CN204434750U - A kind of vertical continuous electroplating device - Google Patents
A kind of vertical continuous electroplating device Download PDFInfo
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- CN204434750U CN204434750U CN201520024612.4U CN201520024612U CN204434750U CN 204434750 U CN204434750 U CN 204434750U CN 201520024612 U CN201520024612 U CN 201520024612U CN 204434750 U CN204434750 U CN 204434750U
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- cell body
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- plated
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- 238000009713 electroplating Methods 0.000 title claims abstract description 244
- 210000005056 cell body Anatomy 0.000 claims abstract description 129
- 239000007788 liquid Substances 0.000 claims abstract description 88
- 239000003814 drug Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 238000007667 floating Methods 0.000 claims abstract description 20
- 238000007747 plating Methods 0.000 claims description 58
- 125000004122 cyclic group Chemical group 0.000 claims description 27
- 239000010936 titanium Substances 0.000 claims description 15
- 229910052719 titanium Inorganic materials 0.000 claims description 15
- 238000005406 washing Methods 0.000 claims description 15
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000005611 electricity Effects 0.000 claims description 9
- 238000001914 filtration Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 230000004308 accommodation Effects 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims description 5
- 239000007769 metal material Substances 0.000 claims description 5
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 230000001351 cycling effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 8
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- 230000007423 decrease Effects 0.000 description 5
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- 239000000126 substance Substances 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
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- 229910052742 iron Inorganic materials 0.000 description 2
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- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
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- 230000007797 corrosion Effects 0.000 description 1
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- -1 during plating Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of vertical continuous electroplating device, comprise frame, electroplating cell body, backflow casing, substrate transfer device to be plated, electrolyzer and electrical means, described backflow casing is arranged on the bottom of described frame, described electroplating cell body is in the middle part of described frame, and be positioned at the top of described backflow casing, described substrate transfer device to be plated is positioned at the top of described electroplating cell body, the negative electrode of described electrolyzer is electrically connected with the fixture of the clamping plate to be plated on described substrate transfer device to be plated, electroplating liquid medicine conducting in anode and described electroplating cell body, described electrical means is arranged on the top of described frame, also comprise galvanization floating bed device, described galvanization floating bed device comprises the kickboard be in described electroplating cell body, and be in above described substrate transfer device to be plated, drive the kickboard hoisting appliance that described kickboard rises or declines in described electroplating cell body.Electroplating device described in the utility model, structure letter is gathered, and not only saves the occupation of land space of whole equipment, ensure that the security of operator, and electroplate liquid can cycling and reutilization, and electroplating effect significantly improves.
Description
Technical field
The utility model relates to a kind of electroplating device, the main equipment used when referring in particular to vertical continuous plating.
Background technology
So-called plating is exactly the process utilizing electrolysis principle to plate other metal or alloy of skim on some metallic surface, be utilize electrolytic action to make the technique of the surface attachment layer of metal film of metal or other material thus play to prevent burning (as corrosion), improve the effects such as wear resistance, electroconductibility, reflective and having improved aesthetic appearance.
A set of continuous print electroplating device is except comprising most basic plating tank, also comprise power supply, AC power is converted to the rectifier of direct supply, to the refrigerating unit of rectifier cooling, by electroplate liquid, the electrolyzer that part to be plated (negative electrode) and anode are formed, the return tank circulated is formed with the liquid in plating tank, transport the carrier that unplated piece moves ahead in plating tank, the washing unit of cleaning fixture, kickboard structure of blocking power line etc., therefore, the composition structure of the electroplating device of a set of liaison is more, the setting of each structure and the whether rationally distributed quality to electroplating effect, to the smooth operation of continuous print electroplating device, and electroplating device self structure simply compact and take up space and have a significant impact.
Utility model content
For this reason, it is simple and compact for structure that the technical problems to be solved in the utility model is to propose one, and institute takes up space little, the vertical continuous electroplating device that electroplating effect is good.
For solving the problems of the technologies described above, the utility model provides a kind of vertical continuous electroplating device, comprises frame, and
Plating bath arrangement, comprise the electroplating cell body electroplated for plate to be plated wherein, the backflow casing of electroplating liquid medicine is housed, be arranged in described electroplating cell body, the surface of plate to be plated is carried out to the jet pipe of spraying plating, and be arranged in described backflow casing the filtration cycle system realizing electroplating liquid medicine circulation between electroplating cell body, backflow casing;
Substrate transfer device to be plated, delivers plate to be plated and moves ahead in described electroplating cell body;
Electrolyzer, with plate to be plated for negative electrode, take plating metal as anode, electroplates the plate to be plated in described electroplating cell body;
Electrical means, for described electrolyzer provides direct supply;
Described backflow casing is arranged on the bottom of described frame, described electroplating cell body is in the middle part of described frame, and be positioned at the top of described backflow casing, described substrate transfer device to be plated is positioned at the top of described electroplating cell body, the negative electrode of described electrolyzer is electrically connected with the fixture of the clamping plate to be plated on described substrate transfer device to be plated, electroplating liquid medicine conducting in anode and described electroplating cell body, described electrical means is arranged on the top of described frame, also comprise galvanization floating bed device, described galvanization floating bed device comprises the kickboard be in described electroplating cell body, and be in above described substrate transfer device to be plated, drive the kickboard hoisting appliance that described kickboard rises or declines in described electroplating cell body.
In vertical continuous electroplating device of the present utility model, described substrate transfer device to be plated is conveyer chain structure, described electroplating cell body is in below the chain of described conveyer chain structure side, below the chain of described conveyer chain structure opposite side, place is provided with fixture washing unit, a part for described backflow casing is in below described electroplating cell body, and another part of described backflow casing is in the below of described fixture washing unit.
In vertical continuous electroplating device of the present utility model, described fixture washing unit comprises nitric acid section fixture water spilage tray and washing section water spilage tray.
In vertical continuous electroplating device of the present utility model, on described chain, interval is installed with several annexes, the some described fixture under described annex comprises a conductive slider and is arranged on described conductive slider; The part of described chain between drive sprocket and driven sprocket two outside be installed with a track respectively, the length direction of described track is parallel with the length direction of described chain, and during described chain operation, described conductive slider can be sticked on described track, described track conductive, and the side contacted with described conductive slider is the working face conducted electricity.
In vertical continuous electroplating device of the present utility model, described plate to be plated is connected with the negative pole of described electrical means by fixture, described track.
