CN205821497U - There is the electroplating device electroplating bath of suction pipe device - Google Patents
There is the electroplating device electroplating bath of suction pipe device Download PDFInfo
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- CN205821497U CN205821497U CN201620633088.5U CN201620633088U CN205821497U CN 205821497 U CN205821497 U CN 205821497U CN 201620633088 U CN201620633088 U CN 201620633088U CN 205821497 U CN205821497 U CN 205821497U
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- Prior art keywords
- cell body
- resorption
- electroplating
- suction pipe
- inlet
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- 238000009713 electroplating Methods 0.000 title claims abstract description 62
- 210000005056 cell body Anatomy 0.000 claims abstract description 64
- 239000007788 liquid Substances 0.000 claims abstract description 45
- 230000004087 circulation Effects 0.000 claims abstract description 39
- 239000003814 drug Substances 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims description 19
- 238000005086 pumping Methods 0.000 claims description 14
- 239000012535 impurity Substances 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 4
- 239000000356 contaminant Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000004891 communication Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 11
- 239000010949 copper Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 3
- 229910001431 copper ion Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 230000017531 blood circulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses a kind of electroplating device electroplating bath with suction pipe device, be provided with cell body and circulation filter, the inner chamber of cell body is provided with suction pipe device and Effuser device；The two sides cell body sidewall of suction pipe device correspondence cell body is respectively equipped with a set of suction pipe mechanism, two recover suction pipe mechanism installs respectively close to corresponding cell body sidewall, the structure of every suit suction pipe mechanism is: resorption supervisor is arranged on the bottom position of cell body and arranges along the bearing of trend of cell body, the lower end mouth of pipe of every resorption arm one by one all connects resorption supervisor, upper end is all closed and extends up to the upper position of cell body, it is equipped with multiple towards the setting of corresponding groove body sidewall and along the resorption equally distributed suction inlet of arm bearing of trend on the pipe shaft of each resorption arm, the inlet connection resorption supervisor of joint, the inlet of liquid outlet communication loop defecator.This utility model has electroplating liquid medicine and circulates advantage timely, it is possible to increase by the electroplating evenness of electroplate.
Description
Technical field
This utility model relates to a kind of electroplating device electroplating bath with suction pipe device.
Background technology
Along with the epoch are progressive, everything all stresses keeping on improving of quality, and prescription is high, and electroplating technology is also such.
Plating is one of processing procedure particularly important for PCB；General PCB electroplating process can be divided into three parts: pre-treatment section, copper facing section
And post processing section.Copper facing section cell body volume is big, liquid medicine is many, the circular treatment of medicinal liquid be also have to be hoisted.The quality of plating is main
Derive from the uniformity height in plate face. uniformity height preferably, otherwise low for poor.In order to improve the uniformity of plating, medicinal liquid is effective
Preferably circulation becomes as formidable important step.
Fig. 1 is copper plating groove schematic diagram, and copper plating groove is broadly divided into three parts；Part I is pan feeding section 1, and Part II is
Interlude 2, is also the main processing section of electroplating bath, and Part III is discharging section 3.Hereinafter will make based on copper facing interlude 2
Inquire into.
Fig. 2 is the copper plating groove interlude assembling figure of legacy equipment traditional type.Each interlude 2, only circulates pumping at one
Suction inlet 21, jet pipe 25 is again circulating pump outlet, and main purpose is that the medicinal liquid after circulating and filter sprays to PCB surface.
Fig. 3 is the copper plating groove interlude inner loop flow chart of legacy equipment traditional type, and medicinal liquid passes through pumping from suction inlet
21 suck, and after suction pipe 22 and filter 23, then flow to jet pipe 25 from outlet pipe 24 and spray in return-enclosure body, form one simply
Circulation.But due to only suction inlet at, and it is positioned at below cell body, it means that the medicinal liquid at cell body inner upper and middle part is by nothing
Method is back to suction inlet in time, and does not reaches Efficient Cycle and stirring, and the generation being directed at medicinal liquid copper ion concentration everywhere is uneven,
And then affect electroplating evenness；The PCB electroplated by industry manufacturer traditional type copper plating groove blood circulation, uniformity be about 80%～
85%, poor.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of electroplating device plating with suction pipe device
Groove, it is possible to increase by the electroplating evenness of electroplate.
