TWI470261B - Radiation detector and manufacturing method thereof - Google Patents

Description

Radiation detector and method of manufacturing same

The present invention relates to a radiation detector for detecting radiation and a method of manufacturing the same.

As a new generation of X-ray diagnostic detectors, a planar X-ray detector using an active matrix has been developed. The X-ray image or the instantaneous X-ray image is output as a digital signal by detecting X-rays that are incident on the X-ray detector. In the X-ray detector, X-rays are converted into visible light, that is, fluorescent light, by a scintillator layer, and by an amorphous germanium (a-Si) photodiode or a CCD (Charge Coupled Device). A photoelectric conversion element that converts the fluorescent light into a signal charge to obtain an image.

As a material of the scintillator layer, cesium iodide (CsI) is generally used: sodium (Na), cesium iodide (CsI): strontium (Tl), sodium iodide (NaI), or dioxonium disulfide (Gd ₂ O _{2 )} S) and so on. The scintillator layer can be formed by forming a groove by dicing or the like, or depositing a columnar structure by vapor deposition to improve the resolution characteristics. The material as the scintillator has various kinds as described above, and is distinguished from use by use or characteristics required.

In order to improve the utilization efficiency of the fluorescent light on the upper surface of the scintillator layer and to improve the sensitivity characteristics, there is a case where a reflective film is formed. In other words, the fluorescent light that is directed toward the opposite side of the photoelectric conversion element in the fluorescent light emitted from the scintillator layer is reflected by the reflective film, thereby increasing the fluorescence reaching the photoelectric conversion element side.

The reflective film is formed by a method of forming a metal layer having a high fluorescence reflectance such as a silver alloy or aluminum on a scintillator layer, or a light-scattering property of a light-scattering substance containing TiO ₂ or the like and a binder resin. A method of forming a film or the like is formed. Further, although it is not formed on the scintillator film, a method in which a reflector having a metal surface such as aluminum is adhered to the scintillator layer to reflect the scintillation light is also put into practical use.

A moisture-proof structure for protecting a scintillator layer or a reflective layer (or a reflecting plate or the like) from an external ambient gas and suppressing deterioration of characteristics due to humidity or the like is an important component of the detector as a practical product. In particular, in the case of a material which causes deterioration in humidity, that is, a CsI:Tl film or a CsI:Na film as a scintillator layer, it is required to have high moisture resistance. The moisture-proof structure is, for example, a structure in which a moisture-proof layer such as an aluminum foil is sealed to a peripheral portion of the substrate to maintain moisture-proof performance, or a moisture-proof layer such as an aluminum foil or a thin plate is interposed between the substrate and the substrate. Then seal the structure and the like.

[Advanced technical literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-128023

[Patent Document 2] Japanese Patent Laid-Open No. Hei 5-242841

A method of using a cap-shaped metal foil or a thin plate as a moisture-proof body and sealing the cap portion to the surface of the array substrate is well known. The array substrate is formed on a glass substrate to form a pixel of a TFT or a photodiode. An ultraviolet curable or thermosetting resin adhesive is used for the moisture barrier and the substrate. When the adhesive is applied, pressure-bonded, and hardened, the adhesive layer is thinned and narrowed, and the insulating adhesive layer between the metal wiring formed on the substrate and the metallic moisture-proof body is not sufficiently thick, and there is an electrical short circuit. Danger.

Further, there is a method in which the moisture-proof body is attached to the substrate under a reduced-pressure atmosphere, and the inside of the moisture-proof body is decompressed to maintain the mechanical strength in a reduced-pressure environment such as aircraft transportation. In this case, the moisture-proof system is pressed against the substrate side by the external atmospheric pressure, and the metal wiring of the substrate tends to be close to the moisture-proof body. In the case where the moisture-proof body is excessively close to the substrate, the risk of electrical short-circuit increases, and the deformation of the moisture-proof body causes the adhesive layer to be loaded, thereby also causing the adhesive layer to have a risk of peeling.

Accordingly, the problem to be solved by the present invention is to provide a radiation detector which improves the soundness of an adhesive layer between a moistureproof body and an array substrate.

