CN212476926U

CN212476926U - PCB board gilding device

Info

Publication number: CN212476926U
Application number: CN202021186979.3U
Authority: CN
Inventors: 兰洪斌
Original assignee: Dongguan Jingmei Circuit Technology Co ltd
Current assignee: Dongguan Jingmei Circuit Technology Co ltd
Priority date: 2020-06-23
Filing date: 2020-06-23
Publication date: 2021-02-05
Anticipated expiration: 2030-06-23

Abstract

The utility model discloses a PCB board gilding device relates to PCB and electroplates technical field, has solved current electroplating device and has had the relatively poor problem of homogeneity of electroplating the gold layer on the board in the in-service use process, and its technical scheme main points are: the electroplating bath comprises a main body, wherein a plating bath is arranged in the main body, the plating bath is used for storing electroplating solution, a positive plate and a negative plate which are used for forming an electric field are symmetrically arranged on the main body, a connecting arm used for connecting the electroplating plate is arranged on the main body, two spraying parts which are positioned on two sides of the connecting arm are symmetrically arranged in the plating bath, and each spraying part comprises a spraying pipe, a branch pipe and a spray head; the branch pipes are communicated with the spray pipes and are arranged at intervals along the length direction of the spray pipes in a vertical plane parallel to the side surface of the electroplating plate; the spray heads are distributed on the branch pipes at intervals to form side spraying; the spray heads are arranged on two sides of the plating tank, bottom jet flow is changed into jet flow from two sides, and the distance between the spray heads and the gold-plating surface of the electroplating plate is short, so that gold layer spraying is facilitated, and the uniformity of the gold layer on the electroplating plate is improved.

Description

PCB board gilding device

Technical Field

The utility model relates to a PCB electroplates technical field, and more specifically says, it relates to a PCB board gilding device.

Background

Electroplating is an essential process in the PCB manufacturing process, and mainly has the functions of removing the glue residue left on the hole wall after drilling to metalize the hole wall, and thickening the surface copper thickness by using an electroplating method to meet the requirements of customers and post-processing.

Current electroplating device generally includes the inside main part that is equipped with the coating bath, and the coating bath is used for depositing the plating solution, the main part symmetry is equipped with positive plate, the negative plate that is used for forming the electric field, the main part is equipped with the linking arm, and the linking arm below is connected with the electroplate plate that is located the coating bath, and the shower nozzle setting is in the bottom of coating bath, spouts auriferous solution on the PCB board of shower nozzle top to the top to electroplate gold on the PCB.

However, because the distance from the bottom nozzle to the gold-plating surface of the PCB is long, the sprayed gold-plating solution needs to overcome gravity to do work and other reasons, so that the problem that the uniformity of the gold layer on the PCB is poor in the actual use process of the existing electroplating device is caused. Therefore, how to design a PCB gold plating apparatus capable of improving the uniformity of the gold layer on the PCB is a problem that needs to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a PCB board gilding device sets up the shower nozzle in the both sides of coating bath, changes the bottom jet into from both sides jet to the shower nozzle is shorter apart from the distance of electroplating plate gilding face, is favorable to the spraying plating of gold layer, has improved the homogeneity of gold layer on the electroplating plate.

The above technical purpose of the present invention can be achieved by the following technical solutions: a PCB plate gold plating device comprises a main body, wherein a plating tank is arranged in the main body, the plating tank is used for storing electroplating solution, a positive plate and a negative plate which are used for forming an electric field are symmetrically arranged on the main body, a connecting arm used for connecting the electroplating plate is arranged on the main body, two spraying pieces which are positioned on two sides of the connecting arm are symmetrically arranged in the plating tank, and each spraying piece comprises a spraying pipe, a branch pipe and a spray head; the branch pipes are communicated with the spray pipes and are arranged at intervals along the length direction of the spray pipes in a vertical plane parallel to the side surface of the electroplating plate; the spray heads are distributed on the branch pipes at intervals to form side spraying.

By adopting the technical scheme, the spray heads are arranged on the two sides of the plating tank, the bottom jet flow is changed into the jet flow from the two sides, and the distance between the spray heads and the gold-plating surface of the electroplating plate is shorter, so that the spraying of a gold layer is facilitated, and the uniformity of the gold layer on the electroplating plate is improved.

The utility model discloses further set up to: the common input end of the two spray pipes which are communicated through the pipeline is connected with a water pump, and the input end of the water pump is communicated with the plating bath through the pipeline.

By adopting the technical scheme, the water pump drives the gold-containing solution to circulate in the spray head and the plating bath.

The utility model discloses further set up to: the main part symmetry is provided with two fixed pulleys that are used for supporting linking arm both ends tip, and the main part is equipped with the actuating mechanism who is used for driving the linking arm to do horizontal reciprocating motion.

