lower end to arrange the up and down positions of the roller in the roller standing body mutually different.

Therefore, it is possible to prevent the current shielding effect from working at a certain height by the roller. As a result, plating unevenness can be prevented from occurring, and uniform plating is possible.

(7) The plating bath of the present invention includes an upper shielding plate for preventing current from concentrating on the upper end of the plate-shaped workpiece and / or a lower shielding plate for preventing current from concentrating on the lower end. It is characterized by.

Therefore, it is possible to prevent current concentration on both the upper end and the lower end of the plate-shaped workpiece. As a result, the plating film thickness can be made uniform.

(8) The plating bath of the present invention is composed of a shielding plate in which a plurality of the upper shielding plate and / or a lower shielding plate is disposed between the plate-like workpiece and the anode means, and the plurality of shielding plates arranged in the plate-like It is arrange | positioned so that the overlap with a workpiece may become small enough to be close to the said plate-shaped workpiece.

Therefore, the inflow phenomenon of the electric current which arises in only one shielding board can be prevented. Thereby, even if it is a plate-shaped workpiece | work which has a small area | region (a discarding value) which can be current-blocked, plating film thickness can be made uniform. In addition, since the current shielding effect can be sufficiently obtained without reducing the current value, the productivity can be increased.

(9) The plating bath of the present invention is characterized in that the plurality of shield plates arranged in a plurality thereof are integrally constituted and liftable.

As a result, even if the size of the plate-shaped workpiece is changed, the plating film thickness can be made uniform.

The present invention also has independent aspects as shown below.

(a) The plate-like workpiece immersion apparatus according to the present invention is a substrate guide for guiding a plate-like workpiece descending into the treatment tank and a treatment tank for immersing the plate-shaped workpiece in the treatment liquid, parallel to a predetermined interval And a lower guide plate, which is arranged in a vertical manner, and an upper guide plate, which is arranged in a tapered shape so as to have a wider gap in the vertical upper part, and has a groove hole, and protrudes the tip of the upper substrate guide from the surface of the liquid, And a liquid flow generator disposed outside of the substrate guide.

As a result, the liquid flow from the outside of the substrate guide can be led downward in the substrate guide through the groove hole, and the plate-shaped workpiece can be smoothly guided along the substrate guide. In particular, in the case of the acidic cleaner in which the treatment liquid contains a reverse-foaming substance such as a surfactant, it is possible to smoothly guide the plate-shaped workpiece while preventing the deterioration of the plating treatment due to bubbles generated on the liquid surface.

(b) The plate-like workpiece immersion apparatus according to the present invention is characterized in that the liquid flow generator is a bubble generating tube provided at a substantially middle height in a sparger or a treatment tank for spraying jets in a substantially horizontal direction toward the groove hole. .

As a result, the liquid flow from the sparger injected in the substantially horizontal direction toward the groove hole can be led downward through the groove hole downward in the substrate guide without generating bubbles on the surface of the liquid in the substrate guide. It can guide the plate-shaped workpiece.

(c) The plate-like workpiece immersion apparatus according to the present invention is characterized in that the liquid flow generator is a sparger for jetting jets toward the upper portion of the groove hole above the horizontal direction.

Thereby, it is possible to draw the liquid flow from the sparger sprayed on the upper part of the groove hole above the horizontal direction without causing air bubbles on the surface of the liquid in the substrate guide, through the groove hole, to guide the liquid flow downward in the substrate guide. As a result, the plate-like workpiece can be guided more smoothly along the substrate guide.

(d) The plate-like workpiece immersion apparatus according to the present invention is characterized in that the liquid flow generator is a bubble generating tube for discharging gas upward.

As a result, the liquid flow from the bubble generating tube for discharging gas to the upper side can be led downward through the groove hole in the liquid state in the substrate guide to the bottom of the substrate guide, and smoothly along the substrate guide. Guiding the plate-shaped workpiece can be realized with a simple structure.

(e) The plate-like workpiece immersion method according to the present invention includes a lower guide plate arranged in parallel at a predetermined interval and an upper guide plate arranged in a tapered shape so as to have a wider gap in the vertical upper part and a groove hole. A plate-shaped workpiece immersion method for guiding a plate-shaped workpiece descending to a treatment tank by using a substrate guide, wherein the tip of the upper substrate guide constituting the substrate guide is projected from the liquid surface, and the groove hole is immersed in the treatment liquid. And disposing the substrate guide, generating liquid flow by a liquid flow generator disposed outside the substrate guide or below the liquid surface of the processing liquid, and dripping the plate-shaped workpiece into the processing tank to immerse it in the processing liquid. do.

As a result, the liquid flow from the outside of the substrate guide can be led downward in the substrate guide through the groove hole, and the plate-shaped workpiece can be guided smoothly along the substrate guide. In particular, when the treatment liquid is a plating treatment liquid, it is possible to smoothly guide the plate-shaped workpiece while preventing the deterioration of the plating treatment due to bubbles generated on the liquid surface.

Other objects, uses and effects will be apparent to those skilled in the art upon reference to the following drawings or detailed description.

The present invention solves the problems caused by the prior art, and prints in a surface treatment apparatus such as rackless type electroplating (especially an electroplating apparatus for holding and conveying a plate-shaped workpiece such as a printed board in a vertical state). The substrate, in particular, plate-shaped workpieces such as thin printed substrates having a thickness of 0.1 mm or less can be safely transported or immersed without injuring them, and it is possible to achieve uniform plating quality and plated film thickness. .