In vertical continuous electroplating device of the present utility model, the both sides of described electroplating cell body are also provided with interpolation box, described interpolation box is distributed with some accommodation holes, described titanium basket is connected with the positive pole of described electrical means by anode titanium copper-clad.
In vertical continuous electroplating device of the present utility model, described jet pipe is also arranged on described interpolation box.
At vertical continuous electroplating device of the present utility model, each described jet pipe is provided with some nozzles.
In vertical continuous electroplating device of the present utility model, the described jet pipe being distributed in described electroplating cell body side is that the misplace mode of arrangement is arranged relative to the described jet pipe of opposite side.
In vertical continuous electroplating device of the present utility model, the adjacent nozzle in the vertical direction being distributed in described electroplating cell body the same side is arranged in the mode of the arrangement that misplaces.
In vertical continuous electroplating device of the present utility model, described electrical means comprises alternating-current is converted to galvanic motor-generator set, and give the cold water pipeline of described motor-generator set cooling, described motor-generator set and described cold water pipeline are all in the top of described galvanization floating bed device.
In vertical continuous electroplating device of the present utility model, described filtration cycle system comprises by described backflow casing first cyclic part for clean electroplating liquid medicine in described electroplating cell body, supplied the second cyclic part of clean electroplating liquid medicine to described jet pipe by described electroplating cell body, and to the 3rd cyclic part of overflow electroplating liquid medicine in described backflow casing from described electroplating cell body.
In vertical continuous electroplating device of the present utility model, described first cyclic part comprise to extract in described backflow casing electroplating liquid medicine the first pump, the first strainer be connected with the liquid outlet of described first pump, by described first strainer and the first pipeline be communicated with bottom described electroplating cell body.
In vertical continuous electroplating device of the present utility model, one end that the pipette being connected to described first pump fluid inlet place stretches in described backflow casing is also provided with suction port guard.
In vertical continuous electroplating device of the present utility model, described second cyclic part comprises the second pump from the extraction electroplating liquid medicine in described backflow casing, second strainer, be communicated with the liquid outlet of described second pump and the second pipeline of described second strainer fluid inlet, and be communicated with the liquid outlet of described second strainer and the 3rd pipeline of described jet pipe.
In vertical continuous electroplating device of the present utility model, described 3rd cyclic part comprises the overflow weir of the upper end of the sidewall being molded over described electroplating cell body, be on the outer side wall of described electroplating cell body, and around the spill cavity that described overflow weir is arranged, and the return flow line in described backflow casing that the electroplating liquid medicine at described spill cavity place is led.
In vertical continuous electroplating device of the present utility model, described spill cavity is surrounded by some overflow plates.
In vertical continuous electroplating device of the present utility model, the sidewall of described electroplating cell body is also provided with liquid smell outlet orifice higher than the position of described overflow weir, and is also provided with overflow exhausting dividing plate between described overflow weir and described liquid smell outlet orifice.
In vertical continuous electroplating device of the present utility model, the cell body intermediate plate between described electroplating cell body and described backflow casing is provided with circulation relief port, circulation discharge opening, and copper ball escape orifice.
In vertical continuous electroplating device of the present utility model, described electroplating cell body is divided by multiple plating that cell body is end to end to be formed, each described plating divides cell body to be equipped with a point of backflow casing, each described point backflow casing is provided with communicating pipe, is communicated with by described communicating pipe between point backflow casing described in adjacent two.
In vertical continuous electroplating device of the present utility model, it is individual that described plating divides cell body to be provided with, described first cyclic part comprises two cover liquid feeding pipelines, first liquid feeding pipeline for first electroplate point cell body arrange described in point backflow casing, second electroplate point cell body arrange described in the main pipeline that is all communicated with of point backflow casing after described first pump, described first strainer, described heating unit, by some branch pipeline to described first plating point cell body self and arrangement number for a described plating for odd number divides cell body to supply clean electroplating liquid medicine; Second liquid feeding pipeline for N electroplate that point cell body arranges described in point backflow casing, N-1 electroplate that point cell body arranges described in another main pipeline of being all communicated with of point backflow casing after another set of described first pump, described first strainer, described heating unit, electroplate point cell body self and arrangement number for a described plating for even number by some branch pipeline to described N and divide cell body to supply clean electroplating liquid medicine.
In vertical continuous electroplating device of the present utility model, being in described second plating point cell body and the described N-1 arrangement number of electroplate between point cell body is that the plating of odd/even divides on cell body and is also respectively equipped with a set of liquid self-feeding pipeline, described liquid self-feeding pipeline comprises the 3rd pump be communicated with described point of backflow casing, 3rd strainer, and the pipeline dividing cell body to be communicated with described plating, and the fluid inlet place of described 3rd pump is also provided with another connecting pipe divides the described backflow casing of cell body to be communicated with the plating of adjacent even/odd.
Described kickboard hoisting appliance comprises
Flexible pipe structure, at least be provided with one, comprise lifting outer tube, and extended or pipe/bar in being set in described lifting outer tube with retracting lifting, described lifting outer tube or the interior pipe/bar of described lifting are fixedly connected with described kickboard, and in described lifting, pipe/bar or described lifting outer tube are packed in described frame;
Wireline, the number of setting is consistent with the number of described flexible pipe structure, and one end of described wireline manages with in the described lifting outer tube be fixedly connected in described kickboard or described lifting/and bar is connected;
Wireline folding structure, controls the folding and unfolding of described wireline, and it is connected with the other end of described wireline.
At vertical continuous electroplating device of the present utility model, also comprise and be arranged between described wireline folding structure and described stretching structure, to the pulley changed course structure that the extraction of described wireline is led, described pulley changed course structure comprises some pulleys, and described pulley is arranged on the pulley mount in described frame.
In vertical continuous electroplating device of the present utility model, described pulley mount is U-type groove structure, and the side outer side wall of described U-type groove structure is fixed in frame by arm, and opposite side outer side wall fixedly mounts described pulley.
In vertical continuous electroplating device of the present utility model, in described lifting, the upper end of pipe/bar or described lifting outer tube is packed in described frame by the bottom surface being fixedly connected on described U-type groove structure.
In vertical continuous electroplating device of the present utility model, described flexible pipe structure is arranged in pairs in described passage both sides, described pulley changed course structure comprises two sister blocks be coaxially made up of two single-sheaved blocks, and the single-sheaved block that two independent, wireline corresponding to described flexible pipe structure by corresponding described independent single-sheaved block, and first on sister block described in latter two described single-sheaved block of respective side guide described wireline folding structure into.
