TW202037928A - Radiation detection module, radiation detector, and radiation detection module production method - Google Patents

Abstract

A radiation detection module according to an embodiment comprises: an array substrate that has a plurality of photoelectric conversion parts; a scintillator that is provided on top of the plurality of photoelectric conversion parts; a frame-like sealing part that includes a thermoplastic resin as the main component, is provided at the periphery of the scintillator, and is joined to the array substrate and the scintillator; and an anti-moisture part that covers the upper part of the scintillator and is joined to the outer surface of the sealing part near the peripheral edge of the anti-moisture part. The shape of the outer surface of the sealing part is that of an outwardly protruding curved surface.

Description

Radiation detection module, radiation detector and manufacturing method of radiation detection module

The embodiment of the present invention relates to a radiation detection module, a radiation detector, and a method for manufacturing the radiation detection module.

An example of a radiation detector is an X-ray detector. The X-ray detector is equipped with a scintillator that converts X-rays into fluorescence, and an array substrate that converts fluorescence into electrical signals. In addition, in order to increase the efficiency of fluorescent utilization and improve the sensitivity characteristics, there are cases where a reflective layer is provided on the scintillator. Here, in order to suppress the deterioration of the characteristics due to water vapor or the like, the scintillator and the reflective layer need to be isolated from the external atmosphere. For example, when the scintillator contains CsI (cesium iodide): Tl (thallium) or CsI: Na (sodium), etc., there is a possibility that the characteristics of the scintillator may deteriorate due to water vapor or the like.

Therefore, a technology of covering the scintillator and the reflective layer with a hat-shaped moisture-proof part and adhering the brim (hat edge) of the moisture-proof part to the array substrate is proposed as a structure that can achieve high moisture-proof performance. However, if the brim portion of the moisture-proof part is adhered to the array substrate, a space for adhering the brim portion to the periphery of the scintillator is required. In recent years, miniaturization of X-ray detectors has been desired, but if a hat-shaped moisture-proof part is used, there is a possibility that miniaturization of X-ray detectors cannot be achieved.

Moreover, if a large amount of X-ray irradiation is performed on the human body, it will have an adverse effect on health. Therefore, the amount of X-ray irradiation on the human body is suppressed to the minimum necessary. For this reason, in the case of X-ray detectors used in medical treatment, the intensity of the irradiated X-rays may decrease, and the intensity of X-rays passing through the moisture-proof part may become very small. In this case, if the thickness of the moisture-proof part is made thin, the strength of X-rays transmitted can be increased. However, once the thickness of the hat-shaped moisture-proof part is made thin, cracks and the like are likely to occur when foil such as aluminum is formed into the hat shape. Therefore, it is desired to develop a technology that can reduce the size of the X-ray detector and can reduce the thickness of the moisture-proof portion. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2009-128023 A

(The problem to be solved by the invention)

The problem to be solved by the present invention is to provide a radiation detection module that can reduce the size of the radiation detector and can reduce the thickness of the moisture-proof part, a radiation detector and a method for manufacturing the radiation detection module. (Means to solve the problem)

The radiation detection module of the implementation form has: An array substrate, which has a plurality of photoelectric conversion parts; A scintillator, which is arranged on the aforementioned plural photoelectric conversion parts; A frame-shaped sealing portion containing thermoplastic resin as a main component is provided around the scintillator and is bonded to the array substrate and the scintillator; and The moisture-proof part covers the upper part of the scintillator, and is joined to the outer surface of the sealing part near the periphery. The shape of the outer surface of the aforementioned sealing portion is a curved surface protruding to the outside.

Hereinafter, referring to the drawings, the relevant embodiments are described as examples. In addition, in each drawing, the same symbols are attached to the same components, and detailed descriptions are omitted as appropriate. In addition, the radiation detector of the embodiment of the present invention can be applied to various radiation such as gamma rays in addition to X-rays. Here, the case of a representative X-ray among radiation rays is given as an example. Therefore, by replacing "X-ray" in the following embodiment with "other radiation", it can also be applied to other radiation. In addition, the radiation detector can be used in general medical care, for example. However, the use of radiation detectors is not limited to general medical treatment.

(X-ray detector and X-ray detection module) FIG. 1 is a schematic perspective view for illustrating an X-ray detector 1 and an X-ray detection module 10 of this embodiment. In addition, in order to avoid becoming complicated, in FIG. 1, the protective layer 2f, the reflective layer 6, the moisture-proof part 7, the sealing part 8 and the like are omitted for drawing. FIG. 2 is a schematic cross-sectional view used to illustrate the X-ray detection module 10. FIG. 3 is a block diagram of the X-ray detector 1.

As shown in FIGS. 1 and 2, the X-ray detector 1 is provided with an X-ray detection module 10 and a circuit board 11. In addition, the X-ray detector 1 can be provided with a housing (not shown). The X-ray detection module 10 and the circuit board 11 can be installed inside the frame. For example, a plate-shaped support plate 12 can be provided inside the frame, and the X-ray detection module 10 can be provided on the surface of the support plate 12 on the side of the X-ray injection side, opposite to the side of the X-ray injection side of the support plate 12 The circuit board 11 is provided on the side surface.

The X-ray detection module 10 is provided with an array substrate 2, a scintillator 5, a reflective layer 6, a moisture-proof part 7 and a sealing part 8. The array substrate 2 has a substrate 2a, a photoelectric conversion portion 2b, a control line (or gate line) 2c1, a data line (or signal line) 2c2, a wiring pad 2d1, a wiring pad 2d2, and a protective layer 2f. In addition, the number of photoelectric conversion parts 2b, control lines 2c1, and data lines 2c2, etc. are not limited to examples.

The substrate 2a has a plate shape and is formed of glass such as alkali-free glass. The planar shape of the substrate 2a can be quadrangular. The thickness of the substrate 2a can be set to about 0.7 mm, for example. The photoelectric conversion unit 2b is provided in plural on one surface side of the substrate 2a. The photoelectric conversion portion 2b has a rectangular shape and is provided in a region partitioned by the control line 2c1 and the data line 2c2. The plural photoelectric conversion units 2b are arranged in a matrix. In addition, one photoelectric conversion unit 2b is a pixel corresponding to one X-ray image.

Each of the plural photoelectric conversion portions 2b is a thin film transistor (TFT; Thin Film Transistor) 2b2 provided with a photoelectric conversion element 2b1 and a switching element. In addition, a storage capacitor (not shown) that stores the signal charge converted in the photoelectric conversion element 2b1 may be provided. The storage capacitor has, for example, a rectangular flat plate shape, and can be provided under each thin film transistor 2b2. However, depending on the capacitance of the photoelectric conversion element 2b1, the photoelectric conversion element 2b1 can also serve as a storage capacitor.

The photoelectric conversion element 2b1 can be, for example, a light emitting diode or the like. The thin-film transistor 2b2 is a switch for accumulating and discharging electric charge to the accumulating capacitor. The thin film transistor 2b2 has a gate electrode, a drain electrode and a source electrode. The gate electrode of the thin film transistor 2b2 is electrically connected to the corresponding control line 2c1. The drain electrode of the thin film transistor 2b2 is electrically connected to the corresponding data line 2c2. The source electrode of the thin film transistor 2b2 is electrically connected to the corresponding photoelectric conversion element 2b1 and the storage capacitor. In addition, the anode side of the photoelectric conversion element 2b1 and the storage capacitor are grounded. In addition, the anode side of the photoelectric conversion element 2b1 and the storage capacitor may be connected to a bypass line not shown.

A plurality of control lines 2c1 are arranged in parallel with each other at predetermined intervals. The control line 2c1 extends in the row direction, for example. One control line 2c1 is electrically connected to one of a plurality of wiring pads 2d1 provided near the periphery of the substrate 2a. In one wiring pad 2d1, one of the plural wirings provided on the flexible printed circuit board 2e1 is electrically connected. The other ends of the plural wirings provided on the flexible printed circuit board 2e1 are electrically connected to the readout circuits 11a provided on the circuit board 11, respectively.