FIG. 1 is a view showing the α-α cross section of the plating bath 2 (FIG. 14).
FIG. 2 is a diagram showing the structure in the plating bath 2 seen in the β direction of FIG. 1.
3 is a plan view of the plating bath 2 seen in the γ direction of FIG. 1.
FIG. 4 is a detailed view of the roller standing body viewed in the β direction of FIG. 1. FIG.
5 is a view showing details of the fall prevention member 122 (122a, 122b).
6 is a detailed view showing the structure of the substrate immersion apparatus 600.
7 is a perspective view showing the structure of the substrate guide 62.
8 is a diagram showing details of the dividing nozzle 64.
9 is a diagram showing the structure of the transport hanger 15.
10 is a cross sectional view of the center of the transport hanger 15.
FIG. 11: is a top view which shows the structure of the planar intermittent conveying means 17 provided in the upper part of the lifting guide rail 10. As shown in FIG.
12 is a diagram illustrating the structure of the positioning conveying means 18.
Fig. 13 is a diagram showing the structure of the substrate immersion apparatus.
14 is a plan view of the surface treatment apparatus 300 viewed from above.
FIG. 15 is a side view of the surface treatment apparatus 300 shown in FIG. 14 seen from the α direction.
16 is a view showing the structure of a conventional guide guide.
17 shows the structure of the ejecting means 302.
18 shows the shielding means 303.
19 is a view of the reinforcing connection member 216 viewed from the thin substrate W side.
20 shows the structure of the anode 102.
It is a figure which shows the length in which the thin board | substrate W and the shielding plate overlap.
FIG. 22: is a figure which shows the structure in the lower part of the roller standing body 120. As shown in FIG.
It is a figure which looked at the board | substrate W which caused the shake from the conveyance direction.
Fig. 24 is a view of the substrate W causing the shaking seen from the upper side of the plating bath.
25 is a diagram illustrating a structure of an upper end portion of the roller placing body 120.
FIG. 26: is a figure which shows the relationship between the number of rollers 116, and the predetermined area of the thin board | substrate W conveyed.

1. Plating tank

The basic structure of the surface treatment apparatus is shown in FIGS. 14 and 15. 14 is a plan view of the surface treatment apparatus 300 viewed from above. FIG. 15 is a side view of the surface treatment apparatus 300 shown in FIG. 14 seen from the α direction.

As shown in FIG. 14 and FIG. 15, the surface treatment apparatus 300 is provided with the guide rails 10-13 for conveying the conveyance hanger 15 which supported the plate-shaped workpiece W, such as a printed board. A pretreatment tank 1 for carrying out the plating pretreatment process along with these guide rails, a plating tank 2 for carrying out the electroplating process, a recovery tank 3 for carrying out the plating post-treatment process, and a water washing tank (4), the peeling tank for performing the peeling process (hanger return process) which peels and drops the plating attached to the unloading part 5 for separating the plate-shaped workpiece W, and the conveyance hanger 15 ( 6), the water washing tank 7 which performs a post-hanger treatment process, and the rod part 8 which adheres a plate-shaped workpiece are provided.

As the elevating guide rails 10 and 12 shown in FIG. 14 descend, the plate-shaped workpiece W falls into each treatment tank (pretreatment tank 1, plating tank 2, water washing tank 3, recovery tank 4). B) dipping tank (6). In addition, in the state which the lifting guide rails 10 and 12 shown in FIG. 15 fell, the guide rails 10-13 comprise one annular guide rail.

Fig. 1 shows the α-α cross section of the plating bath 2 (Fig. 14) according to the embodiment of the present invention. The treatment tank main body 100 (including the overflow tank 202 and the drain 200 described later) is filled with a plating liquid. The thin plate W, which is a plate-like workpiece processed in the treatment tank main body 100 filled with the plating liquid, is suspended by the upper end thereof supported by the clamp 48 of the transfer hanger 15. As the conveyance hanger 15 moves, the thin board | substrate W also moves in the process tank main body 100. FIG.

The treatment tank main body 100 includes an anode means 301 for supplying metal ions to be plated, a ejection means 302 for ejecting a plating liquid toward the thin plate substrate W, and a current so as not to concentrate current at an end portion of the thin plate substrate W. The shielding means 303 which shields | blocks and the thin board | substrate W are arrange | positioned, and the regulation roller means 304 which keeps an upright state when the thin board | substrate W advances in the process tank main body 100 is provided. In addition, the specific structure of the anode means 301, the blowing means 302, the shielding means 303, and the regulation roller means 304 is demonstrated below.

As shown in FIG. 1, the anode means 301 includes a pair of anodes 102 and 104 provided in a plurality with a predetermined interval along the advancing direction of the thin plate substrate W, and the thin plate substrate on the treatment tank body 100. It is provided along the advancing direction of W, and is comprised by the feed rail 224 which suspends and energizes the said anode 102,104.

As shown in FIG. 1, the ejection means 302 has the induction box 204 which equalizes the pressure of a plating liquid, and the plating liquid from both sides of the thin board W at a position closer to the thin board W than the anodes 102 and 104. As shown in FIG. After filtering the pair of sparger 106 and the plating liquid discharged from the drain 200 or the overflow tank 202 with a filtration filter to blow out toward the thin board | substrate W, it passes through the pipe 210. The pipe 210 and the circulation pump 208 which return to the duct box 204 are comprised.

As shown in FIG. 1, the shielding means 303 includes the following four shielding plates. The lower substrate shielding plate 108 is provided at the lower end of the thin substrate W in close proximity to the thin substrate W along the advancing direction of the thin substrate W. As shown in FIG. On the other hand, in the vicinity of the upper end of the thin substrate W, an upper substrate shielding plate 109 is provided similarly adjacent to the thin substrate W along the traveling direction of the thin substrate W. In addition, between the anode 102 and the sparger 106 and between the anode 104 and the sparger 106, a lower electrode shielding plate 112 is provided near the lower ends of the anodes 102 and 104, and the anodes 102 and 104. The upper electrode shielding plate 113 is provided in proximity to the anodes 102 and 104 in the advancing direction of the thin plate substrate W, respectively, near the upper end of the uppermost portion. In addition, the shielding means 303 has height adjusting means 220 for adjusting the heights of the lower substrate shielding plate 108 and the lower electrode shielding plate 112 according to the size of the thin plate substrate W. In FIG. The left side of the board | substrate W shows the state which made height low according to the big thin board | substrate W, and the right side shows the state where the height was adjusted high according to the thin board | substrate W which is small in size.

