JP3366319B2 - Continuous automatic plating equipment - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a continuous automatic plating apparatus.

[0002]

2. Description of the Related Art FIG. 3 is a vertical cross-sectional view showing an example of a continuous automatic plating apparatus previously developed. A plating solution supply pipe 2 near the bottom of a plating tank 1 extends vertically in FIG. Discharge ports 3 that are provided and that are provided in large numbers in the tube wall
The plating solution 4 is supplied into the plating tank 1 from the above. The plating solution 4 supplied into the plating tank 1 is agitated by the air jetted from the air jet pipe 5.

A V-shaped rail 6 extending in the vertical direction in FIG. 3 is provided at the upper center of the plating liquid supply pipe 2, and a plate-shaped object 7 such as a printed circuit board is vertically mounted on the V-shaped rail 6. It is placed in the above-mentioned posture and sent into the plating tank 1. A plurality of rotary shafts 8 are vertically arranged on both sides of the rail 6 at intervals in the vertical direction of FIG. 3, and the rotary shafts 8 on both sides of the rail 6 are rotated in opposite directions by a rotating device 9. It is designed to be rotated.
The rotating shaft 8 has a feed roller 10 (also partially serving as an electrode)
The object 7 to be plated on the rail 6 is sandwiched between the feed rollers 10 and horizontally moved along the rail 6. Anodes 12 are hung from both sides inside the plating tank 1 via lift cylinders 11,
The vertical position of the anode 12 is adjusted by the elevating cylinder 11 so that it is always immersed in the plating solution 4.

The above-mentioned rotating device 9 and lifting cylinder 1
1 is attached to a frame 13 provided above the plating tank 1, and a shielding plate 14 is arranged inside the plating tank 1. Further, a compartment 1 is provided outside one side of the plating tank
5 is attached to the side wall of the plating tank 1 where the compartment 15 is attached, and a horizontally long and slender hole 16 is formed in the side wall of the plating tank 1.
It communicates with the inside of. A plating solution discharge pipe 17 is connected to the bottom of the compartment 15, and the plating solution discharge pipe 17 is connected to a filter (not shown). The plating solution 4 flows from the plating tank 1 through the hole 16 into the compartment 15. Is introduced into the filter through the plating solution discharge pipe 17, filtered, and then supplied again to the plating solution supply pipe 2 through the discharge port 3 to the plating tank 1
It circulates inside.

Next, the operation of the conventional continuous automatic plating apparatus shown in FIG. 3 will be described. Discharge port 3 of plating liquid supply pipe 2
When the liquid level of the plating solution 4 flowing into the plating tank 1 from the above reaches the height of the hole 16, the plating solution 4 in the plating tank 1 flows out from the hole 16 into the compartment 15. The liquid level of the plating solution 4 in the plating tank 1 is maintained at the height of the hole 16. The liquid level of the plating solution 4 is such that the upper part of the object 7 to be plated that moves horizontally along the rail 6 is not exposed from the plating solution 4.

By applying a DC voltage between the anode 12 and a cathode (not shown) located between the plurality of rotating shafts 8 and operating the rotating device 9, the plated objects 7 arranged on the rails 6 are The plating is continuously performed while moving along the rail 6. The amount of the plating solution 4 flowing into the plating tank 1 from the discharge port 3 of the plating solution supply pipe 2 is
The plating solution 4 therein is set to circulate 3 to 5 times per hour.

[0007]

In the continuous automatic plating apparatus, foreign matter such as copper ions and dust peeled off from the cathode (not shown) located between the plurality of rotating shafts 8 is removed by the plating solution 4.
Mixed in the surface of the object to be plated 7,
As it will have an adverse effect such as pits and adhesion of foreign matter,
It is necessary to remove the foreign matter mixed in the plating solution 4.

However, in the conventional continuous automatic plating apparatus shown in FIG. 3, since the plating solution 4 is circulated so that the plating solution 4 flows out from the liquid surface to the compartment 15, a light floating matter rises up. Foreign matter having a large specific gravity tends to settle below the plating solution 4 and is not removed.
There was a problem that adversely affected the plating.

An object of the present invention is to provide a continuous automatic plating apparatus which solves such a problem and can easily remove foreign matter having a high specific gravity.

According to a first aspect of the present invention, there is provided a continuous automatic plating apparatus for vertically plating a plate-shaped object to be plated while continuously moving on a rail in the plating tank. A plating solution supply port that opens toward both sides, a compartment that is provided on the side of the plating tank and through which the plating solution flows out, and below the lower edge of the object to be plated transferred in the plating tank and The plating solution discharge pipe with suction openings open at both sides below the rail, the plating solution flowing out from the compartment and the plating solution discharged from the plating solution discharge pipe are passed through a filter to the plating solution supply port. The present invention relates to a continuous automatic plating apparatus having a circulating device and a large number of foreign substances having a large specific gravity are generated in the plating solution and gradually settle down. Easy to concentrate in the vicinity. Foreign matter concentrated near the rail is below the lower edge of the object to be plated and the suction port sandwiches the rail.
It is sucked and removed from the plating solution discharge pipe that is open at the lower side .