In vertical continuous electroplating device of the present utility model, the described flexible pipe structure arranged in pairs is provided with three covers.
In vertical continuous electroplating device of the present utility model, described wireline folding structure comprises the capstan tying around and discharge wireline, and drives the motor of described capstan rotating, or described wireline folding structure is line motor.
In vertical continuous electroplating device of the present utility model, described wireline folding structure also comprises acquisition motor rotary speed signal, control the encoder of described motor running, the sensor of the highs and lows of detection and control kickboard, and the Shen house permanent seat of described sensor is installed.
In vertical continuous electroplating device of the present utility model, the upper surface of the both sides of the passage that the plate to be plated of the confession in described kickboard lower end is passed through also is provided with the guide plate led to unplated piece moving ahead in described passage.
In vertical continuous electroplating device of the present utility model, described kickboard is provided with the through hole of some through described kickboard upper and lower surfaces.
In vertical continuous electroplating device of the present utility model, described track is fixedly mounted in described frame by described arm, and described substrate transfer device to be plated is arranged on the below of described pulley mount.
In vertical continuous electroplating device of the present utility model, also comprise kickboard height indicating unit, described kickboard height indicating unit comprises and is fixed on described arm, and the vertical scale arranged, and lower end is fixed on the instruction guide rod in described kickboard, described scale is also provided with web member, and described web member is arranged perpendicular to the graduated surface of establishing of described scale, and described web member forms the through hole that applicable described instruction guide rod passes.
Technique scheme of the present utility model compared with prior art has the following advantages:
1. vertical continuous electroplating device of the present utility model divides organic for each integral part position, upper, middle and lower being arranged in frame dexterously, vertical continuous electroplating can not only be realized, and it is simple and compact for structure, rationally distributed, institute takes up space little, in addition, the electroplating effect that ensure that of the setting of kickboard hoisting appliance.
2. in vertical continuous electroplating device of the present utility model, described rectifying device and extractor fan are arranged at the top of plating tank, not only save the occupation of land space of whole equipment, and plating time produce sour gas all the time by pump drainage above whole equipment, therefore be convenient to the flowing of gas, thus decrease the harm to human body to the full extent.
3. in vertical continuous electroplating device of the present utility model, by two scuncheons of described plating tank, interpolation box is set respectively, and the titanium basket be provided with in described interpolation box for holding metallic substance, during plating, metallic substance directly contacts with electrolytic solution, thus ensure that the density of cupric ion in electrolytic solution; In addition, described interpolation box is provided with the jet pipe spraying electroplate liquid to plating piece near described plating tank opening median side, thus electroplate liquid is constantly sprayed on plating piece by jet pipe by the electroplate liquid in described plating tank, ensure that the homogeneity of plating.
4. in vertical continuous electroplating device of the present utility model, being provided with the gripping unit for clamping plating piece by described transporting mechanism, stable for plating piece being sent in plating tank in the horizontal direction can being electroplated, ensure the effect of plating.
5. in vertical continuous electroplating device of the present utility model, galvanization floating bed device can not only realize the rising of kickboard in frame and the adjustment of decline, and pull kickboard due to the simple flexible pipe structure of wireline fit structure that functional quality is lighter, therefore, need to expend the energy driving kickboard to rise and to decline just to greatly reduce, greatly reduce production cost, and one-piece construction is also more compact.
6. in vertical continuous electroplating device of the present utility model, galvanization floating bed device also comprises and is arranged between described wireline folding structure and described stretching structure, to the pulley changed course structure that the extraction of wireline is led, can one-piece construction be made further compacter, be easy to arrange, occupied space is reduced.
7., in vertical continuous electroplating device of the present utility model, the setting of the guide plate in galvanization floating bed device kickboard, can when plate to be plated moves ahead along passage, what replace kickboard contact is guide plate, because guide plate is wavy, therefore, scratch can not be caused to unplated piece.Therefore, directly can not contact with plate to be plated as kickboard in prior art, cut be concentrated point-blank, clearly, thus affects the attractive in appearance of plate to be plated and performance.
8. in vertical continuous electroplating device of the present utility model, the setting of the position track of corresponding chain on galvanization floating bed device, can lead to the fixture be connected on chain structure and conduct electricity, and plate to be plated is sandwiched on fixture, thus can under the prerequisite of scratch not being caused to plate surface to be plated, plate to be plated is played to the effect of conduction and guiding, thus ensure that plate to be plated steadily moves ahead in electroplating cell body.
9. in vertical continuous electroplating device of the present utility model, plating bath arrangement includes the setting of the filtration cycle system of three road cyclic parts, make in plating production process, electroplate liquid not only can circulate between electroplating cell body and backflow casing, also make electroplate liquid can flow in electroplating cell body internal recycling simultaneously, add the mobility of electroplate liquid, make the chemical composition of electroplate liquid in plating bath arrangement more even, thus make electrolytic coating also more even, improve electroplating effect.And the setting of the 3rd cyclic part, the liquid level of electroplating cell body can be controlled, the electroplating liquid medicine overflowed can be realized to be back to backflow casing simultaneously, in addition, the feed liquor due to jet pipe provides from the electroplating cell body of liquid level stabilizing, instead of directly provide from the backflow casing of liquid level instability, therefore, can ensure the amount of the electrolytic solution gushed out in the jet pipe unit time, and hydraulic pressure is balanced, electroplating quality is high.
10. in vertical continuous electroplating device of the present utility model, plating bath arrangement arranges overflow weir by the top at electroplating cell body, can ensure the liquid level of electroplating cell body, and when there is unusual condition, the electroplate liquid in electroplating cell body is unlikely to overflow from groove top.Preferably all arrange overflow weir in the both sides of electroplating cell body, this set can make plating piece stress balance when overflow, ensures that plating piece (particularly thin plate plating piece) is steady.
11. in vertical continuous electroplating device of the present utility model, and plating bath arrangement arranges liquid smell outlet orifice on the overflow weir of electroplating cell body, discharges in cell body for the gas will produced in production process.Preferably all be provided with exhausting hole in the both sides of electroplating cell body, to reduce the impact on electroplate liquid flow direction in groove.