As shown in FIG. 1, the regulating roller means 304 is provided with the roller standing body 120 standing up on the upper surface of the lower board | substrate shielding plate 108 at the height which reaches to the upper vicinity of the thin board | substrate W, and a fall prevention member. It consists of 122. The height regulation means 220 adjusts the height according to the size of the thin substrate W together with the lower substrate shielding plate 108 and the lower electrode shielding plate 112 by the height adjusting means 220.

The roller placing body 120 includes a shaft 114 that is mounted on the lower substrate shielding plate 108 and a roller 116 that is rotatably attached to the shaft 114 in the vertical direction. In addition, the roller 116 may be fixed to the shaft 114, and the shaft 114 itself may be rotatable.

Specifically, as shown in FIG. 4, which is a detailed view of the roller tongue body as viewed in the β direction of FIG. 1, the roller tongue body 120 includes a roller 116 formed of a resin such as a Pp, and an upper and lower roller ( An adjustment member 116e for adjusting the distance between the upper and lower rollers 116 is interposed between the 116 and the shaft 114 is inserted into each of the insertion holes. The shaft 114 is attached to the upper end of the shaft 114. The fixing member 116g is attached so that the roller 116 and the adjusting member 116e do not fall out.

Here, as shown in FIG. 25, the fixing member 116g is attached to the upper end of the roller 116 of the upper end at intervals L70. As a result, the roller 116 floats in the electroplating liquid, and prevents rotation failure due to rubbing between the rollers 116 and the adjusting member 116e, and scratches are caused by the contact with the roller 116 on the thin substrate W. It is preventing.

2 shows the structure in the plating bath 2 seen in the β direction of FIG. 1. It can be seen that a large number of roller tongues 120 are provided over the traveling direction C of the thin substrate W. FIG.

3 is a plan view of the plating bath 2 seen in the γ direction of FIG. 1. The thin substrate W is conveyed between the opposing roller placing bodies 120. That is, while being regulated by the roller 116 of the thin board | substrate W and the roller fitting body 120, it is conveyed in a linear state (while maintaining an upright state). By the way, in the said regulation roller means 304, since the thin board | substrate W maintains a linear state (upright state), the roller standing body 120 and the roller 116 are arrange | positioned as demonstrated below.

First, the arrangement of the roller placing body 120 will be described. As shown in FIG. 22, the opposing roller mounting body 120 is arrange | positioned so that the distance L40 of the roller 116 and the thin board | substrate W may be 1-5 mm (here 4 mm). If it is less than 1 mm, the roller 116 will always be in contact with the thin board | substrate W, and there exists a possibility that a scratch may arise on the surface of the thin board | substrate W. FIG. If the thickness exceeds 5 mm, the thin substrate W may be distorted in the vertical direction (FIG. 23), so that a uniform plating film thickness may not be obtained.

In addition, in the said Example, in the position of the sparger 106 (shown as N in FIG. 4), the space | interval L3 of the roller standing body 120 is made wider than the space | interval L2 of another part. In the said embodiment, the space | interval L3 larger than the diameter of the roller 116 is provided in the position N of the sparger 106. As shown in FIG. At other positions, the interval L2 is smaller than the diameter of the roller 116. As a result, it is possible to reduce the disturbance of the roller placing body 120 with respect to the classification of the plating liquid ejected from the sparger 106, and to effectively spread the classification of the plating liquid onto the surface of the thin substrate W.

However, as mentioned above, when it is set as large space | interval L3, the thin board | substrate W will be bent by the sorting from the sparger 106 in the site | part, and the part bent between the roller standing bodies 120 will enter, and it conveys It may cause a defect. Therefore, in the above embodiment, the fall prevention member 122a is provided at the lower end of the roller placing body 120 at an intermediate height. In particular, it is important to provide a fall prevention member 122a at the lower end such that the lower end of the thin plate W is not bent.

5 shows details of the fall prevention members 122 (122a and 122b). 5A is a view from above, and FIG. 5B is a view from the side. As can be seen in FIG. 5B, the fall prevention member 122a is fixed to the lower end of the shaft 114 (0 to 50 mm from the top surface of the lower substrate shielding plate 108, in particular in the range of 0 to 20 mm: here 5 mm). It is. The release preventing member 122a does not rotate while the roller 116 is rotatable. 5A, the conveyance space 124 of the thin board | substrate W is provided between a pair of fall prevention member 122a. In this way, the edge part of the thin-plate board | substrate W is bent in the vicinity of the sparger 106, and is prevented from entering between the roller standing bodies 120, or coming out of the lower board | substrate shielding plate 108. As shown in FIG. In addition, the fall prevention member 122b also has the same structure as the fall prevention member 122a.

Next, the arrangement of the roller 116 will be described. As shown in FIG. 26, at least 1 roller 116 is arrange | positioned per predetermined area (for example, 100 mm x 100 mm) in the area | region where 10-12 roller tongues 120 are arrange | positioned. Here, the region in which the roller placing body 120 is disposed is a direction in which the roller placing body 120 disposed along the traveling direction of the thin plate substrate W goes straight with respect to the traveling direction, as shown in FIG. 26. When we look at, we say placement area. In the above region, the roller 116 that regulates the shaking of the thin substrate W is disposed so as to be in contact with the thin substrate W at least in a predetermined area, thereby effectively suppressing the shaking occurring in the thin substrate W. FIG. The roller 116 is arranged in units of a predetermined area because the shaking of the thin substrate W has a shake in the advancing direction and a shake in the up and down direction, so as to regulate both shakes. In addition, the predetermined area is preferably 100 mm x 100 mm at the maximum.