In order to solve the above problems, a radiation detector according to an embodiment includes an array substrate having a photoelectric conversion element layer in which photoelectric conversion elements for converting fluorescent light into electrical signals are arranged, and a scintillator film covering the above-mentioned photoelectric a conversion element layer is disposed on a surface of the array substrate, and converts the radiation into a fluorescent light; and the moistureproof body includes an edge portion facing the array substrate and surrounding the scintillator film, and covers the scintillator film; And an adhesive layer, wherein the edge portion is followed by the array substrate, and an inner edge thereof is located further inside than the edge portion over the entire circumference.

Further, a method of manufacturing a radiation detector according to an embodiment includes a step of forming a scintillator layer on a surface of a substrate on which a photoelectric conversion element layer in which a photoelectric conversion element that converts fluorescence into an electrical signal is disposed is provided. Forming the scintillator layer for converting radiation into fluorescence in such a manner as to cover the photoelectric conversion element layer; and applying a step of forming a strip around the layer The edge portion of the moisture-proof body at the edge portion of the shape and the inner edge portion of the moisture-proof body are coated with at least two layers of an adhesive; and the step of coating the edge portion after the coating step The surface of the adhesive is pressed to a portion outside the scintillator film of the substrate under a reduced-pressure atmosphere, and a curing step is performed to cure the adhesive.

Hereinafter, a radiation detector according to an embodiment will be described with reference to the drawings. Incidentally, the same or similar components are denoted by the same reference numerals and the repeated description is omitted.

Fig. 6 is a schematic perspective view of a radiation detecting apparatus according to an embodiment.

The radiation detector 11 of the present embodiment is an X-ray plane sensor that detects an X-ray image that is a radiation image, and is used, for example, in general medical use. The radiation detecting device 10 includes the radiation detector 11, the support plate 31, the circuit board 30, and the flexible substrate 32. The radiation detector 11 has an array substrate 12 and a scintillator film 13. The radiation detector 11 detects incident X-rays and converts them into fluorescent light, and converts the fluorescent light into electrical signals. The radiation detecting device 10 drives the radiation detector 11 and outputs an electrical signal output from the radiation detector 11 as image information. The image information output from the radiation detecting device 10 is displayed on an external display device or the like.

The array substrate 12 has a glass substrate 16. A plurality of fine pixels 20 are arranged on the surface of the glass substrate 16 in a square lattice shape. Each of the pixels 20 has a thin film transistor 22 and a photodiode 21. Further, on the surface of the glass substrate 16, the same number of control lines 18 as the number of columns of the square lattices in which the pixels 20 are arranged extend between the pixels 20. Furthermore, on the surface of the glass substrate 16, the same number of data lines 19 as the number of rows of square lattices in which the pixels 20 are arranged Extending between each pixel 20. The scintillator film 13 is formed on the surface of the region where the pixels 20 of the array substrate 12 are arranged.

The scintillator film 13 is provided on the surface of the array substrate 12, and when X-rays are incident, the fluorescent light in the visible light region is generated. The resulting fluorescent light reaches the surface of the array substrate 12.

The scintillator film 13 is formed by, for example, a ruthenium iodide (CsI): ruthenium (Tl) or sodium iodide (NaI): ruthenium (Tl) by a vacuum deposition method. CsI: The thickness of the column (pillar) of the columnar structure crystal of Tl is, for example, about 8 to 12 μm on the outermost surface. Alternatively, the dioxonium disulfide (Gd ₂ O ₂ S) phosphor particles may be mixed with a binder, coated on the array substrate 12, fired and hardened, and cut by a cutter to form a groove portion. The prisms are quadrangular to form the scintillator film 13. An inert gas such as nitrogen (N ₂ ) for atmospheric or anti-oxidation may be enclosed between the columns, or may be in a vacuum state.

The array substrate 12 receives the fluorescent light generated by the scintillator film 13 and generates an electrical signal. As a result, the visible light image generated on the scintillator film 13 by the incident X-rays is converted into image information expressed by an electrical signal.

