TWI247435B - Side-emitting LED package structure - Google Patents

Abstract

The present invention discloses side-emitting LED package structure, which comprises a metal lead frame, an insulating shell, and a LED chip. The metal lead frame possesses a central opening. The insulating shell covers partial metal lead frame, while the part of the metal lead frame uncovered by the insulating shell forms the pins for external connection. The eutectic growth of the LED chip is formed on the surface of a substrate to build up an electrical connection between the substrate and the LED chip. The substrate is mounted on the metal lead frame with a conductive adhesive is located inside a containing space of the insulating shell such that the emitting area of the LED chip faces to the opening. The structural design of the present invention reduces the package size, and continues using the present manufacturing process and the equipment simultaneously.

Description

1247435 V. INSTRUCTION DESCRIPTION OF THE INVENTION (1) Technical Field of the Invention The present invention relates to a side-emitting package technology for a light-emitting diode (LED), and more particularly to a side-emitting diode that can be used in an existing process without wire bonding. Package structure. # [Prior Art] According to the principle of the light-emitting diode, the semiconductor is inherently characterized, and the current flows into the PN junction of the semiconductor to emit light, so the LED is called a cold light. LED has high durability, long life, small size, low power consumption, and no harmful substances such as mercury

The advantages are widely used in LCD backlights and future lighting equipment industries. Due to the wide application of light-emitting diodes in short, thin and light consumer products, the focus is not only on stability, but most importantly, its thinness, especially for LCDs, the thickness of the glass light guide used is reduced from l lmin to 〇 7mm, and then reduced to 〇 · 55mm increasingly thinner, the side of the LED light source needs to be increasingly thin. However, because the industry has created a side-emitting diode package structure is very thick, it is often unable to meet the demand.

The structure of the side-emitting diode used at present, as shown in the first (a) and the first (b), includes a wafer 4 and a holder 42 for mounting the wafer 4 The wafer 40 is placed on the adhesive holder 42 and then accommodated therein by a plastic housing 44, and the plurality of metal leads 46 are connected to the wafer 40 and the bracket 42 by a wire bonding technique to electrically connect the two. A transparent encapsulant 48 encloses the wafer 40 and leads 46 to protect it. It is not difficult to know from the above description of the structure that the package of the entire side light-emitting diode is mainly taken.

1247435 V. INSTRUCTIONS (2) Depending on the plastic casing 44 and its opening, since the illuminating wafer 4 is placed deep on the bracket 42, the nozzle used has a size limitation, so the opening cannot be made large and the wire is made The opening cannot naturally be too small, otherwise the manufacturability is inconvenient, resulting in a decrease in production yield. In view of the above, the present invention proposes a side-emitting diode package structure that does not require wire bonding and can be downsized to improve the defects existing in the prior art. SUMMARY OF THE INVENTION The main object of the present invention is to provide an ultra-thin side-emitting diode package structure, which uses a conductive material to directly form a substrate with a flip-chip substrate and a metal lead frame without the need for wire bonding. Small package size. $ ^ The present invention is for thin invention, which can be used in the prior art. The light-emitting diode of the present invention is used to reach the lead frame on the lead frame, both of which face the lead frame substrate and the upper surface of the light-emitting diode package. Small, so a thin side electric adhesive can be used to accommodate the lead frame in the light-emitting area of the photodiode crystal chip, so that another purpose of the dew is to provide a thin side type or thick type LCD backlight guide. use. A further object is to provide a type of light-emitting device that is used in conjunction with an existing machine. Yet another object is to provide a structure that is easy to produce. For the above purpose, the present invention utilizes a conductive two-substrate, and the substrate is provided with an opening for electrically connecting and opening the middle of the light-emitting diode; and an insulating housing, the light-emitting diode wafer, and Coated part