As a result, the thin substrate W loses its uprightness due to the plating liquid classification, and the distance from the anodes 102 and 104 is changed as shown in FIG. 23 and FIG. 2-4. As a result, the thickness of the thin plate substrate W is prevented from changing. When the tip portion (the tip in the advancing direction) is shaken and bent, it can be prevented from entering the gap between the roller placing bodies 120 and causing a conveyance defect. 24 is the figure which looked at the thin board | substrate W which caused the shaking from the upper part of a plating bath.

In addition, the vertical space | interval of the roller 116 comrades in the roller mounting body 120 is arrange | positioned at 50-100 mm. Here, the upper installation interval means the upper and lower intervals (L30 shown in FIG. 4) of the disc portion of the roller 116. If the thickness is less than 50 mm, the roller 116 may have an electric shielding action with respect to the thin substrate W, so that the plating film thickness may vary. On the other hand, when the thickness exceeds 100 mm, the thin substrate W is bent between the rollers 116, and the uprightness is lost. As shown in FIG. 23, the distance between the thin substrates W and the anodes 102 and 104 in the longitudinal direction is local. May change and plating thickness may fluctuate. 23 is the figure which looked at the thin board | substrate W which caused the shake from the conveyance direction.

In addition, the arrangement state of the roller standing body 120 is shown in FIG. In arrangement | positioning of the roller tongue body 120 provided in multiple numbers, 10 to 12 roller tongue bodies 120 are made into one unit toward the advancing direction of the thin board | substrate W, and the position of the height direction of each roller 116 mutually It is arranged differently. For example, it arrange | positions so that there may be no roller located in height H like roller 116a of the center part. Regarding the other rollers, two or more of the same height are not present. This prevents linear "stains" from occurring in the plating of the thin substrate W by contacting the roller 116 at the same height, or the electrical shielding on the surface of the thin substrate W generated by the roller 116 is at a constant height. This is to prevent the plating film thickness of the shielded portion from being thinned.

However, in the lower part of the roller standing body 120 which is 50 mm or less from the upper surface of the lower board | substrate shielding plate 108, the roller 116 is allowed to be located in the same height. The lowest roller 116b of the roller placing body 120 is 50 mm or less, especially 20 mm or less from the upper surface of the lower substrate shielding plate 108. As shown in FIG. 23, when the uprightness of the thin substrate W is lost due to the plating liquid classification, the lower end of the thin substrate W becomes high. Therefore, at the bottom end, the roller 116 is provided as close to the lower end of the thin substrate W as possible. The lower end of the thin substrate W is prevented from deviating from the gap formed by the lower substrate shielding plate 108.

As described above, the roller standing body 120 is installed on the lower substrate shielding plate 108 and lifts up and down integrally with the lower substrate shielding plate 108. Accordingly, even if the height of the lower substrate shielding plate 108 is adjusted according to the size of the thin substrate W, the lowermost roller 116b of the lower substrate shielding plate 108 and the roller standing body 120 or the fall prevention member 122a are formed. Since the positional relationship does not change, it can be made to function similarly to the thin board | substrates W of various sizes with a simple structure.

In this way, the regulating roller means 304 in the above embodiment restricts five elements to improve the quality of electroplating, and the arrangement of the roller 116 is determined. That is, i) maintenance of the upright posture of the thin plate substrate W, ii) suppression of the current shielding effect by the roller 116, iii) maintenance of the effect of plating flow classification by the ejection means, iv) the thin substrate W Arrangement of the roller 116 etc. is decided in order to achieve the prevention of the conveyance defect, such as entering into the space | interval of 120, and the prevention of the occurrence of the scratch by the roller 116.

Specifically, in order to achieve the above i), at least one roller 116 is arranged in a predetermined unit area (for example, 100 mm x 100 mm), and the warpage in the longitudinal direction of the thin plate substrate W is more effective. In order to suppress this, the distance between the roller 116 and the thin plate substrate W is 1 to 5 m (not wider than 5 mm), and the distance between the upper and lower rollers 116 is 50 to 100 mm (not wider than 100 mm). In order to achieve said ii), the space | interval of the upper and lower rollers 116 shall be 50-100 mm (not narrower than 50 mm), and the rollers 116 may be the same vertical position between 10-12 roller placing bodies 120 mutually. Do not install it on. In order to achieve said iii), in the arrangement | positioning position of the sparger 106, the space | interval of the roller standing body 120 is arrange | positioned in L3 wider than another site | part. In order to achieve the above iv), the roller 116 is allowed to be disposed at the same height position in the lower portion of the roller standing body 120, and the prevention member falls into the position where the roller standing body 120 is arranged at the interval L3. 122 is arrange | positioned, and the roller standing body 120 is arrange | positioned at the space | interval of L2 narrower than the diameter of the roller 116 in the position where the sparger 106 is not arrange | positioned. Finally, in order to achieve the above v), the fixing member 116g is spaced apart from the upper end of the roller 116 at the upper end, so that it can rotate smoothly in the plating liquid, and between the roller 116 and the thin plate W Is set to 1 to 5 mm (not narrower than 1 mm).

Although each combination of these can be suitably selected according to the element to be regulated, it is preferable to provide all.