The radiation detector 11 is supported by the support plate 31 so that the surface on the opposite side to the surface on which the scintillator film 13 is formed is in contact with the support plate 31. The circuit board 30 is disposed on the opposite side with respect to the radiation detector 11 of the support board 31. The radiation detector 11 and the circuit board 30 are electrically connected to each other by a flexible substrate 32.

Fig. 7 is a circuit diagram of the radiation detector of the embodiment.

Each of the photodiodes 21 is connected to the control line 18 and the data line 19 via a thin film transistor 22 which is a switching element. Moreover, the photoelectric diodes 21 are connected in parallel There is an accumulation capacitor 27. Further, since the capacitance of the photodiode 21 also serves as the storage capacitor 27, the storage capacitor 27 is not essential.

The photodiode 21 and the storage capacitor 27 connected in parallel are connected to the drain electrode 25 of the thin film transistor 22. The gate electrode 23 of the thin film transistor 22 is connected to the control line 18. The source electrode 24 of the thin film transistor 22 is connected to the data line 19.

The gate electrodes 23 of the thin film transistors 22 located in the same column of pixels 20 are connected to the same control line 18. The source electrodes 24 of the thin film transistors 22 located in the pixels 20 of the same row are connected to the same data line 19.

The gate electrodes 23 of the thin film transistors 22 in the pixels 20 of the same column are connected to the same control line 18. The source electrodes 24 of the thin film transistors 22 in the pixels 20 of the same row are connected to the same data line 19.

Each of the thin film transistors 22 is responsible for the conversion function, which accumulates and discharges electric charges generated by the incident light to the photodiode 21 by the fluorescent light. At least a part of the thin film transistor 22 is made of a semiconductor material such as amorphous germanium (a-Si) which is an amorphous semiconductor which is a crystalline semiconductor material, or polycrystalline germanium (P-Si) which is a polycrystalline semiconductor.

In addition, in FIGS. 6 and 7, although only five columns of five rows or four columns of four rows are described in the pixel, actually, more pixels necessary for the resolution and the imaging area are formed.

Fig. 8 is a block diagram of the radiation detecting apparatus of the embodiment.

The radiation device 10 includes a radiation detector 11, a gate driver 39, a column selection circuit 35, an integrating amplifier 33, an A/D converter 34, and a parallel/ The series converter 38 and the image synthesizing circuit 36. The gate driver 39 is connected to each control line 18 of the radiation detector 11. The gate driver 39 controls the operation state of each of the thin film transistors 22, that is, on and off. The integrating amplifier 33 is connected to each of the data lines 19 of the radiation detector 11.

The column selection circuit 35 is connected to the gate driver 39. The parallel/serial converter 38 is connected to the integrating amplifier 33. The A/D converter 34 is connected to the parallel/series converter 38. The A/D converter 34 is connected to the image synthesizing circuit 36.

The integrating amplifier 33 is provided, for example, on the flexible substrate 32 that connects the radiation detector 11 and the circuit board 30. Other components are provided, for example, on the circuit substrate 30.

The gate driver 39 receives the signal from the selection circuit 35 and sequentially switches the voltage of the control line 18. The column selection circuit 35 transmits a signal for selecting a particular column of the scanned X-ray image to the gate driver 39. The integrating amplifier 33 amplifies and outputs an extremely small charge signal output from the radiation detecting panel 21 through the data line 19.

Fig. 9 is a partially enlarged cross-sectional view showing the radiation detector of the embodiment.

An insulating protective film 28 is formed on the surface of the array substrate 12, and covers the detecting elements such as the photodiode 21 and the thin film transistor 22, and the metal wiring such as the control line 18 and the data line 19. The scintillator film 13 is formed on the surface of the protective film 28 so as to cover the region in which the pixels 20 are arranged.

A reflective film 14 is provided on the surface of the scintillator film 13. The reflection film 14 is such that the phosphor generated by the scintillator film 13 is reflected away from the array substrate 12 toward the array substrate 12 side. Thereby, the amount of fluorescent light reaching the photodiode 21 is increased.

The reflective film 14 is formed by a method in which a metal having a high fluorescence reflectance such as a silver alloy or aluminum is formed on a scintillator film. Alternatively, a reflector having a metal surface such as aluminum may be adhered to the scintillator film 13 or a light-scattering material containing TiO ₂ or the like and a reflective film 14 having a diffuse reflectance of the binder resin may be applied. Further, the reflection film 14 is provided by characteristics such as resolution and brightness which the radiation detector 11 seeks, and is not essential.

