TWI459047B - 組合反射鏡裝置、光學成像系統、與用以支撐組合反射鏡裝置之琢面元件之方法 - Google Patents
組合反射鏡裝置、光學成像系統、與用以支撐組合反射鏡裝置之琢面元件之方法 Download PDFInfo
- Publication number
- TWI459047B TWI459047B TW100124197A TW100124197A TWI459047B TW I459047 B TWI459047 B TW I459047B TW 100124197 A TW100124197 A TW 100124197A TW 100124197 A TW100124197 A TW 100124197A TW I459047 B TWI459047 B TW I459047B
- Authority
- TW
- Taiwan
- Prior art keywords
- support
- edge
- kneading
- kneading element
- mirror device
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 52
- 238000012634 optical imaging Methods 0.000 title claims description 13
- 238000004898 kneading Methods 0.000 claims description 171
- 230000003287 optical effect Effects 0.000 claims description 59
- 239000000463 material Substances 0.000 claims description 37
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 238000012546 transfer Methods 0.000 claims description 23
- 239000000853 adhesive Substances 0.000 claims description 20
- 230000001070 adhesive effect Effects 0.000 claims description 20
- 238000003466 welding Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 238000005286 illumination Methods 0.000 claims description 8
- 238000003384 imaging method Methods 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000003507 refrigerant Substances 0.000 claims description 6
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 5
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- RHDUVDHGVHBHCL-UHFFFAOYSA-N niobium tantalum Chemical compound [Nb].[Ta] RHDUVDHGVHBHCL-UHFFFAOYSA-N 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 3
- 239000010426 asphalt Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- UNASZPQZIFZUSI-UHFFFAOYSA-N methylidyneniobium Chemical compound [Nb]#C UNASZPQZIFZUSI-UHFFFAOYSA-N 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0891—Ultraviolet [UV] mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/09—Multifaceted or polygonal mirrors, e.g. polygonal scanning mirrors; Fresnel mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/12—Reflex reflectors
- G02B5/126—Reflex reflectors including curved refracting surface
- G02B5/132—Reflex reflectors including curved refracting surface with individual reflector mounting means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/181—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
- G02B7/1815—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation with cooling or heating systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
- G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Optical Elements Other Than Lenses (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2010/060955 WO2012013227A1 (en) | 2010-07-28 | 2010-07-28 | Facet mirror device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201229572A TW201229572A (en) | 2012-07-16 |
| TWI459047B true TWI459047B (zh) | 2014-11-01 |
Family
ID=42671938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100124197A TWI459047B (zh) | 2010-07-28 | 2011-07-08 | 組合反射鏡裝置、光學成像系統、與用以支撐組合反射鏡裝置之琢面元件之方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9599910B2 (enExample) |
| JP (1) | JP5738410B2 (enExample) |
| CN (1) | CN103140782B (enExample) |
| TW (1) | TWI459047B (enExample) |
| WO (1) | WO2012013227A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012204273B4 (de) * | 2012-03-19 | 2015-08-13 | Carl Zeiss Smt Gmbh | Beleuchtungsoptik für die EUV-Projektionslithografie |
| DE102013203035A1 (de) * | 2013-02-25 | 2014-08-28 | Carl Zeiss Smt Gmbh | Optisches modul |
| DE102015208514A1 (de) * | 2015-05-07 | 2016-11-10 | Carl Zeiss Smt Gmbh | Facettenspiegel für die EUV-Projektionslithografie sowie Beleuchtungsoptik mit einem derartigen Facettenspiegel |
| DE102016205624B4 (de) * | 2016-04-05 | 2017-12-28 | Carl Zeiss Smt Gmbh | Beleuchtungsoptik für die EUV-Projektionslithografie, Beleuchtungssystem, Projektionsbelichtungsanlage und Verfahren zur Projektionsbelichtung |
