JPS58189396A - Method for conveying printed substrate in plating treatment - Google Patents

Abstract

PURPOSE:To eliminate the resistance of wind pressure during conveying of substrates and to improve the speed of conveying remarkably, by immersing the substrates into the treatment chambers of a treatment cell which is divided in parallel with the traveling direction of a carrier, and passing the substrates successively through the adjacent treatment cells through air knives in the state of the perpendicular surface in parallel with the traveling direction of the carrier. CONSTITUTION:A rack 14 mounted with plural sheets of substrates on one plane is immersed into the degreasing chamber 2 of the 1st treatment tank 1 in parallel with the traveling direction of a carrier 8. The suspension part 12 of the carrier 8 is then moved downward and when a transverse rod 13 hooks a rod 15 for suspension of a rack 14, the carrier is moved over a rinsing chamber 3, where the substrates are immersed in the chamber 3 in the same way as mentioned above. Thereafter, the substrates are subjected to treatments successively in a rinsing chamber 4, a pickling chamber 5, a neutralizing chamber 6, and a rinsing chamber 7. The rack 14 attached with the substrates is thereafter lifted, and is moved to the position facing the gap of an air knife part 16 so as to pass through the same, by which the liquid stuck on the rack 14 is blown off. The substrates are moved in a perpendicular state in parallel with the traveling direction of the carrier 8 during this time and are fed to the next treatment tank 1 without receiving the wind pressure. The substrates are treated successively in the respective divided chambers similar to the chambers mentioned above and are further conveyed for the next treatment tank.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for transporting printed circuit boards during plating processing.

Recently, mass production has progressed due to the large demand for printed circuit boards.
- As a large amount of plating processing is required, it is becoming common to mount several boards on a single rack and transport them in lengths of 1" to 2 m.

Increasing transport speed is also an important element for mass production. However, with conventional plating methods, LL%
The tank is divided perpendicularly to the transport direction to form processing chambers, and the substrates are also immersed and processed perpendicularly to the transport direction. Therefore, a large area is required in the layout of the processing tank, and the distance traveled by the carrier is large. Further, during transportation, the substrate is lifted and transported as it is. That is, the substrate has a size of 1 to 2rn2, and as it is moved in a vertical plane perpendicular to the transport direction, it is subjected to considerably large wind pressure resistance. Therefore, a) There is a limit to the speed at which the substrate can be transported, and large vibrations remain even when the board is stopped. (b) In order to overcome wind pressure resistance and increase speed, extra strength is required of the equipment and equipment, which is also uneconomical.

V~ Depending on the material of the substrate, the wind pressure applied during transportation may cause warping, and distortion may occur in substrates that require a flat surface. In addition, when transported to the next tank after processing in one tank, the chemicals adhere to the substrate and are taken out, and the liquid is brought into the next tank, causing a drop in quality uniformity, which can be prevented. Therefore, extra cleaning equipment is required, and there are many ways to treat the wastewater. Furthermore, even if an air knife were to be provided, the substrate would travel in a vertical plane perpendicular to the transport direction, which would require a large and complicated device.

The present invention relates to a method for transporting a printed circuit board in a coating process, and is an object of the present invention to solve the above-mentioned drawbacks and problems of the conventional means. That is, the purpose is first to reduce the installation area of the processing tank by layout, and also to shorten the distance traveled by the carrier by bringing the processing chambers closer together. Secondly, the board can be transported with almost no wind pressure resistance, dramatically increasing the transport speed, and eliminating shaking when stopped. It is not necessary to provide strength, and the purpose is to prevent the board from warping or being damaged due to wind pressure resistance. The third purpose is to use a simple means to prevent liquid from adhering to the substrate during transport to the next tank, to eliminate the problem of uneven quality caused by taking the liquid out and bringing it into the next tank, and to avoid unnecessary The aim is to solve the problem of installing cleaning tanks and the resulting increase in treated wastewater.

The present invention will be described below with reference to illustrated embodiments, but first an outline of the apparatus used therein will be described. tl+ is a processing tank, which is provided in several rows in the longitudinal direction, that is, in the running direction of the carrier;
Each processing tank m is divided into several processing chambers parallel to its traveling direction. For example, one treatment tank +1+ includes a degreasing room (2), a washing room (3), a washing room (4), and a pickling room (5
)・Neutralization room (6)・Washing room (7)
Next, the electrolytic degreasing room, electrolytic degreasing room, washing room, washing room,
A pickling chamber, a washing chamber, etc. are provided, and a subsequent treatment chamber is provided in the next treatment tank (tl).

(8; is a carrier, which is a portal-shaped pillar that can run on longitudinal rails (9) installed at the front and rear positions of the processing tank [1)
1O) and a screw pedestal (11) which is rotatably installed horizontally between the pedestal no+ and which can be raised and lowered by an air cylinder;
The rack hanging part (121) is screwed onto the core body 1) and can be moved back and forth by the rotation of 11).The rack hanging part i+
The horizontal rod (13) of 2) is provided with a rank 114) to be described later in parallel with the running direction of the carrier (8), that is, the direction of conveying the substrate to the next tank.

The board rack (14) can mount several boards A (six boards in the figure) on the same surface, and has a hanging rack (14) above it.
15). The rack θ4) can be immersed into the processing chamber of the processing tank (l+) parallel to the traveling direction of the carrier (8).

(16. is an air knife blowing part, which is installed near 171 at the boundary between each processing tank m and the adjacent part i1). Its height is slightly higher than the board hole, and the board material rack (6
) are arranged at intervals that allow passage from the side edges, and the air outlets are erected so as to face each other. Therefore, one tree may be used for each of the two calibrations as shown in the figure, but a large number of trees may be provided.