The radiation detector 11 is provided with a moistureproof body 15 so as to cover the scintillator film 13 and the reflection film 14.

Fig. 10 is a top plan view of the radiation detector of the embodiment. Fig. 11 is a side view of the radiation detector of the embodiment.

The moisture-proof body 15 is formed in a hat shape in which the central portion is raised. The peripheral portion of the moisture-proof body 15 is formed into a flat strip-shaped edge portion 50. The edge portion 50 is formed in a strip shape on the outer side of the region formed by the scintillation film 13 surrounding the surface of the array substrate 12. A top plate portion 51 is formed inside the edge portion 50. The top plate portion 51 is a flat portion which is slightly larger than the scintillator film 13. A slope portion 52 is formed between the edge portion 50 and the top plate portion 51.

The edge portion 50 is opposed to the array substrate 12. The edge portion 50 and the array substrate 12 are in a connected state. The scintillation film 13 and the reflection film 14 formed on the array substrate 12 are covered by the top plate portion 51 of the moistureproof body 15 and the inclined surface portion 52. The moistureproof body 15 protects the scintillator film 13 and the reflective film 14 from outside air or humidity.

The moisture-proof body 15 is formed, for example, of an aluminum alloy foil having a thickness of 0.1 mm. The moisture-proof body 15 is formed of an aluminum alloy foil or an aluminum foil such as an AlN30-O material. The width of the rim 50 is, for example, 5 mm.

A terminal group 26 in which the end portions of each of the control line 18 and the data line 19 are exposed is provided on the array substrate 12. The terminal groups 26 are arranged along the sides of the array substrate 12. even The terminal group 26 connected to the control line 18 and the terminal group 26 connected to the data line 19 are arranged along different sides. The terminal groups 26 are electrically connected to the circuit board via the flexible substrate 32.

Fig. 1 is an enlarged cross-sectional view showing the vicinity of an edge portion of a moistureproof body of the embodiment. Fig. 2 is an enlarged plan view showing the vicinity of the edge portion of the moistureproof body of the embodiment.

The edge layer 40 is interposed between the edge portion 50 of the moisture-proof body 15 and the array substrate 12. Next, the layer 40 is provided along the edge portion 50 in a strip shape on the outer side of the region formed by the scintillator film 13 surrounding the surface of the array substrate 12. Next, the inner edge 43 of the inner edge of the layer 40, that is, the vicinity of the region formed by the scintillator film 13 on the surface of the array substrate 12, is located further inside than the inner edge 53 of the edge portion 50 over the entire circumference. Next, the layer 40 is formed of a heat-curing type or an ultraviolet curing type epoxy resin-based adhesive.

Next, a method of manufacturing the radiation detector of the present embodiment will be described.

First, the photoelectric conversion portion 17, the control line 18, the signal line 19, and the like are formed on the surface of the glass substrate 16 (see FIG. 6), and the array substrate 12 is obtained. Next, on the array substrate 12, the scintillator film 13 and the reflection film 14 are sequentially formed. Further, the moisture-proof body 15 is produced by press-molding an aluminum alloy foil or the like into a hat shape.

Next, the array substrate 12 in which the scintillator film 13 and the reflection film 14 thus obtained are integrated is connected to the moisture-proof body 15.

Fig. 3 is a plan view showing a method of applying an adhesive to the moisture-proof body of the embodiment. Fig. 4 is a partially enlarged plan view showing a method of applying an adhesive to the moisture-proof body of the embodiment. Fig. 5 is a partially enlarged cross-sectional view showing a method of applying an adhesive to the moisture-proof body of the embodiment.

In the subsequent process of the moisture-proof body 15 to the array substrate 12, first, the ultraviolet-curable adhesives 41 and 42 are applied to the surface of the moisture-proof body 15 opposite to the array substrate 12 by using a coater. Two layers of the adhesives 41, 42 are applied over at least the edge portion 50 over the entire circumference. These include: an adhesive 41 applied at least substantially at the center of the rim 50; and an adhesive 42 applied adjacent to the inner edge of the rim.