| DE102019201509A1 (de) * | 2019-02-06 | 2020-08-06 | Carl Zeiss Smt Gmbh | Abstützung eines optischen Elements |
| DE102019209610A1 (de) * | 2019-07-01 | 2021-01-07 | Carl Zeiss Smt Gmbh | Verfahren und Vorrichtung zum Herstellen einer Klebeverbindung zwischen einer ersten Komponente und einer zweiten Komponente |
| CN119717374A (zh) * | 2023-09-20 | 2025-03-28 | 深圳市绎立锐光科技开发有限公司 | 支撑组件、其组装方法及光源装置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW538256B (en) * | 2000-01-14 | 2003-06-21 | Zeiss Stiftung | Microlithographic reduction projection catadioptric objective |
| TWI243967B (en) * | 2001-07-14 | 2005-11-21 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US20060103908A1 (en) * | 2004-11-12 | 2006-05-18 | Asml Holding N.V. | Active faceted mirror system for lithography |
| WO2008101656A2 (en) * | 2007-02-19 | 2008-08-28 | Carl Zeiss Smt Ag | Method for producing facet mirrors and projection exposure apparatus |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4268123A (en) * | 1979-02-26 | 1981-05-19 | Hughes Aircraft Company | Kinematic mount |
| NL8100164A (nl) | 1981-01-15 | 1982-08-02 | Datawell Nv | Drijver voor het meten van golfhellingen. |
| JPS57146107U (enExample) * | 1981-03-06 | 1982-09-14 | ||
| DE69224645T2 (de) * | 1992-11-26 | 1998-08-20 | Oce Tech Bv | Drehspiegelsystem |
| US6043863A (en) * | 1996-11-14 | 2000-03-28 | Nikon Corporation | Holder for reflecting member and exposure apparatus having the same |
| SE9800665D0 (sv) * | 1998-03-02 | 1998-03-02 | Micronic Laser Systems Ab | Improved method for projection printing using a micromirror SLM |
| US7843632B2 (en) * | 2006-08-16 | 2010-11-30 | Cymer, Inc. | EUV optics |
| DE10205425A1 (de) | 2001-11-09 | 2003-05-22 | Zeiss Carl Smt Ag | Facettenspiegel mit mehreren Spiegelfacetten |
| ATE464585T1 (de) * | 2002-02-09 | 2010-04-15 | Zeiss Carl Smt Ag | Facettenspiegel mit mehreren spiegelfacetten |
| DE10324796A1 (de) | 2003-05-31 | 2004-12-16 | Carl Zeiss Smt Ag | Facettenspiegel mit Spiegelfacetten |
| JP2004361624A (ja) * | 2003-06-04 | 2004-12-24 | Sumitomo Electric Ind Ltd | 光モジュール、及び光モジュールの製造方法 |
| JP2006142388A (ja) * | 2004-11-16 | 2006-06-08 | Nihon Micro Coating Co Ltd | 研磨テープ及び方法 |
| ES2307467T1 (es) * | 2005-10-06 | 2008-12-01 | Gutehoffnungshutte Radsatz Gmbh | Proceso para el registro dinamico sin contacto del perfil de un cuerpo solido. |
| KR101769157B1 (ko) * | 2008-10-20 | 2017-08-17 | 칼 짜이스 에스엠테 게엠베하 | 방사선 빔 안내를 위한 광학 모듈 |
-
2010
- 2010-07-28 WO PCT/EP2010/060955 patent/WO2012013227A1/en not_active Ceased
- 2010-07-28 JP JP2013520975A patent/JP5738410B2/ja not_active Expired - Fee Related
- 2010-07-28 CN CN201080069330.6A patent/CN103140782B/zh not_active Expired - Fee Related
-
2011
- 2011-07-08 TW TW100124197A patent/TWI459047B/zh not_active IP Right Cessation
-
2013
- 2013-01-18 US US13/744,943 patent/US9599910B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW538256B (en) * | 2000-01-14 | 2003-06-21 | Zeiss Stiftung | Microlithographic reduction projection catadioptric objective |
| TWI243967B (en) * | 2001-07-14 | 2005-11-21 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
| US20060103908A1 (en) * | 2004-11-12 | 2006-05-18 | Asml Holding N.V. | Active faceted mirror system for lithography |
| WO2008101656A2 (en) * | 2007-02-19 | 2008-08-28 | Carl Zeiss Smt Ag | Method for producing facet mirrors and projection exposure apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201229572A (en) | 2012-07-16 |
| US9599910B2 (en) | 2017-03-21 |
| JP5738410B2 (ja) | 2015-06-24 |
| CN103140782B (zh) | 2018-11-27 |
| WO2012013227A1 (en) | 2012-02-02 |
| CN103140782A (zh) | 2013-06-05 |
| JP2013533632A (ja) | 2013-08-22 |
| US20130120730A1 (en) | 2013-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |