CN113549983A - A cell body structure, electroplating system and production line for electroplate - Google Patents

Abstract

The invention provides a tank body structure for electroplating, an electroplating system and a production line. Wherein, the separation component and the groove body extend in the same direction and are arranged in the groove body. Two rows of circuit boards of once accessible in the groove body effectively improve electroplating efficiency and productivity. When anode materials are placed on the two opposite inner walls of the tank body, the outer side surfaces of the two rows of circuit boards are electroplated opposite to the anode materials, and the single surfaces of the two rows of circuit boards can be electroplated simultaneously in the tank body structure at one time; when the anode material is placed on the separation component, the inner side surfaces of the two rows of circuit boards are electroplated opposite to the anode material, and the single surfaces of the two rows of circuit boards can be electroplated simultaneously at one time in the tank body structure; when anode materials are arranged on the two opposite inner walls of the tank body and the separation assembly, the inner side surface and the outer side surface of the two rows of circuit boards are electroplated opposite to the anode materials, the two sides of the two rows of circuit boards can be electroplated simultaneously in the tank body structure once, and the tank body structure has good product adaptability.

Description

A cell body structure, electroplating system and production line for electroplate

Technical Field

The invention relates to the technical field of workpiece treatment, in particular to a tank body structure for electroplating, an electroplating system and a production line.

Background

In the processes of cleaning, electroplating, coating and the like, different containers are used for containing different treatment liquids to form a required process flow, and the work piece is cleaned, electroplated, coated and the like. For example, in the electroplating process, rack plating is one of the electroplating methods. And hanging the workpiece on a hanging mechanism by hanging plating, and immersing the workpiece in electroplating solution to finish electroplating the surface of the workpiece.

The existing electroplating bath comprises a bath body and anode titanium baskets suspended on two sides in the bath body, wherein a material passing channel for a product to pass through is formed between the anode titanium baskets on the two sides. For example, when electroplating, the product is a circuit board, and electroplating solution is stored in the tank body. The clamps are fixed on the conveying steel belt and move along with the steel belt, the circuit boards are sequentially clamped on the clamps distributed along the steel belt in a row and are immersed in electroplating liquid, and the circuit boards are driven by the steel belt to move in the electroplating bath for electroplating.

The conventional tank body structure can only realize single-row and double-side electroplating of circuit boards, namely, only one row of circuit boards can pass through the electroplating tank body, and the electroplating is carried out on the surfaces of the anode titanium baskets right opposite to the two sides of the electroplating tank body. Along with the diversification of the processing technology of the circuit board and the increase of the required quantity, the electroplating efficiency of the traditional single-row electroplating tank body is particularly low.

Disclosure of Invention

Therefore, the technical problem to be solved by the invention is to overcome the defect of low electroplating efficiency of the electroplating tank body in the prior art.

Therefore, the invention provides a tank body structure for electroplating, which comprises

A tank body;

the separation assembly extends in the same direction with the tank body and is arranged in the tank body and is suitable for separating the tank body into two electroplating channels which are parallel to each other;

the cell body is adapted to receive anode material on opposite interior walls and/or on the separator assembly.

Optionally, the above-mentioned tank structure for electroplating further includes:

two groups of anode titanium baskets are respectively connected to the inner walls of two opposite sides of the tank body; the anode titanium basket is suitable for placing anode materials.

Optionally, in the above tank structure for electroplating, the separation component includes

At least one group of inrush current parts, wherein any group of inrush current parts are distributed along the extending direction of the tank body; an electroplating channel for products to pass through is formed between the current surge part and the anode titanium basket.

Optionally, in the above tank body structure for electroplating, the inrush current component is provided with a first ejection hole facing at least one of two sides of the tank body.

Optionally, in the above tank body structure for electroplating, the first ejection holes are formed in both sides of the inrush current component;

the inrush current parts are provided with three groups, wherein in the three groups of inrush current parts, the electroplating channels are formed between two adjacent groups of inrush current parts; the middle inrush current component is a first inrush current component, the inrush current components on two sides of the first inrush current component are second inrush current components, and second ejection holes opposite to the first inrush current component are formed in one sides, facing the middle inrush current component, of the second inrush current components on two sides.

Optionally, the above tank structure for electroplating further comprises

The first guide assembly is arranged on two sides of the first inrush current component, avoids the ejection port of the first inrush current component and is suitable for guiding the running track of the product in the groove.