Next, the moisture-proof body 15 to which the adhesives 41 and 42 are applied is pressed to the array substrate 12 under a reduced-pressure atmosphere, and both are pressure-bonded. The ambient gas system at the time of the pressure bonding is, for example, a reduced-pressure ambient gas of about 0.1 atmosphere. Further, in order to ensure uniformity of the thickness of the adhesive layer 40 and protrusion to the inner side of the edge portion 50 of the adhesives 41 and 42, the adhesives 41 and 42 at the time of pressure bonding are preferably made to have a higher degree of viscosity. Therefore, before or after application of the adhesives 41 and 42 to the moisture-proof body 15, the adhesive may be hardened to some extent before pressure bonding.

Thus, by manufacturing the radiation detector 11, the inner edge 43 of the layer 40 can be located further inside than the inner edge 53 of the edge portion 50.

Thus, the radiation detector 11 is completed by forming the moisture-proof structure. The control line 18 of the radiation detector 11 and the terminal portions 26 of the data line 19 are connected to each other by a TAB connection, and are connected to a circuit after the amplifier, and are combined into a casing to complete the radiation detecting device.

It is difficult to uniformly apply the coating amount of the adhesive agent to the edge portion 50 of the moisture-proof body 15 and the coating position in the width direction of the edge portion 50 over the entire circumferential direction of the edge portion 50. Further, by the unevenness of the coating amount and the coating position, the inclination of the moisture-proof body 15 and the array substrate 12, etc., when the moisture-proof body 15 and the array substrate 12 are crimped, the state in which the adhesive is flattened is not uniform. situation. again In the case where the pressure-reducing ambient gas is opened to the atmospheric pressure in a state where the adhesive agent is not completely cured, there is a possibility that the adhesive moves toward the inner side, that is, the direction of the scintillator film 13 by the external atmospheric pressure.

There is an adhesive which follows the array substrate 12 and the moisture-proof body 15 by the coating amount of the adhesive, the coating position, the unevenness of the flattening, or the movement of the adhesive caused by the pressure difference, or even the combination thereof. The width or thickness becomes uneven. When the unevenness of the width or the thickness becomes remarkable, there is a possibility that the adhesion between a portion of the edge portion 50 and the rear portion of the array substrate 12 in the circumferential direction is lowered, or the moisture resistance performance is deteriorated. Further, when the thickness of the adhesive layer 40 is reduced, there is a possibility that the protective film 28 on the surface of the array substrate 12 comes into contact with the moisture-proof body 15.

Further, since the space 54 between the array substrate 12, the scintillator film 13, the reflector 14, and the moisture-proof body 15 is decompressed with the atmosphere gas, the moisture-proof body 15 is pressed to the array substrate 12 side by the atmospheric pressure, and The moisture-proof body 15 acts as a force that is in close contact with the array substrate 12 and the scintillator film 13. When the bent portion of the inner edge 53 of the edge portion 50 is pressed against the array substrate 12 side and deformed by the force or the like, tensile stress is generated in the adhesive layer 40. There is a possibility that the adhesion layer 40 is destroyed by the tensile stress.

If the unhardened adhesive flows due to atmospheric pressure, or the adhesive which is caused by atmospheric pressure or the like causes damage to the adhesive layer, the adhesive layer 40 is not impregnated to prevent moisture. The possibility of the body 15 being in direct contact with the array substrate 12.

Fig. 12 is a cross-sectional view showing an example of a state in which a protective film on a surface of an array substrate is in contact with a moisture-proof body.

When the moisture-proof body 15 is in direct contact with the array substrate 12, the protective film 28 is broken, and the metal wiring 29 formed on the array substrate 12 is in direct contact with the moisture-proof body 15, and the wiring on the array substrate 12 is short-circuited. The edge portion 50 of the array substrate 12 on which the scintillator film 13 is formed and the moisture-proof body 15 are interposed with an ultraviolet curing type or the like, for example, in a moisture-proof structure which is sealed under a reduced-pressure atmosphere gas, and is protected from moisture. An insulating adhesive is reliably formed between the edge portion 50 of the body 15 and the array substrate 12, and deformation of the AL cap itself is suppressed to relieve stress, and it is important to stabilize the mechanical and electrical properties.

