五、發明說明（1) 【發明所屬之技術領域】 本發明係有關一種發光二極體（LED)之侧面發光封 裝技術’特別是關於-種可沿用現有製程且無須打線之側 面發光二極體封裝結構。 【先前技術】 按，發光二極體之發光原理係利用半導體固有特性， 將電流順向流入半導體的PN接面，使其發出光線，所以 LED^稱為冷光源（cold light):且因led具有高耐久 性、壽命長、體積小、耗電量低且不含水銀等有害物質等 之優點，故可廣泛應用於LCD之背光源及未來照明設備產 由於發光二極體應用甚廣，在短小輕薄的消費產品， 而其所講究的不僅是穩定性，最重要的是它的輕薄，尤其 ’其所用玻璃導光板厚度由l lmm減為〇7mm，再減 為0.55mm日益變薄，LED之侧面發光源亦需日益變薄。， 然因目前業界製造出側面發光二極體封裝結構很厚，故往 往無法滿足需求。 目二=使用之側面發光二極體之結構，如第一（a)圖及 裝之?二所不’其係包括—晶片4°及—可供此日日日片40安 將晶片40放置於黏著支架42上，再藉由-塑 將其容置於其内，並利用打線 =連接晶片40與支架42，使兩者形成電性連；數= 膠體48包覆晶片4〇與引線46以保護之。由上述 之^構敘述不難得知，整個側面發光二極體之封裝主要取 立、赞嗍詋明 決於塑膠殼體44及其開口，因為發光晶片4〇置放於支架42 上很深，所用之吸嘴有尺寸限制，所以開口無法很大。又 由於打線使其開口自然無法太小，否則其製作性又不方 便，造成生產良率降低。 有鑑於此，本發明係提出一種無須打線且可縮小尺寸 之侧面發光二極體封裝結構，以改善存在於先前技術中之 該些缺失。 【發明内容】 ㈣ΐί:之ΐί目的係在提供一種超薄型側面發光二極 利用導電材質使具有復晶晶片之基板與 接形成電性連接’無須再打線…有效縮 體，ίΓίϋ”的係在提供一種薄型侧面發光二極 體，以供薄型或厚型LCD背光導板使用。 構，$:4::担：的係在提供-種發光二極體封裝結 現有之製程與設備。 夂嘴大小，故可沿用 本發明之又一目的係在提供容 發光二極體結構。 I们種溥沒側面 2達到上述之目的’本發明 導線架上安裝-基板 f電接著劑在- 片，兩者係形成電性連接，=有一發光二極體晶 中間之開σ ;另有—絕緣殼體，= 基板及其上之發光二極體晶片，…部份V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a side-emitting light-emitting packaging technology of a light-emitting diode (LED), and particularly to a side-emitting light-emitting diode that can follow the existing process and does not need to be wired. Package structure. [Previous technology] According to the principle of light-emitting diodes, the inherent characteristics of semiconductors are used to direct the current into the semiconductor's PN junction to emit light. Therefore, LED ^ is called cold light: It has the advantages of high durability, long life, small size, low power consumption and no harmful substances such as mercury, so it can be widely used in LCD backlights and future lighting equipment. Due to the wide application of light-emitting diodes, Short and thin consumer products, and what they pay attention to is not only stability, the most important thing is its thinness, especially 'the thickness of the glass light guide plate used is reduced from l lmm to 07mm, and then to 0.55mm, which is becoming thinner. Side light sources also need to become thinner. However, because the side-emitting diode packaging structure currently manufactured by the industry is very thick, it is often unable to meet the demand. Head 2 = The structure of the side-emitting diodes used, such as the first (a) picture and the second one, which includes-the wafer 4 ° and-for the daily 40-day film 40 A to place the wafer 40 On the adhesive bracket 42, it is accommodated in it by plastic molding, and the wire is used to connect the chip 40 and the bracket 42 to form an electrical connection; the number = the gel 48 covers the chip 40 and the lead 46. To protect it. From the above description, it is not difficult to know that the packaging of the entire side light-emitting diode is mainly determined by the plastic case 44 and its opening, because the light-emitting chip 40 is placed deep on the bracket 42 and used. The nozzle has a size limitation, so the opening cannot be large. And because the opening of the wire can not be too small, otherwise it is inconvenient to make, and the production yield is reduced. In view of this, the present invention proposes a side-emitting diode packaging structure that does not require wiring and can be reduced in size, in order to improve some of the defects existing in the prior art. [Summary of the Invention] The purpose of ㈣ΐί: is to provide an ultra-thin side-emitting light-emitting diode that uses a conductive material to electrically connect a substrate with a polycrystalline wafer to the substrate. Provide a thin side-emitting diode for thin or thick LCD backlight guides. The structure, $: 4 :: Tan: is to provide-a kind of light-emitting diode packaging and existing processes and equipment. Pout Size, so another object of the present invention can be used to provide a light-emitting diode structure. We have annihilated the side 2 to achieve the above purpose. This is to form an electrical connection, = an opening σ in the middle of a light-emitting diode crystal; another-an insulating case, = the substrate and the light-emitting diode wafer on it, ... part