A plurality of data lines 2c2 are arranged parallel to each other at predetermined intervals. The data line 2c2 extends in the column direction orthogonal to the row direction, for example. One data line 2c2 is electrically connected to one of a plurality of wiring pads 2d2 provided near the periphery of the substrate 2a. In one wiring pad 2d2, one of the plural wirings provided on the flexible printed circuit board 2e2 is electrically connected. The other end of the plural wirings provided on the flexible printed circuit board 2e2 is electrically connected to the signal detection circuit 11b provided on the circuit board 11, respectively. The control line 2c1 and the data line 2c2 can be formed using low-resistance metal such as aluminum or chromium, for example.

The protective layer 2f covers the photoelectric conversion portion 2b, the control line 2c1, and the data line 2c2. The protective layer 2f can be formed of an insulating material. The insulating material can be, for example, an oxide insulating material, a nitride insulating material, an oxynitride insulating material, and a resin.

The scintillator 5 is provided on a plurality of photoelectric conversion units 2b, and converts the incident X-rays into visible light, that is, fluorescent light. The scintillator 5 is provided so as to cover the area (effective pixel area A) on the substrate 2a where the plurality of photoelectric conversion units 2b are provided. The scintillator 5 can be one containing cesium iodide (CsI): thallium (Tl), sodium iodide (NaI): thallium (Tl), or cesium bromide (CsBr): europium (Eu), for example. The scintillator 5 can be formed by a vacuum evaporation method. If the scintillator 5 is formed by a vacuum vapor deposition method, the scintillator 5 formed of an aggregate of a plurality of columnar crystals is formed. The thickness of the scintillator 5 can be set to about 600 μm, for example.

In addition, when forming the scintillator 5 by a vacuum vapor deposition method, a mask having an opening is used. In this case, the scintillator 5 is formed at a position facing the opening in the array substrate 2 (on the effective pixel area A). In addition, the film deposited by vapor deposition is also formed on the surface of the mask. Moreover, in the vicinity of the opening of the mask, the film grows so as to gradually protrude into the inside of the opening. Once the film protrudes into the opening, vapor deposition to the array substrate 2 in the vicinity of the opening is suppressed. Therefore, as shown in FIGS. 1 and 2, the thickness of the vicinity of the periphery of the scintillator 5 gradually decreases as it goes outward.

In addition, the scintillator 5 can also be formed by using, for example, pomium-activated gamma sulfide oxide (Gd ₂ O ₂ S/Tb, or GOS). In this case, it is possible to provide matrix-shaped grooves such that the quadrangular prism-shaped scintillators 5 are provided for every plurality of photoelectric conversion parts 2b.

The reflective layer 6 is provided in order to increase the utilization efficiency of fluorescent light and improve the sensitivity characteristics. That is, the reflective layer 6 reflects the fluorescent light generated in the scintillator 5 toward the side opposite to the side on which the photoelectric conversion section 2b is provided, and is directed toward the photoelectric conversion section 2b. However, the reflective layer 6 is not necessarily necessary, as long as it is provided in accordance with the sensitivity characteristics required by the X-ray detection module 10. The case where the reflective layer 6 is provided is described below as an example.

The reflective layer 6 is provided on the incident side of the X-ray of the scintillator 5. The reflective layer 6 covers at least the upper surface of the scintillator 5. The reflective layer 6 can also cover the side surface 5a of the scintillator 5 more. For example, a material mixed with light-scattering particles made of titanium oxide (TiO ₂ ), resin, and solvent can be applied to the scintillator 5 and dried to form the reflective layer 6. In addition, for example, the reflective layer 6 can be formed by forming a layer made of a metal with high light reflectivity, such as silver alloy or aluminum, on the scintillator 5. In addition, for example, a thin plate made of a metal with high light reflectivity such as silver alloy or aluminum or a resin thin plate containing light-scattering particles or the like may be provided on the scintillator 5 as the reflective layer 6.

In addition, when a paste material is applied to the scintillator 5 and dried, the scintillator 5 may be stretched and the scintillator 5 may peel off from the array substrate 2 because the material shrinks as it dries. For this reason, it is ideal to provide a thin plate-shaped reflective layer 6 on the scintillator 5. In this case, the thin-plate-shaped reflective layer 6 may be joined to the scintillator 5 with, for example, a double-sided tape or the like, but it is desirable to place the thin-plate-shaped reflective layer 6 on the scintillator 5. If the thin-plate-shaped reflective layer 6 is placed on the scintillator 5, it is easy to suppress the scintillator 5 from peeling from the array substrate 2 due to expansion or contraction of the reflective layer 6.

The moisture-proof portion 7 is provided to prevent the characteristics of the reflective layer 6 or the characteristics of the scintillator 5 from deteriorating due to moisture contained in the air. The moisture-proof part 7 covers at least a part of the scintillator 5 and the sealing part 8. There may be a gap between the moisture-proof part 7 and the reflective layer 6 and the like, or the moisture-proof part 7 may be in contact with the reflective layer 6 and the like. For example, if the moisture-proof part 7 and the sealing part 8 are joined in an environment where the pressure is lower than the atmospheric pressure, the moisture-proof part 7 can be brought into contact with the reflective layer 6 and the like. In addition, the scintillator 5 generally has a void of about 10% to 40% of its volume. Therefore, if gas is contained in the gap, when the X-ray detector 1 is transported by an aircraft or the like, the gas will expand and the moisture-proof portion 7 may be damaged. If the moisture-proof part 7 and the sealing part 8 are joined in an environment where the pressure is lower than atmospheric pressure, even if the X-ray detector 1 is transported by an aircraft or the like, the moisture-proof part 7 can be prevented from being damaged. That is, the pressure of the space partitioned by the sealing portion 8 and the moisture-proof portion 7 is preferably lower than the atmospheric pressure.

Here, there may be bubbles or voids inside the sealing portion 8, or there may be a gap or leakage channel between the sealing portion 8 and the moisture-proof portion 7, or there may be a gap or leakage channel between the sealing portion 8 and the array substrate 2 Case. In this case, when the moisture-proof part 7 and the sealing part 8 are joined in an environment with a pressure lower than the atmospheric pressure, and then returned to the atmospheric pressure environment, the atmosphere may intrude into the inside through a gap or a leak path. Once the atmosphere enters the interior, the moisture-proof part 7 and the scintillator 5 may not be in close contact, wrinkles are generated on the surface of the moisture-proof part 7, or tension is lost. Therefore, it is easy to visually recognize that there is a gap or a leak path. The life span of products with gaps or leaking channels may be shortened, but such products can be easily found to be removed during inspection. Therefore, the quality of the X-ray detector 1 can be easily improved.

The moisture-proof portion 7 can be a thin plate containing metal. The metal can be, for example, an aluminum-containing metal, a copper-containing metal, a magnesium-containing metal, a tungsten-containing metal, stainless steel, a Kovar material, or the like. In this case, if it is set as the moisture-proof part 7 containing a metal, the moisture which penetrates the moisture-proof part 7 can be removed almost completely.

Moreover, the moisture-proof part 7 may be a laminated sheet which can also be used as a laminated resin film and a metal film. In this case, the resin film can be made of, for example, polyimide resin, epoxy resin, polyethylene terephthalate resin, Teflon (registered trademark), low-density polyethylene, high-density polyethylene, elastic Formed by rubber, etc. The metal film can be, for example, one containing the aforementioned metal. The metal film can be formed by, for example, a sputtering method, a lamination method, or the like. In this case, it is ideal that the metal film is provided on the side of the scintillator 5. If formed in this way, since the metal film can be covered by the resin film, it is possible to prevent the metal film from being damaged by external force or the like. In addition, if the metal film is provided on the inner side (on the side of the scintillator 5) than the resin film, it is possible to prevent the characteristics of the scintillator 5 from deteriorating due to moisture permeability through the resin layer. In addition, it is possible to replace the metal film or provide an inorganic film together with the metal film. The inorganic film is, for example, a film containing silicon oxide, aluminum oxide, or the like. The inorganic film can be formed by a sputtering method or the like, for example.

In the case of a laminated sheet containing a metal film, for example, a resin film having a thickness approximately the same as that of the metal film can be used. If a resin film having such a thickness is provided, the rigidity of the moisture-proof part 7 can be increased, and therefore the generation of pinholes in the moisture-proof part 7 can be suppressed in the manufacturing process. In addition, generally, the linear expansion coefficient of resin is larger than that of metal. Therefore, if the thickness of the resin film is too thick, the array substrate 2 described later is likely to be bent. Therefore, the thickness of the resin film is preferably equal to or less than the thickness of the metal film.

In addition, the thickness of the moisture-proof portion 7 can be determined in consideration of X-ray absorption, rigidity, and the like. In this case, if the thickness of the moisture-proof portion 7 is increased, the amount of X-rays absorbed by the moisture-proof portion 7 increases. On the other hand, if the thickness of the moisture-proof part 7 is made thin, the rigidity will fall and it will break easily.

For example, if the thickness of the moisture-proof portion 7 is less than 10 μm, the rigidity of the moisture-proof portion 7 is too low, and there is a risk that pinholes may be generated due to damage caused by external force or the like, and leakage may occur. If the thickness of the moisture-proof portion 7 exceeds 50 μm, the rigidity of the moisture-proof portion 7 is too high, and the followability to the unevenness of the upper end of the scintillator 5 is deteriorated. Therefore, it may be difficult to confirm the aforementioned gap or leakage path. Furthermore, there is a possibility that the bending of the array substrate 2 described later may easily occur.

Therefore, the thickness of the moisture-proof portion 7 is preferably 10 μm or more and 50 μm or less. In this case, the moisture-proof portion 7 is, for example, an aluminum foil having a thickness of 10 μm or more and 50 μm or less. If the thickness of the aluminum foil is 10 μm or more and 50 μm or less, compared with the aluminum foil with a thickness of 100 μm, the X-ray transmission can be increased by 20% to 30%. In addition, if it is an aluminum foil having a thickness of 10 μm or more and 50 μm or less, the occurrence of the aforementioned leakage can be suppressed, and the aforementioned gap or leakage path can be easily confirmed. In addition, it is possible to suppress the bending of the array substrate 2 described later.

Here, if a large amount of X-ray irradiation is performed on the human body, it will have an adverse effect on health. Therefore, the amount of X-ray irradiation on the human body is suppressed to the minimum necessary. For this reason, in the case of the X-ray detector 1 used in medical treatment, the intensity of the irradiated X-ray may decrease, and the intensity of the X-ray passing through the moisture-proof portion 7 may become very small. The moisture-proof portion 7 of the present embodiment is a thin plate having a thickness of 10 μm or more and 50 μm or less. Therefore, even if the intensity of the irradiated X-rays is low, X-ray images can be photographed.

In this case, if the thickness of the moisture-proof part 7 is made thin, the rigidity of the moisture-proof part 7 will fall. Therefore, if a brim portion or the like is provided as a three-dimensional moisture-proof portion, for example, cracks and the like are likely to occur when the metal foil is press-molded. As shown in FIG. 2, the vicinity of the peripheral edge of the moisture-proof portion 7 having a thin plate shape is joined to the outer surface 8 a of the sealing portion 8. Therefore, it is not necessary to process the moisture-proof portion 7 into a solid shape in advance, and the thin-plate-like moisture-proof portion 7 can be joined to the outer surface 8a of the sealing portion 8 as it is. As a result, even if the thickness of the moisture-proof part 7 is 10 μm or more and 50 μm or less, the occurrence of cracks and the like in the moisture-proof part 7 can be suppressed.

In addition, as described later, by heating the vicinity of the periphery of the moisture-proof section 7, the vicinity of the periphery of the moisture-proof section 7 and the sealing section 8 are joined. In this case, if the temperature near the periphery of the moisture-proof part 7 and the temperature of the sealing part 8 decrease, thermal stress is generated between the vicinity of the periphery of the moisture-proof part 7 and the sealing part 8. If thermal stress is generated between the vicinity of the periphery of the moisture-proof portion 7 and the sealing portion 8, peeling may occur between the vicinity of the periphery of the moisture-proof portion 7 and the sealing portion 8. Once peeling occurs, the moisture-proof performance may be significantly reduced. Since the thickness of the moisture-proof portion 7 is 10 μm or more and 50 μm or less, the moisture-proof portion 7 is easily extended when thermal stress occurs. Therefore, the thermal stress can be alleviated, and therefore peeling between the vicinity of the periphery of the moisture-proof portion 7 and the sealing portion 8 can be suppressed.

As shown in FIG. 2, the sealing portion 8 is joined to the side surface 5 a of the scintillator 5 and the array substrate 2. In this case, the sealing portion 8 can be brought into close contact with the side surface 5a of the scintillator 5. When the scintillator 5 is an aggregate of a plurality of columnar crystals, irregularities are formed on the side surface 5 a of the scintillator 5. Therefore, if a part of the sealing portion 8 is provided inside the unevenness of the side surface 5a of the scintillator 5, the bonding strength between the sealing portion 8 and the scintillator 5 can be increased. The sealing portion 8 can be brought into close contact with the array substrate 2. If the sealing portion 8 is in close contact with the array substrate 2, it is possible to prevent moisture or the like contained in the atmosphere from passing between the sealing portion 8 and the array substrate 2 to reach the scintillator 5.

The shape of the outer surface 8a of the sealing portion 8 can be a curved surface protruding to the outside. In this way, the distance L between the outer surface 8a of the sealing portion 8 and the side surface 5a of the scintillator 5 can be lengthened. Therefore, it is possible to suppress moisture and the like contained in the atmosphere from passing through the inside of the sealing portion 8 to reach the scintillator 5. Furthermore, if the shape of the outer surface 8a of the sealing portion 8 is a curved surface protruding to the outside, it is easy to make the vicinity of the periphery of the moisture-proof portion 7 imitate the outer surface 8a of the sealing portion 8. Therefore, it is easy to make the moisture-proof part 7 closely contact the sealing part 8. In addition, since the moisture-proof part 7 can be deformed gently, even if the thickness of the moisture-proof part 7 is made thin, the occurrence of cracks and the like in the moisture-proof part 7 can be suppressed.

Also, as shown in FIG. 2, when the moisture-proof portion 7 is in close contact with the sealing portion 8, it is desirable that the peripheral end surface 7a of the moisture-proof portion 7 is in contact with the array substrate 2, or the peripheral end surface 7a is located near the array substrate 2. . In this way, it is possible to effectively prevent moisture and the like contained in the atmosphere from entering the inside of the sealing portion 8.

In addition, it is desirable that the height of the sealing portion 8 be equal to or less than the height of the scintillator 5. If the height of the sealing portion 8 is equal to or less than the height of the scintillator 5, the thin plate serving as the moisture-proof portion 7 can be prevented from being unduly deformed. Therefore, the occurrence of wrinkles, breakage, pinholes, etc. in the moisture-proof portion 7 can be suppressed.

In addition, if the height of the sealing portion 8 is lower than the height of the scintillator 5, the vicinity of the periphery of the moisture-proof portion 7 can be bent. If the vicinity of the periphery of the moisture-proof portion 7 can be bent, the difference between the amount of thermal shrinkage of the moisture-proof portion 7 and the amount of thermal shrinkage of the array substrate 2 can be absorbed. Therefore, deformation of the array substrate 2 due to thermal stress can be suppressed. In addition, the details of making the height of the sealing portion 8 lower than the height of the scintillator 5 will be described later (see FIG. 8).

The sealing part 8 can be made into what contains thermoplastic resin as a main component. If the sealing portion 8 contains a thermoplastic resin as a main component, it can be joined to the array substrate 2, the scintillator 5, and the moisture-proof portion 7 by heating. Here, for example, if the sealing portion 8 contains ultraviolet curable resin as a main component, it is necessary to irradiate ultraviolet rays when joining the sealing portion 8 to the array substrate 2, the scintillator 5, and the moisture-proof portion 7. However, the moisture-proof portion 7 contains metal or the like, and therefore cannot transmit ultraviolet rays. In addition, if the moisture-proof portion 7 is configured to transmit ultraviolet rays, the scintillator 5 may be discolored due to ultraviolet rays, and the generated fluorescence may not be absorbed. In contrast, since the sealing portion 8 contains a thermoplastic resin as a main component, it can be easily joined by heating. In addition, the scintillator 5 will not be discolored by ultraviolet rays. In addition, since the heating and cooling of the sealing portion 8 can be completed in a short time, it is possible to reduce the manufacturing time and further reduce the manufacturing cost.

The thermoplastic resin can be, for example, nylon, PET (Polyethyleneterephthalate), polyurethane, polyester, polyvinyl chloride, ABS (Acrylonitrile Butadiene Styrene), propylene, polystyrene, polyethylene, polypropylene, etc. In this case, the water vapor transmission coefficient of polyethylene is 0.068g･mm/day･m ² , and the water vapor transmission coefficient of polypropylene is 0.04g･mm/day･m ² . Therefore, if the sealing part 8 contains at least one of polyethylene and polypropylene as a main component, the moisture that penetrates the inside of the sealing part 8 and reaches the scintillator 5 can be greatly reduced. The rigidity of the thermoplastic resin may be lower than the rigidity of the moisture-proof portion 7.

In addition, the sealing portion 8 may further include a filler using an inorganic material. If a filler made of an inorganic material is contained in the sealing portion 8, the permeation of moisture can be more suppressed. The inorganic material can be, for example, talc, graphite, mica, kaolin (clay containing kaolin as a main component), or the like. The filler is, for example, one that can have a flat shape. The moisture that has penetrated into the sealing portion 8 from the outside is prevented from diffusion by the filler made of an inorganic material. Therefore, the speed of the moisture passing through the sealing portion 8 can be reduced. Therefore, the amount of moisture reaching the scintillator 5 can be reduced.

Here, the X-ray detector 1 stored in a high temperature and humidity environment may sometimes be used in a lower temperature environment. In this case, the water vapor in the housing may condense and sometimes adhere to The surface of the X-ray detector 1. If there are fine cracks on the outer surface 8a of the sealing portion 8, the moisture adhering to the surface may penetrate into the cracks and may be introduced into the inside of the sealing portion 8. In addition, the X-ray detector 1 may be transported to an environment below the freezing point, and moisture that has penetrated into the cracks may freeze. Once the water invaded into the cracks freezes, the volume will increase, so as the cracks become larger, the water will invade more easily. If the above situation is repeated, there is a risk of damage to the sealing portion 8, peeling of the moisture-proof portion 7 and the sealing portion 8, peeling of the array substrate 2 and the sealing portion 8, and the like. Therefore, it is desirable that at least the outer surface 8a of the sealing portion 8 has water repellency. If at least the outer surface 8a of the sealing portion 8 has water repellency, it is possible to suppress the penetration of moisture into cracks. For example, a water-repellent agent may be applied to the outer surface 8a of the sealing portion 8. Moreover, as long as the sealing part 8 contains at least any one of polyethylene and polypropylene as a main component, it can be set as the outer surface 8a which has water repellency.

In addition, after coating the thermoplastic resin in a frame shape, it is ideal to observe the inside immediately to check for the presence of bubbles, foreign matter, leakage channels, etc. If such inspection can be performed by visual inspection or optical microscope, production efficiency can be improved. Therefore, it is desirable that the thermoplastic resin coated in a frame shape is transparent at the thickest part. In other words, it is desirable that the sealing portion 8 has translucency. In this way, it is possible to easily remove products that have bubbles, foreign objects, leakage channels, and the like that may have a short life. Therefore, the quality of the product can be improved.

Next, returning to FIG. 1, the circuit board 11 will be described. As shown in FIG. 1, the circuit board 11 is provided on the side opposite to the side of the array substrate 2 where the scintillator 5 is provided. The circuit substrate 11 is electrically connected to the X-ray detection module 10 (array substrate 2). As shown in FIG. 3, the circuit board 11 is provided with a readout circuit 11a and a signal detection circuit 11b. In addition, these circuits may be provided on one substrate, or these circuits may be separately provided on a plurality of substrates.

The readout circuit 11a switches the ON state and OFF state of the thin film transistor 2b2. The readout circuit 11a has a plurality of gate drivers 11aa and row selection circuits 11ab. In the row selection circuit 11ab, a control signal S1 is input from an image processing unit (not shown) provided outside the X-ray detector 1. The row selection circuit 11ab inputs the control signal S1 to the corresponding gate driver 11aa according to the scanning direction of the X-ray image. The gate driver 11aa inputs the control signal S1 to the corresponding control line 2c1. For example, the readout circuit 11a inputs the control signal S1 in order by each control line 2c1 via the flexible printed circuit board 2e1. The thin film transistor 2b2 is turned on according to the control signal S1 input to the control line 2c1, and can receive the charge from the storage capacitor (image data signal S2).

The signal detection circuit 11b has a complex integrating amplifier 11ba, a complex selection circuit 11bb, and a complex AD converter 11bc. One integrating amplifier 11ba is electrically connected to one data line 2c2. The integrating amplifier 11ba sequentially receives the image data signal S2 from the photoelectric conversion unit 2b. In addition, the integrating amplifier 11ba integrates the current flowing in a certain period of time, and outputs a voltage corresponding to the integrated value to the selection circuit 11bb. In this way, the value of the current (the amount of charge) flowing through the data line 2c2 within a predetermined time can be converted into a voltage value. That is, the integrating amplifier 11ba converts the image data information corresponding to the intensity distribution of the fluorescent light generated in the scintillator 5 into potential information.

The selection circuit 11bb selects the integrating amplifier 11ba for reading, and sequentially reads the image data signal S2 converted into potential information. The AD converter 11bc sequentially converts the read image data signal S2 into a digital signal. The image data signal S2 converted into a digital signal is input to the image processing unit via wiring. In addition, the image data signal S2 converted into a digital signal can also be sent to the image processing unit by wireless.

The image processing unit composes an X-ray image based on the image data signal S2 converted into a digital signal. In addition, the image processing unit may be integrated with the circuit board 11.

Next, X-ray detection modules related to other embodiments will be described. 4(a) and (b) are schematic cross-sectional views for illustrating the X-ray detection module 10a of other embodiments. As described later, the sealing portion 8 is formed by coating a softened thermoplastic resin on the array substrate 2 in a frame shape, or by using a 3D printer or the like to frame the thermoplastic resin on the array substrate 2. Therefore, the size of the sealing portion 8 may vary.

If there is a deviation in the size of the sealing portion 8, the peripheral end surface 7 a of the moisture-proof portion 7 may interfere with the array substrate 2, and wrinkles or the like may occur near the peripheral edge of the moisture-proof portion 7. If wrinkles or the like are generated near the periphery of the moisture-proof portion 7, peeling of the moisture-proof portion 7 may occur. In this case, as shown in FIG. 4( a ), a distance H1 can be provided between the peripheral end surface 17 a of the moisture-proof portion 17 and the array substrate 2. For example, what is necessary is just to shorten the size of the moisture-proof part 17 which has a thin plate shape. In this way, even if the size of the sealing portion 8 varies, the generation of wrinkles and the like in the vicinity of the periphery of the moisture-proof portion 17 can be suppressed.

In this case, if the distance H1 is too large, there is a possibility that the moisture intruding into the inside of the sealing portion 8 may increase. Based on the findings obtained by the inventors, as shown in FIG. 4(b), it is desirable to make the distance H1 a half or less of the height H2 of the sealing portion 8. In this case, if the distance H1 is changed to be small, the moisture entering the inside of the sealing portion 8 will be changed to be small.

FIG. 5 is a schematic cross-sectional view for illustrating an X-ray detection module 10b of another embodiment. FIG. 6(a) is a schematic plan view of the moisture-proof portion 17. FIG. 6(b) is a schematic perspective view of the moisture-proof portion 17. As shown in FIG. 5, the vicinity of the periphery of the moisture-proof portion 17 may be bent along the array substrate 2. That is, the bent portion 17b along the array substrate 2 may be provided on the periphery of the moisture-proof portion 17. In this case, the bent portion 17b can also be adhered to the array substrate 2. In this way, the outer surface 8a of the sealing portion 8 can be covered by the moisture-proof portion 17, and therefore the penetration of moisture into the inside of the moisture-proof portion 17 can be effectively suppressed. In addition, if the size of the bent portion 17b is too large, there is a possibility that the size of the X-ray detection module 10b cannot be reduced, and the size of the X-ray detector 1 may be reduced. Therefore, the size of the bent portion 17b is preferably set to 2 mm or less, for example.

In addition, if the vicinity of the periphery of the moisture-proof portion 17 is bent, the following problems will occur. The moisture-proof portion 17 can be formed using a thin plate without skew or unevenness. If the thin plate serving as the moisture-proof portion 17 is covered on the scintillator 5, the thin plate will float from the array substrate 2 to the extent of the thickness of the scintillator 5 only. It is easy to bend the vicinity of the peripheral edge of the thin plate in such a state to the side of the array substrate 2 along the sealing portion 8, and the elongated stress is hardly applied to the thin plate.

However, it is geometrically impossible to bend the thin plate into the same shape as the side in the corner portion of the frame-shaped sealing portion 8. Therefore, it is necessary to stretch a part of the thin plate along the sealing portion 8. The moisture-proof part 17 is required to shield moisture from the outside, but if a part of the thin plate is elongated, the part may become thin, or fine cracks may occur, or pinholes may occur. Once cracks or pinholes occur, the ability to shield water will be reduced.

In this case, as shown in Figs. 6(a) and (b), if a convex portion 17c protruding outward is provided at the corner of the moisture-proof portion 17, the aforementioned geometric distortion can be absorbed. Therefore, it is possible to suppress a part of the thin plate from being elongated, so that the generation of cracks or pinholes can be suppressed.

FIG. 7 is a schematic cross-sectional view for illustrating an X-ray detection module 10c of another embodiment. As described above, the material of the array substrate 2, the material of the scintillator 5, the material of the moisture-proof part 7, and the material of the sealing part 8 are different. Therefore, they have different coefficients of linear expansion. Here, heat is generated during the activation of the X-ray detection module 10c, so the temperature of the X-ray detection module 10c becomes higher. In addition, the temperature around the X-ray detector 1 may change. Therefore, in accordance with the temperature change, thermal stress is generated between them. In this case, once the tensile stress F is generated in the moisture-proof part 7, the tensile stress F will be applied to the joint part of the moisture-proof part 7 and the sealing part 8, or the joint part of the sealing part 8 and the array substrate 2. There is a risk of peeling or breaking. Once peeling or breakage occurs, water easily reaches the scintillator 5. In addition, there is also a risk of deformation such as bending in the array substrate 2.

Therefore, in the X-ray detection module 10c of this embodiment, the recessed portion 8a1 is provided on the outer surface 8a of the sealing portion 8. If the recess 8a1 is provided, the vicinity of the recess 8a1 will easily deform. Therefore, by deforming the vicinity of the recess 8a1, the generated tensile stress F can be relaxed.

Moreover, the bending part 7c may be provided in the part of the moisture-proof part 7 facing the recessed part 8a1. The flexible portion 7c can be elastically deformed more easily than the portion of the moisture-proof portion 7 where the flexible portion 7c is not provided. If the flexible portion 7c is provided, the flexible portion 7c is elastically deformed, so that the generated tensile stress F can be relaxed. In this case, the flexible portion 7c and the concave portion 8a1 may be brought into contact, or a gap may be provided between the flexible portion 7c and the concave portion 8a1 as shown in FIG. 7. If the flexible portion 7c is in contact with the concave portion 8a1, the rigidity of the flexible portion 7c can be increased, and therefore, the occurrence of breakage or pinholes in the flexible portion 7c can be suppressed. If a gap is provided between the flexible portion 7c and the recessed portion 8a1, since the flexible portion 7c is easily deformed, the relaxation of the tensile stress F becomes easy. If the tensile stress F can be relaxed, peeling or breaking of the moisture-proof portion 7 can be suppressed. In addition, it is possible to suppress deformation such as bending in the array substrate 2.

Moreover, as shown in FIG. 15 mentioned later, the convex part 18c may be provided in the outer surface 8a of the sealing part 8. As shown in FIG. In addition, the details of the convex portion 18c will be described later.

Fig. 8 is a schematic cross-sectional view illustrating an X-ray detection module 10d according to another embodiment. As shown in FIG. 8, the height H3 of the sealing portion 8 can be lower than the height H4 of the scintillator 5. If the height H3 of the sealing portion 8 is lower than the height H4 of the scintillator 5, the vicinity of the periphery of the moisture-proof portion 7 can be bent. That is, in this way, it is easy to provide the flexible portion 7d near the periphery of the moisture-proof portion 7. The flexible portion 7d is easier to elastically deform than the portion of the moisture-proof portion 7 where the flexible portion 7d is not provided. If the flexible portion 7d is provided, the same effect as the aforementioned flexible portion 7c can be obtained. That is, the elastic deformation of the flexure portion 7 d can relax the generated tensile stress F, so that the occurrence of peeling or breakage of the moisture-proof portion 7 or deformation such as bending in the array substrate 2 can be suppressed.

For example, the coefficient of linear expansion of the moisture-proof portion 7 using aluminum foil is approximately 23×10 ^-6 . The linear expansion coefficient of the array substrate 2 is about 4×10 ^-6 . Therefore, if the temperature of the moisture-proof part 7 fixed to the sealing part 8 decreases, the moisture-proof part 7 shrinks more than the array substrate 2. In this case, if the moisture-proof portion 7 becomes almost completely flat, the difference in the amount of shrinkage cannot be absorbed, and the array substrate 2 is warped. On the other hand, if the flexures 7c and 7d are provided, the difference in the amount of shrinkage can be absorbed, and therefore the occurrence of bending in the array substrate 2 can be suppressed.

In this case, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 can be set to be greater than the thickness of the moisture-proof portion 7. For example, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 can be 0.1 mm or more. On the other hand, if the height H3 of the sealing portion 8 is too low, when a high voltage such as static electricity is applied, the moisture-proof portion 7 and the array substrate 2 may be short-circuited. Therefore, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 is preferably 0.5 mm or less. That is, the difference between the height H4 of the scintillator 5 and the height H3 of the sealing portion 8 is 0.1 mm or more, and preferably 0.5 mm or less.

According to the findings obtained by the inventors, the height H3 of the sealing portion 8 is 30% or more of the height H4 of the scintillator 5, and preferably 70% or less. If the height H3 of the sealing portion 8 is set as such, the aforementioned suppression of the bending of the array substrate 2, the reduction of the moisture permeability per unit time, the reduction of the amount of material necessary for the formation of the sealing portion 8 and the like can be achieved.

For example, the effect of reducing the moisture permeability per unit time can be considered as follows. If the total moisture permeability per unit time of the moisture-proof part 7 and the sealing part 8 is Q, the moisture-permeability per unit time of the moisture-proof part 7 is Q7, and the moisture permeability per unit time of the sealing part 8 If the moisture permeability is set to Q8, the following equation holds. Q=Q7+Q8 In this case, since Q7 can be considered to be approximately constant, the increase or decrease of Q is almost determined by the increase or decrease of Q8. Here, if the moisture transmission coefficient of the sealing portion 8 is set to P, the moisture transmission cross-sectional area of the sealing portion 8 is set to S (mm ² ), the moisture transmission width of the sealing portion 8 is set to W, and the sealing portion 8 If the circumference is L (mm), and the height of the sealing portion 8 is H (mm), the following equation holds. Q8=P×S/W=P×L×H/W Therefore, if the height H of the sealing part 8 is reduced, the moisture permeability Q8 per unit time of the sealing part 8 can be reduced, and the moisture-proof part 7 and The total moisture permeability Q of the sealing portion 8 per unit time. That is, since the moisture resistance can be improved, the reliability of the X-ray detection module 10 can be improved.

Figs. 9(a) and (b) are schematic cross-sectional views for illustrating another embodiment of the flexure 7e. As shown in Figs. 9(a) and (b), the flexure 7e may be provided in an area facing the upper surface 5b of the scintillator 5 of the moisture-proof part 7. The flexure 7e can be embossed, for example. The surface on the side opposite to the scintillator 5 side of the flexure 7e (the surface on the side where X-rays enter) protrudes outward from the surface on the side opposite to the scintillator 5 side of the moisture-proof portion 7. The surface of the scintillator 5 of the flexure 7e protrudes from the surface of the moisture-proof portion 7 on the scintillator 5 side toward the outside.

The thickness of the flexure 7e can be set to be approximately the same as the thickness of the moisture of the moisture-proof part 7 where the flexure 7e is not provided. The flexure 7e is formed, for example, by performing press processing (press processing) using a stamping and marking die on the thin-plate-shaped moisture-proof portion 7. In addition, even if it is a low-moisture-permeable and moisture-proof film in which a resin film and a film made of an inorganic material are laminated, the flexure 7e can be formed by performing press processing (press processing) using a stamping and marking metal mold.

The height dimension of the flexure 7e can be larger than the thickness dimension of the moisture-proof part 7 where the flexure 7e is not provided. The width, number, arrangement, etc. of the flexures 7e are not particularly limited. The width, number, arrangement, etc. of the flexures 7e can be appropriately determined in accordance with the amount of heat shrinkage or the size of the moisture-proof portion 7 described above.

The flexible portion 7e is easier to elastically deform than the portion of the moisture-proof portion 7 where the flexible portion 7e is not provided. Therefore, by elastic deformation of the flexure 7e, the difference in the amount of thermal contraction due to the difference in the linear expansion coefficient can be absorbed. Therefore, if the flexible portion 7e is provided, the occurrence of bending in the array substrate 2 can be suppressed. In this case, as shown in FIG. 9(a), only the flexure 7e may be provided in the moisture-proof portion 7, or as shown in FIG. 9(b), a flexure 7e may be provided in the moisture-proof portion 7 , And flexures 7d, 7c are provided near the periphery of the moisture-proof portion 7.

FIG. 10 is a schematic cross-sectional view for illustrating an X-ray detection module 110 of a comparative example. As shown in FIG. 10, the sealing portion 8 is bonded to the array substrate 2. If it is not bonded to the side surface 5a of the scintillator 5, peeling of the sealing portion 8 is likely to occur. For example, as described above, thermal stress is generated by temperature changes caused by starting or changes in ambient temperature. In this case, if the sealing portion 8 is only bonded to the array substrate 2, the bonding strength of the sealing portion 8 becomes low. Therefore, there is a possibility that the sealing portion 8 may peel off due to the generated thermal stress.

In contrast, in the X-ray detection modules 10 and 10a to 10c of this embodiment, the sealing portion 8 is bonded to the side surface 5a of the scintillator 5 and the array substrate 2. In addition, the sealing portion 8 is in close contact with the side surface 5a of the scintillator 5. In addition, a part of the sealing portion 8 is provided inside the unevenness of the side surface 5 a of the scintillator 5. Therefore, the bonding strength of the sealing portion 8 can be improved, so that the sealing portion 8 can be prevented from peeling off due to thermal stress.

FIG. 11 is a schematic cross-sectional view for illustrating an X-ray detection module 110a of a comparative example. As shown in FIG. 11, the exposed portion 118a1 of the outer surface 118a of the sealing portion 118 is an inclined surface that is inclined to approach the scintillator 5 toward the array substrate 2 side. Therefore, in the vicinity of the array substrate 2, the distance L between the outer surface 118a of the sealing portion 118 and the side surface 5a of the scintillator 5 becomes shorter. Therefore, moisture and the like contained in the atmosphere easily penetrate between the sealing portion 118 and the array substrate 2 to reach the scintillator 5.

In contrast, in the X-ray detection modules 10 and 10a to 10c of the present embodiment, the shape of the outer surface 8a of the sealing portion 8 is a curved surface protruding to the outside. Therefore, in the vicinity of the array substrate 2, the distance L between the outer surface 18 a of the sealing portion 18 and the side surface 5 a of the scintillator 5 can be elongated, so that moisture contained in the atmosphere cannot reach the scintillator 5.

FIG. 12 is a schematic cross-sectional view for illustrating an X-ray detection module 110b of a comparative example. As shown in FIG. 12, if the height of the sealing portion 128 is higher than the height of the scintillator 5, the thin plate of the moisture-proof portion 17 must be reluctantly deformed when it is covered. Therefore, wrinkles, breakage, pinholes, etc. are easily generated in the moisture-proof portion 17. In addition, the exposed portion of the outer surface 128a of the sealing portion 128 is likely to become larger. Once the exposed portion becomes larger, the penetration profile of the moisture becomes larger, and therefore, more moisture easily penetrates into the inside of the sealing portion 128.

On the other hand, in the X-ray detection modules 10 and 10a to 10c of the present embodiment, the height of the sealing portion 8 is equal to or less than the height of the scintillator 5, so the thin plate serving as the moisture-proof portion 7 can be prevented from being unduly deformed. Therefore, the occurrence of wrinkles, breakage, pinholes, etc. in the moisture-proof part 7 can be suppressed.

FIG. 13 is a schematic cross-sectional view for illustrating an X-ray detection module 110c of a comparative example. As shown in FIG. 13, if the outer surface 138a of the sealing portion 138 becomes a plane perpendicular to the array substrate 2, it is difficult to cover the outer surface 138a with the moisture-proof portion 117. If the outer surface 138a is not covered by the moisture-proof part 117, since the penetration profile of the moisture becomes larger, more moisture will easily penetrate into the inside of the sealing part 138. In this case, if the vicinity of the periphery 117a of the moisture-proof portion 117 is bent to cover the outer surface 138a, cracks or breakage are likely to occur in the bent portion 117b. Once cracks or breaks occur, there is a risk of moisture intruding through the cracks or breaks.

In contrast, in the X-ray detection modules 10 and 10a to 10c of this embodiment, the shape of the outer surface 8a of the sealing portion 8 is a curved surface protruding to the outside. Therefore, when the outer surface 8a is covered by the sealing portion 7, there is no part where the sealing portion 7 must be reluctantly bent. Therefore, the outer surface 8a can be covered by the sealing portion 7 without cracks or breakage.

(Method of manufacturing X-ray inspection module and method of manufacturing X-ray detector) Next, an example of the manufacturing method of the X-ray detection module and the manufacturing method of the X-ray detector are shown. First, a control line 2c1, a data line 2c2, a wiring pad 2d1, a wiring pad 2d2, a photoelectric conversion portion 2b, a protective layer 2f, and the like are sequentially formed on the substrate 2a to manufacture an array substrate 2. The array substrate 2 can be manufactured using a semiconductor manufacturing process, for example. In addition, since the manufacturing of the array substrate 2 applies a known technology, detailed description is omitted.

Next, the scintillator 5 is formed so as to cover the effective pixel area A on the substrate 2a. For example, the scintillator 5 can be formed by a vacuum evaporation method. If the scintillator 5 is formed by a vacuum vapor deposition method, the scintillator 5 formed of an aggregate of a plurality of columnar crystals is formed. The thickness of the scintillator 5 can be appropriately changed according to the DQE characteristics, sensitivity characteristics, resolution characteristics, etc. required by the X-ray detector 1. The thickness of the scintillator 5 can be set to about 600 μm, for example.

In addition, it is also possible to mix the luminescent material and the adhesive material, apply the mixed material so as to cover the effective pixel area A, and then fire it. The fired material forms a matrix of grooves for every plural photoelectric conversion parts 2b is provided with a quadrangular column-shaped scintillator 5.

Next, a reflective layer 6 is formed on the scintillator 5. For example, the reflective layer 6 can be formed by applying a coating liquid in which a plurality of light-scattering particles, resin, and solvent are mixed on the scintillator 5 and drying it. Furthermore, for example, the reflective layer 6 may be formed by forming a layer made of a metal with high light reflectivity, such as silver alloy or aluminum, on the scintillator 5. In addition, for example, a thin plate made of a metal with high light reflectivity such as silver alloy or aluminum or a resin thin plate containing light-scattering particles or the like may be placed on or attached to the scintillator 5 to provide the reflective layer 6.

Next, the sealing portion 8 is formed. For example, a solvent is used to soften the thermoplastic resin, the softened thermoplastic resin is applied to the periphery of the scintillator 5 in a frame shape, and the solvent is evaporated to cure the thermoplastic resin, and the sealing portion 8 can be formed. In addition, for example, the thermoplastic resin is heated to soften it, and the softened thermoplastic resin is coated around the scintillator 5 in a frame shape, and the thermoplastic resin is cured by heat radiation or the like to form the sealing portion 8. In addition, for example, a 3D printer or the like may be used to form the frame-shaped sealing portion 8.

FIG. 14 is a schematic perspective view for illustrating the application of the thermoplastic resin 18 of the comparative example. As described above, the softened thermoplastic resin 18 is coated in a frame shape. Therefore, at least one seam 18a is generated. When applying the softened thermoplastic resin 18 in a frame shape, if the supply amount per unit time of the thermoplastic resin 18 is set to be constant, or the movement speed B of the nozzle that discharges the thermoplastic resin 18 is set to be constant. As shown in FIG. 14, there is a case where a depression 18b is formed at the joint 18a between the start point of the supply and the end point of the supply. For example, if the start point of supply and the end point of supply are separated, a sharp depression 18b may be formed at the joint 18a between the start point of supply and the end point of supply. Once the steep depression 18b is generated, the thin plate that becomes the moisture-proof portion 7 cannot follow the depression 18b, and there is a possibility that a leakage path may be generated. In the part of the leakage passage, the moisture-proof part 7 and the outer surface 8a of the sealing part 8 are not joined, and moisture easily penetrates through the leakage passage.

FIG. 15 is a schematic perspective view for exemplifying the application of the thermoplastic resin 18 in this embodiment. As shown in FIG. 15, the convex part 18c can be formed in the joint 18a. For example, the convex portion 18c can be formed by increasing the supply amount of the thermoplastic resin 18 per unit time in the portion of the joint 18a or delaying the movement speed B of the nozzle. In this case, it is desirable to have a gentle outer surface and to form the convex portion 18c with a low height. Compared with the steep recess 18b, it is easier for the thin plate to be the moisture-proof portion 7 to follow the convex portion 18c. Therefore, the leakage path can be suppressed.

Next, a thin plate serving as the moisture-proof portion 7 is covered on the scintillator 5, the reflective layer 6, and the sealing portion 8, and the vicinity of the periphery of the thin plate is joined to the outer surface 8a of the sealing portion 8. For example, by heating the thin plate in a state where the vicinity of the periphery of the thin plate is pressed against the outer surface 8a of the sealing portion 8, the outer surface 8a of the sealing portion 8 can be melted to join the moisture-proof portion 7. The moisture-proof part 7 is formed by joining a thin plate to the outer surface 8a of the sealing part 8. The joining of thin plates can be performed in an environment with a pressure lower than atmospheric pressure.

The thin plate is joined to the outer surface 8a of the sealing portion 8 in an environment where the pressure is lower than the atmospheric pressure. Thereby, it can suppress that the air containing water vapor is contained in the inside of the moisture-proof part 7. In addition, as in the case where the X-ray detector 1 is transported by an aircraft, even if the X-ray detector 1 is placed in an environment with a pressure lower than atmospheric pressure, it is possible to prevent the moisture-proof part 7 from being in the moisture-proof part. The air inside 7 expands or deforms. In addition, since the moisture-proof part 7 is suppressed by atmospheric pressure, the moisture-proof part 7 is in close contact with the scintillator 5. As above, X-ray inspection modules 10, 10a-10c can be manufactured.

Next, the array substrate 2 and the circuit substrate 11 are electrically connected via the flexible printed substrates 2e1 and 2e2. Others, properly install circuit parts, etc.

Next, the array substrate 2, the circuit board 11, and the like are housed in a housing not shown. In this case, if the bending of the array substrate 2 is large, there is a risk that the array substrate 2 interferes with a member housed in the housing, or the array substrate 2 interferes with the inner wall of the housing. As described above, if the X-ray detection module 10 of the present embodiment is used, the bending of the array substrate 2 can be suppressed, and therefore the work of the assembly process can be smoothed. In addition, an electrical test, an X-ray image test, etc., can be performed to confirm whether the photoelectric conversion element 2b1 is abnormal or the electrical connection is abnormal. As above, the X-ray detector 1 can be manufactured. In addition, in order to confirm the reliability of the product against humidity or changes in the temperature environment, a high-temperature and high-humidity test, a cold-heat cycle test, etc. can also be implemented.

As described above, the manufacturing method of the X-ray detection module of this embodiment can include the following processes. The process of forming the scintillator 5 on the plurality of photoelectric conversion parts 2 b provided on the array substrate 2. A process of applying the softened thermoplastic resin 18 around the scintillator 5 in a frame shape to form the sealing portion 8. A process of covering the scintillator 5 and the sealing part 8 with a thin plate that becomes the moisture-proof part 7, heating the vicinity of the circumference of the thin plate, and joining the vicinity of the circumference of the thin plate to the outer surface 8 a of the sealing part 8. In this case, in the process of forming the sealing portion 8, the convex portion 18c may be formed on the joint 18a to be applied.

As mentioned above, several embodiments of the present invention have been exemplified, but these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, changes, etc. can be made without departing from the scope of the spirit of the invention. These embodiments and their modifications are included in the scope or gist of the invention, and are included in the invention described in the scope of patent application and its equivalent scope. In addition, the aforementioned embodiments can be implemented in combination with each other.

1: X-ray detector 2: Array substrate 2a: substrate 2b: Photoelectric conversion section 2b1: photoelectric conversion element 2b2: thin film transistor 2c1: control line 2c2: data line 2d1: Wiring pad 2d2: Wiring pad 2e1: Flexible printed circuit board 2e2: Flexible printed circuit board 2f: protective layer 5: scintillator 6: reflective layer 7: Moisture-proof part 7a: Zhou end face 7c: Flexure 7d: Flexure 8: Sealing part 8a: outside 8a1: recess 10: X-ray detection module 10a: X-ray inspection module 10b: X-ray detection module 10c: X-ray detection module 10d: X-ray detection module 11: Circuit board 11a: readout circuit 11aa: gate driver 11ab: Row selection circuit 11b: Signal detection circuit 11ba: integrating amplifier 11bb: select circuit 11bc: AD converter 12: Support plate 17: Moisture-proof part 17a: Zhou end face 17b: Bending part 18: Thermoplastic resin 18a: seam 18b: depression 18c: convex 110: X-ray detection module 110a: X-ray inspection module 110b: X-ray detection module 110c: X-ray detection module 117: Moisture-proof part 118: Sealing part 118a: outside 118a1: exposed part 128: Sealing part 128a: outside 138: Seal 138a: outside S1: Control signal S2: image data signal H1: distance L: distance H2: height H3: height H4: height F: Tensile stress

[Fig. 1] is a schematic perspective view for illustrating the X-ray detector and the X-ray detection module of this embodiment. [Figure 2] is a schematic cross-sectional view illustrating an X-ray detection module. [Figure 3] is a block diagram of the X-ray detector. [FIG. 4] (a) and (b) are schematic cross-sectional views for illustrating X-ray detection modules of other embodiments. [Fig. 5] is a schematic cross-sectional view for illustrating an X-ray detection module of another embodiment. [Fig. 6] (a) is a schematic plan view of the moisture-proof portion, and (b) is a schematic perspective view of the moisture-proof portion 17. [Fig. 7] is a schematic cross-sectional view for illustrating an X-ray detection module of another embodiment. [Fig. 8] is a schematic cross-sectional view for illustrating an X-ray detection module of another embodiment. [Fig. 9] (a) and (b) are schematic cross-sectional views for illustrating flexures in other embodiments. [Fig. 10] is a schematic cross-sectional view of an X-ray detection module for illustrating a comparative example. [Fig. 11] is a schematic cross-sectional view of an X-ray detection module for illustrating a comparative example. [Fig. 12] is a schematic cross-sectional view for illustrating an X-ray detection module of a comparative example. [Fig. 13] is a schematic cross-sectional view of an X-ray detection module for illustrating a comparative example. Fig. 14 is a schematic perspective view for illustrating the application of the thermoplastic resin of the comparative example. Fig. 15 is a schematic perspective view for illustrating the application of the thermoplastic resin in this embodiment.

2: Array substrate

2a: substrate

2b: Photoelectric conversion section

2f: protective layer

5: scintillator

5a: side

6: reflective layer

7: Moisture-proof part

7a: Zhou end face

8: Sealing part

8a: outside

10: X-ray detection module

12: Support plate

A: Effective pixel area

L: distance

Claims (26)

A radiation detection module, which is characterized by having: An array substrate, which has a plurality of photoelectric conversion parts; A scintillator, which is arranged on the aforementioned plural photoelectric conversion parts; A frame-shaped sealing portion containing thermoplastic resin as a main component is provided around the scintillator, and is joined to the array substrate and the scintillator; and The moisture-proof part covers the upper part of the scintillator and is joined to the outer surface of the sealing part near the periphery, The shape of the outer surface of the aforementioned sealing portion is a curved surface protruding to the outside. For example, the radiation detection module of the first item in the scope of patent application, wherein the peripheral end surface of the moisture-proof portion is in contact with the array substrate. For example, the radiation detection module of the first item of the scope of patent application, wherein the peripheral end surface of the moisture-proof part is provided in the vicinity of the array substrate. For example, in the radiation detection module of claim 1, wherein the distance between the peripheral end surface of the moisture-proof portion and the array substrate is less than half of the height of the sealing portion. For example, the radiation detection module of the first item of the scope of patent application, wherein a bending portion along the array substrate is provided on the periphery of the moisture-proof portion. For example, the radiation detection module of item 5 of the scope of patent application, wherein a convex part protruding outward is provided at the corner of the aforementioned moisture-proof part. The radiation detection module described in any one of items 1 to 6 in the scope of patent application, wherein a recess is provided on the outer surface of the sealing portion. For example, the radiation detection module of item 7 of the scope of patent application, wherein a portion facing the concave portion of the moisture-proof portion is provided with a flexure. The radiation detection module described in any one of items 1 to 8 in the scope of patent application, wherein a convex portion is provided on the outer surface of the sealing portion. The radiation detection module described in any one of the claims 1 to 9, wherein the height of the sealing portion is equal to or less than the height of the scintillator. For example, the radiation detection module of the 10th patent application, wherein the difference between the height of the scintillator and the height of the sealing portion is 0.1 mm or more and 0.5 mm or less. For example, the radiation detection module of item 10 or 11 of the scope of patent application, wherein the height of the sealing portion is 30% or more and 70% or less of the height of the scintillator. For example, the radiation detection module described in any one of items 1 to 12 of the scope of patent application, wherein the side surface of the scintillator is provided with unevenness, A part of the sealing portion is provided inside the unevenness of the side surface of the scintillator. The radiation detection module described in any one of items 1 to 13 in the scope of the patent application, wherein the sealing portion is transparent. The radiation detection module described in any one of items 1 to 14 in the scope of patent application, wherein at least the outer surface of the sealing portion has water repellency. The radiation detection module described in any one of items 1 to 15 in the scope of the patent application, wherein the thermoplastic resin is at least any one of polyethylene and polypropylene. The radiation detection module described in any one of items 1 to 16 in the scope of the patent application, wherein the aforementioned thermoplastic resin further contains fillers using inorganic materials. The radiation detection module described in any one of items 1 to 17 in the scope of the patent application, wherein the moisture-proof part is a metal-containing sheet, a laminated sheet of a laminated resin film and a metal film, and a laminated resin film and Any of the laminated sheets of inorganic film. The radiation detection module described in any one of items 1 to 18 in the scope of patent application, wherein the thickness of the moisture-proof part is 10 μm or more and 50 μm or less. For example, the radiation detection module described in any one of items 1 to 19 in the scope of patent application, wherein the aforementioned moisture-proof part has a flexible part, The flexure is easier to elastically deform than a portion of the moisture-proof part where the flexure is not provided. The radiation detection module described in any one of items 1 to 20 in the scope of patent application, wherein the rigidity of the thermoplastic resin is lower than the rigidity of the moisture-proof part. The radiation detection module described in any one of items 1 to 21 in the scope of patent application, wherein the pressure of the space partitioned by the sealing part and the moisture-proof part is lower than atmospheric pressure. The radiation detection module described in any one of items 1-22 in the scope of the patent application, wherein the scintillator contains cesium iodide (CsI): thallium (Tl). The radiation detection module described in any one of items 1 to 23 in the scope of the patent application further includes a reflective layer provided between the scintillator and the moisture-proof part. A radiation detector, which is characterized by having: Such as the radiation detection module described in any one of items 1 to 24 in the scope of the patent application; and A circuit board electrically connected to the aforementioned radiation detection module. A method for manufacturing a radiation detection module, which is characterized by having: The process of forming a scintillator on a plurality of photoelectric conversion parts arranged on an array substrate; The process of coating the softened thermoplastic resin around the scintillator in a frame shape to form a sealing part; and The process of covering the scintillator and the sealing part with a thin plate that becomes the moisture-proof part, heating the vicinity of the circumference of the thin plate, and joining the vicinity of the circumference of the thin plate to the outside of the sealing part In the process of forming the aforementioned sealing portion, a convex portion is formed at the joint to be applied.

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