In the present embodiment, the moisture-proof body 15 and the adhesive layer 40 of the array substrate 12 are extended such that the inner edge 43 of the adhesive layer 40 is located inside the inner edge 53 of the edge portion 50 of the moisture-proof body 15. Therefore, the hardened portion that protrudes further inside than the inner edge 53 of the edge portion 50 of the adhesive layer 40 is prevented from approaching the array substrate 12.

Further, the gap between the slope portion 52 in the vicinity of the inner edge 53 of the edge portion 50 of the moistureproof body 15 and the array substrate 12 is filled by such a protruding and hardened adhesive. As a result, the layer 40 is formed to have a thicker portion than the edge portion 50 and the array substrate 12, further than the inner edge 53 of the edge portion 50. The thicker portion of the adhesive layer 40 is shaped to bulge along the slope portion 52. Therefore, the bent portion in the vicinity of the edge portion 50 of the moistureproof body 15 can be fixed, and the deformation of the moistureproof body 15 caused by the external atmospheric pressure or the like can be suppressed. As a result, the tensile stress generated in the adhesive layer 40 can be lowered. Since the stress generated by the adhesive layer 40 is suppressed as described above, the possibility of peeling of the adhesive layer 40 can be reduced.

Further, by arranging the inner edge 43 of the adhesive layer 40 adjacent to the scintillator film 13, between the outer edge of the scintillator film 13 and the edge portion 50 of the moistureproof body 15, the array substrate 12 The surface is covered by the adhesive layer 40, and the possibility of the moisture-proof body 15 coming into contact with the array substrate 12 becomes extremely small. In particular, if the inner edge 43 of the adhesive layer 40 is adjacent to the scintillator film 13 throughout the entire circumference, the surface of the array substrate 12 between the outer edge of the scintillator film 13 and the edge of the moisture-proof body 15 is completely covered by the layer 40. Coverage, so the effect is good.

As described above, in the present embodiment, since the mechanical strength of the adhesive layer 40 is increased, a highly reliable moisture-proof structure is obtained. Further, particularly in the case where a metal such as aluminum is used as the moisture-proof body 15, the possibility of electrical short-circuit between the moisture-proof body 15 and the wiring on the array substrate 12 can be suppressed. As a result, the soundness of the radiation detector 11 at the time of manufacture and subsequent use can be improved.

Further, in the manufacturing method of the present embodiment, the adhesive is applied to the edge portion 50 of the moistureproof body 15 by a multilayer coating method in which at least two layers are applied to the inner edge 53 of the edge portion 50 and the inner edge 53 of the edge portion 50. It can improve the bonding of the adhesives to each other. Further, the amount of protrusion of the adhesive on the outer side and the inner side of the edge portion 50 of the moistureproof body 15 can be controlled with higher precision.

When the moisture-proof body 15 of the multilayer application adhesive is bonded to the array substrate 12 in which the scintillator film 13 and the reflection film 14 are integrated, and then sealed under a reduced-pressure atmosphere, the adhesive applied to the central portion of the edge portion 50 is applied. The 41 is pressed by the edge portion 50 to expand, and a uniform thickness layer 40 is formed. The adhesive 42 applied to the inner edge 53 of the edge portion 50 is extended in the center direction of the edge portion 50 and is attached to the center portion. The agent protrudes to the inner side of the rim 50.

Moreover, by using such a method of applying the two-layer adhesives 41 and 42, even if the atmosphere is opened in a state where the adhesive is not cured, it is possible to suppress thinning of the adhesive due to the flow of the adhesive. On the side of applying a layer of adhesive In the method, in order to sufficiently diffuse the adhesive at the time of crimping and to secure the width of the adhesive layer, it is necessary to first reduce the viscosity of the adhesive to a certain extent.