Optionally, in the above tank structure for electroplating, the first guide assembly includes

And the guide wheels are rotatably arranged on the first current gushing component and are arranged at intervals along the extending direction of the tank body.

Optionally, the above tank structure for electroplating further comprises

The second guide assemblies extend along the length direction of the groove body and are arranged on two sides of the first guide assemblies, and the second guide assemblies are positioned on the inner sides of the two groups of second gushing parts; the second guide assembly is adapted to guide the path of the product within the trough body.

Optionally, in the above tank structure for electroplating, the second guide assembly comprises

The wide side of the guide component extends to the first guide component along the width direction of the groove body, the long side of the guide component extends along the length direction of the groove body, and the long side of the guide component is up-down fluctuated or obliquely arranged.

Optionally, in the above tank structure for electroplating, the second guide assembly further includes

The shielding component is arranged at the bottom of the guide component and extends along the extending direction of the groove body; the shielding part is arranged between the anode titanium basket and the first current inrush part; the shielding component is used for shielding positive ions at the bottom of the product when the product travels in the groove body.

Optionally, in the above tank structure for electroplating, the cross section of the shielding component is rectangular; and/or one side of the shielding component facing the first inrush current component is provided with a chamfer.

Optionally, the above tank structure for electroplating further comprises

And the lifting mechanism is connected with the shielding component, supports and drives the shielding component to lift in the groove body.

The invention provides an electroplating system, which comprises a tank body structure for electroplating.

Optionally, the electroplating system further comprises

The clamp is fixed on the driving device and is arranged on the two parallel electroplating channels in a spanning manner; it is provided with two symmetrically arranged chucks; the clamping head is arranged corresponding to the electroplating channel; the clamping surfaces of the two clamping heads are parallel to each other; any of the cartridges is adapted to hold a product.

The invention provides a production line, which comprises the electroplating system.

The technical scheme of the invention has the following advantages:

1. according to the tank body structure for electroplating, the two electroplating channels are formed in the tank body by arranging the separation assembly, and two rows of circuit boards can pass through the tank body once, so that the electroplating efficiency and the productivity are effectively improved. When anode materials are placed on the two opposite inner walls of the tank body, the outer side surfaces of the two rows of circuit boards are electroplated opposite to the anode materials, and the single surfaces of the two rows of circuit boards can be electroplated simultaneously in the tank body structure at one time; when the anode material is placed on the separation component, the inner side surfaces of the two rows of circuit boards are electroplated opposite to the anode material, and the single surfaces of the two rows of circuit boards can be electroplated simultaneously at one time in the tank body structure; when anode materials are arranged on the two opposite inner walls of the tank body and the separation assembly, the inner side surface and the outer side surface of the two rows of circuit boards are electroplated opposite to the anode materials, the two sides of the two rows of circuit boards can be electroplated simultaneously in the tank body structure once, and the tank body structure has good product adaptability.

2. According to the tank body structure for electroplating, provided by the invention, the arrangement of the first guide assembly and the second guide assembly limits the parallel movement of a product in an electroplating channel.

3. According to the tank body structure for electroplating, provided by the invention, the long edge of the guide component is up-down fluctuated or obliquely arranged, and when a circuit board runs along the tank body, the part on the circuit board, which is shielded by the guide component, is continuously changed, so that the uniformity of a plating layer is ensured.

4. According to the tank body structure for electroplating, the shielding component extends along the extending direction of the tank body; the shielding part is arranged between the anode titanium basket and the first current inrush part; when the product advances in the groove body, the shielding part is used for shielding partial cations at the bottom of the circuit board, so that the coating at the bottom of the circuit board is prevented from being thicker, and the coating is ensured to be uniform.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a side view of a tank structure for electroplating provided in example 1 of the present invention;

FIG. 2 is an enlarged view of a portion A of FIG. 1;

fig. 3 is a top view of a tank structure for electroplating according to example 1 of the present invention;

FIG. 4 is a partial enlarged view of portion B of FIG. 3;

fig. 5 is a front view of a tank structure for electroplating according to example 1 of the present invention.

FIG. 6 is a front view of the second guide assembly;

FIG. 7 is a top view of the second guide assembly;

FIG. 8 is a side view of a second guide assembly;

fig. 9 is a schematic view of the distribution of electric field lines in the cell body.

