WO2020100809A1 - Radiation detection module, radiation detector, and radiation detection module production method - Google Patents

Abstract

A radiation detection module according to an embodiment comprises: an array substrate that has a plurality of photoelectric conversion parts; a scintillator that is provided on top of the plurality of photoelectric conversion parts; a frame-like sealing part that includes a thermoplastic resin as the main component, is provided at the periphery of the scintillator, and is joined to the array substrate and the scintillator; and an anti-moisture part that covers the upper part of the scintillator and is joined to the outer surface of the sealing part near the peripheral edge of the anti-moisture part. The shape of the outer surface of the sealing part is that of an outwardly protruding curved surface.

Description

Radiation detection module, radiation detector, and method of manufacturing radiation detection module

The embodiment of the present invention relates to a radiation detection module, a radiation detector, and a method for manufacturing the radiation detection module.

An X-ray detector is an example of the radiation detector. The X-ray detector is provided with a scintillator that converts X-rays into fluorescence and an array substrate that converts fluorescence into electrical signals. In addition, a reflective layer may be further provided on the scintillator in order to improve the utilization efficiency of fluorescence and improve the sensitivity characteristics.
Here, the scintillator and the reflective layer need to be isolated from the external atmosphere in order to suppress the deterioration of the characteristics due to water vapor or the like. For example, when the scintillator contains CsI (cesium iodide): Tl (thallium), CsI: Na (sodium), or the like, the characteristic deterioration due to water vapor or the like may increase.

Therefore, as a structure capable of obtaining high moistureproof performance, a technique has been proposed in which the scintillator and the reflection layer are covered with a hat-shaped moistureproof portion, and the brim (flange) portion of the moistureproof portion is bonded to the array substrate.
However, if the brim portion of the moisture-proof portion is bonded to the array substrate, a space for bonding the brim portion is required around the scintillator. In recent years, it has been desired to reduce the size of the X-ray detector. However, when the hat-shaped moisture-proof portion is used, there is a fear that the X-ray detector cannot be downsized.

Further, since a large amount of X-ray irradiation on the human body has a bad influence on health, the X-ray irradiation amount on the human body can be suppressed to a necessary minimum. Therefore, in the case of an X-ray detector used for medical treatment, the intensity of the X-rays that are emitted may be low, and the intensity of the X-rays that pass through the moisture-proof portion may be extremely low. In this case, if the thickness of the moisture-proof portion is reduced, the intensity of X-rays that are transmitted can be increased. However, if the thickness of the hat-shaped moisture-proof portion is reduced, cracks and the like are likely to occur when forming a foil of aluminum or the like into the hat-shaped.
Therefore, it has been desired to develop a technique capable of reducing the size of the X-ray detector and reducing the thickness of the moisture-proof portion.

JP, 2009-128023, A

The problem to be solved by the present invention is to provide a radiation detection module, a radiation detector, and a method for manufacturing a radiation detection module, which can reduce the size of the radiation detector and can reduce the thickness of the moisture-proof portion. Is to provide.

The radiation detection module according to the embodiment includes an array substrate having a plurality of photoelectric conversion units, a scintillator provided on the plurality of photoelectric conversion units, and a thermoplastic resin as a main component, and provided around the scintillator. And a frame-shaped sealing portion joined to the array substrate and the scintillator, and a moisture-proof portion that covers an upper portion of the scintillator and has a peripheral edge portion joined to an outer surface of the sealing portion. The outer surface of the sealing portion has a curved surface protruding outward.

It is a schematic perspective view for illustrating the X-ray detector and the X-ray detection module according to the present embodiment. It is a schematic cross section for illustrating an X-ray detection module. It is a block diagram of an X-ray detector. (A), (b) is a schematic cross section for illustrating the X-ray detection module concerning other embodiments. It is a schematic cross section for illustrating an X-ray detection module concerning other embodiments. (A) is a schematic plan view of a moisture-proof part. (B) is a schematic perspective view of the moisture-proof part 17. It is a schematic cross section for illustrating an X-ray detection module concerning other embodiments. It is a schematic cross section for illustrating an X-ray detection module concerning other embodiments. (A), (b) is a schematic cross section for illustrating a flexible part concerning other embodiments. It is a schematic cross section for illustrating an X-ray detection module concerning a comparative example. It is a schematic cross section for illustrating an X-ray detection module concerning a comparative example. It is a schematic cross section for illustrating an X-ray detection module concerning a comparative example. It is a schematic cross section for illustrating an X-ray detection module concerning a comparative example. It is a schematic perspective view for illustrating application of a thermoplastic resin according to a comparative example. It is a schematic perspective view for illustrating application of the thermoplastic resin according to the present embodiment.

Embodiments will be exemplified below with reference to the drawings. In the drawings, the same components are designated by the same reference numerals, and detailed description thereof will be appropriately omitted.
Further, the radiation detector according to the embodiment of the present invention can be applied to various radiations such as γ-rays as well as X-rays. Here, as an example, description will be given by taking a case relating to X-rays as a typical one of radiations. Therefore, by replacing “X-ray” in the following embodiments with “other radiation”, it can be applied to other radiation.
Further, the radiation detector can be used, for example, in general medicine. However, the application of the radiation detector is not limited to general medicine.

(X-ray detector and X-ray detection module)
FIG. 1 is a schematic perspective view for illustrating an X-ray detector 1 and an X-ray detection module 10 according to this embodiment.
In order to avoid complication, the protective layer 2f, the reflection layer 6, the moisture-proof portion 7, the sealing portion 8 and the like are omitted in FIG.
FIG. 2 is a schematic cross-sectional view for illustrating the X-ray detection module 10.
FIG. 3 is a block diagram of the X-ray detector 1.

As shown in FIGS. 1 and 2, the X-ray detector 1 is provided with an X-ray detection module 10 and a circuit board 11. Further, the X-ray detector 1 can be provided with a casing (not shown). The X-ray detection module 10 and the circuit board 11 can be provided inside the housing. For example, the plate-shaped support plate 12 is provided inside the housing, the X-ray detection module 10 is provided on the X-ray incident side surface of the support plate 12, and the side opposite to the X-ray incident side of the support plate 12 is provided. The circuit board 11 can be provided on the surface of the.

The X-ray detection module 10 is provided with the array substrate 2, the scintillator 5, the reflective layer 6, the moisture-proof portion 7, and the sealing portion 8.
The array substrate 2 includes a substrate 2a, a photoelectric conversion unit 2b, a control line (or gate line) 2c1, a data line (or signal line) 2c2, a wiring pad 2d1, a wiring pad 2d2, and a protective layer 2f.
The numbers of the photoelectric conversion unit 2b, the control line 2c1, and the data line 2c2 are not limited to those illustrated.

The substrate 2a has a plate shape and is made of glass such as alkali-free glass. The planar shape of the substrate 2a can be a quadrangle. The thickness of the substrate 2a can be set to about 0.7 mm, for example.
A plurality of photoelectric conversion units 2b are provided on one surface side of the substrate 2a.
The photoelectric conversion unit 2b has a rectangular shape and is provided in a region defined by the control line 2c1 and the data line 2c2. The plurality of photoelectric conversion units 2b are arranged in a matrix. Note that one photoelectric conversion unit 2b corresponds to one pixel of the X-ray image.

