TWI463691B - Light emitting device - Google Patents

Description

Illuminating device

The present invention relates to a light-emitting device using a semiconductor light-emitting element, and more particularly to a thin-type light-emitting device used in a backlight of a liquid crystal display or the like.

In recent years, high-luminance, high-output light-emitting elements and small-sized, high-sensitivity light-emitting devices have been developed and used in various fields. Such a light-emitting device has characteristics of small size, low power consumption, and light weight, and can be used in, for example, a light source of a mobile phone and a liquid crystal backlight, and a light source of various meters.

For example, in order to reduce the size and weight of a light source used in a backlight, a light source used in a backlight is sought to be thinner. Therefore, since the light-emitting device used as the light source itself needs to be miniaturized, various light-emitting devices such as a side view type have been developed.

In general, a side view type light-emitting device is configured to form an opening for emitting light on a front surface of a package, a light-emitting element is mounted on a bottom surface of the opening, and a part of a lead electrode is self-packaged as an external terminal. Internally guided to the outside. Such a configuration is usually formed by performing injection molding using a mold in which a lead electrode is sandwiched.

However, such a side view type package has extremely thin walls with further miniaturization, and therefore, when the package obtained by injection molding is detached from the mold, it may not be able to resist the mold release resistance. The package is damaged and cannot maintain its shape. Moreover, when the mold release resistance becomes large and it is difficult to take out the product from the mold, it is necessary to stop the operation of the apparatus and take it out. Product, which leads to a significant decrease in productivity.

Therefore, for example, as shown in Figs. 6A and 6B, an inclined surface (so-called extraction gradient) is provided on the side of the package to take out the molded article from the mold. The inclined surface is formed, for example, such that the side surface adjacent to the back surface is inclined so as to be widened in the front direction to form an inclined surface (for example, Patent Document 1).

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-168824

However, if the lead electrode is bent along the bottom surface and the end portion of the lead electrode is bent so as to be disposed on the side surface of the package, for example, as shown in FIG. 6B, the portion of the package side surface and the terminal are provided along the electrode. A gap 612 is formed. In such a case, when the light-emitting device is operated, if a force is applied in the direction of the gap (that is, a force in a direction in which the gap is narrowed), a defect in which the terminal is bent may occur. Such a terminal bending is caused by, for example, fixing a light-emitting device when a light-emitting device is selected, a packaging project, a light-emitting inspection, or the like, or when a terminal is brought into contact with a measuring electrode.

In view of the above, it is an object of the present invention to provide a thin light-emitting device which can be manufactured with good mass productivity without deterioration in mold release property during production, and which can prevent bending of terminals during processing.

In order to achieve the above object, a light-emitting device of the present invention includes: a light-emitting element; and a package having a lead electrode connected to the light-emitting element and a front surface for taking out light from the light-emitting element An opening portion, wherein one of the lead electrodes protrudes from the outside; the lead electrode is bent and an end portion thereof is disposed on a side surface of the package; The side surface has a first surface adjacent to the back surface of the package and having an end portion of the lead electrode disposed thereon, a second surface having a surface direction different from the first surface, and a surface adjacent to the front surface of the package different from the above The third side of the second side.

Further, in the light-emitting device of the present invention, it is preferable that the first surface is substantially perpendicular to a main surface of the lead electrode.

Further, in the light-emitting device of the present invention, it is preferable that the second surface is inclined so as to be widened in the front direction, whereby the mold release property can be improved at the time of molding.

Further, in the light-emitting device of the present invention, it is preferable that the third surface is inclined so as to be narrowed in the front direction, whereby the mold release property can be improved at the time of molding.

Further, in the light-emitting device of the present invention, it is preferable that a corner portion of the package in which the lead electrode is bent is cut.