Solving above-mentioned technical problem, the technical scheme that this utility model is used is as follows:
A kind of electroplating device electroplating bath with suction pipe device, is provided with cell body and circulation filter, described cell body
Inner chamber is provided with suction pipe device and Effuser device, and the inlet of described circulation filter connects described suction pipe device, goes out
Liquid mouth connects described Effuser device, and described circulation filter will be able to be contained in described cell body by described suction pipe device
Electroplating liquid medicine in chamber sucks and carries out contaminant filter, and, described circulation filter can pass through described Effuser device will
Electroplating liquid medicine after described impurity screening be sprayed onto be positioned in described cell body inner chamber by plating plate on, it is characterised in that: institute
The two sides cell body sidewall of the corresponding described cell body of the suction pipe device stated is respectively equipped with a set of suction pipe mechanism, wherein, described two sides
Relative and along described cell body the bearing of trend of cell body sidewall is arranged, and described two recover suction pipe mechanism respectively close to corresponding cell body side
Wall is installed, and suction pipe mechanism described in every suit is connected composition, this connected mode by resorption supervisor, many resorption arms and joint
Being arranged on the bottom position of described cell body for: described resorption supervisor and arrange along the bearing of trend of described cell body, described each is returned
Inhaling the arm bearing of trend uniform intervals layout along described cell body, the lower end mouth of pipe of the most described resorption arm all connects institute
State resorption supervisor, the upper position of described cell body, the pipe shaft of each described resorption arm are all closed and extended up in upper end
On be equipped with multiple towards corresponding groove body sidewall arrange and along the described resorption equally distributed suction inlet of arm bearing of trend, described
Joint is arranged on the cell body sidewall of correspondence, and the inlet of described joint connects and follows described in described resorption supervisor, liquid outlet connection
The inlet of ring defecator；Described Effuser device is arranged on described two and recovers between suction pipe mechanism.
As preferred implementation of the present utility model: each described resorption arm is each perpendicular to described resorption supervisor and sets
Put.
In order to increase the inhalation flow to electroplating liquid medicine, as a kind of improvement of the present utility model: described suction pipe machine
Structure is additionally provided with at least one described joint；Each joint described is arranged along the bearing of trend uniform intervals of described cell body, each
The inlet of described joint is all connecting described resorption supervisor near the position of this joint.
As preferred implementation of the present utility model: described Effuser device is provided with two row jet pipes, described two row jet pipes
Between leave for described by the gap passed through of plating plate, described every string jet pipe includes by many prolonging along described cell body
Stretching the jet pipe that direction uniform intervals is arranged, what each described jet pipe was equipped with that multiple uniform intervals from top to bottom arranges goes out liquid
Mouthful, the liquid outlet of each described jet pipe is all arranged towards the gap between described two row jet pipes；The feed liquor of described each jet pipe
Mouth connects the liquid outlet of described circulation filter by collecting pipe.
As preferred implementation of the present utility model: described circulation filter is provided with circulation pumping and for filtering
The filter of the impurity in electroplating liquid medicine；The suction inlet of described circulation pumping is as the inlet of described circulation filter, institute
The delivery outlet stating circulation pumping connects the entrance of described filter, and the outlet of described filter is as described circulation filter
Liquid outlet.
Compared with prior art, this utility model has the advantages that
The suction inlet of many resorption arms is evenly distributed in the internal both sides of cell body everywhere by this utility model, in cell body both sides
Top, middle part, lower position suck electroplating liquid medicine simultaneously, thus, this utility model can be timely by cell body electricity everywhere
Plating medicinal liquid be drawn in circulation filter by suction tube device, in making groove the electroplating liquid medicine energy short time of each position suck back with
Flowing out, circulation is accelerated rapidly, will not produce stagnant water and the slow phenomenon that refluxes, it is simple to reach the circulation more completely more equalized so that
In cell body, electroplating liquid medicine everywhere can reach stirring timely, does not produce dead angle, not only sucks area wider, and flow is the most more
Greatly so that copper ion concentration evenly, solve industry miscellaneous equipment traditional type single hole suck, single-point circulation make copper ion dense
Spend uneven, the problem of electroplating evenness difference.Therefore, this utility model has electroplating liquid medicine and circulates advantage timely, it is possible to carry
The high electroplating evenness by electroplate, through test, the electroplating evenness by electroplate can be improved to 85%～92% by it.
Accompanying drawing explanation
The utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings:
Fig. 1 is the perspective view of existing electroplating device copper plating groove；
Fig. 2 is the interlude perspective view in existing electroplating device copper plating groove；
Fig. 3 is that the electroplating liquid medicine of existing electroplating device copper plating groove flows to schematic diagram；
Fig. 4 is the perspective view of electroplating device electroplating bath of the present utility model；
Fig. 5 is the stereochemical structure signal of resorption supervisor 31 and resorption arm 32 in electroplating device electroplating bath of the present utility model
Figure；
Fig. 6 is the stereochemical structure signal after the hiding wherein cell body sidewall of electroplating device electroplating bath of the present utility model
Figure；
Fig. 7 is that the electroplating liquid medicine of electroplating device electroplating bath of the present utility model flows to schematic diagram.