Accompanying drawing explanation
In order to make content of the present utility model be more likely to be clearly understood, below according to specific embodiment of the utility model also by reference to the accompanying drawings, the utility model is described in further detail, wherein
Fig. 1 is the front view of the utility model vertical continuous electroplating device;
Fig. 2 is the vertical view of the utility model vertical continuous electroplating device;
Fig. 3 is the left view of the utility model vertical continuous electroplating device;
Fig. 4 is the structure iron of galvanization floating bed device in the utility model vertical continuous electroplating device;
Fig. 5 is the front view of plating bath arrangement of the present utility model;
Fig. 6 is the vertical view of plating bath arrangement of the present utility model;
Fig. 7 is the schematic diagram (direction of arrow represents the flow direction of electroplating liquid medicine) of the first cyclic part
Fig. 8 is the front view that plating bath arrangement of the present utility model only arranges the first cyclic part;
Fig. 9 is the schematic diagram (direction of arrow represents the flow direction of electroplating liquid medicine) of the second cyclic part;
Figure 10 plating bath arrangement of the present utility model only arranges the front view of the second cyclic part;
Figure 11 is the structure iron of the cell body (only comprising electroplating cell body and lower groove) of plating bath arrangement of the present utility model;
Figure 12 figure is the sectional view in Figure 11 A-A direction;
Figure 13 figure is the sectional view in Figure 11 B-B direction;
In figure, Reference numeral is expressed as:
1-frame, 2-kickboard, 3-is elevated outer tube, pipe/bar in 4-lifting, 5-wireline, 6-pulley mount, 7-sister block, 8-single-sheaved block, 9-capstan, 10-motor, 11-encoder, 12-Shen house permanent seat, 13-guide plate, 14-passage, 15-through hole, 16-track, 17-arm, 18-scale, 19-indicates guide rod, 22-motor-generator set, 23-cold water pipeline, 24-nitric acid section fixture water spilage tray, 25-washing section water spilage tray, 26-fixture, 27-chain, 28-anode titanium copper-clad, 29-exhaust duct,
A1-electroplating cell body, A2-lower groove, A3-jet pipe, A4-first strainer, A5-first pipeline, A6-suction port guard, A7-second strainer, A8-the 3rd pipeline, A9-overflow weir, A10-spill cavity, A11-return flow line, A12-liquid smell outlet orifice, A13-overflow exhausting dividing plate, A14-nozzle, A15-cell body intermediate plate, A16-circulation relief port, A17-circulation discharge opening, A18-copper ball escape orifice, A19-communicating pipe, A20-first pump, A21-second pump, A22-second pipeline, A23-refluxes casing, A24-titanium basket, A25-pipette, A26-adds box.
Embodiment
In order to there be understanding clearly to technical characteristic of the present utility model, object and effect, now contrast accompanying drawing and embodiment of the present utility model is described.
As Figure 1-3, a kind of vertical continuous electroplating device of the present embodiment comprises frame 1, and
Plating bath arrangement, comprise the electroplating cell body A1 electroplated for plate to be plated wherein, the backflow casing A23 of electroplating liquid medicine is housed, be arranged in described electroplating cell body A1, the surface of plate to be plated is carried out to the jet pipe A3 of spraying plating, and be arranged in described backflow casing A23 the filtration cycle system realizing electroplating liquid medicine circulation between electroplating cell body A1, backflow casing A23;
Substrate transfer device to be plated, delivers plate to be plated and moves ahead in described electroplating cell body A1;
Electrolyzer, with plate to be plated for negative electrode, take plating metal as anode, electroplates the plate to be plated in described electroplating cell body A1;
Electrical means, for described electrolyzer provides direct supply;
Described backflow casing A23 is arranged on the bottom of described frame 1, described electroplating cell body A1 is in the middle part of described frame 1, and be positioned at the top of described backflow casing A23, described substrate transfer device to be plated is positioned at the top of described electroplating cell body A1, the negative electrode of described electrolyzer is electrically connected with the fixture 26 of the clamping plate to be plated on described substrate transfer device to be plated, electroplating liquid medicine conducting in anode and described electroplating cell body A1, described electrical means is arranged on the top of described frame 1, also comprise galvanization floating bed device, described galvanization floating bed device comprises the kickboard 2 be in described electroplating cell body A1, and be in above described substrate transfer device to be plated, drive the kickboard hoisting appliance that described kickboard 2 rises or declines in described electroplating cell body.
Said structure is core scheme of the present utility model, by the setting of such scheme, make vertical continuous electroplating device of the present utility model can not only realize vertical continuous electroplating, and it is simple and compact for structure, rationally distributed, institute takes up space little, in addition, and the electroplating effect that the setting of kickboard hoisting appliance ensure that.
Described substrate transfer device to be plated is conveyer chain structure, described electroplating cell body A1 is in below the chain 27 of described conveyer chain structure side, below the chain 27 of described conveyer chain structure opposite side, place is provided with fixture washing unit, a part of described backflow casing A23 is in below described electroplating cell body A1, another part of described backflow casing A23 is in the below of described fixture washing unit, electroplating cell body A1 and fixture washing unit branch office are in the both sides of ring chain 27, plating and fixture cleaning can be circulated in an orderly manner carry out, and structure is very simple gathers, institute takes up space little.Described fixture washing unit comprises nitric acid section fixture water spilage tray 24 and washing section water spilage tray 25.
Further, on described chain 27, interval is installed with several annexes, the some described fixture 26 under described annex comprises a conductive slider and is arranged on described conductive slider; The part of described chain 27 between drive sprocket and driven sprocket two outside be installed with a track 16 respectively, the length direction of described track 16 is parallel with the length direction of described chain 27, and described chain 27 is when running, described conductive slider can be sticked on described track, described track 16 conducts electricity, and the side contacted with described conductive slider is the working face conducted electricity.。Described plate to be plated is connected with the negative pole of described electrical means by fixture (26), described track (16).Described track 16 is fixedly mounted in described frame 1 by described arm 17, and described substrate transfer device to be plated is arranged on the described pulley mount 6 i.e. below of U-type groove structure.The setting of track can be led to the fixture be connected on chain structure and conduct electricity, and plate to be plated is sandwiched on fixture, thus can under the prerequisite of scratch not being caused to plate surface to be plated, plate to be plated is played to the effect of conduction and guiding, thus ensure that plate to be plated steadily moves ahead in electroplating cell body.