A second aspect of the present invention relates to the continuous automatic plating apparatus according to the first aspect, characterized in that a squeezing portion having a narrowed cross-sectional area is provided in the vicinity of the suction port of the plating liquid discharge pipe. The flow rate of the plating liquid discharged from the plating liquid discharge pipe is increased in the squeezing portion, and the foreign matter suction performance is improved.

According to a third aspect of the present invention, the flow rate of the plating solution flowing from the suction port into the plating solution discharge pipe is equal to or more than the flow rate of the plating solution flowing out into the compartment. 1 relates to the continuous automatic plating apparatus, and since the amount of liquid discharged from the plating liquid discharge pipe below is equal to or more than the amount of liquid discharged from the plating liquid surface, the suction efficiency of foreign matter having a large specific gravity Becomes higher.

A fourth aspect of the present invention relates to the continuous automatic plating apparatus according to the first aspect, characterized in that compartments in which the plating solution flows out are provided on both sides of the plating tank. The overflow of the plating liquid from the liquid surface is averaged on the left and right, and the surface finish of the object to be plated becomes clean.

A fifth aspect of the present invention relates to the continuous automatic plating apparatus according to the first aspect, characterized in that the plating solution supply port opened in the plating tank is a plurality of vertically elongated slits. It becomes possible to efficiently supply the plating solution to the bath.

The invention according to claim 6 relates to the continuous automatic plating apparatus according to claim 1, characterized in that the plating solution supply port opened in the plating tank is a large number of small holes. It is possible to evenly and uniformly supply the plating solution.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a vertical cross-sectional view showing an example of an embodiment of the present invention, and FIGS. 2A and 2B are side views showing an example of an embodiment of a plating solution supply port according to the present invention, the same as FIG. The same reference numerals are given to the parts.

In the plating tank 1 of the continuous automatic plating apparatus according to the present invention, as shown in FIG. 2 (a), a plurality of plating solution supply slits 18 which are vertically long slits are opened in parallel to each other. The plating liquid 4 can be evenly supplied to both surfaces of the plated object 7.
The plating liquid supply slit 18 is not a slit but a slit shown in FIG.
As shown in (b), the plating solution supply nozzle 23 may have a plurality of fine shapes such as circular small holes or other shapes.

A plating solution discharge pipe 20 having suction ports 19 open on both sides below the rail 6 is attached from the inside of the plating tank 1 to both outsides of the plating tank 1, and A squeezing unit 21 having a narrow cross-sectional area is provided at a position near the suction port 19. Further, a plating solution discharge pipe 22 for removing foreign matters finally settled is attached to the side of the bottom of the plating tank 1, and both of the plating solution discharge pipes 20 and 22 are connected to a filter (not shown). .

Partition chambers 15 are attached to the outsides of both sides of the plating tank 1, and horizontal elongated holes 16 are formed at positions at the same height on both sides of the plating tank 1.
And the inside of the compartments 15 on both sides communicate with each other. The plating liquid discharge pipe 17 opened at the bottom of the compartment 15
Is connected to a filter (not shown). The flow rate of the plating solution 4 flowing from the suction port 19 into the plating solution discharge pipe 20 is
The plating solution 4 flowing into the compartments 15 on both sides through the holes 16
The flow rate is set to be equal to or larger by 10 to 80%. The shape of the suction port 19 may be round or rectangular,
As shown in FIG. 1, the position of the suction port 19 is such that the vertical distance a between the upper end of the suction port 19 and the lower edge of the object 7 is 30 to 1
The optimum distance is about 50 mm, and the horizontal distance b between the tip of the suction port 19 and the surface of the object 7 to be plated is about 30 to 250 mm.

In the embodiment shown in FIG. 1 described above,
From the plating solution supply slit 18 of FIG. 1 (FIG. 2A) or the plating solution supply nozzle 23 of FIG.
The plating solution 4 that has flowed into the compartment 1 is supplied from the holes 16 on both sides to the compartment 1.
5, discharged through the plating liquid discharge pipe 17 and the plating liquid discharge pipe 20, and also flows out to the plating liquid discharge pipe 22 from the side of the bottom of the plating tank 1. The flow rate of the plating solution 4 flowing into the plating tank 1 from the plating solution supply slit 18 or the plating solution supply nozzle 23 is determined by the plating solution discharge pipe 20 connected to the suction port 19 and the plating solution discharge pipe 17 connected to the compartment 15.
And the total flow rate of the plating solution 4 flowing out from the plating solution discharge pipe 22 at the bottom is larger, and the plating solution 4 flows out from the holes 16 on both sides of the plating tank 1 into the compartment 15, thereby The surface of the plating solution 4 is kept at the height of the hole 16 so that the upper portion of the object 7 to be plated which moves horizontally along the rail 6 is not exposed from the plating solution 4.