In the figure, 1,181 (i) The rack holder is a member and is provided on both sides of each processing chamber.

Next, the method according to the invention will be explained in one case using the above device.

Holes for several substrates are mounted on a rack (14) in one plane, and the substrate is first immersed in the degreasing chamber (2) of the first processing tank tll in parallel to the traveling direction of the carrier. When the processing time there has elapsed, the rack hanging part (12) of the carrier (8) descends, and its horizontal rod (13) becomes the hanging rod (14) of the rack (14).
16) and ascend. Next, by rotation of the threaded rod (11), the upper assembly part (121) moves to the soil of the washing room (3), and descends to immerse the rack (I4) with board holes in the same manner as above. This treatment tank + 1 + washing room (
4) Processing is performed in the pickling room (5), neutralization room (6), and washing room (7), but the carrier (8) does not need to run during this time. After that, it will be transferred to the adjacent processing tank tl+, but the rack 114) with the substrate (3) that has been processed in the last washing chamber (7) of the front tank m will be lifted up and Move it to a position corresponding to the gap between the air knife part (16).At this time, since the rank with substrate (14) is parallel to the traveling direction of the carrier, the carrier (81) is moved to the adjacent processing tank f+l side. As a result, the rack (14) with substrate holes passes through the gap between the air knife portions: 161. During this passage, the liquid adhering to the substrate holes and ranks (14) is blown off by the air knife. In this case, the board holes attached to the rack (14) move in a vertical plane parallel to the running direction of the carrier, so they receive almost no wind pressure resistance. In addition to speeding up the process, the board (2) will not warp due to wind pressure.

After that, in the next treatment tank (1), the process is sequentially processed in each of the divided treatment chambers in the same way as above, and after that, it is further transported to the next treatment tank via an air knife by a carrier. It will be done.

Therefore, the present invention has the following effects.

[a] The processing tank is divided parallel to the traveling direction of the carrier, and the substrates are immersed therein for sequential processing. Therefore, unlike the conventional plating device that is immersed perpendicular to the traveling direction, the layout of the entire plating equipment can reduce the space, the movement of the carrier due to traveling is reduced, and the shaking of the substrate when transportation is stopped is also small. It can be immersed into the processing chamber immediately.

[b] The conveyance speed of printed circuit boards can be significantly improved. That is, for mass production, this type of substrate is subjected to a large amount of plating processing at once, and is transported in the size of IM or 2D, which is the size of several substrates. However, in the past, the substrates were conveyed in a vertical plane perpendicular to the traveling direction of the carrier, and as a result, they were subjected to considerable wind pressure resistance, which limited the ability to increase the speed. In order to overcome the wind pressure resistance of the trench and speed up the process, extra strength is required for the equipment and jigs, which is also uneconomical. On the other hand, in the present invention, the substrates are erected in a vertical plane parallel to the traveling direction of the carrier, with respect to the movement of substrates to the next tank where the amount of movement is large, except between processing chambers where the amount of movement wJ is small. Since it is transported, 1 to 2i as in Art.
Even when transporting objects of this size, wind resistance was completely eliminated. As a result, conveyance speed can be significantly improved compared to conventional methods, and there is no need for equipment or jigs to have special strength to withstand wind pressure, unlike conventional methods, contributing to the mass production of printed circuit boards. However, it is large.

[c] The substrate will not be warped or damaged due to wind pressure resistance during transportation. In other words, as mentioned above, the substrate is transported over a fairly large area, so if the conventional method of transporting it in a vertical plane perpendicular to the carrier travel direction results in large wind pressure resistance, depending on the substrate material, it may warp or lose its flatness. In some cases, undesirable distortion occurred, resulting in fatal defects as a printed circuit board. On the other hand, in the present invention, since the substrate is conveyed in a vertical plane parallel to the traveling direction of the carrier, there is almost no wind pressure resistance, and high quality substrates can be obtained without warping or distortion.

(d) It is possible to prevent plating liquid and other processing liquids from being taken out or brought in when the substrate is transported.

In other words, when substrates are conveyed in a vertical plane perpendicular to the carrier travel direction as in the past, it is not easy to remove the liquid adhering to the substrate, and the liquid is taken out and brought into the next tank, resulting in uneven quality. In addition, there were problems such as large-scale cleaning equipment and an accompanying increase in treated wastewater. However, in the present invention,
As described above, since the substrates are conveyed in a vertical plane parallel to the traveling direction of the carrier, it is sufficient to set up an air knife in the vicinity of the boundary with the next tank and pass the substrates from the measuring end. As a result, the liquid adhering to the substrate is blown off by air and is not taken out, which is highly economical, and the liquid does not carry over to the next tank, resulting in excellent quality uniformity.

Further, there is no need to install a cleaning tank or other large-scale removal means, and there are beneficial effects such as a significant reduction in ruts caused by treated wastewater.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention; FIG. 1 is a perspective view of a portion of a plating apparatus used for carrying out the present invention, and FIG. 2 is a plan view of a portion of the apparatus. Figure (11') Symbol: Printed circuit board, (+): Processing tank, (8): Carrier, !+41: Air knife blowing part.

Claims (1)

[Claims] ■The substrate is immersed in a processing chamber formed by dividing the processing tank parallel to the traveling direction of the carrier, and after the sequential processing, the substrate is [
Similarly, the carrier passes through an air knife that is vertically parallel to the traveling direction of the carrier and is installed near the boundary with the next tank.
A method of transporting printed circuit boards during plating processing, in which the tank is immersed in separate processing chambers in the same way as the previous tank and subjected to sequential processing.