Preferably, described track 16 is fixedly mounted in described frame 1 by arm 17.
The both sides of described electroplating cell body A1 are also provided with and add box 20, described interpolation box 20 is distributed with some accommodation holes, hold the titanium basket 21 that anode metal material is housed and to be arranged on described interpolation box 20, described titanium basket 21 is distributed on described interpolation box A26 by anode titanium copper-clad 28 by described accommodation hole, and described titanium basket 21 is connected with the positive pole of described electrical means by anode titanium copper-clad.Described plate to be plated is connected with the negative pole of described electrical means by fixture 26, described track 16.Due to the metallic substance in titanium basket, as copper ball directly contacts with electrolytic solution, thus ensure that the density of cupric ion in electrolytic solution;
Described jet pipe A3 is also arranged on and adds on box, and jet pipe A3 is at the center of position closer to electroplating cell body A1 of adding the relative titanium basket in position on box.In order to ensure emission direction, each jet pipe A3 is provided with some nozzle A14.By arranging jet pipe and nozzle in electroplating cell body, improve the fluid speed of electroplate liquid, further increase the mobility of electroplate liquid, when multiple jet pipe and nozzle is contour be equidistantly arranged side by side with electroplating cell body side time, the chemical composition of electroplate liquid in electroplating cell body can be made more even.
In the present embodiment, the jet pipe A3 being preferably distributed in electroplating cell body A1 side is that the misplace mode of arrangement is arranged relative to the jet pipe A3 of opposite side.
The adjacent nozzle A14 in the vertical direction being preferably distributed in electroplating cell body A1 the same side is further arranged in the mode of the arrangement that misplaces.
As shown in figures 5-13, in the utility model, described filtration cycle system comprises the first cyclic part being supplied clean electroplating liquid medicine by backflow casing A23 in electroplating cell body A1, supplied the second cyclic part of clean electroplating liquid medicine to jet pipe A3 by electroplating cell body A1, and to the 3rd cyclic part of overflow electroplating liquid medicine in backflow casing A23 from electroplating cell body A1.In electroplanting device, the setting of the filtration cycle system of said structure, make in plating production process, electroplate liquid not only can circulate between electroplating cell body and backflow casing, also make electroplate liquid can flow in electroplating cell body internal recycling simultaneously, add the mobility of electroplate liquid, make the chemical composition of electroplate liquid in plating bath arrangement more even, thus make electrolytic coating also more even, improve electroplating effect.And the setting of the 3rd cyclic part, the liquid level of electroplating cell body A1 can be controlled, can realize the electroplating liquid medicine overflowed being back to backflow casing A23 simultaneously, in addition, the feed liquor due to jet pipe A3 provides from the electroplating cell body A1 of liquid level stabilizing, instead of directly provide from the backflow casing A23 of liquid level instability, therefore, can ensure the amount of the electrolytic solution gushed out in the jet pipe A3 unit time, and hydraulic pressure is balanced, electroplating quality is high.
In the present embodiment, described first cyclic part comprise to extract in backflow casing A23 electroplating liquid medicine the first pump A20, the the first strainer A4 be connected with the liquid outlet of described first pump A20, by described first strainer A4 and the first pipeline be communicated with bottom electroplating cell body A1.In order to the impurity in further filtering liquid medicine, one end that the pipette A25 being connected to described first pump A20 fluid inlet place stretches in described backflow casing A23 is also provided with suction port guard A6.As shown in Figure 7, described second cyclic part comprises the second pump A21 extracting electroplating liquid medicine in backflow casing A23, second strainer A7, be communicated with the liquid outlet of described second pump A21 and the second pipeline of described second strainer A7 fluid inlet, and be communicated with the liquid outlet of described second strainer A7 and the 3rd pipeline A8 of jet pipe A3.Because jet pipe A3 is relatively provided with two rows in electroplating cell body A1 body, therefore, described second cyclic part is also provided with two covers.
Described 3rd cyclic part comprises the overflow weir A9 of the upper end of the sidewall being molded over electroplating cell body A1, be on the outer side wall of electroplating cell body A1, and around the spill cavity A10 that overflow weir A9 is arranged, and by the return flow line A11 in the electroplating liquid medicine at spill cavity A10 place guiding backflow casing A23.In the present embodiment, described spill cavity A10 is surrounded by some overflow plates.
In order to improve the Working environment of workman, the sidewall of described electroplating cell body A1 is also provided with liquid smell outlet orifice A12 higher than the position of overflow weir A9, and be also provided with overflow exhausting dividing plate A13 between overflow weir A9 and liquid smell outlet orifice A12, the liquid smell of electroplating cell body A1 is by liquid smell outlet orifice A12, by the exhaust duct 29 that is communicated with spill cavity A10 and extractor fan, liquid smell is discharged outside factory building and carry out environmental protection treatment.
Heating unit is used for for the electroplating liquid medicine heating in backflow casing A23 or insulation.In the present embodiment, preferred described heating unit is plate heater.By arranging heating unit, for by the electroplate liquid heating in backflow casing or insulation, to realize the control to temperature of electroplating solution, electroplating effect can be improved.When using water bath heating device, the accurate control to temperature can be realized.
Cell body intermediate plate A15 between described electroplating cell body A1 and backflow casing A23 is provided with circulation relief port A16, circulation discharge opening A17, and copper ball escape orifice A18.
Described electroplating cell body A1 is divided by multiple plating that cell body is end to end to be formed, each described plating divides cell body to be equipped with a point of backflow casing, each described point backflow casing is provided with communicating pipe A19, is communicated with by described communicating pipe A19 between point backflow casing described in adjacent two.
As shown in Figure 4, the described kickboard hoisting appliance of described galvanization floating bed device comprises
Flexible pipe structure, at least be provided with one, comprise lifting outer tube 3, and the interior pipe/bar 4 of lifting that is extended or that be set in retracting in described lifting outer tube 3, described lifting outer tube 3 or the interior pipe/bar 4 of described lifting are fixedly connected with described kickboard 2, in described lifting, the upper end of pipe/bar 4 or described lifting outer tube 3 is fixed in described frame 1, and lower end is fixed on electroplating cell body;
Wireline 5, the number of setting is consistent with the number of described flexible pipe structure, and one end of described wireline 5 manages with in the described lifting outer tube 3 be fixedly connected in described kickboard 2 or described lifting/and bar 4 is connected;
Wireline folding structure, controls the folding and unfolding of described wireline 5, and it is connected with the other end of described wireline 5.