The side surface of the light-emitting device package of the present invention configured as described above includes the first surface, the second surface, and the third surface that are different in the direction of the adjacent surface, and the first surface on which the end portion of the lead electrode is disposed is formed. A plane orientation different from the adjacent second and third faces. Thereby, the first surface can be made to have a plane orientation suitable for arranging the end portions of the lead electrodes, and the second surface and the third surface can be set to a surface orientation in consideration of, for example, mold release property at the time of production (molding). .

Therefore, according to the light-emitting device of the present invention, the inclined surface can be provided at an appropriate position on the side surface, and the thickness of the light-emitting device can be reduced without deteriorating the mass productivity. Moreover, according to the light-emitting device of the present invention, by changing the inclination angle of the first surface of the lead electrode disposed on the side surface of the package, it is possible to realize a structure for preventing the terminal from being bent during various processes.

Hereinafter, the best mode for carrying out the invention will be described. However, in the embodiment shown below, a light-emitting device embodying the technical idea of the present invention is exemplified, and the present invention does not limit the light-emitting device to the following types.

Further, of course, the description of the components shown in the scope of the patent application is not intended to be a part of the embodiment. The dimensions, materials, shapes, relative arrangements, and the like of the components disclosed in the embodiments are not intended to limit the scope of the present invention, and are merely illustrative examples. In addition, the size, positional relationship, and the like of the components shown in the respective drawings may be exaggerated for clarity of explanation. In the following description, the same names and symbols indicate the same or equivalent components, and the detailed description is omitted as appropriate.

A light-emitting device according to an embodiment of the present invention is configured by a light-emitting element and a package 102. The package 102 has a lead electrode 101 to which a light-emitting element is connected, and a molded portion, and a portion of the lead electrode 101 protrudes from the molded portion to the outside. Specifically, in the lead electrode 101, the protruding end portion 101a is bent along the side surface of the package 102. Moreover, the front surface of the package 102 has an opening for acquiring light from the light emitting element.

Here, especially in the light-emitting device of the embodiment, both sides of the package The surface is composed of a first surface 103 on which the end portion of the lead electrode is disposed, and a second surface 104 and a third surface 105 having a surface direction different from the first surface 103, and the first surface 103 is provided to be suitable for the arrangement of the lead electrodes. The surface orientation of the end portion and the surface orientation of the second surface 104 and the third surface 105 are set in consideration of the mold release property at the time of production (during molding).

In the package of the embodiment, the first surface 103 of one side surface faces the first surface 103 of the other side surface, and the second surface 104 of one side surface faces the second surface 104 of the other side surface, and one side surface The third side 105 faces the third side 105 of the other side.

More specifically, in the package of the embodiment, the first surface 103 is adjacent to the surface of the back surface of the package, and is provided in a plane orientation suitable for arranging the end portions of the lead electrodes 101, preferably substantially perpendicular to the lead electrodes. Main face. Here, in the present specification, the main surface of the lead electrode 101 refers to a surface on the side where the bottom surface of the opening formed in the package 102 is exposed. Generally, the main surface of the lead electrode 101 is parallel to the package 102. The front side of the face. Therefore, the first surface 103 provided substantially perpendicular to the main surface of the lead electrode 101 is a surface substantially perpendicular to the front surface of the package.

Further, the second surface 104 is sandwiched between the first surface 103 and the third surface 105, and is set in a direction different from the surface of the first surface 103 so as to form an extraction gradient during molding. For example, when the mold on the back side is moved backward and the package 102 is pulled out from the mold during molding, the second surface 104 is narrowed toward the back side (widened in the front direction), and the second is set. The orientation of the face 104.

In addition, the third surface 105 is adjacent to the front surface of the package 102 for molding. When the gradient is formed, it is set in a direction different from the plane of the second surface 104. For example, when the mold on the front side is moved forward and the package is pulled out from the mold during molding, the surface orientation of the third surface 105 is set so that the distance between the third surfaces 105 is narrowed toward the front side.