Detailed description of the invention
As shown in Figures 4 to 7, electroplating device electroplating bath of the present utility model, it is provided with cell body 1 and circulation filter 2, its
In, the inner chamber of cell body 1 is provided with suction pipe device 3 and Effuser device 4.
The two sides cell body sidewall 11 of the corresponding cell body 1 of above-mentioned suction pipe device 3 is respectively equipped with a set of suction pipe mechanism, wherein,
Relative and along cell body 1 the bearing of trend of two sides cell body sidewall 11 is arranged, and two recover suction pipe mechanism respectively close to corresponding cell body side
Wall 11 is installed, and every suit suction pipe mechanism is connected composition, this connection by resorption supervisor 31, many resorption arms 32 and joint 33
Mode is: resorption is responsible for 31 bottom positions being arranged on cell body 1 and the bearing of trend along cell body 1 is arranged, each resorption arm 32
Along cell body 1 bearing of trend uniform intervals arrange, the most one by one the lower end mouth of pipe of resorption arm 32 all connect resorption supervisor 31, on
The upper position of cell body 1 is all closed and extended up to end, and each resorption arm 32 is each perpendicular to resorption supervisor 31 setting,
Multiple setting and along resorption arm 32 side of extension it is equipped with towards corresponding groove body sidewall 11 on the pipe shaft of each resorption arm 32
To equally distributed suction inlet 32a, joint 33 is arranged on the cell body sidewall 11 of correspondence, the inlet connection resorption master of joint 33
Pipe 31, the inlet of liquid outlet communication loop defecator 2.
Above-mentioned Effuser device 4 is arranged on two and recovers between suction pipe mechanism, and Effuser device 4 is provided with two row jet pipes, two row jet pipes
Between leave for by the gap passed through of plating plate, every string jet pipe includes by the many bearing of trends along cell body 1 uniform
Spaced apart jet pipe, each jet pipe is equipped with the liquid outlet that multiple uniform intervals from top to bottom is arranged, each jet pipe
Liquid outlet is all arranged towards the gap between two row jet pipes；The inlet of each jet pipe passes through collecting pipe communication loop defecator
The liquid outlet of 2.
Above-mentioned circulation filter 2 is provided with circulation pumping 21 and for filtering the filter 22 of the impurity in electroplating liquid medicine 5；
The suction inlet of circulation pumping 21 connects filter 22 as the inlet of circulation filter 2, the delivery outlet of circulation pumping 21
Entrance, the outlet of filter 22 is as the liquid outlet of circulation filter 2.Thus so that above-mentioned circulation filter 2 can lead to
Cross suction pipe device 3 sucked by the electroplating liquid medicine 5 being contained in cell body 1 inner chamber and carry out contaminant filter, further, it is possible to by spray
Pipe device 4 electroplating liquid medicine 5 after impurity screening is sprayed onto be positioned in cell body 1 inner chamber by plating plate on.
It addition, in order to increase the inhalation flow to electroplating liquid medicine 5, above-mentioned suction pipe mechanism also can set up at least one joint
33；Each joint 33 is arranged along the bearing of trend uniform intervals of cell body 1, and the inlet of each joint 33 is all connecing near this
The position connection resorption supervisor 31 of 33.
Seeing Fig. 7, working method of the present utility model is as follows:
Electroplating liquid medicine 5 is sucked, through resorption master from the many suction inlet 32a inhaling arm 32 by the suction of circulation pumping 21
Pipe 31 and joint 33 collect the suction inlet flowing to circulation pumping 21, then are drawn to filter 22 by circulation pumping 21, logical after filtration
Cross collecting pipe and flow to many jet pipes, each jet pipe be sprayed onto by electroplate and pass back in the inner chamber of cell body 1, form one and follow
Loop back path.
This utility model is not limited to above-mentioned detailed description of the invention, according to foregoing, according to the ordinary skill of this area
Knowledge and customary means, without departing under this utility model above-mentioned basic fundamental thought premise, this utility model can also be made
The equivalent modifications of other various ways, replace or change, all fall among protection domain of the present utility model.