The setting of galvanization floating bed device can block the power line of plate lower end to be plated, thus make the homogeneity of the overlay coating of plate to be plated better, and the design of the kickboard hoisting appliance of said structure can not only realize the rising of kickboard 2 in frame 1 and the adjustment of decline in the utility model, and pull kickboard 2 due to the simple flexible pipe structure of wireline 5 fit structure that functional quality is lighter, therefore, need to expend the energy driving kickboard 2 to rise and decline to greatly reduce, greatly reduce production cost, and one-piece construction is also more compact.
In order to make one-piece construction compacter further, be easy to arrange, the minimizing that takes up space, galvanization floating bed device of the present utility model also comprises and is arranged between described wireline folding structure and described stretching structure, to the pulley changed course structure that the extraction of wireline 5 is led, described pulley changed course structure comprises some pulleys, and described pulley is arranged on the pulley mount 6 in described frame 1.Described pulley mount 6 is preferably U-type groove structure in the present embodiment, and the side outer side wall of described U-type groove structure is fixed in described frame 1 by arm 17, and opposite side outer side wall fixedly mounts described pulley.In described lifting, the upper end of pipe/bar 4 is packed in described frame 1 by the bottom surface being fixedly connected on described U-type groove structure, like this by a structure, the installation of pipe/bar 4 in frame 1 in pulley and described lifting can be realized, manage in wireline 5 can being ensured by the setting of pulley and be elevated simultaneously/one end of connecting of bar 4 be elevated in manage/bar 4 is parallel.
In order to ensure the balance of kickboard 2, described flexible pipe structure is arranged in pairs in described passage both sides, described pulley changed course structure comprises two sister blocks be coaxially made up of two single-sheaved blocks 7, and the single-sheaved block 8 that two independent, described wireline corresponding to described flexible pipe structure 5 by corresponding described independent single-sheaved block 8, and first on sister block 7 described in latter two described single-sheaved block of respective side guide described wireline folding structure into.In the present embodiment, the described flexible pipe structure arranged in pairs is provided with three covers, can certainly arrange two covers, or four overlap or overlap more.
Described wireline folding structure comprises the capstan 9 tying around and discharge wireline 5, and drives the motor 10 of described capstan 9 rotating.Certainly, in other embodiments, described wireline folding structure directly can use line motor.Described wireline folding structure also comprises acquisition motor 10 tach signal, controls the encoder 11 of described motor 10 running, the sensor of the highs and lows of detection and control kickboard, and installs the Shen house permanent seat 12 of described sensor.
The upper surface of the both sides of the passage 14 that the confession plate to be plated lower end in described kickboard 2 is passed through also is provided with the two wavy guide plates 13 led to unplated piece moving ahead in described passage 14.Like this when plate to be plated moves ahead along passage 14, what replace kickboard 2 to contact is guide plate 13, because guide plate 13 is wavy, therefore, can not cause scratch to unplated piece.Therefore, cut will be caused to concentrate on straight line as kickboard in prior art 2 directly directly contacts with plate to be plated, clearly.
Further, to the resistance of kickboard 2, described kickboard 2 can also be provided with the through hole 15 of some through described kickboard 2 upper and lower surfaces in order to reduce electrolytic solution in described kickboard 2 process of rising or falling.
In addition, when galvanization floating bed device of the present utility model applies on continuous print plating line, galvanization floating bed device of the present utility model also comprises and is arranged on above described passage 14, leads to described moving ahead of plate to be plated, and to the track 16 that described plate to be plated conducts electricity.This track 16 can be set to copper track, also can be set to other electro-conductive material, mainly lead to the chain structure being provided with fixture and conduct electricity, and plate to be plated is sandwiched on fixture, thus can play the effect of conduction and guiding to plate to be plated.
Preferably, described track 16 is fixedly mounted in described frame 1 by arm 17.
In order to accurately know the height that kickboard 2 adjusts, also comprise kickboard height indicating unit, described kickboard height indicating unit comprises and is fixed on described arm 17, and the vertical scale 18 arranged, and lower end is fixed on the instruction guide rod 19 in described kickboard 2, described scale 18 is also provided with web member, and described web member is arranged perpendicular to the graduated surface of establishing of described scale 18, and described web member forms the through hole that applicable described instruction guide rod 19 passes.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to embodiment.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all embodiments.And thus the apparent change of extending out or variation be still among the protection domain that the utility model creates.
Claims (32)
1. a vertical continuous electroplating device, comprises frame (1), and
Plating bath arrangement, comprise the electroplating cell body (A1) electroplated for plate to be plated wherein, the backflow casing (A2) of electroplating liquid medicine is housed, be arranged in described electroplating cell body (A1), the surface of plate to be plated is carried out to the jet pipe (A3) of spraying plating, and be arranged in described backflow casing (A2) the filtration cycle system realizing electroplating liquid medicine circulation between electroplating cell body (A1), backflow casing (A2);
Substrate transfer device to be plated, delivers plate to be plated and moves ahead in described electroplating cell body (A1);
Electrolyzer, with plate to be plated for negative electrode, take plating metal as anode, electroplates the plate to be plated in described electroplating cell body (A1);
Electrical means, for described electrolyzer provides direct supply;
It is characterized in that:
Described backflow casing (A2) is arranged on the bottom of described frame (1), described electroplating cell body (A1) is in the middle part of described frame (1), and be positioned at the top of described backflow casing (A2), described substrate transfer device to be plated is positioned at the top of described electroplating cell body (A1), the negative electrode of described electrolyzer is electrically connected with the fixture (26) of the clamping plate to be plated on described substrate transfer device to be plated, anode and the interior electroplating liquid medicine conducting of described electroplating cell body (A1), described electrical means is arranged on the top of described frame (1), also comprise galvanization floating bed device, described galvanization floating bed device comprises the kickboard (2) be in described electroplating cell body (A1), and be in above described substrate transfer device to be plated, drive the kickboard hoisting appliance that described kickboard (2) rises or declines in described electroplating cell body.
2. vertical continuous electroplating device according to claim 1, it is characterized in that: described substrate transfer device to be plated is conveyer chain structure, described electroplating cell body (A1) is in chain (27) below of described conveyer chain structure side, chain (27) the below place of described conveyer chain structure opposite side is provided with fixture washing unit, a part for described backflow casing (A2) is in described electroplating cell body (A1) below, and another part of described backflow casing (A2) is in the below of described fixture washing unit.