Description of reference numerals:

101-a cell body; 102-a current inrush component; 1021-a first inrush component; 1022 — a second inrush component; 103-anode titanium basket; 104-a guide wheel; 1051-a guide member; 1052-a shielding member; 1053-a support base; 106-anode rod; 107-a bus member; 108-a drain tube; 109-a support frame; 1-clamping; 2-circuit board.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

Example 1

The present embodiment provides a tank body structure for electroplating, which includes a tank body 101 and a partition member, as shown in fig. 1 to 5. The separating component and the bath body 101 extend in the same direction and are arranged in the bath body 101, and the separating component is suitable for separating the bath body 101 into two electroplating channels which are parallel to each other; the cell body 101 is adapted to receive anode material on opposite interior walls and/or on the separator assembly.

The electroplating groove body structure with the structure has the advantages that the separation assembly is arranged to form two electroplating channels in the groove body 101, and the two rows of circuit boards 2 can be used once in the groove body 101, so that the electroplating efficiency and the electroplating capacity are effectively improved. When anode materials are placed on the two opposite inner walls of the tank body 101, the outer side surfaces of the two rows of circuit boards 2 are electroplated opposite to the anode materials, and the single surfaces of the two rows of circuit boards 2 can be electroplated simultaneously in the tank body structure at one time; when the anode material is placed on the separation component, the inner side surfaces of the two rows of circuit boards 2 are electroplated opposite to the anode material, and the single surfaces of the two rows of circuit boards 2 can be electroplated simultaneously at one time in the tank body structure; when anode materials are arranged on the two opposite inner walls of the tank body 101 and the separation assembly, the inner side surface and the outer side surface of the two rows of circuit boards 2 are electroplated opposite to the anode materials, the two sides of the two rows of circuit boards 2 can be electroplated simultaneously in the tank body structure at one time, and the tank body structure has good product adaptability.

Further, the tank body structure also comprises two groups of anode titanium baskets 103 and two groups of anode rods 106, wherein the two groups of anode titanium baskets 103 are respectively connected to the inner walls of the two opposite sides of the tank body 101, and the two groups of anode titanium baskets 103 respectively extend along the extension direction of the tank body 101 and are oppositely arranged in parallel; the anode titanium basket 103 is suitable for placing anode materials. For example, the anode material is phosphor copper ball, or iridium oxide titanium mesh + copper dissolving tank is used to add copper powder as anode material.

Referring to fig. 1 and 2, two sets of anode rods 106 are disposed on both sides of the cell body 101 corresponding to the anode titanium baskets 103, and the anode titanium baskets 103 are connected to the anode rods 106 and electrically connected to the anode rods 106. During electroplating, anode materials are placed in the anode titanium basket 103, the anode rod 106 is connected with the anode of the rectifier, the clamp 1 for clamping the circuit board 2 is connected with the cathode of the rectifier, and the clamp 1 clamps two rows of parallel circuit boards 2 to move in two electroplating channels for electroplating.

Referring to fig. 2, the partition assembly includes at least one set of inrush current members 102, and any set of inrush current members 102 is distributed along the extending direction of the tank body 101; an electroplating channel for products to pass is formed between the current surge part 102 and the anode titanium basket 103, and the current surge part 102 is suitable for spraying the electroplating solution into the inner cavity of the tank body 101 uniformly. The current surge part 102 is provided with a first spraying hole facing at least one of two sides of the tank body 101, and when a product to be electroplated is provided with a hole to be plated, especially when the product is thick and the hole is deep, electroplating solution can be sprayed into the deep hole from the first spraying hole, so that uniform plating holes are ensured.

The first ejection holes are formed in both sides of the inrush current part 102, so that the electroplating solution can be uniformly ejected to the products on both sides of the inrush current part, and uniform plating holes of the products on both sides are ensured. Referring to fig. 2, the inrush current parts 102 have three sets, and the plating channels are formed between two adjacent sets of the inrush current parts 102; the middle inrush current component 102 is a first inrush current component 1021, the inrush current components 102 on both sides of the first inrush current component 1021 are second inrush current components 1022, and the second inrush current components 1022 on both sides are provided with second spouting holes opposite to the first spouting holes of the first inrush current component 1021 on the side facing the middle inrush current component 102. When electroplating, anchor clamps 1 is at two rows of circuit boards 2 of top centre gripping horizontal migration in two electroplating channels, and when circuit board 2 was the sheet metal, its horizontal migration in-process rocked easily, and first part 1021 and the second part 1022 of shoving gush out the plating solution to circuit board 2 two sides from both sides evenly, make circuit board 2 both sides keep pressure balance, effectively guarantee circuit board 2's the straightness that hangs down, and circuit board 2 parallel operation does not rock, guarantees that the face is electroplated evenly.