Claims (5)
1. there is an electroplating device electroplating bath for suction pipe device, be provided with cell body (1) and circulation filter (2), described groove
The inner chamber of body (1) is provided with suction pipe device (3) and Effuser device (4), and the inlet of described circulation filter (2) connects institute
State suction pipe device (3), liquid outlet connects described Effuser device (4), and described circulation filter (2) can pass through described resorption
The electroplating liquid medicine (5) being contained in described cell body (1) inner chamber is sucked and carries out contaminant filter by pipe device (3), and, described in follow
Electroplating liquid medicine (5) after described impurity screening can be sprayed onto by described Effuser device (4) and be positioned at institute by ring defecator (2)
State being subject on plating plate in cell body (1) inner chamber, it is characterised in that: the described corresponding described cell body of suction pipe device (3) (1)
Two sides cell body sidewall (11) is respectively equipped with a set of suction pipe mechanism, and wherein, described two sides cell body sidewall (11) is relatively and along described
The bearing of trend of cell body (1) is arranged, and described two recover suction pipe mechanism installs respectively close to corresponding cell body sidewall (11), every suit
Described suction pipe mechanism is connected composition, this connected mode by resorption supervisor (31), many resorption arms (32) and joint (33)
It is arranged on the bottom position of described cell body (1) for: described resorption supervisor (31) and arranges along the bearing of trend of described cell body (1),
Described each resorption arm (32) is arranged along the bearing of trend uniform intervals of described cell body (1), the most described resorption arm
(32) the lower end mouth of pipe all connects described resorption supervisor (31), upper end and all closes and extend up to the top of described cell body (1)
Position, the pipe shaft of each described resorption arm (32) is equipped with multiple towards corresponding groove body sidewall (11) setting and along described
The equally distributed suction inlet of resorption arm (32) bearing of trend (32a), described joint (33) is arranged on the cell body sidewall of correspondence
(11), on, the inlet of described joint (33) connects described resorption supervisor (31), liquid outlet connects described circulation filter (2)
Inlet；Described Effuser device (4) is arranged on described two and recovers between suction pipe mechanism.
Electroplating device electroplating bath the most according to claim 1, it is characterised in that: each described resorption arm (32) is the most vertical
Directly arrange in described resorption supervisor (31).
Electroplating device electroplating bath the most according to claim 1, it is characterised in that: described suction pipe mechanism is additionally provided with at least
One described joint (33)；Described each joint (33) is arranged along the bearing of trend uniform intervals of described cell body (1), each institute
The inlet stating joint (33) all connects described resorption supervisor (31) in the position near this joint (33).
4. according to the electroplating device electroplating bath described in claims 1 to 3 any one, it is characterised in that: described Effuser device
(4) being provided with two row jet pipes, leave for the described gap passed through by plating plate between described two row jet pipes, described every string sprays
Pipe includes the jet pipe arranged by the many bearing of trend uniform intervals along described cell body (1), and each described jet pipe is equipped with
The liquid outlet that multiple uniform intervals from top to bottom are arranged, the liquid outlet of each described jet pipe is all towards between described two row jet pipes
Gap arrange；The inlet of described each jet pipe connects the liquid outlet of described circulation filter (2) by collecting pipe.
5. according to the electroplating device electroplating bath described in claims 1 to 3 any one, it is characterised in that: described circulating filtration
Device (2) is provided with circulation pumping (21) and is used for filtering the filter (22) of the impurity in electroplating liquid medicine (5)；Described circulation pumping
(21) suction inlet is as the inlet of described circulation filter (2), and the delivery outlet connection of described circulation pumping (21) is described
The entrance of filter (22), the outlet of described filter (22) is as the liquid outlet of described circulation filter (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620633088.5U CN205821497U (en) | 2016-06-22 | 2016-06-22 | There is the electroplating device electroplating bath of suction pipe device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620633088.5U CN205821497U (en) | 2016-06-22 | 2016-06-22 | There is the electroplating device electroplating bath of suction pipe device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205821497U true CN205821497U (en) | 2016-12-21 |
Family
ID=58146901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620633088.5U Active CN205821497U (en) | 2016-06-22 | 2016-06-22 | There is the electroplating device electroplating bath of suction pipe device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205821497U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021140857A1 (en) * | 2020-01-10 | 2021-07-15 | 株式会社アルメックステクノロジーズ | Surface treatment device and method |
| CN113151871A (en) * | 2021-03-03 | 2021-07-23 | 广州明毅电子机械有限公司 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
-
2016
- 2016-06-22 CN CN201620633088.5U patent/CN205821497U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021140857A1 (en) * | 2020-01-10 | 2021-07-15 | 株式会社アルメックステクノロジーズ | Surface treatment device and method |
| JPWO2021140857A1 (en) * | 2020-01-10 | 2021-07-15 | ||
| CN114929945A (en) * | 2020-01-10 | 2022-08-19 | Almex科技株式会社 | Surface treatment device and method thereof |
| JP7142982B2 (en) | 2020-01-10 | 2022-09-28 | 株式会社アルメックステクノロジーズ | Surface treatment apparatus and method |
| CN113151871A (en) * | 2021-03-03 | 2021-07-23 | 广州明毅电子机械有限公司 | Vertical continuous electroplating bath capable of realizing uniform electroplating of high aspect ratio holes of electroplated plate |
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| GR01 | Patent grant |