I 五、發明說明（3) 之導電接腳。 附的圖式詳加說明，當更 容、特點及其所達成之功 出絕緣殼體外之導線架作為對外 底下藉由具體實施例配合所 容易瞭解本發明之目的、技術内 效0 【實施方式】 且有二極體封裝結構係利用導電材質使 經由打線製程’所以無引線因生產所佔據之空間，：可； 效縮小封裝尺寸；且因殼體内容置基板與晶μ之空間較 淺，亦可沿用現有之製程與設備。 第二圖為本發明之立體結構示意圖，如圖所示，並請 同時參考第三圖之剖視圖及第四圖之側視圖，一發光二極 體封裝結構10，包括一金屬導線架12，其係具有内引腳 122與外引腳124部份，且在此金屬導線架12之中間之中間 區域形成有一開口14 ;並有一絕緣之塑膠殼體16利用塑膠 材質一體射出成形包覆金屬導線架12之内引腳122，使露 出塑膠殼體16外之導線架12的外引腳124係彎折於塑穋殼 體1 6二側作為對外之導電接腳，此塑膠殼體丨6被金屬導線 架12分隔為第一容置空間18與第二容置空間2〇，兩者間則 以該開口14相連通；一基板22的表面上係安裝有一覆晶發 光二極體晶片24，此發光二極體晶片24係利用一共晶材料 26，例如金-錫、金-矽等安裝固定於基板22上，使基板22 與發光二極體晶片24形成電性連接，並將此已安裝有發光 二極體晶片24之基板22利用一導電接著劑28安裝於金屬導 五、發明說明（4) 線架12之内引腳122上且位於第一容置空間18内，使發光 二極體晶片24之發光區面對該開口 14，當發光二極想24之 發光區發出光線時可藉由該開口 14自塑膠殼體16内發射出 去。 其中，為保護發光二極體晶片24不會受到外界之水氣 或灰塵等影響其元件特性，如第五圖所示，更可在第一容 置空間18填充封裝膠體30且於第二容置空間20内填充一透 明之封裝膠體32，以藉此包覆並保護此發光二極體晶片 24 〇 由於本發明在塑膠殼體16所使用之第一容置空間18較 淺’所以可使用現有製程設備之吸嘴吸附基板22位於該第 一容置空間18内而黏接安裝於金屬導線架12上，所以可完 全沿用現有之製程與設備，無須再另行購買或設計新設 備’相當容易生產。此外，本發明係直接利用導電接著劑 28將具有發光二極體晶片24之基板22安裝在第一容置空間 1 8内且與金屬導線架丨2形成電性相接，完全無使用引線， 故可有效縮小尺寸，提供一種超薄型發光二極體封裝結 構’以供薄型或厚型LCD背光導板使用。 以上所述之實施例僅係為說明本發明之技術思想及特 點’其目的在使熟習此項技藝之人士能夠瞭解本發明之内 谷並據以實施，當不能以之限定本發明之專利範圍，即大 ，依本發明所揭示之精神所作之均等變化或修飾，仍應涵 蓋在本發明之專利範圍内。I V. Description of the invention (3) The conductive pin. The attached drawings explain in detail, when the capacity, characteristics and the work achieved by the lead frame outside the insulated case are used as the external, it is easy to understand the purpose of the present invention, technical internal effects through the cooperation of specific embodiments. ] And there is a diode packaging structure that uses conductive materials to pass through the wire bonding process, so the lead-free space occupied by production is: possible; the package size is effectively reduced; and the space between the substrate and the crystal μ in the housing is shallow, It can also use the existing processes and equipment. The second figure is a schematic diagram of the three-dimensional structure of the present invention. As shown in the figure, please refer to the sectional view of the third figure and the side view of the fourth figure at the same time. A light emitting diode packaging structure 10 includes a metal lead frame 12, It has an inner pin 122 and an outer pin 124, and an opening 14 is formed in the middle area of the middle of the metal lead frame 12; and an insulating plastic case 16 is integrally injection-molded and covered with a metal lead frame using plastic material. The inner pin 122 of 12 makes the outer pin 124 of the lead frame 12 exposed outside the plastic case 16 bent on the two sides of the plastic case 16 as the external conductive pins. This plastic case 6 is metal The lead frame 12 is divided into a first receiving space 18 and a second receiving space 20, and the two are communicated with each other through the opening 14. A surface of a substrate 22 is provided with a chip-on-chip light-emitting diode 24. The light-emitting diode wafer 24 is mounted on a substrate 22 using a eutectic material 26, such as gold-tin, gold-silicon, etc., so that the substrate 22 and the light-emitting diode wafer 24 are electrically connected. The