Optionally, the tank structure for electroplating further comprises a first guide assembly, a second guide assembly and a lifting mechanism.

The first guiding components are arranged at two sides of the first inrush current component 1021 and arranged to avoid the ejection port of the first inrush current component 1021, and the first guiding components are suitable for guiding the running track of the product in the groove body 101 and preventing the circuit board 2 from inclining towards the first inrush current component 1021 in the running process. For example, the first guiding assembly includes a plurality of guiding wheels 104, and the guiding wheels 104 are rotatably disposed on the first current-inrush part 1021 and are arranged at intervals along the extending direction of the tank body 101. Referring to fig. 1, 3 and 4, the partition assembly further includes a supporting frame 109, the supporting frame 109 extends along the extending direction of the trough body 101, the supporting frame 109 includes a top plate and a plurality of ribs, the plurality of ribs are disposed at the bottom of the top plate at equal intervals, and an accommodating space for accommodating the first inrush current component 1021 is formed between adjacent ribs. The first current gushing part 1021 is a first branch nozzle, and a plurality of first branch nozzles are arranged in a row at equal intervals along the extending direction of the trough body 101. Referring to fig. 2, the middle portions of the two sides of the rib plate are recessed inward to form mounting areas, and a guide wheel 104 is mounted at the bottom of each mounting area. The arrangement of the sunken installation area enables the inner side of the guide wheel 104 to be close to the first inrush current component 1021, and the outer side of the guide wheel is positioned outside the first inrush current component 1021 to guide the circuit board 2, so that the structure is compact. The outer side of the guide wheel 104 is suitable for contacting the circuit board 2, the circuit board 2 is guided, friction force between the circuit board 2 and the guide wheel 104 is reduced through rolling friction, and the installation position of the guide wheel 104 can be flexibly adjusted according to the positions of the circuit boards 2 on two sides.

Referring to fig. 2, 6 to 8, second guide assemblies extend along the length direction of the chute body 101 and are arranged at two sides of the first guide assemblies, and the second guide assemblies are located at the inner sides of the two groups of second gushing parts; the second guide assembly is adapted to guide the path of the product within the trough body 101, preventing the product bottom from tilting towards the second gushing member. A first electroplating channel is formed between the second guide assembly on the left side of the tank body 101 and the guide wheel 104 on the left side of the first gushing part, and a second electroplating channel is formed between the second guide assembly on the right side of the tank body 101 and the guide wheel 104 on the right side of the first gushing part, so that products are limited to move in parallel in the electroplating channels.

The second guide assembly includes a guide member 1051, a shielding member 1052, and a plurality of supporting seats 1053. The wide edge of the guide part 1051 extends to the first guide assembly along the width direction of the slot body 101, the long edge extends along the length direction of the slot body 101, and the long edge of the guide part 1051 is up-down fluctuated or inclined. Preferably, the guide member 1051 is flat and undulates up and down along the direction in which the tank body 101 extends. During electroplating, the guide part 1051 is located at the bottom of the circuit board 2 to prevent the bottom of the circuit board 2 from inclining outwards, the guide part 1051 is located between the anode titanium basket 103 and the circuit board 2 to shield a small amount of cations running from the anode titanium basket 103 to the circuit board 2, if the height of the guide part 1051 in the length direction is consistent, the cations are always shielded in the height direction, and the surface plating layer of the circuit board 2 and the guide part 1051 with consistent height is thin. The long edge of the guide part 1051 is up-down fluctuated or inclined, and when the circuit board 2 runs along the groove body 101, the part shielded by the guide part 1051 on the circuit board is constantly changed, so that the uniformity of the plating layer is ensured.

Optionally, the shielding member 1052 is disposed at the bottom of the guiding member 1051, a plurality of supporting seats 1053 are disposed at intervals along the extending direction of the shielding member 1052 at the top of the shielding member 1052, adjacent supporting seats 1053 are disposed in a staggered manner, and the guiding member 1051 is fixed at the top of the supporting seats 1053 to form a height structure.