However, in the method of applying the multilayer adhesive of the present embodiment, since the formation area of the adhesive can be expanded before the pressure bonding, a good adhesion layer 40 can be formed even with a high-viscosity adhesive. When the viscosity of the agent is high, the fluidity is lowered, so that the flow of the adhesive caused by the external atmospheric pressure can be suppressed. The viscosity of the subsequent agent can be increased by adjusting the resin viscosity of the material itself. Or in the case of an ultraviolet curing type adhesive, it is possible to increase the viscosity by increasing the amount of ultraviolet irradiation before the pressure bonding.

In the case where the adhesive was applied to the edge portion 50 of the moisture-proof body 15 and the two layers were applied, the thickness of the adhesive layer 40 when crimped with the same pressure contact force was observed. As a result, in the case of coating one layer, the average value of the thickness of the adhesive layer was 50 μm, and it was observed that the portion having the thinnest portion having a thickness of about 15 μm was observed. On the other hand, in the case where two layers of the adhesive are applied as in the present embodiment, the difference in thickness of the subsequent layer 40 is small, and the film thickness of the thinnest portion is also ensured to be 50 μm or more. As described above, in the present embodiment, it is difficult to form a thin portion in the adhesive layer 40, and the adhesive layer 40 having a sufficient thickness can be formed over the entire periphery of the edge portion 50.

As described above, by forming a structure in which the adhesive layer 40 protrudes inside the moisture-proof body by multilayer coating by an adhesive, mechanical strength can be increased to ensure insulation of the substrate metal wiring, and a high moisture-proof property can be provided. Radiation detector for reliability.

Thus, by using a multilayer coating of an adhesive to achieve a structure in which the adhesive protrudes inside the AL cap, the mechanical strength can be increased to ensure the substrate metal. The insulation of the wiring provides a radiation detector with high moisture resistance and reliability.

Further, it is not the case that only aluminum or an aluminum alloy is used as the material of the moisture-proof body 15, and the case of using other metal materials is also the same. However, since the X-ray absorption coefficient as a metal material is particularly small in the case of a foil of aluminum or aluminum alloy, it is advantageous in that it can suppress the X-ray absorption loss in the moisture-proof body 15, and is processed into a cap. The situation is also excellent in processing.

The moisture-proof body 15 is applied to the array substrate 12 under a reduced-pressure atmosphere, and is also effective in forming a moisture-proof structure excellent in mechanical strength under a reduced pressure environment in which the aircraft is supposed to be transported. Even when the moisture-proof body 15 is brought to the array substrate 12 under atmospheric pressure, it is effective to use the method of coating two layers as in the present embodiment in order to secure a sufficient thickness of the adhesive layer and the width of the adhesive layer.

The subsequent agents 41 and 42 are not applied to the moisture-proof body 15 and may be applied to the array substrate 12 side instead. Even if this method is used, by applying a plurality of layers to the central portion of the edge portion 50 of the moisture-proof body 15 and the inner edge 53 of the edge portion 50, it is possible to obtain the adhesion of the adhesives 41 and 42 to the moisture-proof body. The same effect is achieved in the case of 15. However, when the adhesive is applied to the array substrate 12 side, the influence of the positional deviation of the moisture-proof body 15 and the array substrate 12 is large, so that the method of applying the adhesive to the moisture-proof body 15 side is stabilized in the process. The point is even better.

Although an embodiment of the present invention has been described, the embodiment is presented by way of example only and is not intended to limit the scope of the invention. The novel embodiment can be implemented in a variety of other forms, without departing from the hair Various omissions, substitutions, and changes may be made within the scope of the subject matter. This embodiment or its modifications are intended to be included within the scope and spirit of the invention and are intended to be included within the scope of the invention.