A photoelectric conversion element 2b1 and a thin film transistor (TFT) 2b2 that is a switching element are provided in each of the plurality of photoelectric conversion units 2b.
Further, a storage capacitor (not shown) for storing the signal charges converted by the photoelectric conversion element 2b1 can be provided. The storage capacitor has, for example, a rectangular flat plate shape, and can be provided below each thin film transistor 2b2. However, the photoelectric conversion element 2b1 can also serve as a storage capacitor depending on the capacity of the photoelectric conversion element 2b1.

The photoelectric conversion element 2b1 can be, for example, a photodiode or the like.
The thin film transistor 2b2 performs switching of storage and discharge of electric charge in the storage capacitor. The thin film transistor 2b2 has a gate electrode, a drain electrode, and a source electrode. The gate electrode of the thin film transistor 2b2 is electrically connected to the corresponding control line 2c1. The drain electrode of the thin film transistor 2b2 is electrically connected to the corresponding data line 2c2. The source electrode of the thin film transistor 2b2 is electrically connected to the corresponding photoelectric conversion element 2b1 and storage capacitor. Further, the anode side of the photoelectric conversion element 2b1 and the storage capacitor can be connected to the ground. The anode side of the photoelectric conversion element 2b1 and the storage capacitor can also be connected to a bias line (not shown).

A plurality of control lines 2c1 are provided in parallel with each other at a predetermined interval. The control line 2c1 extends in the row direction, for example. One control line 2c1 is electrically connected to one of the plurality of wiring pads 2d1 provided near the peripheral edge of the substrate 2a. One wiring pad 2d1 is electrically connected to one of a plurality of wirings provided on the flexible printed circuit board 2e1. The other ends of the plurality of wirings provided on the flexible printed board 2e1 are electrically connected to the readout circuit 11a provided on the circuit board 11, respectively.

A plurality of data lines 2c2 are provided in parallel with each other at a predetermined interval. The data line 2c2 extends, for example, in the column direction orthogonal to the row direction. One data line 2c2 is electrically connected to one of the plurality of wiring pads 2d2 provided near the peripheral edge of the substrate 2a. One wiring pad 2d2 is electrically connected to one of a plurality of wirings provided on the flexible printed circuit board 2e2. The other ends of the plurality of wirings provided on the flexible printed board 2e2 are electrically connected to the signal detection circuit 11b provided on the circuit board 11, respectively.
The control line 2c1 and the data line 2c2 can be formed using, for example, a low resistance metal such as aluminum or chromium.

The protective layer 2f covers the photoelectric conversion unit 2b, the control line 2c1 and the data line 2c2. The protective layer 2f can be formed of an insulating material. The insulating material can be, for example, an oxide insulating material, a nitride insulating material, an oxynitride insulating material, a resin, or the like.

The scintillator 5 is provided on the plurality of photoelectric conversion units 2b and converts incident X-rays into visible light, that is, fluorescence. The scintillator 5 is provided so as to cover a region (effective pixel region A) in which the plurality of photoelectric conversion units 2b are provided on the substrate 2a.
The scintillator 5 can contain, for example, cesium iodide (CsI): thallium (Tl), sodium iodide (NaI): thallium (Tl), or cesium bromide (CsBr): europium (Eu). The scintillator 5 can be formed using a vacuum vapor deposition method. If the scintillator 5 is formed by using the vacuum evaporation method, the scintillator 5 composed of an aggregate of a plurality of columnar crystals is formed. The scintillator 5 can have a thickness of, for example, about 600 μm.

A mask having an opening is used when forming the scintillator 5 using the vacuum deposition method. In this case, the scintillator 5 is formed at a position facing the openings on the array substrate 2 (on the effective pixel area A). A film formed by vapor deposition is also formed on the surface of the mask. Then, in the vicinity of the opening of the mask, the film grows so as to gradually project into the inside of the opening. When the film overhangs inside the opening, vapor deposition on the array substrate 2 is suppressed in the vicinity of the opening. Therefore, as shown in FIGS. 1 and 2, in the vicinity of the peripheral edge of the scintillator 5, the thickness gradually decreases toward the outside.

The scintillator 5 can also be formed using, for example, terbium activated gadolinium sulfate sulfate (Gd ₂ O ₂ S / Tb, or GOS). In this case, the groove portions can be provided in a matrix so that the scintillator 5 having a rectangular column shape is provided for each of the plurality of photoelectric conversion units 2b.

The reflective layer 6 is provided in order to improve the utilization efficiency of fluorescence and improve the sensitivity characteristic. That is, the reflection layer 6 reflects the light, which is emitted from the scintillator 5 and is directed toward the side opposite to the side on which the photoelectric conversion section 2b is provided, so as to be reflected toward the photoelectric conversion section 2b. However, the reflective layer 6 is not always necessary, and may be provided according to the sensitivity characteristics required for the X-ray detection module 10.
In the following, as an example, a case where the reflective layer 6 is provided will be described.

The reflective layer 6 is provided on the X-ray incident side of the scintillator 5. The reflective layer 6 covers at least the upper surface of the scintillator 5. The reflective layer 6 can further cover the side surface 5 a of the scintillator 5.
For example, the reflective layer 6 can be formed by coating the scintillator 5 with a material obtained by mixing light-scattering particles made of titanium oxide (TiO ₂ ) or the like, a resin, and a solvent, and drying the material.
Further, for example, the reflective layer 6 can be formed by forming a layer made of a metal having a high light reflectance such as silver alloy or aluminum on the scintillator 5.
Alternatively, for example, a sheet made of a metal having a high light reflectance such as silver alloy or aluminum or a resin sheet containing light scattering particles may be provided on the scintillator 5 to form the reflective layer 6.

When a paste-like material is applied onto the scintillator 5 and dried, the material shrinks as it dries, so the scintillator 5 may be pulled and the scintillator 5 may peel off from the array substrate 2. .. Therefore, it is preferable to provide the sheet-shaped reflective layer 6 on the scintillator 5. In this case, the sheet-shaped reflective layer 6 can be bonded onto the scintillator 5 by using, for example, a double-sided tape, but it is preferable to place the sheet-shaped reflective layer 6 on the scintillator 5. .. If the sheet-shaped reflective layer 6 is placed on the scintillator 5, it becomes easy to prevent the scintillator 5 from peeling off from the array substrate 2 due to expansion or contraction of the reflective layer 6. ..

The moisture-proof portion 7 is provided to prevent the characteristics of the reflective layer 6 and the characteristics of the scintillator 5 from being deteriorated by water contained in the air.
The moisture-proof portion 7 covers at least a part of the scintillator 5 and the sealing portion 8. There may be a gap between the moisture-proof portion 7 and the reflective layer 6 or the like, or the moisture-proof portion 7 and the reflective layer 6 or the like may be in contact with each other. For example, if the moisture-proof portion 7 and the sealing portion 8 are joined in an environment depressurized below the atmospheric pressure, the moisture-proof portion 7 and the reflective layer 6 can be brought into contact with each other. Further, generally, the scintillator 5 has voids of about 10% to 40% of its volume. Therefore, if the void contains gas, the gas may expand and the moisture-proof portion 7 may be damaged when the X-ray detector 1 is transported by an aircraft or the like. If the moisture-proof portion 7 and the sealing portion 8 are joined in an environment depressurized below the atmospheric pressure, the moisture-proof portion 7 is prevented from being damaged even when the X-ray detector 1 is transported by an aircraft or the like. be able to. That is, the pressure in the space defined by the sealing portion 8 and the moisture-proof portion 7 is preferably lower than atmospheric pressure.

Here, there are air bubbles or voids inside the sealing portion 8, gaps or leak paths between the sealing portion 8 and the moistureproof portion 7, and gaps or leak paths between the sealing portion 8 and the array substrate 2. It may happen. In this case, when the moisture-proof portion 7 and the sealing portion 8 are joined in an environment depressurized below the atmospheric pressure and then the atmosphere is returned to the atmospheric pressure environment, the atmosphere enters the inside through a gap or a leak path. There is. When the air enters the inside, the moisture-proof portion 7 and the scintillator 5 do not come into close contact with each other, and the surface of the moisture-proof portion 7 is wrinkled or the tension disappears. Therefore, it is possible to easily visually recognize that there is a gap or a leak path. The life of a product having a gap or a leak path may be shortened, but such a product can be easily found and removed by inspection. Therefore, it becomes easy to improve the quality of the X-ray detector 1.

The moisture-proof part 7 can be a sheet containing metal. The metal can be, for example, a metal containing aluminum, a metal containing copper, a metal containing magnesium, a metal containing tungsten, stainless steel, a Kovar material, or the like. In this case, if the moisture-proof portion 7 containing metal is used, the moisture that permeates the moisture-proof portion 7 can be almost completely eliminated.

Further, the moisture-proof part 7 may be a laminated sheet in which a resin film and a metal film are laminated. In this case, the resin film may be formed of, for example, polyimide resin, epoxy resin, polyethylene terephthalate resin, Teflon (registered trademark), low density polyethylene, high density polyethylene, elastic rubber or the like. The metal film may include, for example, the above-mentioned metal. The metal film can be formed by using, for example, a sputtering method or a laminating method. In this case, it is preferable that the metal film is provided on the scintillator 5 side. By doing so, the metal film can be covered with the resin film, so that the metal film can be prevented from being damaged by an external force or the like. Further, if the metal film is provided inside the resin film (on the side of the scintillator 5), it is possible to prevent the characteristics of the scintillator 5 from deteriorating due to moisture permeation through the resin layer.
An inorganic film can be provided instead of the metal film or together with the metal film. The inorganic film can be, for example, a film containing silicon oxide, aluminum oxide, or the like. The inorganic film can be formed by using, for example, a sputtering method.

When a laminated sheet including a metal film is used, for example, a resin film having a thickness substantially the same as the thickness of the metal film can be used. By providing the resin film having such a thickness, the rigidity of the moisture-proof portion 7 can be increased, so that it is possible to suppress the occurrence of pinholes in the moisture-proof portion 7 during the manufacturing process. Generally, the coefficient of linear expansion of resin is larger than the coefficient of linear expansion of metal. Therefore, if the thickness of the resin film is too thick, the warp of the array substrate 2 described later tends to occur. Therefore, the thickness of the resin film is preferably equal to or less than the thickness of the metal film.

Also, the thickness of the moisture-proof portion 7 can be determined in consideration of absorption of X-rays, rigidity, and the like. In this case, if the thickness of the moistureproof portion 7 is increased, the amount of X-rays absorbed by the moistureproof portion 7 increases. On the other hand, when the thickness of the moisture-proof part 7 is reduced, the rigidity is lowered and the moisture-proof part 7 is easily damaged.

For example, if the thickness of the moisture-proof portion 7 is less than 10 μm, the rigidity of the moisture-proof portion 7 becomes too low, and pinholes may occur due to damage due to external force, which may cause leakage. If the thickness of the moistureproof portion 7 exceeds 50 μm, the rigidity of the moistureproof portion 7 becomes too high, and the conformability to the unevenness of the upper end of the scintillator 5 becomes poor. Therefore, it may be difficult to confirm the above-mentioned gap and leak path. Further, there is a possibility that the warp of the array substrate 2 described later is likely to occur.

Therefore, the thickness of the moisture-proof portion 7 is preferably 10 μm or more and 50 μm or less.
In this case, the moisture-proof portion 7 can be, for example, an aluminum foil having a thickness of 10 μm or more and 50 μm or less. When the thickness of the aluminum foil is 10 μm or more and 50 μm or less, the X-ray transmission amount can be increased by about 20% to 30% as compared with the aluminum foil having a thickness of 100 μm. Further, when the thickness of the aluminum foil is 10 μm or more and 50 μm or less, the occurrence of the above-mentioned leak can be suppressed, and the above-mentioned gap and leak path can be easily confirmed. In addition, the warp of the array substrate 2 described later can be suppressed.

The irradiation of a large amount of X-rays on the human body here has a negative effect on health, so the amount of X-ray irradiation to the human body can be kept to the minimum necessary. Therefore, in the case of the X-ray detector 1 used for medical treatment, the intensity of the X-rays that are emitted may be low, and the intensity of the X-rays that pass through the moisture-proof portion 7 may be extremely low. Since the moisture-proof part 7 according to the present embodiment is a sheet having a thickness of 10 μm or more and 50 μm or less, it is possible to capture an X-ray image even when the intensity of the X-rays to be irradiated is low.

In this case, if the thickness of the moisture-proof part 7 is reduced, the rigidity of the moisture-proof part 7 is reduced. Therefore, if a brim portion or the like is provided to form a three-dimensional moisture-proof portion, for example, cracks are likely to occur when the metal foil is press-molded. As shown in FIG. 2, the vicinity of the peripheral edge of the sheet-shaped moistureproof portion 7 is joined to the outer surface 8 a of the sealing portion 8. Therefore, it is not necessary to previously process the moisture-proof portion 7 into a three-dimensional shape, and the sheet-like moisture-proof portion 7 can be directly bonded to the outer surface 8 a of the sealing portion 8. As a result, even if the moisture-proof portion 7 has a thickness of 10 μm or more and 50 μm or less, it is possible to suppress the occurrence of cracks or the like in the moisture-proof portion 7.

Further, as will be described later, the vicinity of the peripheral edge of the moisture-proof portion 7 is heated to bond the vicinity of the peripheral edge of the moisture-proof portion 7 and the sealing portion 8. In this case, when the temperature in the vicinity of the peripheral edge of the moisture-proof portion 7 and the temperature of the sealing portion 8 decrease, thermal stress is generated between the vicinity of the peripheral edge of the moisture-proof portion 7 and the sealing portion 8. When thermal stress is generated between the vicinity of the peripheral edge of the moisture-proof portion 7 and the sealing portion 8, peeling may occur between the vicinity of the peripheral edge of the moisture-proof portion 7 and the sealing portion 8. If peeling occurs, the moistureproof performance may be significantly reduced. Since the thickness of the moisture-proof portion 7 is 10 μm or more and 50 μm or less, the moisture-proof portion 7 is likely to extend when thermal stress occurs. Therefore, since the thermal stress can be relaxed, it is possible to suppress peeling between the vicinity of the peripheral edge of the moisture-proof portion 7 and the sealing portion 8.

As shown in FIG. 2, the sealing portion 8 is joined to the side surface 5 a of the scintillator 5 and the array substrate 2. In this case, the sealing portion 8 can be brought into close contact with the side surface 5a of the scintillator 5. When the scintillator 5 is an aggregate of a plurality of columnar crystals, unevenness is formed on the side surface 5 a of the scintillator 5. Therefore, if a part of the sealing portion 8 is provided inside the unevenness of the side surface 5a of the scintillator 5, the bonding strength between the sealing portion 8 and the scintillator 5 can be increased. The sealing portion 8 can be brought into close contact with the array substrate 2. If the sealing portion 8 and the array substrate 2 are in close contact with each other, it is possible to prevent moisture contained in the atmosphere from penetrating between the sealing portion 8 and the array substrate 2 and reaching the scintillator 5. be able to.

The shape of the outer surface 8a of the sealing portion 8 may be a curved surface protruding outward. By doing so, the distance L between the outer surface 8a of the sealing portion 8 and the side surface 5a of the scintillator 5 can be increased. Therefore, it is possible to prevent moisture contained in the atmosphere from passing through the inside of the sealing portion 8 and reaching the scintillator 5.
Further, if the shape of the outer surface 8a of the sealing portion 8 is a curved surface projecting to the outside, it is easy to make the peripheral portion of the moisture-proof portion 7 follow the outer surface 8a of the sealing portion 8. Therefore, it becomes easy to bring the moisture-proof portion 7 into close contact with the sealing portion 8. Further, since the moisture-proof portion 7 can be gently deformed, it is possible to prevent the moisture-proof portion 7 from cracking even if the moisture-proof portion 7 is thin.

In addition, as shown in FIG. 2, when the moisture-proof portion 7 is brought into close contact with the sealing portion 8, the peripheral end surface 7 a of the moisture-proof portion 7 contacts the array substrate 2 or the peripheral end surface 7 a is located near the array substrate 2. It is preferable to be located. By doing so, it is possible to effectively prevent the moisture contained in the atmosphere from entering the inside of the sealing portion 8.

Moreover, it is preferable that the height of the sealing portion 8 is equal to or lower than the height of the scintillator 5. If the height of the sealing portion 8 is less than or equal to the height of the scintillator 5, the sheet that becomes the moisture-proof portion 7 can be deformed without difficulty, so that wrinkles, breaks, pinholes, etc. occur in the moisture-proof portion 7. Can be suppressed.

Furthermore, if the height of the sealing portion 8 is lower than the height of the scintillator 5, the vicinity of the peripheral edge of the moistureproof portion 7 can be bent. If the vicinity of the peripheral edge of the moistureproof portion 7 can be bent, the difference between the heat shrinkage amount of the moistureproof portion 7 and the heat shrinkage amount of the array substrate 2 can be absorbed. Therefore, it is possible to suppress the array substrate 2 from being deformed due to thermal stress.
Note that details regarding making the height of the sealing portion 8 lower than the height of the scintillator 5 will be described later (see FIG. 8).

The sealing portion 8 may include a thermoplastic resin as a main component. If the sealing portion 8 contains a thermoplastic resin as a main component, it can be bonded to the array substrate 2, the scintillator 5, and the moistureproof portion 7 by heating. Here, for example, if the sealing portion 8 contains an ultraviolet curable resin as a main component, it is necessary to irradiate ultraviolet rays when the sealing portion 8 is bonded to the array substrate 2, the scintillator 5, and the moistureproof portion 7. is there. However, since the moisture-proof portion 7 contains metal or the like, it cannot transmit ultraviolet rays. If the moisture-proof part 7 transmits ultraviolet rays, the scintillator 5 may be discolored by the ultraviolet rays and the generated fluorescence may be absorbed.
On the other hand, since the sealing portion 8 contains the thermoplastic resin as a main component, the sealing portion 8 can be easily joined by heating. Further, the scintillator 5 is not discolored by ultraviolet rays. Moreover, since the time required for heating and cooling the sealing portion 8 can be short, the manufacturing time can be shortened, and the manufacturing cost can be reduced.

The thermoplastic resin may be, for example, nylon, PET (Polyethyleneterephthalate), polyurethane, polyester, polyvinyl chloride, ABS (Acrylonitrile Butadiene Styrene), acrylic, polystyrene, polyethylene, polypropylene, or the like. In this case, the water vapor transmission coefficient of polyethylene is 0.068 g · mm / day · m ² , and the water vapor transmission coefficient of polypropylene is 0.04 g · mm / day · m ² . Therefore, if the sealing portion 8 contains at least one of polyethylene and polypropylene as a main component, it is possible to significantly reduce the amount of water that permeates the inside of the sealing portion 8 and reaches the scintillator 5.
The rigidity of the thermoplastic resin can be made lower than the rigidity of the moisture-proof portion 7.

Further, the sealing part 8 can further include a filler using an inorganic material. If the filler made of an inorganic material is included in the sealing portion 8, the permeation of water can be further suppressed. The inorganic material can be, for example, talc, graphite, mica, kaolin (clay containing kaolinite as a main component), or the like. The filler can have, for example, a flat shape. The moisture that has entered the inside of the sealing portion 8 from the outside is prevented from diffusing by the filler made of an inorganic material, so that the speed at which the moisture passes through the sealing portion 8 can be reduced. Therefore, the amount of water reaching the scintillator 5 can be reduced.

Here, the X-ray detector 1 stored in a high temperature and high humidity environment may be used in a lower temperature environment. In such a case, the water vapor inside the casing is condensed. , X-ray detector 1 may be attached to the surface. If there are fine cracks on the outer surface 8a of the sealing portion 8, water attached to the surface may enter the cracks and be guided to the inside of the sealing portion 8. In addition, the X-ray detector 1 may be transported to an environment below freezing and the water that has entered the crack may freeze. When the water that has entered the cracks freezes, the volume increases, so that the cracks become larger and the water easily enters. If the above is repeated, the sealing part 8 may be damaged, the moisture-proof part 7 and the sealing part 8 may be peeled off, or the array substrate 2 and the sealing part 8 may be peeled off.
Therefore, it is preferable that at least the outer surface 8a of the sealing portion 8 has water repellency. If at least the outer surface 8a of the sealing portion 8 has water repellency, it is possible to prevent moisture from entering the cracks.
For example, a water repellent agent can be applied to the outer surface 8a of the sealing portion 8. If the sealing portion 8 contains at least one of polyethylene and polypropylene as the main component, the outer surface 8a having water repellency can be obtained.

Also, immediately after applying the thermoplastic resin in a frame shape, it is preferable to observe the inside to check for the presence of bubbles, foreign matters, leak paths, and the like. If such a check can be performed visually or using an optical microscope, the production efficiency can be improved. Therefore, it is preferable that the thermoplastic resin applied in a frame shape is transparent even in the thickest portion. That is, it is preferable that the sealing portion 8 has a light-transmitting property. By doing so, it is possible to easily remove a product that has a bubble, a foreign substance, a leak path, and the like, which may shorten the life. Therefore, the quality of the product can be improved.

Next, returning to FIG. 1, the circuit board 11 will be described.
As shown in FIG. 1, the circuit board 11 is provided on the side of the array substrate 2 opposite to the side on which the scintillator 5 is provided. The circuit board 11 is electrically connected to the X-ray detection module 10 (array board 2).
As shown in FIG. 3, the circuit board 11 is provided with a read circuit 11a and a signal detection circuit 11b. Note that these circuits can be provided on one substrate or these circuits can be provided separately on a plurality of substrates.