In the light-emitting device of the embodiment configured as described above, not only the first surface 103 of the end portion 101a protruding along the lead electrode 101 but also the inclination of the extraction gradient at the time of molding is formed on the side surface of the package 102. The second side 104 and the third side 105. Thereby, not only the mold release resistance at the time of molding but also the end portion 101a of the lead electrode 101 can be bent along the package. Therefore, when the light emitting device is operated, the terminal can be prevented from being bent.

Moreover, it is preferable that the lead electrode 101 is bent at a corner recess of the package. For example, as shown in the present embodiment, the lead electrode 101 is protruded from the bottom surface of the package 102, and is bent along the bottom surface so as to be bent at an angle formed by the bottom surface and the first surface 103, so that the end portion 101a is along The first surface 103 is formed. At this time, a notch such as an R surface or a C surface is formed at an angle formed by the bottom surface of the package and the first surface 103 (FIG. 5B).

As described above, when the corner portion of the portion where the lead electrode 101 is bent is the R surface or the C surface to form a notch, the lead electrode can be freely processed without impairing the shape of the package corner portion due to the bending of the lead electrode. .

Further, as shown in FIG. 2B, in the present embodiment, the concave portion 106 is formed on the third surface 105. This refers to a portion in which a lead electrode (hereinafter referred to as a hanger-type lead electrode) for supporting the package is embedded from the cutting process of the lead electrode 101 until the end of the molding process. A hanger type lead electrode is usually formed by the same metal plate as the lead electrode 101, when the lead electrode 101 is cut After the molding process is completed, the marks are taken out, and the marks are formed into the concave portions 106.

Hereinafter, a method of manufacturing the light-emitting device of the present embodiment will be described with reference to Figs. 3A to 3D.

First, as shown in FIG. 3A, the lead electrode 101 and the hanger-type lead electrode 309 are disposed between the upper and lower divided molds 307 and 308, and are sandwiched by the upper and lower molds 307 and 308. In the description of the manufacturing method, "upper" means the front side of the package, and "lower" means the back side of the package.

Thereafter, as shown in FIG. 3B, the molding material is injected into the cavity of the molds 307, 308 by the material injection gate of the mold 308 on the lower side.

After the molding material in the molds 307, 308 is hardened, as shown in Fig. 3D, the mold is removed in the up and down direction (the direction indicated by the arrow in the figure). In the light-emitting device of the present invention, since the inclined surface (the second surface and the third surface) is provided on the side surface, the mold release resistance can be reduced, and the removal can be performed without damage to the package.

In the following description, for example, as illustrated in FIGS. 2A and 3C, the package portions corresponding to the upper and lower sides of the lead electrodes are referred to as a front side package 102a and a back side package 102b. That is, with respect to the lead electrode 101, the front side package 102a is a package portion on the light acquisition side (main surface side), and the back side package 102b is a package portion on the opposite side.

An opening for mounting the light-emitting element is formed on the surface of the front side package 102a. The opening may be formed at any position of the front side package 102a depending on the type of mounting of the light emitting device, but is preferably formed on the front side of the front side package 102a. Thereby, the side view type light-emitting device can be made into a very small and thin shape.

The shape of the opening is not particularly limited as long as it can be inside the opening, preferably When the light-emitting element is placed on the bottom surface of the opening and a part of the surface of the lead electrode forming the electrical connection is exposed, it can be formed into any one of a column, a 楕 cylinder, a square column, and the like. Thereby, the light from the light-emitting element can be reflected by the inner wall of the package, and the light can be efficiently taken to the front direction. Further, the size and depth of the opening can be appropriately adjusted depending on the number of light-emitting elements to be placed, the bonding method, and the like. Preferably, the inner wall of the package is formed by a material having a high reflectance. When the total reflection is performed and the reflectance is lower, the light from the light-emitting element is mostly absorbed by the inner wall of the package. At this time, if the depth of the opening is made shallow, the light cannot reach the inner wall of the package, and the amount of light directly obtained is increased. Therefore, the light acquisition efficiency can be improved. Further, if the shape of the opening is kept the same, the depth of the opening is made shallow, and the shallower the depth of the opening, the larger the gradient angle of the inner wall of the package, and the mold release property to the mold at the time of molding can be improved.