17 is a view showing the ejecting means 302, and the anode means 301, the regulating roller means 304, and the shielding means 303 are omitted. In FIG. 17, the ejecting means 302 sprays the plating liquid classification from the sparger 106 on the thin substrate W. As shown in FIG. The plating liquid ejected from the sparger 106 is discharged from the treatment tank body 100 from the drain 200 or the overflow tank 202, and is subjected to the filtration treatment by the filtration filter 209, followed by the circulation pump 208. By the pipe 210 is returned to the duct box 204, the pressure of the plating liquid is equalized by the duct box 204 and then returned to the sparger 106 to circulate.

The duct box 204 is provided in the bottom surface of the processing tank main body 100 in multiple numbers along the advancing direction of the thin-plate board | substrate W, and height adjustment with respect to the bottom surface of the processing tank main body 100 as shown in FIG. This is bolted to make it possible. A communication hole is provided in the side wall of the conductor box 204, and the pipe 210 is connected so that a liquid can flow through the said communication hole. In addition, a reinforcing member 204a is attached to the inductor box 204, and the inductor box 204 is deformed due to the pressure of the plating liquid sent from the circulation pump 208, thereby preventing the plating liquid from being equalized. Doing.

As shown in FIG. 17, the sparger 106 is comprised so that the jet nozzle 106a which sprays a plating liquid may be attached to the nozzle pipe 106b at predetermined intervals. The nozzle tube 106b is installed on the duct box 204, and the duct box 204 and the lower end of the nozzle tube 106b are connected by a communication hole so that the liquid can flow. On the other hand, the upper end of the nozzle tube 106b is fitted into a hole provided in the nozzle fixing member 212 attached along the advancing direction of the thin plate substrate W, and the sparger 106 is thinned by the ejection pressure when ejecting the plating liquid. It is prevented from inclining (falling) or shaking in the opposite direction to the substrate W so that the plating liquid classification with respect to the thin substrate W is made constant.

As shown in FIG. 17, the jet nozzle 106a has the height provided in the sparger 106 of the right side and the left side of the thin board | substrate W by turns. This is to make a difference in plating liquid flow dividing pressure on the thin board | substrate W surface, and to implement | achieve liquid distribution effectively in the through-hole (through hole) provided in the thin board | substrate W.

18 is a view showing the shielding means 303, and a part of the anode means 301 and the ejecting means 302 is omitted. As shown in FIG. 18, the shielding means 303 includes a lower electrode shielding means having an upper substrate shielding plate 109, an upper electrode shielding plate 113, a lower substrate shielding plate 108, and a rotation mechanism 150 ( 112, the plate 110 and the reinforcing connecting member 216, the lower substrate shielding plate 108 and the lower electrode shielding plate 112 connecting the lower substrate shielding plate 108 and the lower electrode shielding plate 112 to be integrated. ) Is composed of a height adjusting means 220 for raising and lowering the unit, and a guide 214 and a support column 155 for guiding the lower substrate shielding plate 108 and the lower electrode shielding plate 112 at the time of height adjustment. .

The upper substrate shielding plate 109 and the upper electrode shielding plate 113 are attached to the nozzle fixing member 212 as shown in FIG. 18. Both the upper substrate shielding plate 109 and the upper electrode shielding plate 113 have a long hole in the up and down direction of the drawing, and are fastened to the nozzle fixing member 212 by bolts through the long hole, and the height is adjusted in the up and down direction of the drawing, respectively. It becomes possible.

The use of the upper substrate shielding plate 109 and the upper electrode shielding plate 113 in this manner is for effectively shielding the current in a minute region of 1 to 5 mm from the substrate end of the thin substrate W. The upper substrate shielding plate 109 locally controls the current concentration to the upper end of the thin substrate W, while a current that cannot be fully controlled by the upper substrate shielding plate 109 flows near the upper end of the thin substrate W. It is controlled by the upper electrode shielding plate 113 so as not to be prevented.

In addition, in the above embodiment, as shown in FIG. 18, the lower substrate shielding plate 108 and the lower electrode shielding plate 112 are used as the shielding plate at the lower end of the substrate in order to effectively prevent current concentration to the lower end of the thin substrate W. As shown in FIG. Have. Using the lower substrate shielding plate 108 and the lower electrode shielding plate 112 together is the same as the reason why the upper substrate shielding plate 109 and the upper electrode shielding plate 113 are provided.

Here, the shield plates 108, 112, and 109, 113 are overlapped at the ends of the thin substrate W as the distance from the thin substrate W becomes shorter (the length at which the thin substrate W and the shield plate overlap in FIG. 2 1 overlap: L60 is set to be small. For example, as shown in FIG. 21, the lower substrate shielding plate 108 having a shorter distance from the thin substrate W is set larger than the lower electrode shielding plate 112.

The substrate shielding plates 108 and 109 are preferably provided with a distance L50 (FIG. 22) from the thin substrate W in a range of 1 to 50 mm. As a result, current concentration to the thin-walled substrate W end can be effectively prevented without lowering the amount of current required for plating (the plating efficiency decreases).

Specifically, the upper substrate shielding plate 109 is provided so as to overlap 1 to 15 mm (herein, 10 mm) with respect to the upper end of the thin substrate W, and the upper electrode shielding plate 113 is 10 to 10 with respect to the upper end of the thin substrate W; It is provided so that it may overlap by 60 mm (here, 50 mm). The upper substrate shielding plate 109 (L-shaped bottom edge end) is provided at a distance of 25 mm from the thin substrate W.

On the other hand, the height of the lower substrate shielding plate 108 is set so as to overlap 1-10 mm (here 5 mm) with respect to the lower end part of the thin board | substrate W. FIG. In addition, the height of the lower electrode shielding plate 112 is set so as to overlap 50-75 mm (here, 65 mm) with respect to the lower end part of a thin board | substrate. The lower substrate shielding plate 108 is provided at a distance of 4 mm from the thin substrate W.