3. vertical continuous electroplating device according to claim 2, is characterized in that: described fixture washing unit comprises nitric acid section fixture water spilage tray (24) and washing section water spilage tray (25).
4. vertical continuous electroplating device according to claim 1, it is characterized in that: the upper interval of described chain (27) is installed with several annexes, the some described fixture (26) under described annex comprises a conductive slider and is arranged on described conductive slider; Described chain (27) part between drive sprocket and driven sprocket two outside be installed with a track (16) respectively, the length direction of described track (16) is parallel with the length direction of described chain (27), and during described chain (27) operation, described conductive slider can be sticked on described track, described track (16) conducts electricity, and the side contacted with described conductive slider is the working face conducted electricity.
5. vertical continuous electroplating device according to claim 4, is characterized in that: described plate to be plated is connected with the negative pole of described electrical means by fixture (26), described track (16).
6. vertical continuous electroplating device according to claim 5, it is characterized in that, the both sides of described electroplating cell body (A1) are also provided with and add box (A26), described interpolation box (A26) is distributed with some accommodation holes, holding the titanium basket (A24) that anode metal material is housed is distributed on described interpolation box (A26) by described accommodation hole, and described titanium basket (21) is connected by the positive pole of anode titanium copper-clad with described electrical means.
7. vertical continuous electroplating device according to claim 6, is characterized in that, described jet pipe (A3) is also arranged on described interpolation box (20).
8. vertical continuous electroplating device according to claim 7, is characterized in that, each described jet pipe (A3) is provided with some nozzles (A14).
9. vertical continuous electroplating device according to claim 8, it is characterized in that, the described jet pipe (A3) being distributed in described electroplating cell body (A1) side is that the misplace mode of arrangement is arranged relative to the described jet pipe (A3) of opposite side.
10. vertical continuous electroplating device according to claim 9, is characterized in that, adjacent nozzle (A14) in the vertical direction being distributed in described electroplating cell body (A1) the same side is arranged in the mode of the arrangement that misplaces.
11. vertical continuous electroplating devices according to any one of claim 1-10, it is characterized in that: described electrical means comprises alternating-current is converted to galvanic motor-generator set (22), and the cold water pipeline (23) lowering the temperature to described motor-generator set (22), described motor-generator set (22) and described cold water pipeline (23) are all in the top of described galvanization floating bed device.
12. vertical continuous electroplating devices according to claim 11, it is characterized in that: described filtration cycle system comprises by described backflow casing (A23) first cyclic part for clean electroplating liquid medicine in described electroplating cell body (A1), supplied the second cyclic part of clean electroplating liquid medicine to described jet pipe (A3) by described electroplating cell body (A1), and to the 3rd cyclic part of overflow electroplating liquid medicine in described backflow casing (A23) from described electroplating cell body (A1).
13. vertical continuous electroplating devices according to claim 12, it is characterized in that, described first cyclic part comprise from extract in described backflow casing (A23) electroplating liquid medicine the first pump (A20), the first strainer (A4) be connected with the liquid outlet of described first pump (A20), by the first pipeline (A5) that described first strainer (A4) is communicated with described electroplating cell body (A1) bottom.
14. vertical continuous electroplating devices according to claim 13, it is characterized in that, one end that the pipette (A25) being connected to described first pump (A20) fluid inlet place stretches in described backflow casing (A23) is also provided with suction port guard (A6).
15. vertical continuous electroplating devices according to claim 14, it is characterized in that, described second cyclic part comprise from extract in described backflow casing (A2) electroplating liquid medicine the second pump (A21), second strainer, be communicated with the liquid outlet of described second pump (A21) and the second pipeline of described second strainer (A7) fluid inlet, and be communicated with the liquid outlet of described second strainer (A7) and the 3rd pipeline (A8) of described jet pipe (A3).
16. vertical continuous electroplating devices according to claim 15, it is characterized in that, described 3rd cyclic part comprises the overflow weir (A9) of the upper end of the sidewall being molded over described electroplating cell body (A1), be on the outer side wall of described electroplating cell body (A1), and around the spill cavity (A10) that described overflow weir (A9) is arranged, and the return flow line (A11) that the electroplating liquid medicine at described spill cavity (A10) place is led in described backflow casing (A2).
17. vertical continuous electroplating devices according to claim 16, is characterized in that, described spill cavity (A10) is surrounded by some overflow plates.
18. vertical continuous electroplating devices according to claim 17, it is characterized in that, the sidewall of described electroplating cell body (A1) is also provided with liquid smell outlet orifice (A12) higher than the position of described overflow weir (A9), and is also provided with overflow exhausting dividing plate (A13) between described overflow weir (A9) and described liquid smell outlet orifice (A12).
19. vertical continuous electroplating devices according to claim 18, it is characterized in that, cell body intermediate plate (A15) between described electroplating cell body (A1) and described backflow casing (A2) is provided with circulation relief port (A16), circulation discharge opening (A17), and copper ball escape orifice (A18).
20. vertical continuous electroplating devices according to claim 19, it is characterized in that, described electroplating cell body (A1) is divided by multiple plating that cell body is end to end to be formed, each described plating divides cell body to be equipped with a point of backflow casing, each described point backflow casing is provided with communicating pipe (A19), is communicated with by described communicating pipe (A19) between point backflow casing described in adjacent two.
21. vertical continuous electroplating devices according to any one of claim 1-10, is characterized in that: described kickboard hoisting appliance comprises
Flexible pipe structure, at least be provided with one, comprise lifting outer tube (3), and the interior pipe/bar (4) of lifting that is extended or that be set in retracting in described lifting outer tube (3), described lifting outer tube (3) or the interior pipe/bar (4) of described lifting are fixedly connected with described kickboard (2), and in described lifting, pipe/bar (4) or described lifting outer tube (3) are packed in described frame (1);
Wireline (5), the number arranged is consistent with the number of described flexible pipe structure, one end of described wireline (5) and the described lifting outer tube (3) be fixedly connected in described kickboard (2) or described lifting is interior manages/bar (4) and be connected;
Wireline folding structure, controls the folding and unfolding of described wireline (5), and it is connected with the other end of described wireline (5).