The readout circuit 11a switches the thin film transistor 2b2 between an on state and an off state.
The read circuit 11a includes a plurality of gate drivers 11aa and a row selection circuit 11ab.
A control signal S1 is input to the row selection circuit 11ab from an image processing unit (not shown) provided outside the X-ray detector 1. The row selection circuit 11ab inputs the control signal S1 to the corresponding gate driver 11aa according to the scanning direction of the X-ray image.
The gate driver 11aa inputs the control signal S1 to the corresponding control line 2c1.
For example, the read circuit 11a sequentially inputs the control signal S1 for each control line 2c1 via the flexible printed board 2e1. The thin film transistor 2b2 is turned on by the control signal S1 input to the control line 2c1, and the electric charge (image data signal S2) from the storage capacitor can be received.

The signal detection circuit 11b has a plurality of integration amplifiers 11ba, a plurality of selection circuits 11bb, and a plurality of AD converters 11bc.
One integrating amplifier 11ba is electrically connected to one data line 2c2. The integrating amplifier 11ba sequentially receives the image data signal S2 from the photoelectric conversion unit 2b. Then, the integrating amplifier 11ba integrates the current flowing within a fixed time and outputs a voltage corresponding to the integrated value to the selection circuit 11bb. By doing so, it becomes possible to convert the value of the current (charge amount) flowing through the data line 2c2 into the voltage value within a predetermined time. That is, the integrating amplifier 11ba converts the image data information corresponding to the intensity distribution of fluorescence generated in the scintillator 5 into potential information.

The selection circuit 11bb selects the integration amplifier 11ba to be read, and sequentially reads the image data signal S2 converted into potential information.
The AD converter 11bc sequentially converts the read image data signal S2 into a digital signal. The image data signal S2 converted into a digital signal is input to the image processing unit via the wiring. The image data signal S2 converted into a digital signal may be wirelessly transmitted to the image processing unit.

The image processing unit forms an X-ray image based on the image data signal S2 converted into a digital signal. The image processing section may be integrated with the circuit board 11.

Next, an X-ray detection module according to another embodiment will be described.
4A and 4B are schematic cross-sectional views for illustrating an X-ray detection module 10a according to another embodiment.
As will be described later, the sealing unit 8 applies a softened thermoplastic resin in a frame shape on the array substrate 2 or a thermoplastic resin is provided in a frame shape on the array substrate 2 by a 3D printer or the like. It is formed by doing. Therefore, the dimensions of the sealing portion 8 may vary.

If the dimensions of the sealing portion 8 vary, the peripheral end surface 7a of the moisture-proof portion 7 may interfere with the array substrate 2 and wrinkles may occur near the periphery of the moisture-proof portion 7. If wrinkles or the like occur near the periphery of the moistureproof portion 7, the moistureproof portion 7 may be peeled off.
In this case, as shown in FIG. 4A, a distance H1 can be provided between the peripheral end surface 17a of the moisture-proof portion 17 and the array substrate 2. For example, the dimension of the sheet-like moisture-proof portion 17 may be set to be short. By doing so, it is possible to suppress the occurrence of wrinkles or the like near the peripheral edge of the moisture-proof portion 17 even if the dimensions of the sealing portion 8 vary.

In this case, if the distance H1 is too large, there is a possibility that a large amount of water will enter the inside of the sealing portion 8. According to the knowledge obtained by the present inventors, it is preferable that the distance H1 is equal to or less than half the height H2 of the sealing portion 8 as shown in FIG. In this case, the smaller the distance H1 is, the smaller the amount of water that enters the inside of the sealing portion 8 is.

FIG. 5 is a schematic cross-sectional view for illustrating an X-ray detection module 10b according to another embodiment.
FIG. 6A is a schematic plan view of the moisture-proof portion 17.
FIG. 6B is a schematic perspective view of the moisture-proof portion 17.
As shown in FIG. 5, the vicinity of the peripheral edge of the moisture-proof portion 17 can be bent along the array substrate 2. That is, a bent portion 17b can be provided along the array substrate 2 at the peripheral edge of the moisture-proof portion 17. In this case, the bent portion 17b can be attached to the array substrate 2. In this way, the outer surface 8a of the sealing portion 8 can be covered with the moisture-proof portion 17, so that it is possible to effectively prevent moisture from entering the moisture-proof portion 17. If the size of the bent portion 17b is too large, the X-ray detection module 10b and the X-ray detector 1 may not be downsized. Therefore, the size of the bent portion 17b is preferably 2 mm or less, for example.

Further, bending the vicinity of the peripheral edge of the moisture-proof portion 17 causes the following problems.
The moisture-proof part 17 can be formed using a sheet having no distortion or unevenness. When the scintillator 5 is covered with a sheet to be the moisture-proof portion 17, the sheet is floated from the array substrate 2 by the thickness of the scintillator 5. It is easy to bend the vicinity of the peripheral edge of the sheet in such a state to the array substrate 2 side along the sealing portion 8, and the stretching stress is hardly applied to the sheet.

However, it is geometrically impossible to fold the sheet in the same shape as the sides at the corners of the frame-shaped sealing portion 8. Therefore, it is necessary to stretch a part of the sheet so as to be along the sealing portion 8.
The moisture-proof part 17 is required to have a function of shielding moisture from the outside, but if a part of the sheet is stretched, that part may become thin, fine cracks may occur, or pinholes may occur. There is. If cracks or pinholes occur, the ability to shield moisture will be reduced.

In this case, as shown in FIGS. 6 (a) and 6 (b), if the convex portion 17c protruding outward is provided at the corner of the moisture-proof portion 17, the above-mentioned geometrical distortion can be absorbed. can do. Therefore, since it is possible to prevent a part of the sheet from being stretched, it is possible to suppress the occurrence of cracks and pinholes.

FIG. 7 is a schematic cross-sectional view for illustrating an X-ray detection module 10c according to another embodiment.
As described above, the material of the array substrate 2, the material of the scintillator 5, the material of the moistureproof portion 7, and the material of the sealing portion 8 are different. Therefore, each has a different linear expansion coefficient. Here, since heat is generated while the X-ray detection module 10c is activated, these temperatures become high. In addition, the temperature around the X-ray detector 1 may change. Therefore, thermal stress is generated between them according to the temperature change. In this case, when the tensile stress F is generated in the moisture-proof portion 7, the tensile stress F is applied to the joint portion between the moisture-proof portion 7 and the sealing portion 8 or the joint portion between the sealing portion 8 and the array substrate 2 to cause peeling or breakage. May occur. When peeling or breakage occurs, moisture easily reaches the scintillator 5. In addition, the array substrate 2 may be deformed such as warped.

Therefore, in the X-ray detection module 10c according to the present embodiment, the recess 8a1 is provided on the outer surface 8a of the sealing portion 8. If the recess 8a1 is provided, the vicinity of the recess 8a1 is easily deformed. Therefore, the generated tensile stress F can be relaxed by deforming the vicinity of the recess 8a1.

Further, the bending portion 7c can be provided at a portion of the moisture-proof portion 7 facing the recess 8a1. The flexible portion 7c can be elastically deformed more easily than the portion of the moisture-proof portion 7 where the flexible portion 7c is not provided. If the bending portion 7c is provided, the tensile stress F generated can be relaxed by elastically deforming the bending portion 7c. In this case, the flexible portion 7c and the recess 8a1 may be in contact with each other, or a gap may be provided between the flexible portion 7c and the recess 8a1 as shown in FIG. If the bending portion 7c and the concave portion 8a1 are in contact with each other, the rigidity of the bending portion 7c can be increased, so that the bending portion 7c can be prevented from breaking or pinholes. If a gap is provided between the bending portion 7c and the recess 8a1, the bending portion 7c can be easily deformed, and the tensile stress F can be eased easily.
If the tensile stress F can be relaxed, peeling or breakage of the moisture-proof portion 7 can be suppressed. In addition, it is possible to prevent the array substrate 2 from being deformed such as warped.