However, when the setting of the head values of the substrate shielding plate and the electrode shielding plate is changed, the current shielding effect is also changed. Therefore, as described above, the lower substrate shielding plate 108 and the lower electrode shielding plate 112 have height adjustment means 220 so that the head values of the substrate shielding plate and the electrode shielding plate do not change even when the size of the thin substrate W is changed. The height can be adjusted integrally.

In FIG. 18, the lower substrate shielding plate 108 is attached onto the plate 110, and the plate 110 is connected to the lower electrode shielding plate 112 through the reinforcing connecting member 216 and the lower electrode shielding plate. 112 and the lower substrate shielding plate 108 are integrated. In addition, the reinforcing connector 216 is also fixed to the upper surface of the lower substrate shielding plate 108, and prevents distortion (bending) of the plate 110.

As shown in FIG. 18, a guide 214 for guiding the lower electrode shielding plate 112 is attached to the bottom plate of the treatment tank main body 100 so as to receive the inductor box 204 thereunder. It is. The support pillar 155 is installed on the upper surface of the guide 214, the upper end of the support pillar 155 is fastened to the nozzle fixing member 212 by a bolt. The lower electrode shielding plate 112 is fastened with a bolt to move up and down through the longitudinal hole in the vertical direction with respect to the side of the guide 214 (not shown), and shields the lower electrode with respect to the support pillar 155. The rotating mechanism 150 provided in the plate 112 is coupled so that it can move up and down through the roller 150a. As described above, the lower electrode shielding plate 112 is guided by the guide 214 and the support pillar 155 to shield the lower substrate shielding plate 108 and the lower electrode when the height is adjusted by the height adjusting means 220. The plate 112 and the roller placing body 120 are integrally guided.

In FIG. 18, the height adjusting means 220 is comprised by the drive motor 220a, the pulley 220b, the connection wire 220c, and the drive belt 220d, and one end of the connection wire 220c is pulley 220b. The other end is connected to the reinforcing connecting member. By driving of the drive motor 220a, the wire 220c is wound around the pulley 220b so that the lower substrate shielding plate 108, the lower electrode shielding plate 112, and the roller placing body 120 are integrated and rise. .

19 is a view of the reinforcing connection member 216 viewed from the side of the thin substrate W. FIG. As shown in FIG. 19, the connecting wire 220c is connected to the upper surface of the reinforcing connecting member 216 through the wire joint 218.

20 shows the structure of the anode 102. The anode 102 constituting the anode means 301 has an anode case 102a for receiving a plated metal material such as a copper ball, and a handle 102d is attached to a side of the anode case 102a. A hook 102e for attaching the anode case 102a to the feed rail 224 shown in FIG. 1 is provided at the lower end of 102d). The upper end of the handle 102d is almost at a height reaching the opening 102b. In addition, four rod guides 102c are attached to the upper opening 102b of the anode case 102a (the two do not overlap the paper inward direction in the drawing) at equal intervals. The upper end of the bar guide 102c extends to the vicinity of the injection hole 100b for injecting the plating metal material installed in the lid 100a of the treatment tank main body 100. In addition, 100c is a cap of the injection hole 100b.

If the plating operation is continued, it is necessary to supply the plating metal material to the anode case 102a. The presence of the rod guide 102c prevents the plating metal material from falling into the treatment tank body 100 without being accommodated in the anode case 102a when it is introduced from the injection hole 100b.

If the plating operation is continued, it is necessary to remove the anode case 102a and perform maintenance (cleaning). By the way, in order to avoid the shortage of plated metal material, an excessive amount of plated metal material may be put in (the plated metal material is thrown in as much as overflowing from opening 102b). The guide metal was sandwiched and the plating metal material was prevented from falling into the treatment tank main body 100. However, when the cylindrical guide is used, it is difficult to remove the plated metal material that has been excessively added, and it is cumbersome to separate the anode case 102a during maintenance. By using the rod guide 102c, the excessively plated metal material can be easily removed from the injection hole 100b, so that the anode case 102a can be easily separated at the time of maintenance.

2. Substrate Immersion Device

In the plating bath 2 of the said embodiment, the board | substrate immersion apparatus is provided in the board | substrate immersion part 2a (refer FIG. 15) which immerses the thin board | substrate W. FIG. The structure of the substrate immersion apparatus will be described with reference to FIG. 13A is sectional drawing of the substrate immersion apparatus 600 which shows the state which the board | substrate dropped in the position of FIG. 14, FIG. 13B is the board | substrate immersion apparatus 600 shown in FIG. 13A seen from the top. Drawing.

As shown in FIG. 13A, the substrate immersion apparatus 600 includes a treatment tank main body 60 that collects a plating liquid for immersing the thin substrate W and a substrate for guiding the thin plate W that descends to the treatment tank main body 60. The guide 62 and the bubble generating tube 68 which is the liquid flow generator arrange | positioned outside the said board | substrate guide 62 are provided.

As shown in Fig. 13A, the substrate guide 62 has a lower guide plate 62a arranged in parallel at a predetermined interval t, and a tapered shape so as to have a wider space in the vertical upper portion, and a slit (which is a groove hole). The upper guide plate 62b provided with 62c and the rectifying plate 62d which prevent the liquid flow which arises from air stirring from spreading and weakening are provided. 13A, the board | substrate guide 62 is arrange | positioned by making the front-end | tip 62e of the upper guide plate 62b protrude from the liquid surface, and immersing the said groove hole 62c in plating liquid. 7 is a perspective view showing the structure of the substrate guide 62.