10‧‧‧radiation detection device

11‧‧‧radiation detector

12‧‧‧Array substrate

13‧‧‧Scintillator film

14‧‧‧Reflective film

15‧‧‧Damps

16‧‧‧ glass substrate

17‧‧‧Photoelectric Conversion Department

18‧‧‧Control line

19‧‧‧Information line

20‧‧ ‧ pixels

21‧‧‧Photoelectric diode

22‧‧‧film transistor

23‧‧‧ gate electrode

24‧‧‧ source electrode

25‧‧‧汲 electrode

26‧‧‧Terminal group

27‧‧‧Accumulation capacitor

28‧‧‧Protective film

29‧‧‧Metal wiring

30‧‧‧ circuit board

31‧‧‧Support board

32‧‧‧Flexible substrate

33‧‧‧Integral amplifier

34‧‧‧A/D converter

35‧‧‧ column selection circuit

36‧‧‧Image Synthesis Circuit

38‧‧‧ parallel/serial converter

39‧‧‧gate driver

40‧‧‧Next layer

41‧‧‧Adhesive

42‧‧‧Adhesive

43‧‧‧ inner edge

50‧‧‧Edge

51‧‧‧ top board

52‧‧‧Bevel

53‧‧‧ inner edge

54‧‧‧ Space

Fig. 1 is an enlarged cross-sectional view showing the vicinity of an edge portion of a moistureproof body according to an embodiment.

Fig. 2 is an enlarged plan view showing the vicinity of the edge portion of the moistureproof body of the embodiment.

Fig. 3 is a plan view showing a method of applying an adhesive to a moisture-proof body of an embodiment.

Fig. 4 is a partially enlarged plan view showing a method of applying an adhesive to a moisture-proof body of an embodiment.

Fig. 5 is a partially enlarged cross-sectional view showing a method of applying an adhesive to a moisture-proof body of an embodiment.

Fig. 6 is a schematic perspective view of a radiation detecting apparatus according to an embodiment.

Fig. 7 is a circuit diagram of a radiation detector of an embodiment.

Fig. 8 is a block diagram showing a radiation detecting apparatus of an embodiment.

Fig. 9 is a partially enlarged cross-sectional view showing a radiation detector of an embodiment.

Figure 10 is a top plan view of a radiation detector of an embodiment.

Figure 11 is a side view of a radiation detector of an embodiment.

Fig. 12 is a cross-sectional view showing an example of a state in which a protective film on a surface of an array substrate is in contact with a moisture-proof body.

11‧‧‧radiation detector

13‧‧‧Scintillator film

14‧‧‧Reflective film

15‧‧‧Damps

16‧‧‧ glass substrate

28‧‧‧Protective film

29‧‧‧Metal wiring

40‧‧‧Next layer

43‧‧‧ inner edge

50‧‧‧Edge

51‧‧‧ top board

52‧‧‧Bevel

53‧‧‧ inner edge

54‧‧‧ Space

Claims (6)

A radiation detector comprising: an array substrate provided with a photoelectric conversion element layer in which photoelectric conversion elements for converting fluorescent light into electrical signals are arranged; and a scintillator film covering the photoelectric conversion element layer The method is disposed on a surface of the array substrate and converts the radiation into a fluorescent light; the moistureproof body includes an edge portion that faces the array substrate and surrounds the scintillator film, and covers the scintillator film; and an adhesive layer The edge portion is connected to the array substrate, and the inner edge thereof is located further inside than the edge portion over the entire circumference. A radiation detector according to claim 1, wherein a portion further inside than said edge portion of said adhesive layer is thicker than a portion between said edge portion and said array substrate. A radiation detector according to claim 1 or 2, wherein said moisture-proof system is formed of a metal. The radiation detector according to claim 1 or 2, wherein the adhesive layer is any one of an ultraviolet curable insulating resin adhesive and a thermosetting insulating resin adhesive. The radiation detector according to claim 3, wherein the adhesive layer is any one of an ultraviolet curable insulating resin adhesive and a thermosetting insulating resin adhesive. A method of manufacturing a radiation detector, comprising: forming a scintillator layer, wherein the scintillator layer is provided with a photoelectric conversion element layer in which a photoelectric conversion element that converts fluorescence into an electrical signal is disposed a surface of the substrate, the scintillator layer for converting radiation into fluorescence is formed to cover the photoelectric conversion element layer, and a coating step is performed on the edge portion of the moisture-proof body having a band-shaped edge portion around, and Applying at least two layers of the adhesive agent to the inner side of the edge portion of the moisture-proof body; and subsequently, after the coating step, pressing the surface of the edge portion coated with the adhesive agent under a reduced-pressure atmosphere gas a portion outside the scintillator film of the substrate; and a hardening step of hardening the adhesive.