Further, as shown in FIG. 15 described later, a convex portion 18c may be provided on the outer surface 8a of the sealing portion 8. The details of the convex portion 18c will be described later.

FIG. 8 is a schematic cross-sectional view for illustrating an X-ray detection module 10d according to another embodiment.
As shown in FIG. 8, the height H3 of the sealing portion 8 can be made lower than the height H4 of the scintillator 5. If the height H3 of the sealing portion 8 is lower than the height H4 of the scintillator 5, the vicinity of the peripheral edge of the moistureproof portion 7 can be bent. That is, in this way, it becomes easy to provide the bending portion 7d near the peripheral edge of the moisture-proof portion 7. The flexible portion 7d can be elastically deformed more easily than the portion of the moisture-proof portion 7 where the flexible portion 7d is not provided. If the bending portion 7d is provided, the same effect as that of the bending portion 7c described above can be obtained. That is, since the flexural portion 7d is elastically deformed, the generated tensile stress F can be relaxed, so that the moisture-proof portion 7 may be peeled off or broken, or the array substrate 2 may be deformed such as warped. Can be suppressed.

For example, the coefficient of linear expansion of the moisture-proof part 7 using aluminum foil is about 23 × 10 ⁻⁶ . The linear expansion coefficient of the array substrate 2 is about 4 × 10 ⁻⁶ . Therefore, when the temperature of the moisture-proof portion 7 fixed to the sealing portion 8 decreases, the moisture-proof portion 7 shrinks more than the array substrate 2. In this case, if the moisture-proof portion 7 has a substantially completely flat shape, the difference in shrinkage amount cannot be absorbed and the array substrate 2 warps. On the other hand, if the bending portions 7c and 7d are provided, the difference in shrinkage amount can be absorbed, so that the array substrate 2 can be prevented from warping.

In this case, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 can be equal to or more than the thickness of the moistureproof portion 7. For example, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 can be 0.1 mm or more. On the other hand, if the height H3 of the sealing portion 8 is too low, the moisture-proof portion 7 and the array substrate 2 may be short-circuited when a high voltage such as static electricity is applied. Therefore, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 is preferably 0.5 mm or less. That is, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 is preferably 0.1 mm or more and 0.5 mm or less.

According to the knowledge obtained by the present inventors, the height H3 of the sealing portion 8 is preferably 30% or more and 70% or less of the height H4 of the scintillator 5. By setting the height H3 of the sealing portion 8 in this way, it is possible to suppress the warp of the array substrate 2 described above, reduce the amount of moisture per unit time, and reduce the amount of material required for forming the sealing portion 8. It can be reduced.

For example, the effect of reducing the amount of moisture per unit time can be considered as follows.
The total moisture permeation amount of the moisture-proof portion 7 and the sealing portion 8 is Q, the moisture permeation amount of the moisture preventing portion 7 per unit time is Q7, and the moisture permeation amount of the sealing portion 8 per unit time is Q8. Then, the following formula is established.
Q = Q7 + Q8
In this case, Q7 is considered to be substantially constant, so the increase / decrease in Q is substantially determined by the increase / decrease in Q8.
Here, the moisture permeability coefficient of the sealing portion 8 is P, the moisture permeability cross-sectional area of the sealing portion 8 is S (mm ² ), the moisture permeability width of the sealing portion 8 is W, and the peripheral length of the sealing portion 8 is L. (Mm) and the height of the sealing portion 8 is H (mm), the following formula is established.
Q8 = P × S / W = P × L × H / W
Therefore, if the height H of the sealing portion 8 is reduced, the amount of moisture permeation Q8 of the sealing portion 8 per unit time can be reduced, and as a result, the total of the moisture-proof portion 7 and the sealing portion 8 per unit time can be reduced. The moisture permeation amount Q per hit can be reduced.
That is, since the moisture resistance can be improved, the reliability of the X-ray detection module 10 can be improved.

FIG. 9A and FIG. 9B are schematic cross-sectional views for illustrating the bending portion 7e according to another embodiment.
As shown in FIGS. 9A and 9B, the bending portion 7e can be provided in a region of the moisture-proof portion 7 that faces the upper surface 5b of the scintillator 5. The flexure 7e can be embossed, for example. The surface of the flexible portion 7e on the side opposite to the scintillator 5 side (the surface on the side on which the X-rays are incident) protrudes outward from the surface of the moistureproof portion 7 on the side opposite to the scintillator 5 side. The surface of the flexible portion 7e of the scintillator 5 projects outward from the surface of the moisture-proof portion 7 on the scintillator 5 side.

The thickness of the flexible portion 7e can be made substantially the same as the thickness of the moisture-proof portion 7 where the flexible portion 7e is not provided. The flexible portion 7e can be formed, for example, by subjecting the sheet-shaped moisture-proof portion 7 to press working (embossing) using a press stamping die. Even with a low-moisture-permeable and moisture-proof film in which a resin film and a film made of an inorganic material are laminated, the bending portion 7e can be formed by performing press processing (embossing) using a stamping die.

The height dimension of the flexible portion 7e can be made larger than the wall thickness dimension of the moisture-proof portion 7 where the flexible portion 7e is not provided. There is no particular limitation on the width dimension, number, arrangement, etc. of the flexible portions 7e. The width dimension, the number, the arrangement, and the like of the flexible portion 7e can be appropriately determined according to the magnitude of the heat shrinkage amount described above, the size of the moisture-proof portion 7, and the like.

The flexible portion 7e can be elastically deformed more easily than the portion of the moisture-proof portion 7 where the flexible portion 7e is not provided. Therefore, the flexible portion 7e elastically deforms to absorb the difference in the thermal contraction amount based on the difference in the linear expansion coefficient. Therefore, by providing the bending portion 7e, it is possible to prevent the array substrate 2 from warping.
In this case, as shown in FIG. 9A, the moisture-proof portion 7 may be provided with only the bending portion 7e, or as shown in FIG. 9B, the moisture-proof portion 7 may be provided with the bending portion 7e. At the same time, the bending portions 7d and 7c can be provided near the peripheral edge of the moisture-proof portion 7.

FIG. 10 is a schematic cross-sectional view for illustrating the X-ray detection module 110 according to the comparative example.
As shown in FIG. 10, if the sealing portion 8 is bonded to the array substrate 2 and is not bonded to the side surface 5a of the scintillator 5, the sealing portion 8 is likely to peel off. For example, as described above, thermal stress is generated due to a change in temperature due to activation and a change in ambient temperature. In this case, if the sealing portion 8 is bonded only to the array substrate 2, the bonding strength of the sealing portion 8 becomes low. Therefore, the generated thermal stress may cause peeling of the sealing portion 8.

On the other hand, in the X-ray detection modules 10, 10a to 10c according to the present embodiment, the sealing portion 8 is joined to the side surface 5a of the scintillator 5 and the array substrate 2. The sealing portion 8 is in close contact with the side surface 5 a of the scintillator 5. Further, a part of the sealing portion 8 is provided inside the unevenness of the side surface 5 a of the scintillator 5. Therefore, since the bonding strength of the sealing portion 8 can be increased, it is possible to prevent the sealing portion 8 from peeling off due to thermal stress.