The plating solution 4 that has flowed out to the plating solution discharge pipes 20 and 22 is guided to a filtration device (not shown) and filtered, and then supplied again to the plating solution supply slit 18 or the plating solution supply nozzle 23. ~ Circulates 5 times.

Since the suction port 19 of the plating liquid discharge pipe 20 is opened below the lower edge of the object 7 to be plated transferred in the plating tank 1 and on both sides of the object 7 to be plated, it is separated from the power supply roller. The copper ions and foreign substances that tend to settle in the lower part of the plating solution 4 such as black film and carbon can be sucked from the lateral lower part of the object 7 to be plated, and further the squeezing part 21 near the suction port 19 Since the flow velocity becomes faster when passing through, the foreign matter suction efficiency is improved, and the flow rate of the plating solution 4 flowing from the suction port 19 into the plating solution discharge pipe 20 is
Since the flow rate is equal to or more than the flow rate of the plating solution 4 flowing out to the plate, light foreign matter floating in the plating solution 4 is also sucked from the suction port 19 and is formed on the object 7 to be plated. No adverse effects such as rough spots, pits, and adhesion of foreign matter will occur on the plated surface. Further, metal and foreign matter having a large specific gravity are sucked from the suction port 19 and flow out of the plating tank 1 together with the plating solution 4 from the plating solution discharge pipe 22 at the bottom of the plating tank 1. In this case, it becomes important to perform microfiltration with a filter (not shown).

[0023]

According to the first aspect of the present invention, since the foreign matter in the plating solution is sucked from the lateral lower part of the object to be plated, the foreign matter having a large specific gravity is also sucked and removed, and the plating surface is provided with rough spots, pits, and foreign matter. There is an effect that plating can be performed without adverse effects such as.

According to the second aspect of the invention, the flow rate of the plating solution discharged from the plating solution discharge pipe is increased in the squeezing portion, and the foreign matter suction performance is improved.

According to the third aspect of the present invention, since the amount of liquid discharged from the lower plating liquid discharge pipe is equal to or more than the amount of liquid discharged from the plating liquid surface, the foreign matter having a high specific gravity can be efficiently sucked out. effective.

According to the fourth aspect of the present invention, the overflow of the plating liquid from the liquid surface is averaged on the left and right, and the surface finish of the object to be plated can be made beautiful.

The invention of claim 5 has an effect that the plating solution can be uniformly and efficiently supplied even in a deep plating tank. The invention of claim 6 has an effect that the plating solution can be evenly and uniformly supplied to the plating bath.

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an example of an embodiment of the present invention.

FIG. 2 is a vertical sectional view showing the outline of another example of the embodiment of the present invention.

FIG. 3 is a vertical sectional view showing an example of a conventional continuous automatic plating apparatus.

[Explanation of symbols]

1 plating tank 2 Plating liquid supply pipe 3 outlets 4 plating solution 5 Air ejection pipe 6 rails 7 Plated object 8 rotation axes 9 rotator 10 Feed roller 11 Lifting cylinder 12 Anode 13 frames 14 Shield 15 compartments 16 holes 17 Plating liquid discharge pipe 18 Plating liquid supply slit 19 Suction port 20 Plating liquid discharge pipe 21 Squeezing Department 22 Plating liquid discharge pipe 23 Plating liquid supply nozzle a Vertical distance b Horizontal distance

Claims (6)

(57) [Claims] 1. A continuous automatic plating apparatus for vertically plate-shaped object to be plated while continuously moving on a rail in a plating tank, and opening to both sides of the object to be plated in the plating tank. Plating liquid supply port, a compartment provided on the side of the plating tank for the plating solution to flow out, and both sides below the lower edge of the object to be plated transferred in the plating tank and sandwiching the rail And a device for circulating a plating solution discharge pipe having a suction port opened below and a plating solution flowing out of the compartment and the plating solution discharged from the plating solution discharge pipe to the plating solution supply port through a filter. Characteristic continuous automatic plating equipment. 2. The continuous automatic plating apparatus according to claim 1, wherein a squeezing section having a narrowed cross-sectional area is provided in the vicinity of the suction port of the plating solution discharge pipe. 3. The continuous flow according to claim 1, wherein the flow rate of the plating solution flowing into the plating solution discharge pipe from the suction port is equal to or more than the flow rate of the plating solution flowing out into the compartment. Automatic plating device. 4. The continuous automatic plating apparatus according to claim 1, wherein compartments into which the plating solution flows out are provided on both sides of the plating tank. 5. The plating solution supply port opening in the plating tank is formed of a plurality of vertically elongated slits.
The continuous automatic plating device described in. 6. The continuous automatic plating apparatus according to claim 1, wherein the plating solution supply port opened in the plating tank is a large number of small holes.