Fig. 9 is a schematic diagram showing the distribution of electric lines in the tank body 101, in the lower part of the wiring board 2, cations flow to the lower part of the wiring board 2 from both the bottom side and the bottom end face of the anode titanium basket 103, and cations flow to the middle part of the wiring board 2 from only the side of the middle part of the anode titanium basket 103, which results in the thicker plating layer at the bottom of the wiring board 2. The shielding member 1052 extends along the extending direction of the trough body 101; the shielding part 1052 is arranged between the anode titanium basket 103 and the first current inrush part 1021; when the product advances in the groove body 101, the shielding component 1052 is used for shielding part of cations at the bottom of the circuit board 2, so that the coating at the bottom of the circuit board 2 is prevented from being thicker, and the uniformity of the coating is ensured. Preferably, referring to fig. 2 and 8, the cross section of the shielding component 1052 is rectangular, the shielding component 1052 is arranged between the anode titanium basket 103 and the guide wheel 104, and the bottom of one side of the shielding component facing the anode titanium basket 103 is extended downwards, so that the shielding effect is good. One side of the shielding component 1052 facing the first inrush current component 1021 is provided with a chamfer, for example, the chamfer is located at the top of the shielding component 1052, which facilitates guiding the circuit board 2 from the end of the shielding component 1052 into the electroplating channel to prevent the circuit board from being stuck.

The second gushing part is a second branch nozzle, the top of the shielding part 1052 is provided with a plurality of mounting holes, and the second branch nozzle is mounted in the mounting holes and the bottom of the second branch nozzle extends out of the mounting holes to be communicated with the confluence part 107. An elevating mechanism (not shown) is connected to the shutter member 1052 and supports and drives the shutter member 1052 to be elevated and lowered in the tank body 101. For example, the lifting mechanism includes a lifting driver and a suspension rod connected to the lifting driver, and the bottom of the suspension rod is inserted into the shielding component 1052 to drive the shielding component 1052 and the guiding component 1051 to integrally lift. The second guiding component is arranged in the groove body 101 in a height-adjustable mode, and the position of the second guiding component in the groove body 101 can be flexibly adjusted according to the height of the circuit board 2, so that cations can be effectively guided and shielded.

The bottoms of the first branch nozzle and the second branch nozzle are communicated with a confluence part 107, for example, the confluence part 107 is a main nozzle which is arranged at the bottom of the tank body 101. A lower tank is arranged below the tank body 101, electroplating solution is stored in the lower tank, and the electroplating solution is pumped out of the lower tank, is pumped into the main nozzles and is sprayed out of the branch nozzles. Be equipped with the overflow mouth with the backwash tank intercommunication on the groove body 101, be equipped with in the cell body and send out the bleeder line 108 with the overflow mouth intercommunication, the plating solution passes through bleeder line 108, overflow mouth and backwash tank backward flow to lower groove. Each branch spray pipe is detachably arranged on the main spray pipe, and is convenient to replace when the branch spray pipes are blocked.

As the first alternative embodiment of the embodiment 1, the cross section of the shielding member 1052 may have any other shape as long as it can perform the effect of shielding cations on the bottom portion of the circuit board 2, and the shielding member 1052 may not be provided with a chamfer.

As a second alternative embodiment of the embodiment 1, the guiding member 1051 may also be integrally formed on the shielding member 1052, which is directly up and down arranged as the top surface of the shielding member 1052. The guide wheel 104 may also be secured to a support bracket 109 extending outwardly from the first gush member. The guide wheel 104 may be replaced with a guide plate that guides the circuit board 2 and prevents the circuit board 2 from inclining toward the first gushing out member.

As a third alternative embodiment of example 1, the separation assembly may further include an anode titanium basket 103, the anode titanium basket 103 is located in the middle of the tank body 101 and faces the anode titanium baskets 103 at two sides of the tank body 101, two first gushing parts are respectively arranged at two sides of the anode titanium basket 103 in the middle, and second gushing parts are arranged at two sides of the two first gushing parts, and the first gushing parts and the second gushing parts cooperate to eject the plating solution to ensure that the circuit boards 2 run in parallel.

Example 2

The present embodiment provides an electroplating system including the tank structure for electroplating and the jig 1 in embodiment 1. Wherein, the clamp 1 is fixed on the driving device and is spanned on two parallel electroplating channels; the clamp 1 is provided with two symmetrically arranged chucks; the clamping head is arranged corresponding to the electroplating channel; the clamping surfaces of the two clamping heads are parallel to each other; any of the clips is adapted to hold a circuit board 2. The same clamp 1 clamps the two circuit boards 2 to move and electroplate in the electroplating bath, the inner side surfaces of the two rows of circuit boards 2 are pasted with films to prevent the inner side surfaces from being partially electroplated, and the single surfaces of the two rows of circuit boards 2 are electroplated in the electroplating system at the same time, so that the electroplating productivity is effectively improved.