FIG. 11 is a schematic cross-sectional view for illustrating the X-ray detection module 110a according to the comparative example.
As shown in FIG. 11, the exposed portion 118a1 of the outer surface 118a of the sealing portion 118 is an inclined surface that is inclined toward the scintillator 5 toward the array substrate 2 side. Therefore, in the vicinity of the array substrate 2, the distance L between the outer surface 118a of the sealing portion 118 and the side surface 5a of the scintillator 5 becomes short. Therefore, moisture contained in the atmosphere easily penetrates between the sealing portion 118 and the array substrate 2 and reaches the scintillator 5.

On the other hand, in the X-ray detection modules 10, 10a to 10c according to the present embodiment, the outer surface 8a of the sealing portion 8 has a curved surface protruding outward. Therefore, in the vicinity of the array substrate 2, the distance L between the outer surface 18a of the sealing portion 18 and the side surface 5a of the scintillator 5 can be increased, so that moisture contained in the atmosphere reaches the scintillator 5. It will be difficult.

FIG. 12 is a schematic cross-sectional view for illustrating the X-ray detection module 110b according to the comparative example.
As shown in FIG. 12, if the height of the sealing portion 128 is higher than that of the scintillator 5, it is necessary to force the sheet to be the moistureproof portion 17 to be deformed. Therefore, wrinkles, breaks, pinholes, etc. are likely to occur in the moisture-proof portion 17.
Further, the exposed portion of the outer surface 128a of the sealing portion 128 is likely to be large. When the exposed portion becomes large, the water permeation cross section becomes large, so that a larger amount of water easily enters the sealing portion 128.

On the other hand, in the X-ray detection modules 10, 10a to 10c according to the present embodiment, since the height of the sealing portion 8 is equal to or lower than the height of the scintillator 5, a sheet to be the moistureproof portion 7 should be used. It can be easily transformed. Therefore, it is possible to suppress wrinkles, breakage, pinholes, and the like from occurring in the moisture-proof portion 7.

FIG. 13 is a schematic cross-sectional view for illustrating the X-ray detection module 110c according to the comparative example.
As shown in FIG. 13, when the outer surface 138a of the sealing portion 138 is a plane perpendicular to the array substrate 2, it becomes difficult to cover the outer surface 138a with the moistureproof portion 117. If the outer surface 138a is not covered with the moisture-proof portion 117, the water permeation cross section becomes large, so that a larger amount of water easily enters the sealing portion 138. In this case, if the peripheral portion 117a of the moisture-proof portion 117 is bent so as to cover the outer surface 138a, cracks or fractures are likely to occur in the bent portion 117b. When cracks or breaks occur, water may enter through the cracks or breaks.

On the other hand, in the X-ray detection modules 10, 10a to 10c according to the present embodiment, the outer surface 8a of the sealing portion 8 has a curved surface protruding outward. Therefore, when the outer surface 8a is covered with the sealing portion 7, there is no portion in which the sealing portion 7 needs to be forcibly bent. Therefore, the outer surface 8a can be covered with the sealing portion 7 without cracking or breaking.

(Method of manufacturing X-ray detection module and method of manufacturing X-ray detector)
Next, a method for manufacturing the X-ray detection module and a method for manufacturing the X-ray detector will be illustrated.
First, the array substrate 2 is manufactured by sequentially forming the control line 2c1, the data line 2c2, the wiring pad 2d1, the wiring pad 2d2, the photoelectric conversion section 2b, the protective layer 2f and the like on the substrate 2a. The array substrate 2 can be manufactured using, for example, a semiconductor manufacturing process. Since a known technique can be applied to the manufacture of the array substrate 2, detailed description will be omitted.

Next, the scintillator 5 is formed so as to cover the effective pixel area A on the substrate 2a.
For example, the scintillator 5 can be formed using a vacuum vapor deposition method. If the scintillator 5 is formed by using the vacuum evaporation method, the scintillator 5 composed of an aggregate of a plurality of columnar crystals is formed. The thickness of the scintillator 5 can be appropriately changed according to the DQE characteristics, sensitivity characteristics, resolution characteristics and the like required for the X-ray detector 1. The scintillator 5 can have a thickness of, for example, about 600 μm.

Further, a light-emitting substance and a binder material are mixed, the mixed material is applied so as to cover the effective pixel region A, and this is baked, and a matrix-shaped groove is formed in the baked material to form a plurality of photoelectric conversions. A square column scintillator 5 may be provided for each part 2b.

Next, the reflective layer 6 is formed on the scintillator 5.
For example, the reflective layer 6 can be formed by applying a coating liquid, which is a mixture of a plurality of light-scattering particles, a resin, and a solvent, onto the scintillator 5 and drying the coating liquid.
Further, for example, the reflective layer 6 can be formed by forming a layer made of a metal having a high light reflectance such as silver alloy or aluminum on the scintillator 5.
In addition, for example, a sheet made of a metal having a high light reflectance such as a silver alloy or aluminum, or a resin sheet containing light scattering particles is provided on the scintillator 5 or attached to form the reflection layer 6. It can be provided.

Next, the sealing part 8 is formed.
For example, the thermoplastic resin is softened using a solvent, the softened thermoplastic resin is applied in a frame shape around the scintillator 5, and the solvent is evaporated to solidify the thermoplastic resin to form the sealing portion 8. can do.
In addition, for example, the thermoplastic resin is softened by heating, and the softened thermoplastic resin is applied in a frame shape around the scintillator 5, and the thermoplastic resin is solidified by heat radiation or the like to form the sealing portion 8. can do.
Alternatively, the frame-shaped sealing portion 8 can be formed using, for example, a 3D printer.

FIG. 14 is a schematic perspective view for illustrating application of the thermoplastic resin 18 according to the comparative example. As described above, the softened thermoplastic resin 18 is applied in a frame shape. Therefore, at least one joint 18a is formed. When the softened thermoplastic resin 18 is applied in a frame shape, if the supply amount of the thermoplastic resin 18 per unit time is made constant, or the moving speed B of the nozzle for discharging the thermoplastic resin 18 is made constant, As shown in FIG. 14, a dent 18b may occur at the joint 18a between the supply start point and the supply end point. For example, when the supply start point and the supply end point are separated from each other, a sharp depression 18b having a height lower than the surroundings may be formed at the joint 18a between the supply start point and the supply end point. When the steep depression 18b is formed, the sheet that becomes the moisture-proof portion 7 cannot be along the depression 18b, which may cause a leak path. At the leak path portion, the moisture-proof portion 7 and the outer surface 8a of the sealing portion 8 are not joined to each other, and water easily enters through the leak path.

FIG. 15 is a schematic perspective view for illustrating application of the thermoplastic resin 18 according to this embodiment.
As shown in FIG. 15, a protrusion 18c can be formed on the joint 18a. For example, the convex portion 18c can be formed by increasing the supply amount of the thermoplastic resin 18 per unit time or slowing the moving speed B of the nozzle at the joint 18a. In this case, it is preferable that the convex portion 18c having a gentle outer surface and having a low height is formed.
Compared with the steep depression 18b, it is easier to arrange the sheet to be the moisture-proof portion 7 along the convex portion 18c. Therefore, it is possible to suppress the occurrence of a leak path.