The bubble generator tube 68, which is a liquid flow generator, receives air from the pipe 66 shown in FIG. 13A and blows the air upward. Accordingly, as the air rises, the plating liquid around it rises, so that the plating liquid on the outside short-circuited by the rectifying plate 62d flows in from the lower end of the rectifying plate 62d, causing an upward flow of the plating liquid, and the rising plating liquid is slit. It can be considered that the liquid flows downward through the lower guide 62a continuously through 62c and flows again from the lower end of the rectifying plate 62d to generate a circulating liquid flow. Therefore, the thin substrate W can be smoothly guided and immersed along the substrate guide 62. In addition, in the experimental result, rather than arrange | positioning the bubble generating tube 68 to the height similar to the slit 62c and the lower end part of the rectifying plate 62d, a bubble generate | occur | produces near the center in the depth direction of the processing tank main body 60. When the pipe 68 was installed, it was able to guide more smoothly. In addition, similarly, in the experimental result, the side which provided the slit 62c in the upper guide 62b was able to guide the thin board | substrate W more smoothly than the slit 62c in the lower guide 62a.

With the above structure, the board | substrate guide 62 is the state which arrange | positioned the front-end | tip 62e of the upper guide 62b from the liquid surface, and arrange | positioned the slit 62c in the position which is immersed in plating solution in the lower guide 62a. In this way, liquid flow is generated by the liquid flow generator disposed outside the substrate guide 62, and the thin substrate W can be smoothly immersed in the plating liquid.

In addition, in FIG. 13, although the substrate immersion apparatus was arrange | positioned in the place where the board | substrate of the plating tank 2 is immersed, and the bubble generating tube 68 was used as a liquid flow generator, when the processing effect in the through-hole of a thin board | substrate W and a via hole is improved, Alternatively, when performing the pickling cleaner treatment in the pretreatment tank 1 to avoid foaming, for example, as shown in Fig. 6A, the jet nozzle 64 can be used as the liquid generator. In this case, the jet is sprayed from the jet nozzle 64 toward the slit 62c in a substantially horizontal direction. Accordingly, liquid flows downward through the slit 62c, and then downwards between the lower guides 62 ', so that the thin substrate W can be guided and immersed smoothly along the substrate guides 62.

In addition, as a result of the experiment, it was possible to guide the thin substrate W more smoothly when sprayed toward the upper R of the slit, as shown in FIG. 8, rather than spraying the jet directly toward the slit. In FIG. 8, the jet is sprayed upward with respect to the horizontal plane.

As shown in FIG. 6B, the dividing nozzle 64a is arranged in multiple numbers at equal intervals in the advancing direction (D direction) of the conveyance hanger 15, and as shown in FIG. 6A of the board | substrate guide 62 It is fixed and installed at the same height as the groove hole 62b.

Further, on the liquid surface, an air blow is provided near the outside of the substrate guide 62 so that the air blowing direction is opposite to the substrate guide, and the air discharged to the bubble generating tube 68 bubbles on the liquid surface. You can blow it out before it happens. As a result, bubbles are prevented from adhering to the thin substrate W surface, and the effect of treatment with the treatment liquid can be sufficiently obtained.

In the said Example, although the case where it applied to the plating tank was demonstrated, it is applicable also to the processing tank which performs another washing process.

3. Structure of surface treatment device and conveying hanger

As shown in FIG. 14 and FIG. 15, the surface treatment apparatus 300 is equipped with the guide rails 10-13 for conveying the conveyance hanger 15 which supported the thin board | substrate W, such as a printed board, These Pretreatment tank (1) for carrying out the plating pretreatment process along the guide rails, plating vessel (2) for carrying out the electroplating process, recovery tank (3) and washing tank (4) for carrying out the plating post-treatment process Separation tank for performing peeling process (hanger return process) which peels and removes the plating attached to the unloading part 5 for separating plate-shaped workpiece (thin board | substrate) W, and the conveyance hanger 15 ( 6), the rod part 8 which attaches the water washing tank 7 which performs a process after a hanger peeling off, and the plate-shaped workpiece (thin board substrate) W is provided.

The lifting guide rails 10 and 12 shown in FIG. 5 attach or separate the plate-shaped workpiece (thin substrate) W to the transport hanger 15, or tighten the plate-shaped workpiece (thin substrate) W ( It is a guide rail which moves up and down when immersing in the pretreatment tank 1, the plating tank 2, the water washing tank 4, the recovery tank 4, etc.). The fixed guide rails 11 and 13 are guide rails fixed in order to convey the conveyance hanger 15 which dropped to the plating tank 2 and the peeling tank 6, respectively.

The structure of the conveyance hanger 15 of this invention is demonstrated using FIG.

As shown in FIG. 9, the conveyance hanger 15 has the to-be-processed object support member 47 provided with the clamp 48 which supports the plate-shaped workpiece | work (thin board | substrate W), and the fixed guide rail 11 It has a sliding member 35 which slide-contacts with respect to, and the connection member 44 which connects these. Copper, brass, etc. are used as a material of the sliding member 35 and the connection member 44. As shown in FIG.

The width | variety length L0 of the to-be-processed object support member 47 shown in FIG. 9 is computed based on the width W0 of the plate-shaped workpiece W (thin board | substrate W), and the part W1 which fits. For example, as shown in FIG. 9, when providing the part W1 which pinches at the both ends of plate-shaped workpiece W (expansion paper W0), the width length L0 of the to-be-processed member support member 47 is L0 = W0-2 *. Calculate as W1.

In addition, as shown in FIG. 10, the one-way clutch type gear which meshes with the chain belt 39 (constituting the fixed guide rail conveying means 19 shown in FIG. 14) in the upper part of the sliding member 35 ( A bearing 36 having 40 is fixed. For this reason, the gear 40 which meshes with the chain belt 39 on the fixed guide rails 11 and 13 can only rotate in the X direction shown in FIG. 9 at the time of front conveyance.

The pusher contact surface 37 shown in FIG. 9 is a part which the pushers 16 and 21 (FIG. 11) of the intermittent conveying means 17 and 22 which are the conveying means of the conveyance hanger 15 contact.

