TWI457281B - 氧化矽質粉末、其製造方法及用途 - Google Patents

氧化矽質粉末、其製造方法及用途 Download PDF

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Publication number
TWI457281B
TWI457281B TW098102707A TW98102707A TWI457281B TW I457281 B TWI457281 B TW I457281B TW 098102707 A TW098102707 A TW 098102707A TW 98102707 A TW98102707 A TW 98102707A TW I457281 B TWI457281 B TW I457281B
Authority
TW
Taiwan
Prior art keywords
cerium oxide
oxide powder
powder
resin
content
Prior art date
Application number
TW098102707A
Other languages
English (en)
Chinese (zh)
Other versions
TW200936500A (en
Inventor
Yasuhisa Nishi
Syuji Sasaki
Hiroshi Murata
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW200936500A publication Critical patent/TW200936500A/zh
Application granted granted Critical
Publication of TWI457281B publication Critical patent/TWI457281B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/40—Carbon monoxide
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW098102707A 2008-01-30 2009-01-23 氧化矽質粉末、其製造方法及用途 TWI457281B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008018973 2008-01-30

Publications (2)

Publication Number Publication Date
TW200936500A TW200936500A (en) 2009-09-01
TWI457281B true TWI457281B (zh) 2014-10-21

Family

ID=40912697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098102707A TWI457281B (zh) 2008-01-30 2009-01-23 氧化矽質粉末、其製造方法及用途

Country Status (7)

Country Link
JP (1) JP5606740B2 (ko)
KR (1) KR101442034B1 (ko)
CN (1) CN101925534B (ko)
MY (1) MY158423A (ko)
SG (1) SG188093A1 (ko)
TW (1) TWI457281B (ko)
WO (1) WO2009096343A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5968137B2 (ja) * 2012-07-20 2016-08-10 ナミックス株式会社 液状封止材、それを用いた電子部品
JP7112179B2 (ja) * 2016-10-19 2022-08-03 日鉄ケミカル＆マテリアル株式会社 半導体封止材用球状シリカ質粉末、およびその製造方法
CN110040735A (zh) * 2019-04-01 2019-07-23 成亚资源科技股份有限公司 废弃封装材的二氧化硅再生方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171107A (ja) * 1997-08-25 1999-03-16 Denki Kagaku Kogyo Kk 無機質球状粒子の製造方法及び装置
JP2000229234A (ja) * 1999-02-08 2000-08-22 Denki Kagaku Kogyo Kk 球状無機質粒子の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4428490B2 (ja) * 2000-01-11 2010-03-10 電気化学工業株式会社 球状アルミナ粉末の製造方法
JP4815209B2 (ja) * 2005-03-17 2011-11-16 株式会社アドマテックス 硬化剤及び樹脂組成物
TWI412506B (zh) * 2006-05-12 2013-10-21 Denki Kagaku Kogyo Kk 陶瓷粉末及其用途

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171107A (ja) * 1997-08-25 1999-03-16 Denki Kagaku Kogyo Kk 無機質球状粒子の製造方法及び装置
JP2000229234A (ja) * 1999-02-08 2000-08-22 Denki Kagaku Kogyo Kk 球状無機質粒子の製造方法

Also Published As

Publication number Publication date
CN101925534A (zh) 2010-12-22
TW200936500A (en) 2009-09-01
KR101442034B1 (ko) 2014-09-18
KR20100117561A (ko) 2010-11-03
JP5606740B2 (ja) 2014-10-15
CN101925534B (zh) 2012-12-12
MY158423A (en) 2016-10-14
JPWO2009096343A1 (ja) 2011-05-26
SG188093A1 (en) 2013-03-28
WO2009096343A1 (ja) 2009-08-06

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