Next, the sheet serving as the moisture-proof portion 7 is covered on the scintillator 5, the reflection layer 6, and the sealing portion 8, and the periphery of the sheet is bonded to the outer surface 8 a of the sealing portion 8.
For example, the moisture-proof portion 7 can be joined by heating the sheet while pressing the periphery of the sheet against the outer surface 8a of the sealing portion 8 to melt the outer surface 8a of the sealing portion 8. The moisture-proof portion 7 is formed by joining the sheet to the outer surface 8 a of the sealing portion 8.
The joining of the sheets can be performed in an environment depressurized below atmospheric pressure.

The sheet is bonded to the outer surface 8a of the sealing portion 8 in an environment where the pressure is lower than the atmospheric pressure.
As a result, it is possible to prevent the air containing water vapor from being stored inside the moisture-proof portion 7. Even when the X-ray detector 1 is placed in an environment where the pressure is lower than atmospheric pressure, such as when the X-ray detector 1 is transported by an aircraft, the air inside the moisture-proof section 7 prevents It is possible to prevent the moistureproof portion 7 from expanding or deforming. Further, since the moisture-proof portion 7 is pressed down by the atmospheric pressure, the moisture-proof portion 7 comes into close contact with the scintillator 5.
As described above, the X-ray detection modules 10, 10a to 10c can be manufactured.

Next, the array substrate 2 and the circuit board 11 are electrically connected via the flexible printed boards 2e1 and 2e2.
In addition, circuit components and the like are appropriately mounted.

Next, the array substrate 2, the circuit board 11 and the like are stored inside a casing (not shown).
In this case, if the warp of the array substrate 2 is large, the array substrate 2 may interfere with a member stored inside the housing, or the array substrate 2 may interfere with the inner wall of the housing. As described above, with the X-ray detection module 10 according to the present embodiment, warpage of the array substrate 2 can be suppressed, so that work in the assembly process can be facilitated.
Further, if necessary, an electrical test or an X-ray image test for confirming whether or not there is an abnormality in the photoelectric conversion element 2b1 or whether or not there is an abnormality in electrical connection can be performed.
The X-ray detector 1 can be manufactured as described above.
In addition, in order to confirm the moisture-proof reliability of the product and the reliability against changes in the temperature environment, a high-temperature high-humidity test, a thermal cycle test, and the like can be performed.

As described above, the method of manufacturing the X-ray detection module according to this embodiment can include the following steps.
A step of forming the scintillator 5 on the plurality of photoelectric conversion units 2b provided on the array substrate 2.
A step of forming the sealing portion 8 by applying the softened thermoplastic resin 18 around the scintillator 5 in a frame shape.
A step of covering the scintillator 5 and the sealing portion 8 with a sheet to be the moisture-proof portion 7, heating the periphery of the sheet, and joining the periphery of the sheet to the outer surface 8a of the sealing portion 8.
In this case, in the step of forming the sealing portion 8, the convex portion 18c can be formed at the joint 18a for coating.

Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are also included in the invention described in the claims and the scope of equivalents thereof. Further, the above-described respective embodiments can be implemented in combination with each other.

Claims (26)

1. An array substrate having a plurality of photoelectric conversion units,
   A scintillator provided on the plurality of photoelectric conversion units,
   A thermoplastic resin as a main component, provided around the scintillator, a frame-shaped sealing portion joined to the array substrate and the scintillator,
   A moisture-proof portion that covers the upper side of the scintillator and has a peripheral edge portion joined to the outer surface of the sealing portion,
   Equipped with
   The radiation detecting module, wherein the outer surface of the sealing portion has a curved surface protruding outward.
2. The radiation detection module according to claim 1, wherein a peripheral end surface of the moisture-proof portion is in contact with the array substrate.
3. The radiation detection module according to claim 1, wherein a peripheral end surface of the moisture-proof portion is provided near the array substrate.
4. The radiation detection module according to claim 1, wherein the distance between the peripheral end surface of the moisture-proof portion and the array substrate is half the height of the sealing portion or less.
5. The radiation detection module according to claim 1, wherein a bent portion along the array substrate is provided on a peripheral edge of the moisture-proof portion.
6. The radiation detection module according to claim 5, wherein a convex portion protruding outward is provided at a corner portion of the moisture-proof portion.
7. The radiation detection module according to any one of claims 1 to 6, wherein a concave portion is provided on the outer surface of the sealing portion.
8. The radiation detection module according to claim 7, wherein a bending portion is provided in a portion of the moisture-proof portion facing the recess.
9. The radiation detection module according to any one of claims 1 to 8, wherein a convex portion is provided on the outer surface of the sealing portion.
10. The radiation detection module according to any one of claims 1 to 9, wherein the height of the sealing portion is less than or equal to the height of the scintillator.
11. The radiation detection module according to claim 10, wherein a difference between a height of the scintillator and a height of the sealing portion is 0.1 mm or more and 0.5 mm or less.
12. The radiation detection module according to claim 10 or 11, wherein the height of the sealing portion is 30% or more and 70% or less of the height of the scintillator.
13. The side surface of the scintillator is provided with irregularities,
    The radiation detection module according to any one of claims 1 to 12, wherein a part of the sealing portion is provided inside the unevenness on the side surface of the scintillator.
14. The radiation detection module according to any one of claims 1 to 13, wherein the sealing portion has a light-transmitting property.
15. The radiation detection module according to any one of claims 1 to 14, wherein at least the outer surface of the sealing portion has water repellency.
16. The radiation detection module according to any one of claims 1 to 15, wherein the thermoplastic resin is at least one of polyethylene and polypropylene.
17. The radiation detection module according to any one of claims 1 to 16, wherein the thermoplastic resin further contains a filler using an inorganic material.
18. 18. The moisture-proof part is any one of a sheet containing a metal, a laminated sheet in which a resin film and a metal film are laminated, and a laminated sheet in which a resin film and an inorganic film are laminated. The radiation detection module according to one.
19. The radiation detection module according to any one of claims 1 to 18, wherein the moisture-proof part has a thickness of 10 μm or more and 50 μm or less.
20. The moisture-proof portion has a flexible portion,
    The radiation detecting module according to any one of claims 1 to 19, wherein the flexible portion is elastically deformable more easily than a portion of the moisture-proof portion where the flexible portion is not provided.
21. The radiation detection module according to any one of claims 1 to 20, wherein a rigidity of the thermoplastic resin is lower than a rigidity of the moisture-proof part.
22. The radiation detection module according to any one of claims 1 to 21, wherein a pressure of a space defined by the sealing portion and the moistureproof portion is lower than atmospheric pressure.
23. The radiation detection module according to any one of claims 1 to 22, wherein the scintillator contains cesium iodide (CsI): thallium (Tl).
24. The radiation detection module according to any one of claims 1 to 23, further comprising a reflection layer provided between the scintillator and the moistureproof portion.
25. A radiation detection module according to any one of claims 1 to 24;
    A circuit board electrically connected to the radiation detection module,
    Radiation detector equipped with.
26. A step of forming a scintillator on a plurality of photoelectric conversion units provided on the array substrate,
    A step of applying a softened thermoplastic resin in a frame shape around the scintillator to form a sealing portion,
    A step of covering a sheet to be a moisture-proof section on the scintillator and the sealing section, heating the peripheral edge of the sheet, and bonding the peripheral edge of the sheet to the outer surface of the sealing section,
    Equipped with
    A method of manufacturing a radiation detection module, wherein a convex portion is formed at a joint of application in the step of forming the sealing portion.

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