22. vertical continuous electroplating devices according to claim 21, it is characterized in that: also comprise and be arranged between described wireline folding structure and described stretching structure, to the pulley changed course structure that the extraction of described wireline (5) is led, described pulley changed course structure comprises some pulleys, and described pulley is arranged on the pulley mount (6) in described frame (1).
23. vertical continuous electroplating devices according to claim 22, it is characterized in that: described pulley mount (6) is U-type groove structure, the side outer side wall of described U-type groove structure is fixed in described frame (1) by arm (17), and opposite side outer side wall fixedly mounts described pulley.
24. vertical continuous electroplating devices according to claim 23, is characterized in that: in described lifting, the upper end of pipe/bar (4) or described lifting outer tube (3) is packed in described frame (1) by the bottom surface being fixedly connected on described U-type groove structure.
25. vertical continuous electroplating devices according to claim 24, it is characterized in that: described flexible pipe structure is arranged in pairs in described passage both sides, described pulley changed course structure comprises two sister blocks be coaxially made up of two single-sheaved blocks (7), and the single-sheaved block that two independent (8), described wireline (5) corresponding to described flexible pipe structure is by corresponding described independent single-sheaved block (8), and described wireline folding structure guided into by the described single-sheaved block of the first upper respective side of sister block (7) described in latter two.
26. vertical continuous electroplating devices according to claim 25, is characterized in that: the described flexible pipe structure arranged in pairs is provided with three covers.
27. vertical continuous electroplating devices according to claim 26, it is characterized in that: described wireline folding structure comprises the capstan (9) tying around and discharge wireline (5), and drives the motor (10) of described capstan (9) rotating or described wireline folding structure to be line motor.
28. vertical continuous electroplating devices according to claim 27, it is characterized in that: described wireline folding structure also comprises acquisition motor (10) tach signal, control the encoder (11) that described motor (10) operates, the sensor of the highs and lows of detection and control kickboard, and Shen house permanent seat (12) of installing described sensor.
29. vertical continuous electroplating devices according to claim 28, is characterized in that: the upper surface of the both sides of the passage (14) that the confession plate to be plated lower end in described kickboard (2) is passed through also is provided with the two wavy guide plates (13) led to unplated piece moving ahead in described passage (14).
30. vertical continuous electroplating devices according to claim 29, is characterized in that: described kickboard (2) is provided with the through hole (15) of some through described kickboard (2) upper and lower surfaces.
31. vertical continuous electroplating devices according to claim 30, it is characterized in that: described track (16) is fixedly mounted in described frame (1) by described arm (17), and described substrate transfer device to be plated is arranged on the below of described pulley mount (6).
32. vertical continuous electroplating devices according to claim 31, it is characterized in that: also comprise kickboard height indicating unit, described kickboard height indicating unit comprises and is fixed on the upper and vertical scale (18) arranged of described arm (17), and lower end is fixed on the instruction guide rod (19) in described kickboard (2), (18) are also provided with web member with described scale, described web member is arranged perpendicular to the graduated surface of establishing of described scale (18), and described web member forms the through hole that applicable described instruction guide rod (19) passes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520024612.4U CN204434750U (en) | 2015-01-14 | 2015-01-14 | A kind of vertical continuous electroplating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520024612.4U CN204434750U (en) | 2015-01-14 | 2015-01-14 | A kind of vertical continuous electroplating device |
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| CN204434750U true CN204434750U (en) | 2015-07-01 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105220209A (en) * | 2015-09-30 | 2016-01-06 | 东莞市威力固电路板设备有限公司 | Vertical continuous electroplating device |
| CN111575745A (en) * | 2020-06-01 | 2020-08-25 | 赣州逸豪新材料股份有限公司 | Intelligent preparation equipment of electrolyte for multi-functional electrolytic copper foil |
| CN113549988A (en) * | 2021-07-28 | 2021-10-26 | 厦门海辰新能源科技有限公司 | Conductive base film conveying device and coating machine |
-
2015
- 2015-01-14 CN CN201520024612.4U patent/CN204434750U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105220209A (en) * | 2015-09-30 | 2016-01-06 | 东莞市威力固电路板设备有限公司 | Vertical continuous electroplating device |
| CN111575745A (en) * | 2020-06-01 | 2020-08-25 | 赣州逸豪新材料股份有限公司 | Intelligent preparation equipment of electrolyte for multi-functional electrolytic copper foil |
| CN113549988A (en) * | 2021-07-28 | 2021-10-26 | 厦门海辰新能源科技有限公司 | Conductive base film conveying device and coating machine |
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Address after: 215311 East Side of Dongding Road, Bacheng Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshan Weiwei Science and Technology Co.,Ltd. Address before: Suzhou City, Jiangsu province 215335 Dongting Lake Development District of Kunshan City Road 9, room 2 Patentee before: KUNSHAN DONGWEI PLATING EQUIPMENT TECHNOLOGY Co.,Ltd. |
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| IP01 | Partial invalidation of patent right |
Commission number: 5W117819 Conclusion of examination: On the basis of claims 1-31 submitted by the patentee on August 23, 2019, the patent right of utility model no. 201520024612.4 is maintained to be valid. Decision date of declaring invalidation: 20200108 Decision number of declaring invalidation: 42752 Denomination of utility model: A vertical continuous electroplating equipment Granted publication date: 20150701 Patentee: Kunshan Weiwei Science and Technology Co.,Ltd. |
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| IP01 | Partial invalidation of patent right | ||
| IP01 | Partial invalidation of patent right |
Commission number: 5W118235 Conclusion of examination: On the basis of claims 1-31 submitted by the patentee on August 23, 2019, the patent right of utility model no. 201520024612.4 is maintained to be valid. Decision date of declaring invalidation: 20200110 Decision number of declaring invalidation: 42830 Denomination of utility model: A vertical continuous electroplating equipment Granted publication date: 20150701 Patentee: Kunshan Weiwei Science and Technology Co.,Ltd. |
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| IP01 | Partial invalidation of patent right | ||
| IP01 | Partial invalidation of patent right |
Commission number: 5W123557 Conclusion of examination: On the basis of claims 1-31 submitted by the patentee on May 27, 2021, the utility model patent right No. 201520024612.4 is maintained valid Decision date of declaring invalidation: 20210730 Decision number of declaring invalidation: 51219 Denomination of utility model: A vertical continuous electroplating equipment Granted publication date: 20150701 Patentee: Kunshan Weiwei Science and Technology Co.,Ltd. |
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| IP01 | Partial invalidation of patent right |