Example 3

This embodiment provides a production line including the plating system of embodiment 2. The electroplating system has high productivity.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.

Claims (15)

1. A tank structure for electroplating, comprising:

a tank body (101);

the separation assembly extends in the same direction with the tank body (101) and is arranged in the tank body (101) and is suitable for separating the tank body (101) into two electroplating channels which are parallel to each other;

the tank body (101) is adapted to receive anode material on opposite inner walls and/or on the separator assembly.

2. The tank body structure for electroplating according to claim 1, further comprising:

two groups of anode titanium baskets (103) are respectively connected to the inner walls of two opposite sides of the tank body (101); the anode titanium basket (103) is suitable for placing anode materials.

3. The tank structure for electroplating according to claim 2, wherein the partition member comprises

At least one group of inrush current parts (102), wherein any group of inrush current parts (102) are distributed along the extending direction of the tank body (101); an electroplating channel for products to pass through is formed between the inrush current part (102) and the anode titanium basket (103).

4. The tank body structure for electrolytic plating according to claim 3, wherein the gushing member (102) is provided with a first spouting hole at least one of both sides facing the tank body (101).

5. The tank body structure for electroplating according to claim 4, wherein the first spouting holes are provided on both sides of the spouting member (102);

the inrush current parts (102) are provided with three groups, wherein the electroplating channels are formed between two adjacent groups of the inrush current parts (102) in the three groups of the inrush current parts (102); the middle inrush current component (102) is a first inrush current component (1021), the inrush current components (102) on two sides of the first inrush current component (1021) are second inrush current components (1022), and second ejection holes opposite to the first inrush current component (1021) are formed in one sides, facing the middle inrush current component (102), of the second inrush current components (1022) on two sides.

6. The tank body structure for electroplating according to claim 5, further comprising

The first guide assemblies are arranged on two sides of the first inrush current part (1021), are arranged to avoid the ejection ports of the first inrush current part (1021), and are suitable for guiding the running track of the product in the groove body (101).

7. The tank structure for electroplating according to claim 6, wherein the first guide assembly comprises

And the guide wheels (104) are rotatably arranged on the first current gushing part (1021) and are arranged at intervals along the extending direction of the tank body (101).

8. The tank structure for electroplating according to claim 6 or 7, further comprising

The second guide assemblies extend along the length direction of the groove body (101) and are arranged on two sides of the first guide assemblies, and the second guide assemblies are positioned on the inner sides of the two groups of second gushing parts; the second guide assembly is adapted to guide the travel path of the product within the trough body (101).

9. The tank structure for electroplating according to claim 8, wherein the second guide assembly comprises

And the wide side of the guide component (1051) extends towards the first guide component along the width direction of the slot body (101), the long side of the guide component extends along the length direction of the slot body (101), and the long side of the guide component (1051) is up-down fluctuated or obliquely arranged.

10. The cell body structure for electroplating according to claim 9, wherein the second guide assembly further comprises

A shielding component (1052) arranged at the bottom of the guide component (1051), wherein the shielding component (1052) extends along the extending direction of the slot body (101); the shielding part (1052) is arranged between the anode titanium basket (103) and the first current inrush part (1021); the shielding member (1052) is used for shielding cations at the bottom of the product when the product travels in the tank body (101).

11. The tank structure for plating according to claim 10, wherein the cross section of the shade member (1052) is rectangular; and/or one side of the shielding part (1052) facing the first current inrush part (1021) is provided with a chamfer.

12. The tank structure for electroplating according to claim 10 or 11, further comprising

And the lifting mechanism is connected with the shielding component (1052) and supports and drives the shielding component (1052) to lift in the trough body (101).

13. An electroplating system comprising the tank structure for electroplating according to any one of claims 1 to 12.

14. The electroplating system of claim 13, further comprising

The clamp (1) is fixed on the driving device and spans two parallel electroplating channels; it is provided with two symmetrically arranged chucks; the clamping head is arranged corresponding to the electroplating channel; the clamping surfaces of the two clamping heads are parallel to each other; any of the cartridges is adapted to hold a product.

15. A production line comprising the electroplating system of claim 13 or 14.

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