Further, it is preferable that the bottom surface and/or the side surface of the opening be increased in adhesion area by embossing or plasma treatment, thereby improving adhesion to a light-transmitting covering member to be described later. Sex.

In the present invention, the first surface 103 and the second surface 104 are formed on the side surface of the back side package, and the third surface 105 is formed on the side surface of the front side package. Further, the front side package may further have a plurality of faces on the front side.

Further, in order to reduce the mold release resistance, the third surface 105 of the light-emitting device of the present invention is preferably inclined so as to be narrowed in the front direction. At this time, the angle formed by the third surface 105 and the main surface of the lead electrode 101 is preferably 80 or more and less than 90, more preferably 85 or more and 89 or less.

In this specification, the lead electrode 101 is perpendicular to the mold due to molding. Since the arrangement is performed in the moving direction, the angle of the surface is described using the main surface of the lead electrode 101 as a reference. Further, in general, in the front side package and the back side package, the mold release resistance on the side having the larger inner dimension (X direction in FIG. 1A) is larger, and therefore, the lead electrode can be disposed on the side having a larger internal dimension. The inclined surface with a smaller angle formed by the main surface.

In the present embodiment, the lead electrode 101 is protruded from the bottom surface to the outside of the package, and is bent in the back surface direction to be disposed on the side surface of the back side package. Therefore, the first surface 103 and the second surface 104 are provided on the back side package. on. However, the present invention is not limited thereto, and when the lead electrode 101 is bent in the front direction, two faces are formed on the side faces of the front side package, and the side on which the end portions of the lead electrodes are disposed and the lead electrodes are formed. The angle formed by the main surface is greater than the angle formed by the other surface and the main surface of the lead electrode.

Hereinafter, each component of the light-emitting device in the present embodiment will be described in detail.

(package)

The package 102 of the present invention includes a lead electrode 101 and a forming portion, and a light emitting element is placed thereon. The molded portion functions as a support for holding and holding the lead electrode 101 on which the light-emitting element is placed, and also functions to protect the light-emitting element from the external environment.

The molding material for the package used in the present invention is not particularly limited, and any of the previously known liquid crystal polymers, polyphthalamide resins, polybutylene terephthalate (PBT), and the like can be used. Thermoplastic resin. In particular, if a semi-crystalline polymer resin containing a high melting point crystal such as polyphthalamide is used, the table The surface energy is increased, and a package having good adhesion to a sealing resin which can be provided inside the opening or a light guide plate which can be provided later can be obtained. Thereby, in the process of filling and hardening the sealing resin, peeling of the interface between the package and the sealing resin during cooling can be suppressed. Further, in order to efficiently reflect light from a light-emitting element chip, a white pigment such as titanium oxide or the like may be mixed in the package-molded member.

(light emitting element)

In general, the light-emitting element refers to a semiconductor light-emitting element, and in particular, it may be of any type as long as it is an element called a so-called light-emitting diode. For example, on the substrate, InN (indium nitride), AlN (aluminum nitride), GaN (gallium nitride), InGaN (indium gallium nitride), AlGaN (aluminum nitride), InGaAlN (nitrogen) A plurality of semiconductors such as a nitride semiconductor, a III-V compound semiconductor, and a II-VI compound semiconductor, such as gallium indium gallium nitride, form a laminated structure including an active layer. The light-emitting wavelength of the obtained light-emitting element can be changed from the ultraviolet region to the red color by changing the material of the semiconductor, the mixed crystal ratio, the content of In in the InGaN of the active layer, the type of impurities doped in the active layer, and the like. region.