1247435

The lead frame outside the insulating housing serves as an external conductive pin. The purpose of the present invention, the technology (four), the features and the work achieved by the present invention are better understood by the specific embodiments in conjunction with the accompanying circular details. [Embodiment] The LED package structure proposed by the present invention is The conductive material is used to directly connect the substrate with the wafer to the metal lead frame, and it is necessary to pass through the wire bonding process, so that no lead wire can occupy the space occupied by the production, and the package size can be effectively reduced; The space between the wafer and the wafer is shallow, and the existing processes and equipment can be used. The first figure is a schematic view of a three-dimensional structure of the present invention. As shown in the figure, and referring to the cross-sectional view of the third figure and the side view of the fourth figure, a light-emitting diode-like package structure 10 includes a metal lead frame 12, which The system has an inner lead 12 2 and an outer pin 1 2 4 portion, and an opening 14 is formed in an intermediate portion of the middle of the metal lead frame 12; and an insulating plastic case 16 is integrally formed by using a plastic material. The inner lead pin 122 of the lead frame 12 of the metal lead frame 12 is wrapped so that the outer lead 124 of the lead frame 12 exposed outside the plastic case 16 is bent on the two sides of the plastic material as the external conductive pin. The plastic case 16 The metal lead frame 12 is divided into a first accommodating space 18 and a second accommodating space 2 〇, and the openings 14 are connected to each other. A surface of the substrate 22 is mounted with a 曰=曰 illuminating pole. The body wafer 24 is mounted on the substrate 22 by a eutectic material 26, such as gold-tin, gold-iridium, etc., so that the first plate 22 and the light-emitting diode wafer 24 are electrically connected. And the substrate 22 on which the LED array 24 has been mounted is electrically conductive Agent 28 is mounted on the metal guide

1247435 V. Invention Description (4) The inner pin 122 of the wire frame 12 is located in the first accommodating space 18, so that the light-emitting area of the illuminating diode chip 24 faces the opening 14, when the light-emitting diode 24 When the light-emitting area emits light, the opening 14 can be emitted from the plastic housing 16 to protect the light-emitting diode wafer 24 from external moisture or dust, as shown in the fifth figure. The encapsulating colloid 3 can be filled in the first accommodating space 18 and filled with a transparent encapsulant 32 in the second accommodating space 2 , to thereby coat and protect the illuminating diode chip 24 . The first accommodating space 18 used in the plastic housing 16 is shallower. Therefore, the nozzle absorbing substrate 22 of the existing process equipment can be used for bonding and mounting on the metal lead frame 12 in the first accommodating space 18, Therefore, the existing processes and equipment can be completely used, and it is not necessary to purchase or design new equipment separately, which is quite easy to produce. In addition, the present invention directly mounts the substrate 22 having the light-emitting diode wafer 24 in the first accommodating space 18 by using the conductive adhesive 28 and electrically connects with the metal lead frame 12 without using a bow line. Therefore, it can effectively reduce the size and provide an ultra-thin LED package structure for use with thin or thick LCD backlight guides. The embodiments described above are merely illustrative of the technical idea and the specifics of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the contents of the present invention and to implement the patents of the present invention. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; ~

Page 8 1247435 Brief description of the diagram Circular description: The first (a) and the first (b) are respectively a cross-sectional view and a side view of a conventional light-emitting diode. The second figure is a schematic view of the three-dimensional structure of the present invention. The third figure is a cross-sectional view of the structure of the present invention. The fourth figure is a side view of the structure of the present invention. The fifth figure is a schematic view of another embodiment of the invention filled with an encapsulant. Description of the figure: 10 LED package structure 12 Metal lead frame 122 Inner pin 124 Outer pin 14 Opening 16 Plastic case 18 First accommodating space 20 Second accommodating space 22 Substrate 24 Light-emitting diode wafer 26 Eutectic Material 28 Conductive Adhesive 30 &gt; 32 Package Colloid 40 Wafer 42 Bracket 44 Plastic Housing

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Claims (1)

1247435 _ Case No. 93106137_年月日日 Amendment _ VI. Patent Application Scope The insulating case formed by the plastic material is an integral injection molding. 4 inmi第12页