By adopting the technical scheme, the electroplating plate can be hung on the connecting arm when being electroplated, the driving mechanism drives the connecting arm to do horizontal reciprocating motion on the two fixed pulleys, the connecting arm drives the electroplating plate to move together, and the electroplating plate reciprocates between the spray heads, so that the improvement of the uniformity of all gold layers on the electroplating plate is facilitated.

The utility model discloses further set up to: the driving mechanism comprises a roller, a guide frame and a cam mechanism, the guide frame is fixedly connected with one end of the connecting arm, the roller is located in the guide frame, the roller is coaxially connected with an output shaft of the cam mechanism, and the cam mechanism is fixedly installed on the main body.

Through adopting above-mentioned technical scheme, when cam mechanism rotated, the gyro wheel rolled in the guide frame, drove the guide frame simultaneously and removed in the horizontal plane, continuously rotated through the motor and can realize that the electroplate board reciprocates.

The utility model discloses further set up to: the top end of the main body is provided with a reflux tank communicated with the plating tank.

Through adopting above-mentioned technical scheme, when taking out after the electroplating plate gilding finishes, the gold-containing solution on the electroplating plate drips to the backward flow groove, then flows to the coating bath from the backward flow groove in, prevents that the gold-containing solution from dripping to subaerial and causing the waste, saves the cost.

The utility model discloses further set up to: the main part one side is equipped with the backup pad, and the backup pad is located the main part top, and main part fixed connection has the mounted frame of level setting.

By adopting the technical scheme, the suspension bracket is arranged above the plating tank, and the plated electroplating plate can be suspended on the suspension bracket.

To sum up, the utility model discloses following beneficial effect has: the spray heads are arranged on two sides of the plating tank, the bottom jet flow is changed into the jet flow from two sides, and the distance between the spray heads and the gold-plating surface of the electroplating plate is shorter, so that the spraying of a gold layer is facilitated, and the uniformity of the gold layer on the electroplating plate is improved; the electroplating plate can be hung on the connecting arm during electroplating. The driving mechanism drives the connecting arm to horizontally reciprocate on the two fixed pulleys, the connecting arm drives the electroplating plate on the connecting arm to move together, and the electroplating plate reciprocates between the nozzles, so that the improvement on the uniformity of gold layers on each electroplating plate is facilitated.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic view of the overall structure in an embodiment of the present invention;

fig. 2 is a schematic structural diagram of the spray-coated member in the embodiment of the present invention.

In the figure: 1. a main body; 11. plating bath; 12. a reflux tank; 13. a positive plate; 14. a negative plate; 15. a fixed pulley; 16. a connecting arm; 2. a nozzle; 21. a water pump; 22. a branch pipe; 23. a spray head; 3. a cam mechanism; 31. a guide frame; 32. a roller; 4. a support plate; 41. a suspension bracket; 5. and (6) electroplating the board.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings 1-2 and the embodiments.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Example (b): a PCB plate gold plating device comprises a main body 1 with a plating tank 11 arranged therein, wherein the plating tank 11 is used for storing plating solution, and a positive plate 13 and a negative plate 14 for forming an electric field are symmetrically arranged on the main body 1, as shown in figures 1 and 2. The main body 1 is provided with a connecting arm 16, the connecting arm 16 is used for suspending the electroplating plate 5 in the lower plating tank 11, and the electroplating plate 5 is vertically placed. Two spraying parts which are positioned at two sides of the connecting arm 16 are symmetrically arranged in the plating tank 11, and each spraying part comprises a spray pipe 2, a branch pipe 22 and a spray head 23. The branch pipes 22 are communicated with the spray pipes 2 and are arranged at intervals along the length direction of the spray pipes 2 in a vertical plane parallel to the side surface of the electroplating plate 5, and the spray heads 23 are distributed on the branch pipes 22 at intervals to form side spraying. In the present example, the branch pipe 22 is vertically arranged below the spray pipe 2, and the spray heads 23 are uniformly distributed along the length direction of the branch pipe 22. The spray heads 23 are arranged at two sides of the plating tank 11, the bottom jet flow is changed into the jet flow from two sides, and the distance between the spray heads 23 and the gold plating surface of the electroplating plate 5 is shorter, which is beneficial to the spraying of gold layers and improves the uniformity of the gold layers on the electroplating plate 5.

As shown in figure 1, the common input end of the two spray pipes 2 after being communicated through the pipeline is connected with a water pump 21, and the input end of the water pump 21 is communicated with the plating tank 11 through the pipeline. The water pump 21 drives the gold-containing solution to circulate in the spray head 23 and the plating tank 11.

As shown in fig. 1 and 2, the main body 1 is symmetrically provided with two fixed pulleys 15 for supporting the end portions of the two ends of the connecting arm 16, and the main body 1 is provided with a driving mechanism for driving the connecting arm 16 to horizontally reciprocate. The electroplating plate 5 can be hung on the connecting arm 16 during electroplating, the driving mechanism drives the connecting arm 16 to horizontally reciprocate on the two fixed pulleys 15, the connecting arm 16 drives the electroplating plate 5 thereon to move together, and the electroplating plate 5 reciprocates among the nozzles 23, so that the improvement of the uniformity of gold layers on each position of the electroplating plate 5 is facilitated.

As shown in fig. 1, the driving mechanism includes a roller 32, a guiding frame 31 and a cam mechanism 3, the guiding frame 31 is fixedly connected with one end of the connecting arm 16, the roller 32 is located in the guiding frame 31, the roller 32 is coaxially connected with an output shaft of the cam mechanism 3, and the cam mechanism 3 is fixedly mounted on the main body 1. When the cam mechanism 3 rotates, the roller 32 rolls in the guide frame 31, and simultaneously drives the guide frame 31 to move in the horizontal plane, and the electroplating plate 5 can move back and forth by continuous rotation of the motor.

As shown in fig. 1 and 2, a reflow tank 12 communicating with the plating tank 11 is provided at the top end of the main body 1. When the plating plate is taken out after gold plating is finished, the gold-containing solution on the plating plate 5 drips into the reflux groove 12 and then flows into the plating groove 11 from the reflux groove 12, so that the gold-containing solution is prevented from dripping onto the ground to cause waste, and the cost is saved.

As shown in FIG. 1, a supporting plate 4 is provided on one side of the main body 1, the supporting plate 4 is located above the main body 1, and a horizontally arranged hanging frame 41 is fixedly connected to the main body 1. A suspension bracket 41 is provided above the plating tank 11, and the plated plating plate 5 can be suspended from the suspension bracket 41.

The working principle is as follows: the spray heads 23 are arranged at two sides of the plating tank 11, the bottom jet flow is changed into the jet flow from two sides, and the distance between the spray heads 23 and the gold-plating surface of the electroplating plate 5 is shorter, which is beneficial to the spraying of gold layers and improves the uniformity of the gold layers on the electroplating plate 5; the electroplating plate 5 can be hung on the connecting arm 16 during electroplating, the driving mechanism drives the connecting arm 16 to horizontally reciprocate on the two fixed pulleys 15, the connecting arm 16 drives the electroplating plate 5 thereon to move together, and the electroplating plate 5 reciprocates among the nozzles 23, so that the improvement of the uniformity of gold layers on each position of the electroplating plate 5 is facilitated.

The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.

Claims

1. The utility model provides a PCB board gilding device, includes that inside is equipped with main part (1) of coating bath (11), coating bath (11) are used for depositing the plating solution, main part (1) symmetry is equipped with positive plate (13), negative plate (14) that are used for forming the electric field, main part (1) is equipped with linking arm (16) that are used for connecting electroplate board (5), characterized by: two spraying parts positioned on two sides of the connecting arm (16) are symmetrically arranged in the plating tank (11), and each spraying part comprises a spraying pipe (2), a branch pipe (22) and a spray head (23); the branch pipes (22) are communicated with the spray pipe (2) and are arranged at intervals along the length direction of the spray pipe (2) in a vertical plane parallel to the side surface of the electroplating plate (5); the spray heads (23) are distributed on the branch pipes (22) at intervals to form side spraying.

2. The apparatus for gold-plating of PCB board as claimed in claim 1, wherein: the common input end of the two spray pipes (2) which are communicated through the pipeline is connected with a water pump (21), and the input end of the water pump (21) is communicated with the plating tank (11) through the pipeline.

3. The apparatus for gold-plating of PCB board as claimed in claim 1, wherein: the main body (1) is symmetrically provided with two fixed pulleys (15) used for supporting the end parts of two ends of the connecting arm (16), and the main body (1) is provided with a driving mechanism used for driving the connecting arm (16) to do horizontal reciprocating motion.

4. The PCB plating device of claim 3, wherein: the driving mechanism comprises a roller (32), a guide frame (31) and a cam mechanism (3), the guide frame (31) is fixedly connected with one end of the connecting arm (16), the roller (32) is located in the guide frame (31), the roller (32) is coaxially connected with an output shaft of the cam mechanism (3), and the cam mechanism (3) is fixedly installed on the main body (1).

5. The PCB plating device of any one of claims 1 to 4, wherein: the top end of the main body (1) is provided with a reflux groove (12) communicated with the plating groove (11).

6. The PCB plating device of any one of claims 1 to 4, wherein: the novel multifunctional clothes hanger is characterized in that a supporting plate (4) is arranged on one side of the main body (1), the supporting plate (4) is located above the main body (1), and the main body (1) is fixedly connected with a horizontally arranged hanging frame (41).