The hook contact part 32 of FIG. 10 is a part which the conveyance hook 27 (FIG. 14) of the positioning conveying means 18 which is a conveying means of the conveying hanger 15 contacts. Each conveying means of these conveying hangers 15 is demonstrated below.

4. Each conveyance means of the transport hanger 15

The conveyance hanger 15 shown in FIG. 9 is the following intermittent conveying means 17 and 22, the positioning conveying means 18 and 23, and the fixed guide rail conveying means 19 and 24 in the surface treatment apparatus 300. As shown in FIG. And the delivery conveying means 20, 25.

First, the intermittent conveying means 17 and 22 provided in the upper part of the elevating guide rails 10 and 12 shown in FIG. 15 are (c)-(f), (h)-(k) of the elevating guide rail 19, respectively. 11 is conveyed intermittently by one pitcher (FIG. 11) by pushers 16a-16d and 21a-21d. FIG. 11: is a top view which shows the structure of the intermittent conveying means 17 arrange | positioned at the upper part of the lifting guide rail 10. As shown in FIG.

The positioning conveying means 18 shown in FIG. 15 is provided along the fixed guide rail 11, and the to-be-processed object immersion part (substrate immersion part) 2a is located at the upper position of the plating bath 2. The conveyance hanger 15 (refer FIG. 15) lowered inward is moved to the fixed guide rail 11, and is moved forward to the position of (b), and the plate-shaped workpiece W (plating) in the plating tank 2 is carried out. The distance between the substrate W) and the plate-shaped workpiece W (thin substrate W) at the position (a) in front of it (left side in FIG. 6) is adjusted to a predetermined width L1 (for example, L1 = 5 mm).

The structure of the positioning conveying means 18 is shown in FIG. The positioning conveying means 18 shown in FIG. 12 can move back and forth in the X, Y direction along the rail provided separately along the fixed guide rail 11, and is moved to Z direction by a spring in the state shown in FIG. 12A. It has a conveyance hook 31 which is pressurized. Accordingly, when conveying the transport hanger 15, first, the spring decreases when moving in the X direction, and after passing through the hook contact portion 32 (state of FIG. 12B) shown in FIG. Direction), and the conveyance hook 31 hangs the hook contact portion 32 of the conveyance hanger 15 and conveys the conveyance hanger 14 in the C direction shown in FIG. At this time, the moving speed of the positioning conveying means 18 moves with the conveying hanger 15 before being conveyed by the fixed guide rail conveying means 19 (that is, the chain Speed of the belt 39). Moreover, the positioning conveying means 23 on the peeling tank 6 side also performs the same structure and operation as the positioning conveying means 13 on the said plating tank 2 side shown in FIG.

The fixed guide rail conveying means 19 and 24 hold | maintain the conveyance hanger 15 previously conveyed by the positioning conveying means 18 and 23, maintaining the predetermined | prescribed space | interval (L1 of FIG. 6), the direction of arrow C of FIG. Return to

The conveyance conveying means 20, 25 carries the conveyance hanger 15 conveyed to the position (g) and (o) by the fixed guide rail conveying means 19 and 24, respectively, of the elevating guide rails 12 and 10, respectively. ｈ) and (f) to be transferred to the position (Fig. 14). In addition, the structure and operation | movement of the delivery conveyance means 20 and 25 are the same as the positioning conveyance means 18 shown in FIG.

5. Other Examples

Further, in the above embodiment, two shielding plates of an upper (lower) substrate shielding plate and an upper (lower) electrode shielding plate were provided as a shielding plate for the thin substrate W. However, the shielding plate is provided between the substrate shielding plate and the electrode shielding plate. You may add more.

In addition, in the above embodiment, the upper substrate shielding plate and the upper electrode shielding plate are lifted independently, but may be a mechanism for raising and lowering them integrally.

Claims (7)

A treatment tank for immersing the plate-shaped work in the treatment liquid;
A substrate guide for guiding a plate-shaped work descending to the treatment tank, the lower guide plate arranged in parallel at a predetermined interval, and the upper guide plate disposed in a tapered shape so as to have a wider gap on the vertical upper side, and forming a notch hole. A substrate guide provided with a protruding end of the upper guide plate from a liquid level and immersing the notch hole in a processing liquid;
A liquid flow generator disposed outside the substrate guide;
Plate-shaped workpiece immersion apparatus characterized by the above-mentioned. The method of claim 1,
And the liquid flow generator sprays the jet in the horizontal direction toward the notch hole. The method of claim 1,
And the liquid flow generator sprays jets upwards from the horizontal direction toward the upper portion of the notch hole. The method of claim 1,
And the liquid flow generator is arranged at a predetermined height in the processing tank and discharges gas upwards. The method of claim 4, wherein
The said liquid-flow generator is arrange | positioned at the intermediate height in a process tank, The plate-shaped workpiece immersion apparatus characterized by the above-mentioned. A lower guide plate arranged in parallel at a predetermined interval; A plate-shaped workpiece immersion method for guiding a plate-shaped workpiece descending to a treatment tank using a substrate guide provided with a tapered shape disposed so as to widen the gap vertically and forming a notch hole.
The tip of the upper guide plate constituting the substrate guide protrudes from the liquid level, and the substrate guide is disposed by immersing the notch hole in the processing liquid.
A liquid flow generator is generated by a liquid flow generator disposed at the outer side of the substrate guide and under the liquid surface of the processing liquid, and the plate-shaped workpiece is immersed in the processing liquid by lowering the plate-shaped workpiece into the processing tank. As a board | substrate guide for guiding the plate-shaped workpiece | work descending to a processing tank,
A lower guide plate arranged in parallel at a predetermined interval;
And an upper guide plate disposed in a tapered shape so as to have a wider gap on the vertical upper side, and forming a notch hole.

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