substrate 22 of the light-emitting diode wafer 24 uses a conductive connection The agent 28 is installed on the metal guide 5. Description of the invention (4) The lead 122 in the wire frame 12 is located in the first accommodation space 18 so that the light-emitting area of the light-emitting diode wafer 24 faces the opening 14 and emits light. When light is emitted from the light emitting area of the second pole 24, it can be emitted from the plastic case 16 through the opening 14. Among them, in order to protect the light-emitting diode wafer 24 from being affected by external moisture or dust, as shown in the fifth figure, the first accommodating space 18 can be filled with the encapsulating gel 30 and placed in the second container. The space 20 is filled with a transparent encapsulant 32 to cover and protect the light-emitting diode wafer 24. The first housing space 18 used in the plastic case 16 of the present invention is shallow, so it can be used. The nozzle suction substrate 22 of the existing process equipment is located in the first accommodating space 18 and is adhesively mounted on the metal lead frame 12, so the existing process and equipment can be completely used without the need to separately purchase or design new equipment. produce. In addition, the present invention directly uses the conductive adhesive 28 to mount the substrate 22 having the light-emitting diode wafer 24 in the first accommodating space 18 and forms an electrical connection with the metal lead frame 丨 2 without using leads. Therefore, it can effectively reduce the size and provide an ultra-thin light-emitting diode package structure for thin or thick LCD backlight guide plates. The above-mentioned embodiments are only for explaining the technical ideas and characteristics of the present invention. The purpose is to enable those skilled in the art to understand the inner valley of the present invention and implement it accordingly. The scope of the patent of the present invention cannot be limited by it That is, equal changes or modifications made in accordance with the spirit disclosed by the present invention should still be covered by the patent scope of the present invention.
圖式簡單說明 圖式說明： 第一（a)圖及第一（b)圖分別為習知發光二極體之結構剖視 圖及側視圖。 第二圖本發明之立體結構示意圖。 第三圖為本發明之結構剖視圖。 第四圖為本發明之結構側視圖。 第五圖為本發明填充有封裝膠體的另一實施例示意圖。 圖號說明： 10 發 光 二 極 體 封 裝結構 12 金 屬 導 線 架 122 内 引 腳 124 外 引 腳 14 開 π 16 塑 膠 殼 體 18 第 一 容 置 空 間 20 第 二 容 置 空 間 22 基 板 24 發 光 二 極 體 晶 片 26 共 晶 材 料 28 導 電 接 著 劑 30 ’ •32 封 裝 膠 體 40 晶 片 42 支 架 44 塑 膠 殼 體Brief description of the drawings Brief description of the drawings: The first (a) and the first (b) diagrams are respectively a sectional view and a side view of a structure of a conventional light emitting diode. The second figure is a schematic diagram of the three-dimensional structure of the present invention. The third figure is a sectional view of the structure of the present invention. The fourth figure is a side view of the structure of the present invention. The fifth figure is a schematic diagram of another embodiment of the present invention filled with encapsulating gel. Description of drawing number: 10 Light-emitting diode package structure 12 Metal lead frame 122 Inner pin 124 Outer pin 14 Open π 16 Plastic case 18 First accommodation space 20 Second accommodation space 22 Substrate 24 Light-emitting diode chip 26 Eutectic Material 28 Conductive Adhesive 30 '• 32 Encapsulant 40 Chip 42 Holder 44 Plastic Case
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圖式簡單說明 46 金屬引線 48 封裝膠體 mm 第10頁Brief description of drawings 46 Metal lead 48 Package gel mm Page 10