In the light-emitting device of the present invention, one of the light-emitting elements may be mounted, or a plurality of light-emitting elements may be mounted. In this case, in order to increase the illuminance, a plurality of light-emitting elements that emit light of the same luminescent color may be used in combination. Further, for example, by using a plurality of light-emitting elements having different luminescent colors in combination with the RBG, color reproducibility can be improved.

The light-emitting elements are fixed to the package surface or the lead electrode surface by a bonding member. For example, when the light-emitting element has blue and green light, When the nitride semiconductor is grown on the sapphire substrate, an epoxy resin, polyoxymethylene or the like can be used as the bonding member. Further, in consideration of deterioration due to light or heat from the light-emitting element, Al may be plated on the back surface of the light-emitting element, and a material such as a solder such as Au-Sn eutectic or a material such as a low-melting-point metal or a conductive paste may be used as the bonding. material. Further, a light-emitting element in which electrodes are formed on both surfaces as in a light-emitting element that emits red light such as GaAs may be die-bonded by a conductive paste such as silver, gold or palladium.

(lead electrode 101)

The lead electrode 101 is an electrode for electrically connecting to the light-emitting element, and may be substantially plate-shaped, and may have a corrugated plate shape or a plate shape having irregularities. The film thickness may be uniform or may be locally thick or thin. The material is not particularly limited, and it is preferably formed of a material having a large thermal conductivity. By forming such a material, the heat generated by the light-emitting element can be efficiently dissipated. For example, it is preferable to have a thermal conductivity of about 200 W/(m.K) or more, a material having a large mechanical strength, or a press-pressing process or an etching process. Specific examples thereof include metals such as copper, aluminum, gold, silver, tungsten, iron, and nickel, and alloys such as iron-nickel alloys and phosphor bronze. Further, it is preferable to perform reflection plating on the surface of the lead electrode frame to efficiently obtain light from the mounted light-emitting element.

Further, in the case of the extremely thin side view type light-emitting device, since the package opening portion is narrow and the mounting space of the light-emitting element is narrowed, it is necessary to mount the light-emitting element with high precision. Therefore, by providing a notch on the lead electrode, a mark is formed on a part of the lead electrode, and positioning is performed as the light-emitting element is placed. The target is that the lead electrode is provided to be exposed from the bottom surface of the package opening.

In the light-emitting device of the present invention, a protective element may be mounted in addition to the light-emitting element. The protective element can be mounted in the opening in which the light-emitting element is placed, or can be mounted in another opening in the package. It may be mounted on the inner surface of the lead electrode on which the light-emitting element is mounted, and may be coated with the package molding material to be integrated with the package. In addition, the protection element may be one or more than two or more. Here, the protective element is not particularly limited, and may be any of the well-known types mounted on the light-emitting device. For example, superheat, overvoltage, overcurrent, a protection circuit, an electrostatic protection element, etc. are mentioned. Specifically, a Zener diode, a diode of a transistor, or the like can be used.

Further, in the light-emitting device of the present invention, it is preferable that a light-transmitting covering material is embedded in the opening in which the light-emitting element is placed. The light-transmitting coating material protects the light-emitting element from external force, moisture, and the like, and also protects the wire. Examples of the light-transmitting coating material include a transparent resin excellent in weather resistance such as an epoxy resin, a polyoxymethylene resin, an acrylic resin, and a urea resin, or glass. In particular, the transparent resin can be baked at 100 ° C for 14 hours or more even during the use or during storage, when the light-transmitting coating material contains water, whereby the water contained in the resin is dispersed to the outside. Therefore, it is possible to prevent the phenomenon of water vapor explosion, peeling of the light-emitting element and the light-transmitting coating material.

The light-transmitting coating material may also contain a diffusing agent or a fluorescent material. The diffusing agent has the function of diffusing light, can alleviate the directivity of the light-emitting element, and can expand the viewing angle. The fluorescent substance has a function of converting light emitted from the light-emitting element, and can convert the wavelength of light emitted from the light-emitting element to the outside of the package. When the light emitted from the light-emitting element is a short-wavelength visible light having a high energy, the lanthanide derivative as an organic phosphor, ZnCdS: Cu, YAG: Ce, activated by Eu and/or Cr can be preferably used. A variety of inorganic phosphors such as nitrogen-containing CaO-Al ₂ O ₃ -SiO ₂ . In the present invention, when white light is to be obtained, especially when a YAG:Ce phosphor is used, depending on the content, blue light from the blue light-emitting element and yellow light that absorbs a part of the blue light to complement the color can be emitted. Thereby, white light can be formed relatively simple and with good reliability. Similarly, when a nitrogen-containing CaO-Al ₂ O ₃ -SiO ₂ phosphor activated by Eu and/or Cr is used, depending on the content, blue light from the blue light-emitting element can be emitted, and a part of the blue light can be absorbed. By making the complementary red light, white light can be formed easily and with good reliability. In addition, the phosphor can be completely precipitated to remove bubbles, thereby reducing chromatic aberration.

Hereinafter, embodiments of the invention will be described in detail with reference to the drawings. Furthermore, the present invention is of course not limited to the embodiments shown below.

[Examples]

In this embodiment, the light-emitting device 400 is an extremely thin side-emitting type light-emitting device having a thickness of about 0.4 mm. 4A is a plan view of a light-emitting device in the embodiment, FIG. 4B is a partial enlarged view of FIG. 4A, FIG. 4C is a perspective view, and FIG. 4D is a partially enlarged view of FIG.

In this embodiment, the light-emitting device 400 is constituted by one light-emitting element (not shown), a lead electrode 401 electrically connected to the light-emitting element, and a package 402 integrally fixed to the lead electrode 401.

The lead electrode frame is made of a plate containing copper-iron alloys. The body is formed and has a portion that protrudes from the package bottom surface and functions as a lead electrode terminal. In order to efficiently obtain light emitted from the light-emitting element mounted, silver plating is applied to the surface of the lead electrode 401.

In the light-emitting device of the embodiment, the side surface of the back side package has a first surface 403 adjacent to the back surface of the package and a second surface 404 adjacent to the first surface 403, and the front side package has a front surface adjacent to the package. The third surface 405 and the fourth surface 413 adjacent to the second surface 404 and the third surface 405.

In this embodiment, the angle formed by the first surface 403 and the main surface of the lead electrode 401 (α in FIG. 4B) is about 87°, and the angle between the second surface 404 and the main surface of the lead electrode 401 (FIG. 4B). The β) is about 82°. A gradient is also formed on the third surface 405 forming the side surface of the front side package, and the angle formed by the third surface 405 and the main surface of the lead electrode 401 (γ in Fig. 4B) is about 80°. By the inclined surfaces, the thinning of the light-emitting device can be achieved with good mass productivity, and the end portions of the lead electrode terminals can be bent along the package, so that the bending of the terminals during various operations can be prevented.

Further, the angle formed by the fourth surface 413 and the main surface of the lead electrode is substantially 90°, whereby the concave portion formed on the fourth surface 413 can be made larger (deep), and the above-described hanger type lead electrode can be more reliably fixed. .

Further, as shown in FIG. 5B, in the light-emitting device of the present embodiment, the corner portion of the package in which the lead electrode 401 is bent is formed with a notch, thereby having a notch portion 411. Thereby, the inner side of the bent portion of the lead electrode 401 can be prevented from being bent in contact with the package, and therefore, the lead electrode can be freely processed without impairing the shape of the package.

Further, in the light-emitting device of the present embodiment, the extraction gradient 410 is further formed on one of the outer surfaces of the front side package, whereby the extremely thin opening side wall can be easily formed.

[Industrial availability]

The semiconductor device of the present invention can be applied to a light source for a backlight of a liquid crystal, a light source for various indicators, a panel meter, a display lamp or a surface light switch, an optical sensor, and the like.

101,401,601‧‧‧lead electrode

101a, 401a‧‧‧End of the lead electrode

102,402,602‧‧‧Package

102a‧‧‧Front side package

102b‧‧‧Back side package

103, 403‧‧‧ first side

104,404‧‧‧ second side

105,405‧‧‧ third side

106‧‧‧ recess

307,308‧‧‧Mold

309‧‧‧Hack-type lead electrode

400‧‧‧Lighting device

410‧‧‧ extraction gradient

411‧‧‧ Notch

413‧‧‧ fourth side

612‧‧‧ gap

Fig. 1A is a plan view showing a light-emitting device in an embodiment of the present invention.

Fig. 1B is a partial enlarged view of Fig. 1A.

Fig. 1C is a front elevational view of a light-emitting device of an embodiment.

Fig. 2A is a perspective view of a light-emitting device in an embodiment.

Fig. 2B is a partial enlarged view of Fig. 2A.

Fig. 3A is a cross-sectional view showing a first step of the method of manufacturing the light-emitting device of the embodiment.

Fig. 3B is a cross-sectional view showing a second process of the method of manufacturing the light-emitting device of the embodiment.

Fig. 3C is a cross-sectional view showing a third step of the method of manufacturing the light-emitting device of the embodiment.

Fig. 3D is a cross-sectional view showing a fourth step of the method of manufacturing the light-emitting device of the embodiment.

Fig. 4A is a plan view showing a light-emitting device in an embodiment of the present invention.

Fig. 4B is a partial enlarged view of Fig. 4A.

Fig. 4C is a perspective view of a light-emitting device in the embodiment.

4D is a partial enlarged view of FIG. 4C.

Fig. 5A is a rear view of the light-emitting device in the embodiment.

Fig. 5B is a partial enlarged view of Fig. 5A.

Fig. 5C is a bottom view of the light-emitting device in the embodiment.

Figure 5D is a partial enlarged view of Figure 5C.

Figure 6A is a plan view of a prior illuminating device.

Fig. 6B is a partial enlarged view of Fig. 6A.

101a‧‧‧End of lead electrode

102a‧‧‧Front side package

102b‧‧‧Back side package

103‧‧‧ first side

104‧‧‧ second side

105‧‧‧ third side

106‧‧‧ recess

Claims (9)

A light-emitting device, comprising: a light-emitting element; and a package having a lead electrode connected to the light-emitting element and an opening for removing light from the light-emitting element on a front surface; wherein the package comprises a package bottom surface and One side surface adjacent to the bottom surface of the package, one side surface of the side surface is the front surface, one side opposite to the front surface is a back surface, and the remaining two opposite side surfaces are package side surfaces; each of the package side surfaces has: a first surface adjacent to the back surface of the package and having an end portion on which the lead electrode is disposed; and a second surface located at a position closer to the front surface than the first surface, and the surface direction is different from The first surface; and the third surface are located closer to the front side than the second surface, and have a surface direction different from the second surface; and the lead electrode protrudes from the bottom surface of the package To the outside, curved along the bottom surface of the package and the first surface. The illuminating device of claim 1, wherein the first surface is substantially perpendicular to a major surface of the lead electrode. The light-emitting device of claim 1, wherein the second surface is inclined in such a manner as to widen in a front direction. The illuminating device of claim 2, wherein the second surface is inclined in such a manner as to widen in a front direction. The light-emitting device of claim 1, wherein the third surface is inclined in such a manner as to be narrowed toward the front direction. The illuminating device of claim 2, wherein the third surface is inclined in such a manner as to be narrowed toward the front direction. The light-emitting device of claim 3, wherein the third surface is inclined in such a manner as to be narrowed toward the front direction. The illuminating device of claim 4, wherein the third surface is inclined in such a manner as to be narrowed toward the front direction. The light-emitting device according to any one of claims 1 to 8, wherein a corner portion of the package in which the lead electrode is bent is cut.